WO2005064628A1 - Tab terminal for electrolytic capacitor - Google Patents
Tab terminal for electrolytic capacitor Download PDFInfo
- Publication number
- WO2005064628A1 WO2005064628A1 PCT/JP2004/008756 JP2004008756W WO2005064628A1 WO 2005064628 A1 WO2005064628 A1 WO 2005064628A1 JP 2004008756 W JP2004008756 W JP 2004008756W WO 2005064628 A1 WO2005064628 A1 WO 2005064628A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- tab terminal
- tin
- solvent
- lead wire
- treatment
- Prior art date
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 20
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 55
- 229910052718 tin Inorganic materials 0.000 claims abstract description 53
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 49
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 claims abstract description 31
- 238000003466 welding Methods 0.000 claims abstract description 26
- 229910052751 metal Inorganic materials 0.000 claims abstract description 21
- 239000002184 metal Substances 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims abstract description 18
- 239000002904 solvent Substances 0.000 claims description 33
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical group O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 27
- 229910001887 tin oxide Inorganic materials 0.000 claims description 27
- 238000004519 manufacturing process Methods 0.000 claims description 23
- 238000010438 heat treatment Methods 0.000 claims description 21
- 239000007864 aqueous solution Substances 0.000 claims description 20
- 239000011162 core material Substances 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 8
- 230000001629 suppression Effects 0.000 claims description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 7
- -1 inorganic acid salt Chemical class 0.000 claims description 7
- 229910052760 oxygen Inorganic materials 0.000 claims description 7
- 239000001301 oxygen Substances 0.000 claims description 7
- 150000003863 ammonium salts Chemical class 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 229910019142 PO4 Inorganic materials 0.000 claims description 4
- 150000001642 boronic acid derivatives Chemical class 0.000 claims description 4
- 235000021317 phosphate Nutrition 0.000 claims description 4
- 150000003013 phosphoric acid derivatives Chemical class 0.000 claims description 4
- 150000004760 silicates Chemical class 0.000 claims description 4
- 150000003467 sulfuric acid derivatives Chemical class 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 abstract description 16
- 230000008569 process Effects 0.000 abstract description 5
- 238000007747 plating Methods 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 6
- 229910052797 bismuth Inorganic materials 0.000 description 5
- 239000013078 crystal Substances 0.000 description 5
- 239000011888 foil Substances 0.000 description 5
- 239000005028 tinplate Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000013256 coordination polymer Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 150000007522 mineralic acids Chemical class 0.000 description 3
- 230000009466 transformation Effects 0.000 description 3
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- 239000004115 Sodium Silicate Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000010891 electric arc Methods 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 235000019795 sodium metasilicate Nutrition 0.000 description 2
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 2
- 229910052911 sodium silicate Inorganic materials 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 229910001152 Bi alloy Inorganic materials 0.000 description 1
- 206010053759 Growth retardation Diseases 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
Definitions
- the present invention relates to a tab terminal used for an electrolytic capacitor, and more particularly, to a tab terminal provided with a lead-free tin plating, and a method for manufacturing the same.
- An electrolytic capacitor is formed by winding an anode electrode foil and a cathode electrode foil made of a valve metal such as tantalum or aluminum through a separator to form a capacitor element. It is manufactured by holding it and storing it in an outer case.
- the anode electrode foil and the cathode electrode foil are joined by a known means such as stitch bonding or ultrasonic welding for connecting the respective electrodes to the outside.
- the tab terminal is composed of three parts: a flat part, a round bar part, and a lead wire part.
- the flat part is the part that is joined to the electrode foil
- the round bar part is the part that is inserted through the sealing body that seals the outer case
- the lead wire part is the lead part that is mounted on the circuit board. Yes, a flexible lead wire is used to ensure ease of handling during mounting.
- Such a tab terminal having three partial forces is usually produced by welding two types of members. That is, a flat portion and a round bar portion are formed using a core wire made of an aluminum material or the like, and a lead wire is welded to the round bar portion.
- a lead wire since the electrolytic capacitor is mounted on the circuit board using solder, in order to improve the soldering characteristics, a lead wire whose surface is tinned with tin-lead containing tin is used.
- lead-free soldering has been started for lead-free electrode terminals of electronic components and for joining electronic components.
- lead-free tin balls so-called lead-free tin balls, are beginning to be used instead of conventional lead-containing tin balls.
- tin dies were generated at a welding portion between the aluminum round bar portion and the lead wire portion. Since this tin force grows over time, the whisker Even after removing, the power gradually grows thereafter.
