TW200604389A - Ecmp system - Google Patents

Ecmp system

Info

Publication number
TW200604389A
TW200604389A TW094103216A TW94103216A TW200604389A TW 200604389 A TW200604389 A TW 200604389A TW 094103216 A TW094103216 A TW 094103216A TW 94103216 A TW94103216 A TW 94103216A TW 200604389 A TW200604389 A TW 200604389A
Authority
TW
Taiwan
Prior art keywords
ecmp
correction
drop
electrode
polishing
Prior art date
Application number
TW094103216A
Other languages
Chinese (zh)
Inventor
Vlasta Brusic
Boris D Cahan
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of TW200604389A publication Critical patent/TW200604389A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Measurement Of Resistance Or Impedance (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)

Abstract

An improved electrochemical IR calculation and correction system allows for the precise measurement and control of the interfacial voltage drop at an electrode double layer. In an exemplary use of the invention, this improved IR correction ability allows ECMP to be used for precise surface polishing that would otherwise be impractical with ECMP. The system according to an embodiment of the invention comprises a working electrode, a counter electrode, and a reference electrode. An electrical perturbation is applied to the system and a unique IR calculation circuit is used to determine the IR drop. In an embodiment of the invention applicable to ECMP, an IR correction is provided such that the polishing at the surface of interest is precisely controlled despite the IR drop in the system.
TW094103216A 2004-02-02 2005-02-02 Ecmp system TW200604389A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/769,936 US20050167266A1 (en) 2004-02-02 2004-02-02 ECMP system

Publications (1)

Publication Number Publication Date
TW200604389A true TW200604389A (en) 2006-02-01

Family

ID=34808221

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094103216A TW200604389A (en) 2004-02-02 2005-02-02 Ecmp system

Country Status (4)

Country Link
US (1) US20050167266A1 (en)
JP (1) JP2007519830A (en)
TW (1) TW200604389A (en)
WO (1) WO2005075712A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE502004006578D1 (en) * 2004-06-30 2008-04-30 Siemens Ag Method and device for surface treatment of a component
CA2840640C (en) * 2011-11-07 2020-03-24 Abbott Diabetes Care Inc. Analyte monitoring device and methods
CN110528039B (en) * 2019-07-31 2020-11-17 浙江大学 Micro-nano structure local electrodeposition device based on weak ionic current detection monitoring

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3838032A (en) * 1972-02-01 1974-09-24 Technion Res & Dev Foundation Compensated polarograph
US4123335A (en) * 1976-02-03 1978-10-31 Seyl Rogert G Voltage measurement with spaced reference electrode
US5256565A (en) * 1989-05-08 1993-10-26 The United States Of America As Represented By The United States Department Of Energy Electrochemical planarization
US5180968A (en) * 1991-03-01 1993-01-19 Research Foundation Of State University Of New York Method and apparatus for compensation of double layer charging current in electrochemical cells
US5217586A (en) * 1992-01-09 1993-06-08 International Business Machines Corporation Electrochemical tool for uniform metal removal during electropolishing
US5575706A (en) * 1996-01-11 1996-11-19 Taiwan Semiconductor Manufacturing Company Ltd. Chemical/mechanical planarization (CMP) apparatus and polish method
US6990422B2 (en) * 1996-03-27 2006-01-24 World Energy Labs (2), Inc. Method of analyzing the time-varying electrical response of a stimulated target substance
US5980708A (en) * 1997-02-12 1999-11-09 Champagne; Gilles Y. High sensitivity multiple waveform voltammetric instrument
US5807165A (en) * 1997-03-26 1998-09-15 International Business Machines Corporation Method of electrochemical mechanical planarization
US5911619A (en) * 1997-03-26 1999-06-15 International Business Machines Corporation Apparatus for electrochemical mechanical planarization
AU1468199A (en) * 1997-11-25 1999-06-15 Johns Hopkins University, The Electrochemical-control of abrasive polishing and machining rates
US6395152B1 (en) * 1998-07-09 2002-05-28 Acm Research, Inc. Methods and apparatus for electropolishing metal interconnections on semiconductor devices
US6413388B1 (en) * 2000-02-23 2002-07-02 Nutool Inc. Pad designs and structures for a versatile materials processing apparatus
DE19900173C1 (en) * 1999-01-05 2000-05-31 Max Planck Gesellschaft Process for electrochemically processing a workpiece comprises measuring the geometry of the intermediate space between both electrodes so that only the points of the zones to be processed lie within a specified maximum distance
US7160421B2 (en) * 1999-04-13 2007-01-09 Semitool, Inc. Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US6299741B1 (en) * 1999-11-29 2001-10-09 Applied Materials, Inc. Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus
US6368190B1 (en) * 2000-01-26 2002-04-09 Agere Systems Guardian Corp. Electrochemical mechanical planarization apparatus and method
US7059948B2 (en) * 2000-12-22 2006-06-13 Applied Materials Articles for polishing semiconductor substrates
US7066800B2 (en) * 2000-02-17 2006-06-27 Applied Materials Inc. Conductive polishing article for electrochemical mechanical polishing
US6537144B1 (en) * 2000-02-17 2003-03-25 Applied Materials, Inc. Method and apparatus for enhanced CMP using metals having reductive properties
US6375549B1 (en) * 2000-03-17 2002-04-23 Motorola, Inc. Polishing head for wafer, and method for polishing
US6478936B1 (en) * 2000-05-11 2002-11-12 Nutool Inc. Anode assembly for plating and planarizing a conductive layer
US6811680B2 (en) * 2001-03-14 2004-11-02 Applied Materials Inc. Planarization of substrates using electrochemical mechanical polishing
US6592742B2 (en) * 2001-07-13 2003-07-15 Applied Materials Inc. Electrochemically assisted chemical polish
US6951599B2 (en) * 2002-01-22 2005-10-04 Applied Materials, Inc. Electropolishing of metallic interconnects

Also Published As

Publication number Publication date
JP2007519830A (en) 2007-07-19
US20050167266A1 (en) 2005-08-04
WO2005075712A2 (en) 2005-08-18
WO2005075712A3 (en) 2006-04-27

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