WO2005064628A1 - Tab terminal for electrolytic capacitor - Google Patents

Tab terminal for electrolytic capacitor Download PDF

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Publication number
WO2005064628A1
WO2005064628A1 PCT/JP2004/008756 JP2004008756W WO2005064628A1 WO 2005064628 A1 WO2005064628 A1 WO 2005064628A1 JP 2004008756 W JP2004008756 W JP 2004008756W WO 2005064628 A1 WO2005064628 A1 WO 2005064628A1
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WO
WIPO (PCT)
Prior art keywords
tab terminal
tin
solvent
lead wire
treatment
Prior art date
Application number
PCT/JP2004/008756
Other languages
French (fr)
Japanese (ja)
Inventor
Futoshi Ishii
Shuhei Yoshizawa
Hiroyuki Fujinaka
Original Assignee
Kohoku Kogyo Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2003429116A external-priority patent/JP4452917B2/en
Application filed by Kohoku Kogyo Co., Ltd. filed Critical Kohoku Kogyo Co., Ltd.
Priority to CN2004800004276A priority Critical patent/CN1751368B/en
Publication of WO2005064628A1 publication Critical patent/WO2005064628A1/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004Details
    • H01G9/008Terminals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004Details
    • H01G9/04Electrodes or formation of dielectric layers thereon

Definitions

  • the present invention relates to a tab terminal used for an electrolytic capacitor, and more particularly, to a tab terminal provided with a lead-free tin plating, and a method for manufacturing the same.
  • An electrolytic capacitor is formed by winding an anode electrode foil and a cathode electrode foil made of a valve metal such as tantalum or aluminum through a separator to form a capacitor element. It is manufactured by holding it and storing it in an outer case.
  • the anode electrode foil and the cathode electrode foil are joined by a known means such as stitch bonding or ultrasonic welding for connecting the respective electrodes to the outside.
  • the tab terminal is composed of three parts: a flat part, a round bar part, and a lead wire part.
  • the flat part is the part that is joined to the electrode foil
  • the round bar part is the part that is inserted through the sealing body that seals the outer case
  • the lead wire part is the lead part that is mounted on the circuit board. Yes, a flexible lead wire is used to ensure ease of handling during mounting.
  • Such a tab terminal having three partial forces is usually produced by welding two types of members. That is, a flat portion and a round bar portion are formed using a core wire made of an aluminum material or the like, and a lead wire is welded to the round bar portion.
  • a lead wire since the electrolytic capacitor is mounted on the circuit board using solder, in order to improve the soldering characteristics, a lead wire whose surface is tinned with tin-lead containing tin is used.
  • lead-free soldering has been started for lead-free electrode terminals of electronic components and for joining electronic components.
  • lead-free tin balls so-called lead-free tin balls, are beginning to be used instead of conventional lead-containing tin balls.
  • tin dies were generated at a welding portion between the aluminum round bar portion and the lead wire portion. Since this tin force grows over time, the whisker Even after removing, the power gradually grows thereafter.
  • the force generated from the lead wire on the anode side and the whisker generated from the lead wire on the cathode side are bonded to each other, or the force generated on the lead wire portion is reduced.
  • the leakage current of the electrolytic capacitor may reach the surface of the circuit board, and a short circuit may occur.
  • Japanese Patent Application Laid-Open No. 2000-12386 discloses 0.5-10 Owt% of a metal such as bismuth.
  • the use of a lead provided with a metal layer made of tin is disclosed.
  • a metal such as bismuth By adding a metal such as bismuth to tin, the generation of a zinc force can be suppressed.
  • the present inventors have now found that formation of tin oxide on the surface of a tinned lead wire can suppress the generation of a force that does not impair solder wettability.
  • the present invention is based on strong knowledge.
  • an object of the present invention is to generate a tin-based force from a welded portion even when a lead-free tin-plated lead wire available from a wire material manufacturer or the like is used as it is for a tab terminal.
  • An object of the present invention is to provide a tab terminal that does not perform soldering and has good solder wettability, and a method of manufacturing the same.
  • a tab terminal for an electrolytic capacitor according to the present invention is for an electrolytic capacitor in which an aluminum core wire having a pressed portion is welded to a lead wire end in which a metal layer made of tin is formed on the surface of a core material.
  • a tab terminal wherein a surface of a welded portion between the lead wire portion and the aluminum core wire is subjected to a die force growth suppressing process.
  • the whisker generation suppression process on the surface of the welded portion between the aluminum core wire and the lead wire, which is the place where the die force is generated, the tin die force is prevented from growing over time from the welded portion. be able to.
  • the whisker suppression treatment is a tin oxide formation treatment.
  • the tin formed on the surface of the weld is oxidized to at least SnO or SnO.
  • the whiskers generated from the welded portion can be effectively suppressed.
  • the tin oxide forming treatment is preferably performed by a heat treatment of the tab terminal.
  • the heat treatment temperature is preferably in a range of 60 ° C. to 180 ° C., particularly 80 ° C. to 150 ° C. More preferred Les ,.
  • the tab terminal is heat-treated in an oxygen atmosphere in such a temperature range, and tin oxide is formed on the surface of the tin plate, thereby obtaining a tab terminal with reduced power generation without impairing the solder wettability of the tab terminal. be able to.
  • the tin oxide forming treatment can also be performed by a solvent treatment.
  • solvent treatment By performing the tin oxide formation by solvent treatment, it is possible to selectively perform the whisker generation suppression treatment only on the portion of the tab terminal that requires the whisker generation treatment.
  • the solvent is preferably an aqueous solution of an inorganic acid salt selected from the group consisting of silicates, borates, phosphates, and sulfates, and an aqueous solution further containing an ammonium salt. It is preferable that By performing solvent treatment using such an aqueous solution, tin oxide can be formed on the tin surface to the extent that solder wettability is not impaired, and the effect of suppressing whisker generation can be obtained.
  • the whisker suppression treatment using a solvent can also be performed in combination with the above heat treatment. By performing the heat treatment and the solvent treatment in this manner, a further whisker suppression effect can be obtained.
  • a method of manufacturing a tab terminal for an electrolytic capacitor according to the present invention comprises: A step of welding a lumi-core wire and a step of applying and attaching a solvent to the welded portion immediately after welding.
  • the method for manufacturing a tab terminal for an electrolytic capacitor provides an aluminum capacitor having a pressing portion at an end of a lead wire having a metal layer made of tin formed on a surface of a core material.
  • the tab terminal for an electrolytic capacitor of the present invention has a structure in which an aluminum core wire having a pressed portion is welded to a lead wire end in which a metal layer made of tin is formed on the surface of a core material. The welding between the wire and the aluminum core wire has been subjected to a growth control process for steel force.
  • the lead wire that constitutes the tab terminal of the present invention is provided with a tin plate, and a normal manufacturing method can be used in a manufacturing process until the tin plate is provided.
  • a commercially available lead-free tinted CP wire (lead wire) or the like can be used as the lead wire.
  • the thickness and length of the lead wire are not particularly limited, and various CP wires can be used according to the required characteristics of the electrolytic capacitor.
  • CP wire an iron core Z copper sheath type is usually used from the viewpoint of conductive properties.
  • the aluminum core wire constituting the tab terminal of the present invention those used for conventional tab terminals can be used, and commercially available ones can be used.
  • the aluminum core wire functions as an electrode of an electrolytic capacitor, and one end of the aluminum core wire has a flattened shape.