- the force generated from the lead wire on the anode side and the whisker generated from the lead wire on the cathode side are bonded to each other, or the force generated on the lead wire portion is reduced.
- the leakage current of the electrolytic capacitor may reach the surface of the circuit board, and a short circuit may occur.
- Japanese Patent Application Laid-Open No. 2000-12386 discloses 0.5-10 Owt% of a metal such as bismuth.
- the use of a lead provided with a metal layer made of tin is disclosed.
- a metal such as bismuth By adding a metal such as bismuth to tin, the generation of a zinc force can be suppressed.
- the present inventors have now found that formation of tin oxide on the surface of a tinned lead wire can suppress the generation of a force that does not impair solder wettability.
- the present invention is based on strong knowledge.
- an object of the present invention is to generate a tin-based force from a welded portion even when a lead-free tin-plated lead wire available from a wire material manufacturer or the like is used as it is for a tab terminal.
- An object of the present invention is to provide a tab terminal that does not perform soldering and has good solder wettability, and a method of manufacturing the same.
- a tab terminal for an electrolytic capacitor according to the present invention is for an electrolytic capacitor in which an aluminum core wire having a pressed portion is welded to a lead wire end in which a metal layer made of tin is formed on the surface of a core material.
- a tab terminal wherein a surface of a welded portion between the lead wire portion and the aluminum core wire is subjected to a die force growth suppressing process.
- the whisker generation suppression process on the surface of the welded portion between the aluminum core wire and the lead wire, which is the place where the die force is generated, the tin die force is prevented from growing over time from the welded portion. be able to.
- the whisker suppression treatment is a tin oxide formation treatment.
- the tin formed on the surface of the weld is oxidized to at least SnO or SnO.
- the whiskers generated from the welded portion can be effectively suppressed.
- the tin oxide forming treatment is preferably performed by a heat treatment of the tab terminal.
- the heat treatment temperature is preferably in a range of 60 ° C. to 180 ° C., particularly 80 ° C. to 150 ° C. More preferred Les ,.
- the tab terminal is heat-treated in an oxygen atmosphere in such a temperature range, and tin oxide is formed on the surface of the tin plate, thereby obtaining a tab terminal with reduced power generation without impairing the solder wettability of the tab terminal. be able to.
- the tin oxide forming treatment can also be performed by a solvent treatment.
- solvent treatment By performing the tin oxide formation by solvent treatment, it is possible to selectively perform the whisker generation suppression treatment only on the portion of the tab terminal that requires the whisker generation treatment.
- the solvent is preferably an aqueous solution of an inorganic acid salt selected from the group consisting of silicates, borates, phosphates, and sulfates, and an aqueous solution further containing an ammonium salt. It is preferable that By performing solvent treatment using such an aqueous solution, tin oxide can be formed on the tin surface to the extent that solder wettability is not impaired, and the effect of suppressing whisker generation can be obtained.
- the whisker suppression treatment using a solvent can also be performed in combination with the above heat treatment. By performing the heat treatment and the solvent treatment in this manner, a further whisker suppression effect can be obtained.
- a method of manufacturing a tab terminal for an electrolytic capacitor according to the present invention comprises: A step of welding a lumi-core wire and a step of applying and attaching a solvent to the welded portion immediately after welding.
- the method for manufacturing a tab terminal for an electrolytic capacitor provides an aluminum capacitor having a pressing portion at an end of a lead wire having a metal layer made of tin formed on a surface of a core material.
- the tab terminal for an electrolytic capacitor of the present invention has a structure in which an aluminum core wire having a pressed portion is welded to a lead wire end in which a metal layer made of tin is formed on the surface of a core material. The welding between the wire and the aluminum core wire has been subjected to a growth control process for steel force.
- the lead wire that constitutes the tab terminal of the present invention is provided with a tin plate, and a normal manufacturing method can be used in a manufacturing process until the tin plate is provided.
- a commercially available lead-free tinted CP wire (lead wire) or the like can be used as the lead wire.
- the thickness and length of the lead wire are not particularly limited, and various CP wires can be used according to the required characteristics of the electrolytic capacitor.
- CP wire an iron core Z copper sheath type is usually used from the viewpoint of conductive properties.
- the aluminum core wire constituting the tab terminal of the present invention those used for conventional tab terminals can be used, and commercially available ones can be used.
