WO2005062089A1 - Solid state light device - Google Patents
Solid state light device Download PDFInfo
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- WO2005062089A1 WO2005062089A1 PCT/US2004/035709 US2004035709W WO2005062089A1 WO 2005062089 A1 WO2005062089 A1 WO 2005062089A1 US 2004035709 W US2004035709 W US 2004035709W WO 2005062089 A1 WO2005062089 A1 WO 2005062089A1
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- Prior art keywords
- emitting device
- photon emitting
- optical
- led dies
- fibers
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/61—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using light guides
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/20—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by refractors, transparent cover plates, light guides or filters
- F21S41/24—Light guides
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
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Definitions
- the present invention relates to an illumination or light device and system. More particularly, the present invention relates to a solid state light device and system that may replace current high intensity directed light sources.
- Illumination systems are used in a variety of applications. Home, medical, dental, and industrial applications often require light to be made available. Similarly, aircraft, marine, and automotive applications often require high-intensity illumination beams.
- Traditional lighting systems have used electrically powered filament or arc lamps, which sometimes include focusing lenses and/or reflective surfaces to direct the produced illumination into a beam.
- Conventional light sources based on powered filament or arc lamps, such as incandescent or. discharge bulbs radiate both heat and light in 360 degrees.
- the reflecting/focusing/collecting optics used in a conventional headlight must be designed and/or specially treated to withstand the constant heating effects caused by the high intensity (and high heat) discharge bulbs.
- these conventional headlights require sophisticated reflection optics to provide an industry requirements-based illumination output pattern.
- Some current alternative approaches use a package of high power LEDs as the light source. The light emitted by such a source is directed with the aide of focusing optics into a single optical waveguide, such as a large core plastic optical fiber, that transmits the light to a location that is remote from the source/sources, hi yet another approach, the single fiber may be replaced by a bundle of individual optical fibers.
- These present systems are inefficient, with approximately 70% loss of the light generated in some cases. In multiple fiber systems, these losses may be due to the dark interstitial spaces between fibers in a bundle and the efficiencies of directing the light into the fiber bundle.
- photon emitting device comprises a plurality of solid state radiation sources to generate radiation.
- the solid state radiation sources can be disposed in an array pattern.
- Optical concentrators arranged in a corresponding array pattern, receive radiation from corresponding solid state radiation sources.
- the concentrated radiation is received by a plurality of optical waveguides, also arranged in a corresponding array pattern.
- Each optical waveguide includes a first end to receive the radiation and a second end to output the radiation.
- a support structure is provided to stabilize the plurality of optical waveguides between the first and second ends.
- the radiation sources are individual LED dies or chips, or laser diodes.
- the waveguides may include optical fibers, such as polymer clad silica fibers.
- the first ends of the plurality of optical waveguides receive the radiation emitted from the radiation sources.
- the second ends of the plurality of optical waveguides may be bundled or arrayed to form a single radiation illumination source when illuminated.
- the optical concentrators can be non-imaging optical concentrators, such as reflective couplers, that couple and concentrate light emitted from the radiation sources to provide useable emission to be guided through the corresponding optical waveguides.
- each optical concentrator is in optical communication with and interposed between a corresponding LED die and a first end of a corresponding optical waveguide.
- a photon emitting system comprises a solid state light source that includes a plurality of solid state radiation sources to generate radiation.
- the solid state radiation sources can be disposed in an array pattern.
- Optical concentrators arranged in a corresponding array pattern, receive radiation from corresponding solid state radiation sources.
- the concentrated radiation is received by a plurality of optical waveguides, also arranged in a corresponding array pattern.
- Each optical waveguide includes a first end to receive the radiation and a second end to output the radiation.
- the system further includes a controller, coupled to the solid state light source, to selectively activate one or more individual LED dies and/or groups of the plurality of LED dies.
- Fig. 1 A shows a perspective view and Fig. IB shows an exploded view of a photon emitting device according to a first embodiment of the present invention.
- Fig. 2 shows a top view of an exemplary LED die array disposed on an interconnect circuit according to an embodiment of the present invention.
- Fig. 3 shows a side view of a photon emitting source according to an embodiment of the present invention.