  • the pressing portion can be formed by a conventional technique. For example, by pressing an aluminum core wire and cutting it into a predetermined shape, an aluminum core wire having a compressed portion having a predetermined shape can be manufactured. The step of cutting the pressed portion into a predetermined shape can be performed simultaneously with the press working.
  • the lead wire and the aluminum core wire can be joined by a conventional method to form a tab terminal.
  • both ends of the aluminum core wire and the lead wire can be joined by melting and joining both ends of the aluminum core wire and the lead wire by spark discharge or the like.
  • the tab made in this way
  • the tab terminal of the present invention can be manufactured by performing a whisker growth suppression treatment on the welded portion between the aluminum core wire and the lead wire of the terminal.
  • the present inventors have confirmed that the die force generated near the welded portion of the tab terminal is composed of tin metal alone. And, it has been found that whiskers generated over time can be suppressed by converting tin existing in the welded portion into tin oxide in advance. In other words, the present invention has been derived as a result of intensive studies on the relationship between the tab terminal processing method and the occurrence of whiskers, focusing on the cause of whisker generation.
  • the tin dicing force is composed of a simple metal made of tin, and it is estimated that the tin dicing force is derived from a tin plate provided on the surface of the lead wire.
  • the force is generated only at the welded portion between the lead wire and the aluminum core wire where no force is generated.
  • the reason is considered as follows. That is, at the joint, metals such as aluminum, copper, and tin solidify while the residual stress during welding remains. Tin, unlike aluminum and copper, has a low melting point (232 ° C) and can undergo crystal transformation at low temperatures (tens of degrees C). In the state where such residual stress (strain) remains, it is presumed that the tin crystal transformation proceeds even at room temperature and turns into needle-like whiskers, which appear from the welded portion.
  • whisker removal performed immediately after the production of the tab terminal does not provide a fundamental solution since the growth of the tin die force gradually progresses in the order of several months. That is, according to the findings of the present inventors, it is necessary to suppress the growth of the power itself.
  • tin in the welded portion of the tab terminal is oxidized by heat-treating the tab terminal in an oxygen atmosphere in a temperature range of 60 to 180 ° C, and tin oxide is formed on the surface of the tin plate.
  • the heat treatment is performed after manufacturing the tab terminals (after welding the aluminum core wire and the lead wire). Prior to welding, heat-treat only the tinned lead wire, and then Welding force It is preferable to perform heat treatment after welding to form a tab terminal. By performing whisker generation suppression treatment after welding, tin that appears on the surface of the welded portion can be efficiently oxidized.
  • the heat treatment is performed at a temperature lower than 60 ° C, the effect of suppressing the generation of the dysforce cannot be sufficiently obtained.
  • metal tin and tin oxide are present at an appropriate ratio.
  • a heat treatment temperature at which metal tin and tin oxide can be present at an appropriate ratio a temperature range of 80 to 150 ° C. is particularly preferable.
  • the heat treatment time is preferably in the range of 10 to 60 minutes, and particularly preferably in the range of 15 to 30 minutes. If the heat treatment temperature exceeds 60 minutes, tin oxidation proceeds too much, which has an adverse effect on solder wettability.
  • the strain remaining in the welded portion is also reduced by the heat treatment, whisker generation can be further suppressed.
  • the heat treatment can be performed by a conventionally used method, and is not particularly limited.
  • the whisker generation suppression treatment described above can be performed by a solvent treatment.
  • Solvent treatment can form tin oxide only on the welded part of the tab terminal.
  • the tin oxide can be formed by applying an aqueous solution of an inorganic acid or immersing the tab terminal in an aqueous solution of an inorganic acid after the tab terminal is manufactured. Immediately after welding the aluminum core wire and the lead wire during the tab terminal manufacturing process, it is preferable to apply and attach an aqueous solution of an inorganic acid to the welded portion. Since the tin force is generated immediately after welding of the terminal and grows gradually, solvent treatment is applied when the whis force is still generated and no whis force is generated, effectively suppressing the generation of the sui force. it can. Note that “immediately after welding” means several milliseconds to 11 seconds after welding. In the present invention, it is preferable to apply the solvent within 500 milliseconds, preferably within 300 milliseconds after welding.
  • the temperature of the welded portion is preferably 80 to 250 ° C, more preferably 85 to 185 ° C. As described above, by applying the solvent when the welded portion is at a certain high temperature, the formation of tin oxide is promoted, whereby the generation of the die force can be suppressed effectively.
  • the above temperature can be achieved by applying a solvent immediately after welding. Further, the temperature range of the solvent is preferably from 60 to 100 ° C.
  • an aqueous solution containing an inorganic acid salt selected from the group consisting of silicates, borates, phosphates, and sulfates is preferably an aqueous solution containing a salt.
  • an aqueous solution containing a double salt compound of the above-mentioned inorganic acid salt and ammonium salt can be suitably used. More specifically, the strength of an aqueous solution of ammonium fluoride is not limited to this.
  • the tin can be oxidized to such an extent that the solder wettability is not adversely affected.
  • the tab terminal of the present invention from the viewpoint of suppressing whisker generation as described above, it is preferable that tin oxide is formed in the welded portion, but if all of the metal tin is oxidized to tin oxide. Solder wettability deteriorates. Therefore, the ratio between metal tin and tin oxide needs to be appropriate.
  • the ratio of metal tin to tin oxide can be made appropriate.
  • the concentration of the aqueous solution is preferably 110% by weight.
  • thermo-hygrostat PVH-
  • the temperature was set to 60 ° C. ⁇ 90.
  • a 250-hour accelerated test was performed under the condition of / oRH. After the accelerated test, whiskers generated in the welds of each sample were observed using a 30-fold optical microscope, and the length of the die force generated in the tab terminal welds was measured.
  • ZCT value The zero crossing time (ZCT value) was measured by the 053 soldering test method (equilibrium method). Table 1 shows the measurement results.
  • the tab terminal 1 described above was immersed in a 1.0% by weight aqueous solution of sodium metasilicate at 120 ° C. for 2 minutes to perform a solvent treatment to obtain a sample 6.
  • the obtained sample was subjected to an acceleration test for 250 hours under the conditions of 60 ° C. and 90% RH. After the acceleration test, the length of the force generated at the welding portion of the tab terminal was measured by the same measuring method as described above. Further, the solder wettability of the sample subjected to the solution treatment in the same manner as above was measured. Table 2 shows the measurement results.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

Even when a lead wire plated with lead-free tin and available from a wire manufacturer is directly used as a tab terminal, it is possible to obtain a tab terminal in which tin whisker is not generated from a welded part and which exhibits good solder wettability. Its producing process is also disclosed. The tab terminal for an electrolytic capacitor is obtained by welding an aluminium core having a flat press part to the end part of a lead wire having a metal layer of tin formed on the surface of the core. The surface at the welded part between the lead wire part and the aluminium core is subjected to a treatment for suppressing growth of whisker.

Description

明 細 書  Specification
電解コンデンサ用タブ端子  Tab terminal for electrolytic capacitor
技術分野  Technical field
[0001] 本発明は、電解コンデンサに使用されるタブ端子に関し、特に、鉛フリーのスズメッ キが施されたタブ端子、およびその製造方法に関する。  The present invention relates to a tab terminal used for an electrolytic capacitor, and more particularly, to a tab terminal provided with a lead-free tin plating, and a method for manufacturing the same.