- the aluminum core wire functions as an electrode of an electrolytic capacitor, and one end of the aluminum core wire has a flattened shape.
- the pressing portion can be formed by a conventional technique. For example, by pressing an aluminum core wire and cutting it into a predetermined shape, an aluminum core wire having a compressed portion having a predetermined shape can be manufactured. The step of cutting the pressed portion into a predetermined shape can be performed simultaneously with the press working.
- the lead wire and the aluminum core wire can be joined by a conventional method to form a tab terminal.
- both ends of the aluminum core wire and the lead wire can be joined by melting and joining both ends of the aluminum core wire and the lead wire by spark discharge or the like.
- the tab made in this way
- the tab terminal of the present invention can be manufactured by performing a whisker growth suppression treatment on the welded portion between the aluminum core wire and the lead wire of the terminal.
- the present inventors have confirmed that the die force generated near the welded portion of the tab terminal is composed of tin metal alone. And, it has been found that whiskers generated over time can be suppressed by converting tin existing in the welded portion into tin oxide in advance. In other words, the present invention has been derived as a result of intensive studies on the relationship between the tab terminal processing method and the occurrence of whiskers, focusing on the cause of whisker generation.
- the tin dicing force is composed of a simple metal made of tin, and it is estimated that the tin dicing force is derived from a tin plate provided on the surface of the lead wire.
- the force is generated only at the welded portion between the lead wire and the aluminum core wire where no force is generated.
- the reason is considered as follows. That is, at the joint, metals such as aluminum, copper, and tin solidify while the residual stress during welding remains. Tin, unlike aluminum and copper, has a low melting point (232 ° C) and can undergo crystal transformation at low temperatures (tens of degrees C). In the state where such residual stress (strain) remains, it is presumed that the tin crystal transformation proceeds even at room temperature and turns into needle-like whiskers, which appear from the welded portion.
- whisker removal performed immediately after the production of the tab terminal does not provide a fundamental solution since the growth of the tin die force gradually progresses in the order of several months. That is, according to the findings of the present inventors, it is necessary to suppress the growth of the power itself.
- tin in the welded portion of the tab terminal is oxidized by heat-treating the tab terminal in an oxygen atmosphere in a temperature range of 60 to 180 ° C, and tin oxide is formed on the surface of the tin plate.
- the heat treatment is performed after manufacturing the tab terminals (after welding the aluminum core wire and the lead wire). Prior to welding, heat-treat only the tinned lead wire, and then Welding force It is preferable to perform heat treatment after welding to form a tab terminal. By performing whisker generation suppression treatment after welding, tin that appears on the surface of the welded portion can be efficiently oxidized.
- the heat treatment is performed at a temperature lower than 60 ° C, the effect of suppressing the generation of the dysforce cannot be sufficiently obtained.
- metal tin and tin oxide are present at an appropriate ratio.
- a heat treatment temperature at which metal tin and tin oxide can be present at an appropriate ratio a temperature range of 80 to 150 ° C. is particularly preferable.
- the heat treatment time is preferably in the range of 10 to 60 minutes, and particularly preferably in the range of 15 to 30 minutes. If the heat treatment temperature exceeds 60 minutes, tin oxidation proceeds too much, which has an adverse effect on solder wettability.
- the strain remaining in the welded portion is also reduced by the heat treatment, whisker generation can be further suppressed.
- the heat treatment can be performed by a conventionally used method, and is not particularly limited.
- the whisker generation suppression treatment described above can be performed by a solvent treatment.
- Solvent treatment can form tin oxide only on the welded part of the tab terminal.
- the tin oxide can be formed by applying an aqueous solution of an inorganic acid or immersing the tab terminal in an aqueous solution of an inorganic acid after the tab terminal is manufactured. Immediately after welding the aluminum core wire and the lead wire during the tab terminal manufacturing process, it is preferable to apply and attach an aqueous solution of an inorganic acid to the welded portion. Since the tin force is generated immediately after welding of the terminal and grows gradually, solvent treatment is applied when the whis force is still generated and no whis force is generated, effectively suppressing the generation of the sui force. it can. Note that “immediately after welding” means several milliseconds to 11 seconds after welding. In the present invention, it is preferable to apply the solvent within 500 milliseconds, preferably within 300 milliseconds after welding.
- the temperature of the welded portion is preferably 80 to 250 ° C, more preferably 85 to 185 ° C. As described above, by applying the solvent when the welded portion is at a certain high temperature, the formation of tin oxide is promoted, whereby the generation of the die force can be suppressed effectively.