- Fig. 4 shows a close-up view of an individual LED die coupled to an optical fiber by a non-imaging optical concentrator according to an embodiment of the present invention.
- Figs. 5A-5F show alternative fiber output patterns according to alternative embodiments of the present invention.
- Fig. 6A shows an alternative fiber output pattern for a steerable output and Figs.
- FIG. 6B and 6C respectively show exemplary bandmg and support structure implementations for a steerable output in accordance with alternative embodiments of the present invention.
- Fig. 7 shows another alternative output pattern for a steerable output, where a portion of the output ends of the fibers have angle polished output faces in accordance with an alternative embodiment of the present invention.
- Fig. 8 shows an alternative construction for a fiber array connector in accordance with an embodiment of the present invention.
- Fig. 9A shows a photon emitting system adapted for pixelation in accordance with another embodiment of the present invention.
- Fig. 9B shows an exemplary controller circuit adapted for pixelation in accordance with another embodiment of the present invention.
- Fig. 10 shows an exemplary implementation of the photon emitting device, here utilized as a "cool" headlight.
- Fig. 11 shows another exemplary implementation of the solid state light device, here utilized as part of a dental curing apparatus.
- Fig. 12 shows another exemplary implementation of the solid state light device, here utilized as part of a radiation curing apparatus.
- Fig. 13 shows an alternative embodiment for a steerable output emission. While the invention is amenable to various modifications and alternative forms, specifics thereof have been shown by way of example in the drawings and will be described in detail. It should be understood, however, that the intention is not to limit the invention to the particular embodiments described. On the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the scope of the invention as defined by the appended claims. Detailed Description Fig.
- FIG. 1 A shows a solid state light device 100 (also referred to herein as an illumination device or photon emitting device) in an exemplary configuration.
- Light device 100 is shown in an exploded view in Fig. IB.
- light it is meant electromagnetic radiation having a wavelength in the ultraviolet, visible, and/or infrared portion of the electromagnetic spectrum.
- the light device 100 can have an overall compact size comparable to that of a conventional High Intensity Discharge (HID) bulb, thus providing a replacement for a discharge lamp device in various applications including road illumination, spot lighting, back lighting, image projection and radiation activated curing.
- Light device 100 comprises an array of solid state radiation sources 104 to generate radiation. The radiation is collected and concentrated by a corresponding array of optical concentrators 120.
- the solid state radiation sources 104 comprise a plurality of discrete LED dies or chips disposed in an array pattern.
- the discrete LED dies 104 are mounted individually and have independent electrical connections for operational control (rather than an LED array where all the LEDs are connected to each other by their common semiconductor substrate).
- LED dies can produce a symmetrical radiation pattern and are efficient at converting electrical energy to light. As many LED dies are not overly temperature sensitive, the LED dies may operate adequately with only a modest heat sink compared to many types of laser diodes.
- each LED die is spaced apart from its nearest neighbor(s) by at least a distance greater than an LED die width. In a further exemplary embodiment, each LED die is spaced apart from its nearest neighbor(s) by at least a distance greater than six LED die widths.
- LED dies 104 can be operated at a temperature from -40° to 125°C and can have operating lifetimes in the range of 100,000 hours, as compared to most laser diode lifetimes around 10,000 hours or halogen automobile headlamp lifetimes of 500- 1000 hours. In an exemplary embodiment, the LED dies can each have an output intensity of about 50 Lumens or more.
- Discrete high-power LED dies can be GaN-based LED dies commercially available from companies such as Cree (such as Cree's InGaN-based XBrightTM products) and Osram.
- Cree such as Cree's InGaN-based XBrightTM products
- Osram Osram
- an array of LED dies manufactured by Cree, each having an emitting area of about 300 ⁇ m x 300 ⁇ m, can be used to provide a concentrated (small area, high power) light source.
- Other light emitting . surface shapes such as rectangular or other polygonal shapes can also be utilized.
- the emission layer of the LED dies utilized can be located on the top or bottom surface.
- a plurality of bare blue or ultraviolet (UN) LED dies can be utilized.