背景技術  Background art
[0002] 電解コンデンサは、タンタルやアルミニウム等の弁作用金属からなる陽極電極箔と 陰極電極箔とをセパレータを介して卷回してコンデンサ素子を形成し、このコンデン サ素子に液状電解質または固体電解質を保持させ、これを外装ケース内に収納して 製造される。この陽極電極箔と陰極電極箔とには、それぞれの電極を外部に接続す るためのタブ端子力 ステッチボンドや超音波溶接等の公知の手段により接合されて いる。  [0002] An electrolytic capacitor is formed by winding an anode electrode foil and a cathode electrode foil made of a valve metal such as tantalum or aluminum through a separator to form a capacitor element. It is manufactured by holding it and storing it in an outer case. The anode electrode foil and the cathode electrode foil are joined by a known means such as stitch bonding or ultrasonic welding for connecting the respective electrodes to the outside.
[0003] タブ端子は、扁平部、丸棒部、およびリード線部の三つの部分から構成されている 。扁平部は電極箔に接合される部分であり、丸棒部は、外装ケースを密封する封口 体に貫通挿入される部分であり、また、リード線部は、回路基板に実装される引出し 部分であり、実装時の取扱性を確保するために柔軟性を持つリード線が使用される。  [0003] The tab terminal is composed of three parts: a flat part, a round bar part, and a lead wire part. The flat part is the part that is joined to the electrode foil, the round bar part is the part that is inserted through the sealing body that seals the outer case, and the lead wire part is the lead part that is mounted on the circuit board. Yes, a flexible lead wire is used to ensure ease of handling during mounting.
[0004] このような三つの部分力 構成されるタブ端子は、通常、 2種類の部材を溶接するこ とによって作製される。すなわち、アルミ材等からなる芯線を用いて扁平部と丸棒部と を形成し、この丸棒部にリード線を溶接することによって作製される。また、電解コン デンサは回路基板にハンダを用いて実装されることから、ハンダ付け特性の向上の ため、リード線の表面にスズゃ鉛を含有するスズでメツキしたものが使用されている。  [0004] Such a tab terminal having three partial forces is usually produced by welding two types of members. That is, a flat portion and a round bar portion are formed using a core wire made of an aluminum material or the like, and a lead wire is welded to the round bar portion. In addition, since the electrolytic capacitor is mounted on the circuit board using solder, in order to improve the soldering characteristics, a lead wire whose surface is tinned with tin-lead containing tin is used.
[0005] 近年、環境に配慮して、電子部品の電極端子の無鉛化や電子部品の接合に無鉛 ハンダを使用することが始められている。電子部材として用いるリード線においても、 従来の鉛含有スズメツキに替わり、鉛を用いなレ、、いわゆる鉛フリーのスズメツキが使 用され始めている。このような鉛フリーのスズメツキが施されたリード線を用いたタブ端 子では、アルミ丸棒部とリード線部との溶接部分にスズのゥイス力が発生するという問 題があった。このスズゥイス力は経時的に成長するため、タブ端子製造直後にウイスカ を除去しても、その後に徐々にゥイス力が成長する。従って、電解コンデンサを回路 基板に実装した後に、陽極側のリード線から発生したゥイス力と陰極側のリード線から 発生したウイスカとが互いに接合したり、あるいは、リード線部に発生したゥイス力が回 路基板の表面まで達して電解コンデンサの漏れ電流を増大させたり、ショートを発生 さ tる恐れちある。 [0005] In recent years, in consideration of the environment, lead-free soldering has been started for lead-free electrode terminals of electronic components and for joining electronic components. For lead wires used as electronic components, lead-free tin balls, so-called lead-free tin balls, are beginning to be used instead of conventional lead-containing tin balls. In such a tab terminal using a lead wire provided with a lead-free tin plating, there was a problem that tin dies were generated at a welding portion between the aluminum round bar portion and the lead wire portion. Since this tin force grows over time, the whisker Even after removing, the power gradually grows thereafter. Therefore, after mounting the electrolytic capacitor on the circuit board, the force generated from the lead wire on the anode side and the whisker generated from the lead wire on the cathode side are bonded to each other, or the force generated on the lead wire portion is reduced. The leakage current of the electrolytic capacitor may reach the surface of the circuit board, and a short circuit may occur.
[0006] このような問題に対し、溶接部からのスズゥイス力の発生を抑制するため、特開 200 0—12386号公報には、 0. 5— 10. Owt%のビスマス等の金属を含有するスズからな る金属層を設けたリード線を使用することが開示されている。スズにビスマス等の金属 を含有させることにより、ゥイス力の発生を抑制することができる。  [0006] In order to suppress the generation of tin-ice force from a welded portion in order to solve such a problem, Japanese Patent Application Laid-Open No. 2000-12386 discloses 0.5-10 Owt% of a metal such as bismuth. The use of a lead provided with a metal layer made of tin is disclosed. By adding a metal such as bismuth to tin, the generation of a zinc force can be suppressed.
[0007] し力 ながら、リード線表面に、ビスマスを含有するスズからなる金属層を設けるた めには、ビスマスを所定量含有するスズ合金のメツキを施す必要がある。従って、線 材メーカー等から入手できる鉛フリーのスズメツキされたリード線をタブ端子の製造に 直接用いることができず、別途メツキ工程を必要とする。このように線材メーカー等か ら入手できるリード線をそのまま使用してタブ端子を製造することができれば、製造ェ 程も複雑とならず、製造コストを増大させることもない。  [0007] However, in order to provide a metal layer made of tin containing bismuth on the surface of the lead wire, it is necessary to apply tin alloy containing a predetermined amount of bismuth. Therefore, lead-free tin-plated lead wires available from wire manufacturers cannot be used directly for the production of tab terminals, and a separate plating step is required. As described above, if the tab terminal can be manufactured by using the lead wire available from a wire manufacturer or the like as it is, the manufacturing process does not become complicated and the manufacturing cost does not increase.
[0008] また、ゥイス力が発生する部位はアルミ芯線とリード線との溶接部のみであるのに対 し、ビスマス/スズ合金メッキはリード線全体に施されているため、ウイスカ発生しない 部分のメツキ処理が無駄になりコスト上昇を招く。  [0008] In addition, while the portion where the force is generated is only the welded portion between the aluminum core wire and the lead wire, bismuth / tin alloy plating is applied to the entire lead wire, so that the portion where no whisker is generated is formed. The plating process is wasted, resulting in an increase in cost.
[0009] さらに、スズに添加するビスマスの含有量が多くなると、ハンダ濡れ性等のメツキ特 性が変化してしまう。  [0009] Further, when the content of bismuth added to tin increases, plating characteristics such as solder wettability change.
発明の開示  Disclosure of the invention
[0010] 本発明者らは、今般、スズメツキされたリード線の表面に酸化スズを形成することに より、ハンダ濡れ性を損ねることなぐゥイス力の発生が抑制できるとの知見を得た。本 発明は力かる知見によるものである。  [0010] The present inventors have now found that formation of tin oxide on the surface of a tinned lead wire can suppress the generation of a force that does not impair solder wettability. The present invention is based on strong knowledge.