- the above temperature can be achieved by applying a solvent immediately after welding. Further, the temperature range of the solvent is preferably from 60 to 100 ° C.
- an aqueous solution containing an inorganic acid salt selected from the group consisting of silicates, borates, phosphates, and sulfates is preferably an aqueous solution containing a salt.
- an aqueous solution containing a double salt compound of the above-mentioned inorganic acid salt and ammonium salt can be suitably used. More specifically, the strength of an aqueous solution of ammonium fluoride is not limited to this.
- the tin can be oxidized to such an extent that the solder wettability is not adversely affected.
- the tab terminal of the present invention from the viewpoint of suppressing whisker generation as described above, it is preferable that tin oxide is formed in the welded portion, but if all of the metal tin is oxidized to tin oxide. Solder wettability deteriorates. Therefore, the ratio between metal tin and tin oxide needs to be appropriate.
- the ratio of metal tin to tin oxide can be made appropriate.
- the concentration of the aqueous solution is preferably 110% by weight.
- thermo-hygrostat PVH-
- the temperature was set to 60 ° C. ⁇ 90.
- a 250-hour accelerated test was performed under the condition of / oRH. After the accelerated test, whiskers generated in the welds of each sample were observed using a 30-fold optical microscope, and the length of the die force generated in the tab terminal welds was measured.
- ZCT value The zero crossing time (ZCT value) was measured by the 053 soldering test method (equilibrium method). Table 1 shows the measurement results.
- the tab terminal 1 described above was immersed in a 1.0% by weight aqueous solution of sodium metasilicate at 120 ° C. for 2 minutes to perform a solvent treatment to obtain a sample 6.
- the obtained sample was subjected to an acceleration test for 250 hours under the conditions of 60 ° C. and 90% RH. After the acceleration test, the length of the force generated at the welding portion of the tab terminal was measured by the same measuring method as described above. Further, the solder wettability of the sample subjected to the solution treatment in the same manner as above was measured. Table 2 shows the measurement results.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2004800004276A CN1751368B (en) | 2003-12-25 | 2004-06-22 | Tab terminal for electrolytic capacitor |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003429116A JP4452917B2 (en) | 2002-12-27 | 2003-12-25 | Tab terminal for electrolytic capacitor |
JP2003-429116 | 2003-12-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005064628A1 true WO2005064628A1 (en) | 2005-07-14 |
Family
ID=34736294
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2004/008756 WO2005064628A1 (en) | 2003-12-25 | 2004-06-22 | Tab terminal for electrolytic capacitor |
Country Status (4)
Country | Link |
---|---|
KR (1) | KR100702607B1 (en) |
CN (1) | CN1751368B (en) |
MY (1) | MY140340A (en) |
WO (1) | WO2005064628A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012182326A (en) * | 2011-03-01 | 2012-09-20 | Yokohama Rubber Co Ltd:The | Electrolytic capacitor |
DE102018109059B4 (en) * | 2018-01-15 | 2020-07-23 | Doduco Solutions Gmbh | Electrical press-in contact pin |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09186053A (en) * | 1995-12-28 | 1997-07-15 | Matsushita Electric Ind Co Ltd | Electrode terminal for aluminum electrolytic capacitor |
JP2000124073A (en) * | 1998-10-14 | 2000-04-28 | Matsushita Electric Ind Co Ltd | Aluminum electrolytic capacitor |
-
2004
- 2004-06-22 KR KR1020047020740A patent/KR100702607B1/en active IP Right Grant
- 2004-06-22 WO PCT/JP2004/008756 patent/WO2005064628A1/en active Application Filing
- 2004-06-22 CN CN2004800004276A patent/CN1751368B/en not_active Expired - Lifetime
- 2004-06-25 MY MYPI20042507A patent/MY140340A/en unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09186053A (en) * | 1995-12-28 | 1997-07-15 | Matsushita Electric Ind Co Ltd | Electrode terminal for aluminum electrolytic capacitor |
JP2000124073A (en) * | 1998-10-14 | 2000-04-28 | Matsushita Electric Ind Co Ltd | Aluminum electrolytic capacitor |
Also Published As
Publication number | Publication date |
---|---|
CN1751368A (en) | 2006-03-22 |
CN1751368B (en) | 2010-06-09 |
KR100702607B1 (en) | 2007-04-03 |
KR20060005290A (en) | 2006-01-17 |
MY140340A (en) | 2009-12-31 |
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