[0011] したがって、本発明の目的は、線材メーカー等から入手できる、鉛フリーのスズメッ キが施されたリード線を、そのままタブ端子に使用した場合であっても、溶接部分から スズゥイス力が発生せず、かつ、ハンダ濡れ性が良好なタブ端子、およびその製造方 法を提供することにある。 [0012] 本発明による電解コンデンサ用タブ端子は、芯材表面にスズからなる金属層が形 成されてなるリード線端部に、圧扁部を有するアルミ芯線が溶接されてなる電解コン デンサ用タブ端子であって、前記リード線部と前記アルミ芯線との溶接部表面に、ゥ イス力の成長抑制処理が施されていることを特徴とする。このように、ゥイス力の発生場 所であるアルミ芯線とリード線との溶接部分の表面に、ウイスカ発生抑制処理を施す ことにより、当該溶接部分からスズゥイス力が経時的に成長するのを抑制することがで きる。 [0011] Accordingly, an object of the present invention is to generate a tin-based force from a welded portion even when a lead-free tin-plated lead wire available from a wire material manufacturer or the like is used as it is for a tab terminal. An object of the present invention is to provide a tab terminal that does not perform soldering and has good solder wettability, and a method of manufacturing the same. [0012] A tab terminal for an electrolytic capacitor according to the present invention is for an electrolytic capacitor in which an aluminum core wire having a pressed portion is welded to a lead wire end in which a metal layer made of tin is formed on the surface of a core material. A tab terminal, wherein a surface of a welded portion between the lead wire portion and the aluminum core wire is subjected to a die force growth suppressing process. In this way, by performing the whisker generation suppression process on the surface of the welded portion between the aluminum core wire and the lead wire, which is the place where the die force is generated, the tin die force is prevented from growing over time from the welded portion. be able to.
[0013] 本発明の好ましい態様として、前記のウイスカ抑制処理は、酸化スズ形成処理であ る。このように溶接部表面に形成されたスズを酸化して、少なくとも SnOまたは Sn〇  [0013] As a preferred embodiment of the present invention, the whisker suppression treatment is a tin oxide formation treatment. The tin formed on the surface of the weld is oxidized to at least SnO or SnO.
2 に変性することにより、当該溶接部分から発生するウイスカを効果的に抑制することが できる。  By changing to 2, the whiskers generated from the welded portion can be effectively suppressed.
[0014] また、前記酸化スズ形成処理は、タブ端子の熱処理により行われることが好ましぐ 前記熱処理温度は 60°C— 180°C、特に 80°C— 150°Cの範囲であることがより好まし レ、。このような温度範囲において酸素雰囲気下でタブ端子を熱処理し、スズメツキの 表面に酸化スズを形成することにより、タブ端子のハンダ濡れ性を損なわずに、ゥイス 力発生が抑制されたタブ端子を得ることができる。  Further, the tin oxide forming treatment is preferably performed by a heat treatment of the tab terminal. The heat treatment temperature is preferably in a range of 60 ° C. to 180 ° C., particularly 80 ° C. to 150 ° C. More preferred Les ,. The tab terminal is heat-treated in an oxygen atmosphere in such a temperature range, and tin oxide is formed on the surface of the tin plate, thereby obtaining a tab terminal with reduced power generation without impairing the solder wettability of the tab terminal. be able to.
[0015] さらに、前記酸化スズ形成処理は、溶剤処理によっても行うことができる。酸化スズ の形成を溶剤処理により行うことで、タブ端子中で、ウイスカ発生処理が必要な部分 のみを選択的にウイスカ発生抑制処理することができる。  [0015] Further, the tin oxide forming treatment can also be performed by a solvent treatment. By performing the tin oxide formation by solvent treatment, it is possible to selectively perform the whisker generation suppression treatment only on the portion of the tab terminal that requires the whisker generation treatment.
[0016] 前記の溶剤は、珪酸塩、ホウ酸塩、リン酸塩、および硫酸塩からなる群から選択さ れる無機酸塩の水溶液であることが好ましぐさらにアンモニゥム塩を含んでなる水溶 液であることが好ましい。このような水溶液を用いて溶剤処理を行うことにより、ハンダ 濡れ性を損なわない程度に、スズ表面に酸化スズを形成することができ、ウイスカ発 生の抑制効果が得られる。  [0016] The solvent is preferably an aqueous solution of an inorganic acid salt selected from the group consisting of silicates, borates, phosphates, and sulfates, and an aqueous solution further containing an ammonium salt. It is preferable that By performing solvent treatment using such an aqueous solution, tin oxide can be formed on the tin surface to the extent that solder wettability is not impaired, and the effect of suppressing whisker generation can be obtained.
[0017] また、溶剤によるウイスカ抑制処理は、上記の熱処理と併用して行うこともできる。こ のように熱処理と溶剤処理とを行うことにより更なるウイスカ抑制効果が得られる。  [0017] The whisker suppression treatment using a solvent can also be performed in combination with the above heat treatment. By performing the heat treatment and the solvent treatment in this manner, a further whisker suppression effect can be obtained.
[0018] 本発明の別の態様として、本発明による電解コンデンサ用タブ端子の製造方法は、 芯材表面にスズからなる金属層が形成されてなるリード線端部に、圧扁部を有するァ ルミ芯線を溶接する工程、および溶接直後に、前記溶接部分に溶剤を塗布して付着 させる工程、を含んでなるものである。 [0018] As another aspect of the present invention, a method of manufacturing a tab terminal for an electrolytic capacitor according to the present invention comprises: A step of welding a lumi-core wire and a step of applying and attaching a solvent to the welded portion immediately after welding.
[0019] また、別の態様として、本発明による電解コンデンサ用タブ端子の製造方法は、芯 材表面にスズからなる金属層が形成されてなるリード線端部に、圧扁部を有するアル ミ芯線を溶接してタブ端子を準備する工程、および前記溶接されたタブ端子を、熱処 理する工程を含んでなるものである。  Further, as another aspect, the method for manufacturing a tab terminal for an electrolytic capacitor according to the present invention provides an aluminum capacitor having a pressing portion at an end of a lead wire having a metal layer made of tin formed on a surface of a core material. A step of preparing a tab terminal by welding a core wire; and a step of heat-treating the welded tab terminal.
発明を実施するための最良の形態  BEST MODE FOR CARRYING OUT THE INVENTION
[0020] 以下、本発明の実施形態の一例に係るタブ端子およびその製造方法について説 明する。 Hereinafter, a tab terminal and a method for manufacturing the same according to an embodiment of the present invention will be described.
本発明の電解コンデンサ用タブ端子は、芯材表面にスズからなる金属層が形成さ れてなるリード線端部に、圧扁部を有するアルミ芯線が溶接されてなる構造を有し、 このリード線とアルミ芯線との溶接部に、ゥイス力の成長抑制処理が施されている。本 発明のタブ端子を構成するリード線はスズメツキが施されており、このスズメツキを設 けるまでの製造工程は、通常の製造方法を使用できる。また、リード線は、市販の鉛 フリーのスズメツキが施された CP線(引き込み線)等を使用することができる。  The tab terminal for an electrolytic capacitor of the present invention has a structure in which an aluminum core wire having a pressed portion is welded to a lead wire end in which a metal layer made of tin is formed on the surface of a core material. The welding between the wire and the aluminum core wire has been subjected to a growth control process for steel force. The lead wire that constitutes the tab terminal of the present invention is provided with a tin plate, and a normal manufacturing method can be used in a manufacturing process until the tin plate is provided. In addition, as the lead wire, a commercially available lead-free tinted CP wire (lead wire) or the like can be used.
[0021] リード線の太さや長さも、特に限定されるものではなぐ電解コンデンサの要求特性 に応じて、種々の CP線を使用することができる。なお、 CP線は、導電特性の観点か ら、鉄コア Z銅シース型のものが通常用いられる。 The thickness and length of the lead wire are not particularly limited, and various CP wires can be used according to the required characteristics of the electrolytic capacitor. Note that, as the CP wire, an iron core Z copper sheath type is usually used from the viewpoint of conductive properties.
[0022] 本発明のタブ端子を構成するアルミ芯線も、従来のタブ端子に使用されているもの を使用することができ、市販のものを用いることができる。  [0022] As the aluminum core wire constituting the tab terminal of the present invention, those used for conventional tab terminals can be used, and commercially available ones can be used.
[0023] アルミ芯線は電解コンデンサの電極として機能するものであり、その一端部は扁平 状に圧扁された形状を有している。圧扁部は従来技術により形成することができる。 例えば、アルミ芯線をプレス加工して所定形状に切断することにより、所定形状の圧 扁部を有するアルミ芯線を作製することができる。圧扁部を所定形状に切断するェ 程は、プレス加工と同時に行うこともできる。  The aluminum core wire functions as an electrode of an electrolytic capacitor, and one end of the aluminum core wire has a flattened shape. The pressing portion can be formed by a conventional technique. For example, by pressing an aluminum core wire and cutting it into a predetermined shape, an aluminum core wire having a compressed portion having a predetermined shape can be manufactured. The step of cutting the pressed portion into a predetermined shape can be performed simultaneously with the press working.
[0024] 上記のリード線およびアルミ芯線を、従来の方法により接合して、タブ端子の形状と すること力 Sできる。例えば、火花放電等により、アルミ芯線とリード線との両端を溶解し て接合する方法等により両者を接合することができる。このようにして作製されたタブ 端子の、アルミ芯線とリード線との溶接部分に、ウイスカ成長抑制処理を施すことによ り、本発明のタブ端子を製造できる。 [0024] The lead wire and the aluminum core wire can be joined by a conventional method to form a tab terminal. For example, both ends of the aluminum core wire and the lead wire can be joined by melting and joining both ends of the aluminum core wire and the lead wire by spark discharge or the like. The tab made in this way The tab terminal of the present invention can be manufactured by performing a whisker growth suppression treatment on the welded portion between the aluminum core wire and the lead wire of the terminal.
[0025] 本発明者らは、タブ端子の溶接部分付近から発生するゥイス力が、スズ金属単体か らなるものであることを確認した。そして、溶接部分に存在するスズをあらかじめ酸化 スズに変成しておくことで、経時的に発生するウイスカを抑制できるとの知見を得た。 すなわち、本願発明は、ウイスカ発生原因に着目し、タブ端子の処理方法とウイスカ 発生との関係について鋭意検討をした結果、導き出されたものである。  [0025] The present inventors have confirmed that the die force generated near the welded portion of the tab terminal is composed of tin metal alone. And, it has been found that whiskers generated over time can be suppressed by converting tin existing in the welded portion into tin oxide in advance. In other words, the present invention has been derived as a result of intensive studies on the relationship between the tab terminal processing method and the occurrence of whiskers, focusing on the cause of whisker generation.
[0026] 本発明者らの知見によれば、スズゥイス力はスズからなる単体金属で構成されてお り、リード線表面に設けられたスズメツキに由来するものと推定され、リード線全体にゥ イス力が発生するものではなぐリード線とアルミ芯線との溶接部分のみに集中してス ズゥイス力が発生する。その理由は以下のように考えられる。すなわち、接合部分で は、溶接時の残留応力が残されたまま、アルミ、銅およびスズ等の金属が固化する。 スズは、アルミや銅と異なり融点が低く(232°C)、また、低温 (数十。 C)において結晶 変態を起こし得る。このような残留応力(ひずみ)が残されている状態においては、常 温においてもスズの結晶変態が進み、針状のウイスカとなって溶接部分から現れるも のと推定される。  [0026] According to the findings of the present inventors, the tin dicing force is composed of a simple metal made of tin, and it is estimated that the tin dicing force is derived from a tin plate provided on the surface of the lead wire. The force is generated only at the welded portion between the lead wire and the aluminum core wire where no force is generated. The reason is considered as follows. That is, at the joint, metals such as aluminum, copper, and tin solidify while the residual stress during welding remains. Tin, unlike aluminum and copper, has a low melting point (232 ° C) and can undergo crystal transformation at low temperatures (tens of degrees C). In the state where such residual stress (strain) remains, it is presumed that the tin crystal transformation proceeds even at room temperature and turns into needle-like whiskers, which appear from the welded portion.
[0027] スズゥイス力の成長は、数ケ月のオーダーで徐々に進行するため、タブ端子製造直 後にウイスカ除去を行っても、根本的な解決にはならないことに留意するべきである。 すなわち、本発明者らの知見によれば、ゥイス力の成長自体を抑制する必要があると レ、うことである。  [0027] It should be noted that the whisker removal performed immediately after the production of the tab terminal does not provide a fundamental solution since the growth of the tin die force gradually progresses in the order of several months. That is, according to the findings of the present inventors, it is necessary to suppress the growth of the power itself.
[0028] 本発明においては、スズの結晶成長を抑制するために、溶接部分の残留応力を取 りのぞき、かつ、スズを酸化スズに変性し、その結果としてウイス力の発生を抑制する ものである。このように溶接部分のスズを酸化スズに変性することで、スズの結晶変態 も起こらず、スズの結晶成長が効果的に抑制されることは予想外のことであった。  [0028] In the present invention, in order to suppress the crystal growth of tin, residual stress in the welded portion is removed, and tin is transformed into tin oxide, and as a result, the generation of whis force is suppressed. is there. It was unexpected that the modification of tin in the welded portion to tin oxide does not cause tin crystal transformation and effectively suppresses tin crystal growth.
[0029] 本発明では、 60— 180°Cの温度範囲において、酸素雰囲気下で、タブ端子を熱処 理することにより、タブ端子の溶接部分のスズを酸化して、スズメツキ表面に酸化スズ を形成するものである。熱処理は、タブ端子製造後(アルミ芯線とリード線との溶接後 )に行う。溶接前にスズメツキされたリード線のみを熱処理して、その後にアルミ芯線と 溶接することもできる力 溶接してタブ端子とした後に熱処理を行うことが好ましい。 溶接後にウイスカ発生抑制処理を行うことにより、溶接部分の表面に現れたスズを効 率的に酸化できる。 60°Cよりも低い温度において熱処理を行うとゥイス力発生抑制効 果が十分には得られない。一方、スズを酸化するためには高温で熱処理を行うことが 好ましいが、 180°Cを超える温度ではスズの酸化が進みすぎてリード線表面のメツキ が変色し、ハンダ濡れ性が低下してしまう。すなわち、酸素雰囲気下での熱処理によ り、溶接部の表面付近に存在する金属スズのうち一部を酸化スズ (SnOまたは Sn〇 [0029] In the present invention, tin in the welded portion of the tab terminal is oxidized by heat-treating the tab terminal in an oxygen atmosphere in a temperature range of 60 to 180 ° C, and tin oxide is formed on the surface of the tin plate. To form. The heat treatment is performed after manufacturing the tab terminals (after welding the aluminum core wire and the lead wire). Prior to welding, heat-treat only the tinned lead wire, and then Welding force It is preferable to perform heat treatment after welding to form a tab terminal. By performing whisker generation suppression treatment after welding, tin that appears on the surface of the welded portion can be efficiently oxidized. If the heat treatment is performed at a temperature lower than 60 ° C, the effect of suppressing the generation of the dysforce cannot be sufficiently obtained. On the other hand, in order to oxidize tin, it is preferable to perform heat treatment at a high temperature.However, at temperatures exceeding 180 ° C, tin oxidation proceeds too much, and the surface of the lead wire becomes discolored and solder wettability decreases. . That is, by heat treatment in an oxygen atmosphere, part of the metallic tin existing near the surface of the welded part is converted to tin oxide (SnO or Sn〇).
2 2
)に変化させることが重要である。ウイスカ発生を抑制する目的からは酸化スズの存在 は好ましいものの、金属スズのすべてが、酸化スズに酸化されてしまうと、ハンダ濡れ 性が低下するため好ましくない。本願発明のタブ端子は、金属スズと酸化スズとが適 度な割合で存在することが好ましい。このような、金属スズと酸化スズが適度な割合で 存在できる熱処理温度としては、特に、 80 150°Cの温度範囲が好ましい。熱処理 時間は、 10— 60分の範囲が好ましぐ特に、 15— 30分の範囲が好ましい。熱処理 温度同様に 60分を超えるとスズの酸化が進行しすぎて、ハンダ濡れ性に悪影響を及 ぼす。 ) Is important. Although the presence of tin oxide is preferred for the purpose of suppressing the generation of whiskers, if all of the metallic tin is oxidized to tin oxide, the solder wettability is undesirably reduced. In the tab terminal of the present invention, it is preferable that metal tin and tin oxide are present at an appropriate ratio. As such a heat treatment temperature at which metal tin and tin oxide can be present at an appropriate ratio, a temperature range of 80 to 150 ° C. is particularly preferable. The heat treatment time is preferably in the range of 10 to 60 minutes, and particularly preferably in the range of 15 to 30 minutes. If the heat treatment temperature exceeds 60 minutes, tin oxidation proceeds too much, which has an adverse effect on solder wettability.
[0030] 本発明による電解コンデンサ用タブ端子にあっては、かかる熱処理により溶接部分 に残存したひずみも緩和されているため、よりウイスカ発生を抑制することができる。 なお、熱処理は、従来から用いられている方法により行うことができ、特に限定される ものではない。  [0030] In the tab terminal for an electrolytic capacitor according to the present invention, since the strain remaining in the welded portion is also reduced by the heat treatment, whisker generation can be further suppressed. The heat treatment can be performed by a conventionally used method, and is not particularly limited.
[0031] 本発明の他の好ましい態様として、上記のウイスカ発生抑制処理を溶剤処理により 行うこともできる。溶剤処理によって、タブ端子の溶接部分のみに酸化スズを形成す ること力 Sできる。  [0031] In another preferred embodiment of the present invention, the whisker generation suppression treatment described above can be performed by a solvent treatment. Solvent treatment can form tin oxide only on the welded part of the tab terminal.
[0032] 酸化スズの形成は、タブ端子を作製した後に、無機酸の水溶液を塗布したり、無機 酸水溶液中にタブ端子を浸漬することにより行うこともできるが、本発明においては、 溶剤処理を、タブ端子製造工程中のアルミ芯線とリード線とを溶接した直後に、当該 溶接部分に無機酸水溶液を塗布し付着させることにより、行うことが好ましい。スズゥ イス力は、端子の溶接直後から発生し徐々に成長するため、まだウイス力が発生して レ、ない状態にあるときに溶剤処理を施すことにより、効果的にゥイス力の発生を抑制 できる。なお、溶接直後とは、溶接後、数ミリ秒一 1秒を言うものである。本発明におい ては、溶接後、 500ミリ秒以内、好ましくは 300ミリ秒以内に溶剤を塗布することが好 ましい。 [0032] The tin oxide can be formed by applying an aqueous solution of an inorganic acid or immersing the tab terminal in an aqueous solution of an inorganic acid after the tab terminal is manufactured. Immediately after welding the aluminum core wire and the lead wire during the tab terminal manufacturing process, it is preferable to apply and attach an aqueous solution of an inorganic acid to the welded portion. Since the tin force is generated immediately after welding of the terminal and grows gradually, solvent treatment is applied when the whis force is still generated and no whis force is generated, effectively suppressing the generation of the sui force. it can. Note that “immediately after welding” means several milliseconds to 11 seconds after welding. In the present invention, it is preferable to apply the solvent within 500 milliseconds, preferably within 300 milliseconds after welding.
[0033] 本発明の他の好ましい態様として、更に、タブ端子の洗浄時に溶剤を塗布すること が好ましい。  In another preferred embodiment of the present invention, it is preferable to further apply a solvent when cleaning the tab terminals.
[0034] さらに溶剤処理する際の、溶接部分の温度は 80 250°Cであることが好ましぐより 好ましくは 85°C 185°Cである。このように、溶接部分がある程度高温のときに溶剤 を塗布することにより酸化スズの形成を促し、それによつて、効果的にゥイス力の発生 を抑制することができる。なお、上記の温度は、溶接直後に溶剤を塗布することにより 実現できる。また、溶剤の温度範囲としては、 60— 100°Cが好ましい。  [0034] In the solvent treatment, the temperature of the welded portion is preferably 80 to 250 ° C, more preferably 85 to 185 ° C. As described above, by applying the solvent when the welded portion is at a certain high temperature, the formation of tin oxide is promoted, whereby the generation of the die force can be suppressed effectively. The above temperature can be achieved by applying a solvent immediately after welding. Further, the temperature range of the solvent is preferably from 60 to 100 ° C.
[0035] 本発明に用いられる処理溶剤としては、珪酸塩、ホウ酸塩、リン酸塩、および硫酸 塩からなる群から選択される無機酸塩を含む水溶液を用いることが好ましぐさらにァ ンモニゥム塩を含む水溶液であることが好ましい。例えば、上記無機酸塩とアンモニ ゥム塩との複塩化合物を含有する水溶液等を好適に使用できる。具体的には、ケィ フッ化アンモニゥム水溶液等が挙げられる力 これに限定されるものではなレ、。  [0035] As the treatment solvent used in the present invention, it is preferable to use an aqueous solution containing an inorganic acid salt selected from the group consisting of silicates, borates, phosphates, and sulfates. It is preferably an aqueous solution containing a salt. For example, an aqueous solution containing a double salt compound of the above-mentioned inorganic acid salt and ammonium salt can be suitably used. More specifically, the strength of an aqueous solution of ammonium fluoride is not limited to this.
[0036] 上記の処理溶剤を用いることにより、ハンダ濡れ性に悪影響を及ぼさない程度にス ズを酸化することができる。本発明のタブ端子においては、上記のごとぐウイスカ発 生抑制の面からは、溶接部分に酸化スズが形成されていることが好ましいが、金属ス ズのすべてを酸化スズに酸化してしまうとハンダ濡れ性が悪化する。従って、金属ス ズと酸化スズとの割合が適当である必要がある。上記の無機酸塩やアンモニゥム塩を 含む水溶液を用いて金属スズを酸化することにより、金属スズと酸化スズとの割合を 適切にすることが可能となる。上記水溶液の濃度は、 1一 10重量%であることが好ま しい。  [0036] By using the above treatment solvent, the tin can be oxidized to such an extent that the solder wettability is not adversely affected. In the tab terminal of the present invention, from the viewpoint of suppressing whisker generation as described above, it is preferable that tin oxide is formed in the welded portion, but if all of the metal tin is oxidized to tin oxide. Solder wettability deteriorates. Therefore, the ratio between metal tin and tin oxide needs to be appropriate. By oxidizing metal tin using an aqueous solution containing the above-mentioned inorganic acid salt or ammonium salt, the ratio of metal tin to tin oxide can be made appropriate. The concentration of the aqueous solution is preferably 110% by weight.
実施例  Example
[0037] リード線としてスズ 100%のメツキを施した、鉄/銅からなる引き込み線 (CP線)と、 アルミ芯線とを、それぞれ所定の長さに切断した。この切断されたリード線とアルミ芯 線とをアーク放電にて溶接した後、アルミ芯線部分をプレス加工により圧扁することに よりタブ端子 1を得た。得られたタブ端子 1をパラフィン系溶剤により脱脂洗浄処理を 行い、 80°C X 12分、熱風乾燥を行った。 [0037] A lead wire (CP wire) made of iron / copper and an aluminum core wire, each of which was provided with a 100% tin plating as a lead wire, were cut into predetermined lengths. After the cut lead wire and the aluminum core wire were welded by arc discharge, the tab portion 1 was obtained by pressing the aluminum core wire portion by pressing. The obtained tab terminal 1 is degreased and washed with a paraffinic solvent. Then, hot air drying was performed at 80 ° C for 12 minutes.
[0038] 脱脂処理を行ったタブ端子 1を、表 1に示す温度にて 20分間、恒温恒湿器 (PVH-[0038] The degreased tab terminal 1 is placed in a thermo-hygrostat (PVH-
110 :タバイエスペック製)を用いて熱処理を行った(実施例 1一 4、および比較例 1)。 また、熱処理を行わなレ、試料を比較例 2とした。 110: manufactured by Tabai Espec Corp.) (Examples 14 to 14 and Comparative Example 1). In addition, the sample which was not subjected to the heat treatment was Comparative Example 2.
[0039] 次に、熱処理を行った試料 (実施例)および熱処理を行わなかった試料 (比較例) のウイスカを観察するため、 60°C X 90。/oRHの条件において 250時間加速試験を行 つた。加速試験後、各試料の溶接部に発生したウイスカを 30倍の光学顕微鏡を用い て観察し、タブ端子の溶接部分に発生したゥイス力の長さを測定した。 Next, to observe the whiskers of the sample subjected to the heat treatment (Example) and the sample not subjected to the heat treatment (Comparative Example), the temperature was set to 60 ° C. × 90. A 250-hour accelerated test was performed under the condition of / oRH. After the accelerated test, whiskers generated in the welds of each sample were observed using a 30-fold optical microscope, and the length of the die force generated in the tab terminal welds was measured.
[0040] さらに、上記の加速試験を行う前の各試料のハンダ濡れ性を調べるため、 JIS C-0[0040] Further, in order to examine the solder wettability of each sample before performing the above-mentioned accelerated test, JIS C-0
053はんだ付け試験方法(平衡法)によりゼロクロス時間(ZCT値)を測定した。測定 結果を表 1に示す。 The zero crossing time (ZCT value) was measured by the 053 soldering test method (equilibrium method). Table 1 shows the measurement results.
[表 1]  [table 1]
表 1  table 1
Figure imgf000009_0001
Figure imgf000009_0001
[0041] 次に、上記のタブ端子 1を、 1. 0重量%のメタ珪酸ナトリウム水溶液中に 120°Cで 2 分間浸漬して溶剤処理を行い、試料 6を得た。得られた試料について、 60°C X 90% RHの条件において 250時間加速試験を行った。加速試験後、上記と同様の測定方 法により、タブ端子の溶接部分に発生したゥイス力の長さを測定した。また、上記と同 様にして溶液処理した試料のハンダ濡れ性を測定した。測定結果を表 2に示す。 Next, the tab terminal 1 described above was immersed in a 1.0% by weight aqueous solution of sodium metasilicate at 120 ° C. for 2 minutes to perform a solvent treatment to obtain a sample 6. The obtained sample was subjected to an acceleration test for 250 hours under the conditions of 60 ° C. and 90% RH. After the acceleration test, the length of the force generated at the welding portion of the tab terminal was measured by the same measuring method as described above. Further, the solder wettability of the sample subjected to the solution treatment in the same manner as above was measured. Table 2 shows the measurement results.
[0042] また、上記のリード線とアルミ芯線とをアーク放電にて溶接後 300ms以内に、溶接 部分に 5重量%のケィフッ化アンモニゥム水溶液を塗布して付着させた。その後、上 記と同様にしてアルミ芯線部分をプレス加工により圧扁することによりタブ端子 2 (試 料 7)を得た。得られたタブ端子 2をパラフィン系溶剤により脱脂洗浄処理を行い、 80 °C X 12分、熱風乾燥を行った。 [0042] Further, within 300 ms after welding the above-mentioned lead wire and aluminum core wire by arc discharge, a 5% by weight aqueous solution of ammonium fluoride was applied and adhered to the welded portion. Then, press the aluminum core wire by pressing in the same manner as above to make tab terminal 2 (test Fee 7). The obtained tab terminal 2 was degreased and washed with a paraffin-based solvent, and dried with hot air at 80 ° C for 12 minutes.
得られた試料 6および 7について、上記と同様にして加速試験を行い、ゥイス力の長 さ、およびハンダ濡れ性について測定を行った。結果は表 2に示される通りであった  The obtained samples 6 and 7 were subjected to an acceleration test in the same manner as above, and the length of the die force and the solder wettability were measured. The results were as shown in Table 2
[表 2] [Table 2]
表 2  Table 2
ウイスカ長さ Z CT値  Whisker length Z CT value
麵溶剤 ハンダ濡れ性  麵 Solvent solder wettability
(mm) (秒) 離 6 (錢例 4) メタ珪酸ナトリゥム 0. 15 2. 40 〇 ケィフッ化  (mm) (s) Separation 6 (Example 4) Sodium metasilicate 0.15 2.40
謝 7 (纖例 5) 0. 086 2. 35 〇  X7 (Fibre Example 5) 0.086 2.35 〇
アンモニゥム 顯 5 (比較例 2) なし 0. 23 2. 50 〇  Ammonium 5 (Comparative Example 2) None 0.23 2.50 〇

Claims

請求の範囲 The scope of the claims
[I] 芯材表面にスズからなる金属層が形成されてなるリード線端部に、圧扁部を有する アルミ芯線が溶接されてなる電解コンデンサ用タブ端子であって、前記リード線と前 記アルミ芯線との溶接部に、ゥイス力の成長抑制処理が施されてなる、電解コンデン サ用タブ端子。  [I] A tab terminal for an electrolytic capacitor in which an aluminum core wire having a pressed portion is welded to an end portion of a lead wire having a metal layer made of tin formed on a core material surface, wherein the lead wire and the lead wire are connected to each other. A tab terminal for electrolytic capacitors in which the welded part with the aluminum core wire is treated to suppress the growth of wire force.
[2] 前記のウイスカ抑制処理が、酸化スズ形成処理である、請求項 1に記載のタブ端子  [2] The tab terminal according to claim 1, wherein the whisker suppression treatment is a tin oxide formation treatment.
[3] 前記の酸化スズ形成処理により、前記リード線と前記アルミ芯線との溶接部に少な くとも SnOまたは Sn〇が含まれてなる、請求項 2に記載のタブ端子。 3. The tab terminal according to claim 2, wherein the tin oxide forming treatment causes at least SnO or Sn〇 to be contained in a welded portion between the lead wire and the aluminum core wire.
2  2
[4] 前記の酸化スズ形成処理が、タブ端子を熱処理することにより行われる、請求項 1 一 3のいずれか 1項に記載のタブ端子。  4. The tab terminal according to claim 1, wherein the tin oxide forming treatment is performed by heat-treating the tab terminal.
[5] 前記熱処理が、 60— 180°Cの範囲において酸素雰囲気下で行われる、請求項 4 に記載のタブ端子。 [5] The tab terminal according to claim 4, wherein the heat treatment is performed in an oxygen atmosphere in a range of 60 to 180 ° C.
[6] 前記熱処理が、 80— 150°Cの範囲において酸素雰囲気下で行われる、請求項 4 に記載のタブ端子。  [6] The tab terminal according to claim 4, wherein the heat treatment is performed in an oxygen atmosphere at a temperature in the range of 80 to 150 ° C.
[7] 前記の酸化スズ形成処理が、溶剤処理により行われる、請求項 1一 3のいずれか 1 項に記載のタブ端子。  7. The tab terminal according to claim 13, wherein the tin oxide forming treatment is performed by a solvent treatment.
[8] 前記溶剤処理が、リード線端部にアルミ芯線を溶接した直後に行われるものである [8] The solvent treatment is performed immediately after welding the aluminum core wire to the end of the lead wire.
、請求項 7に記載のタブ端子。 The tab terminal according to claim 7.
[9] 前記溶剤が、珪酸塩、ホウ酸塩、リン酸塩、硫酸塩、およびこれらの混合物からなる 群から選択される無機酸塩を含んでなる水溶液である、請求項 7に記載のタブ端子。 [9] The tab according to claim 7, wherein the solvent is an aqueous solution containing an inorganic acid salt selected from the group consisting of silicates, borates, phosphates, sulfates, and mixtures thereof. Terminal.
[10] 前記溶剤が、さらにアンモニゥム塩を含んでなる水溶液である、請求項 9に記載の タブ端子。 [10] The tab terminal according to claim 9, wherein the solvent is an aqueous solution further containing an ammonium salt.
[II] 前記水溶液の濃度が、 1一 10重量%である、請求項 9または 10に記載のタブ端子  [II] The tab terminal according to claim 9 or 10, wherein the concentration of the aqueous solution is 1 to 10% by weight.
[12] 請求項 1一 11に記載のタブ端子の製造方法であって、 [12] The method for manufacturing a tab terminal according to claim 11, wherein
芯材表面にスズからなる金属層が形成されてなるリード線端部に、圧扁部を有する アルミ芯線を溶接してタブ端子を準備する工程、および 前記溶接されたタブ端子を、熱処理する工程、 A step of preparing a tab terminal by welding an aluminum core wire having a pressing portion to an end of a lead wire in which a metal layer made of tin is formed on a core material surface, and Heat-treating the welded tab terminal,
を含んでなる、タブ端子の製造方法。  A method for manufacturing a tab terminal.
[13] 前記熱処理が、 60— 180°Cの範囲において酸素雰囲気下で行われる、請求項 12 に記載の製造方法。  13. The production method according to claim 12, wherein the heat treatment is performed in an oxygen atmosphere at a temperature in the range of 60 to 180 ° C.
[14] 前記熱処理が、 80— 150°Cの範囲において酸素雰囲気下で行われる、請求項 12 に記載の製造方法。  [14] The production method according to claim 12, wherein the heat treatment is performed in an oxygen atmosphere at a temperature in the range of 80 to 150 ° C.
[15] 請求項 1一 11に記載のタブ端子の製造方法であって、 [15] The method for producing a tab terminal according to claim 11, wherein
芯材表面にスズからなる金属層が形成されてなるリード線端部に、圧扁部を有する アルミ芯線を溶接する工程、および  A step of welding an aluminum core wire having a pressing portion to an end of a lead wire in which a metal layer made of tin is formed on the surface of the core material, and
前記溶接部分に溶剤を塗布して付着させる工程、  A step of applying and attaching a solvent to the welded portion,
を含んでなる、タブ端子の製造方法。  A method for manufacturing a tab terminal.
[16] 前記の溶剤を付着させる工程を、溶接直後に行う、請求項 15に記載の製造方法。 16. The production method according to claim 15, wherein the step of attaching the solvent is performed immediately after welding.
[17] 前記の溶剤を付着させる工程を、更に、タブ端子の洗浄時に行う、請求項 16に記 載の製造方法。 17. The production method according to claim 16, wherein the step of attaching the solvent is further performed at the time of cleaning the tab terminal.
[18] 前記溶剤が、珪酸塩、ホウ酸塩、リン酸塩、硫酸塩、およびこれらの混合物からなる 群から選択される無機酸塩を含んでなる水溶液である、請求項 15— 17のいずれ力 1 項に記載の製造方法。  18. The method according to claim 15, wherein the solvent is an aqueous solution containing an inorganic acid salt selected from the group consisting of silicates, borates, phosphates, sulfates, and mixtures thereof. The manufacturing method according to item 1.
[19] 前記溶剤が、さらにアンモニゥム塩を含んでなる水溶液である、請求項 18に記載の 製造方法。  [19] The method according to claim 18, wherein the solvent is an aqueous solution further containing an ammonium salt.
[20] 前記水溶液の濃度が、 0. 5— 10重量%である、請求項 18または 19に記載の製造 方法。  [20] The production method according to claim 18 or 19, wherein the concentration of the aqueous solution is 0.5 to 10% by weight.
[21] 前記溶接部分に溶剤を塗布する際の、溶接部分の温度が、 80 250°Cである、請 求項 15— 20のいずれ力 4項に記載の製造方法。  21. The method according to claim 15, wherein the temperature of the welded portion when applying a solvent to the welded portion is 80 to 250 ° C.
[22] 前記溶剤の温度が、 60 100°Cである、請求項 15 21のいずれ力、 1項に記載の 製造方法。 22. The method according to claim 15, wherein the temperature of the solvent is 60 to 100 ° C.
PCT/JP2004/008756 2003-12-25 2004-06-22 Tab terminal for electrolytic capacitor WO2005064628A1 (en)

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JP2012182326A (en) * 2011-03-01 2012-09-20 Yokohama Rubber Co Ltd:The Electrolytic capacitor
DE102018109059B4 (en) * 2018-01-15 2020-07-23 Doduco Solutions Gmbh Electrical press-in contact pin

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09186053A (en) * 1995-12-28 1997-07-15 Matsushita Electric Ind Co Ltd Electrode terminal for aluminum electrolytic capacitor
JP2000124073A (en) * 1998-10-14 2000-04-28 Matsushita Electric Ind Co Ltd Aluminum electrolytic capacitor

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09186053A (en) * 1995-12-28 1997-07-15 Matsushita Electric Ind Co Ltd Electrode terminal for aluminum electrolytic capacitor
JP2000124073A (en) * 1998-10-14 2000-04-28 Matsushita Electric Ind Co Ltd Aluminum electrolytic capacitor

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