- one or more LED dies can be coated, preferably on a light-emitting surface, with a phosphor layer (not shown), such as YAG:Ce phosphor.
- the phosphor layer can be used to convert the output of the LED die into "white” light.
- a blue LED die can be coated with a YAG:Ce phosphor (or the like).
- a portion of the blue light from the LED die is mixed with the phosphor-converted yellow light to effectively generate "white” light.
- a mixture of RGB (red, green, blue) phosphors can be used to convert UN die output to "white” light.
- a collection of red, blue, and green LED dies can be selectively placed in an array.
- the resulting emission is collected by the array of fibers 130 so that the light emitted from the output ends of the fibers is seen by an observer as colored light or "white” light, when blended together in concert.
- the LED die array may be replaced with a vertical cavity surface emitting laser (VCSEL) array, which can conventionally provide output in the visible region, including "white” light.
- VCSEL vertical cavity surface emitting laser
- the emission from LED dies 104 is received by a plurality of optical concentrators 120 which are disposed in a corresponding array pattern.
- each optical concentrator receives radiation from a corresponding one of the LED dies 104.
- the optical concentrators 120 comprise non-imaging optical concentrators (also referred to as reflective optical couplers) disposed in an array. The shape of the reflective surfaces of the optical concentrators 120 are designed to capture a substantial portion of the radiation emitted by each of the sources 104 to preserve the power density.
- each non-imaging concentrator of the array of non-imaging concentrators 120 has an interior reflecting surface conforming to a two- dimensional (2-D) surface, with at least a second portion of the interior reflecting surface conforming to a three-dimensional (3-D) surface.
- Each optical concentrator in array 120 can be formed by, e.g., injection molding, transfer molding, microreplication, stamping, punching or thermoforming.
- the substrate or sheeting in which the optical concentrators 120 can be formed can include a variety of materials such as metal, plastic, thermoplastic material, or multilayer optical film (MOF) (such as Enhanced Specular Reflector (ESR) film available from 3M Company, St. Paul, MN).
- the substrate material used to form the optical concentrator 120 can be coated with a reflective coating, such as silver, aluminum, or reflective multilayer stacks of inorganic thin films, or simply polished in order to increase its reflectivity.
- the optical concentrator substrate can be disposed so that the array of optical concentrators can be oriented beneath, around, or above the LED dies.
- the optical concentrator substrate is disposed on or proximate to the LED array so that each concentrator of array 120 can be formed to slide over each LED die 104, so that the optical concentrator's lower opening 123 (see Fig. 4) provides a close fit around the perimeter of the LED die 104.
- Alternative concentrator designs include the additional use of a reflective coating on the substrate on which the LED die is supported.
- An aspect of the illustrated embodiment of Fig. IB is the one-to-one correspondence between each radiation source, a corresponding optical concentrator, and a corresponding waveguide.
- Each optical concentrator surface is designed to convert the isotropic emission from a corresponding LED die, including, in some embodiments, phosphor-coated LED die, into a beam that will meet the acceptance angle criteria of a corresponding light-receiving waveguide. As stated above, this concentrator surface design aids in preserving the power density of the light emitted from the LED dies.
- the concentrated output radiation is received by a plurality of optical waveguides 130, shown in Fig. IB as an array of optical fibers, with each waveguide having an input end 132 and an output end 133.
- the present exemplary embodiment includes an array 130 of large-core (for example, 400 ⁇ m to 1000 ⁇ m) polymer clad silica fibers (such as those marketed under the trade designation TECSTM, available from 3M Company, St. Paul, MN).
- each of the optical fibers 130 can comprise polymer clad silica fibers having a core diameter of about 600 ⁇ m to 650 ⁇ m.
- the longitudinal lengths of the fibers can be about 1 to 5 inches (2.5 cm - 12.5 cm) in length. As the exemplary fibers are very flexible, this short distance still provides the ability to place the fibers in a tight, patterned bundle at the output ends.
- the short length provides for a very compact device having a size comparable to the size of conventional HID lamps.
- the fiber lengths can be increased in other applications without causing a detrimental effect in operation.
- Other types of optical fibers such as conventional or specialized glass fibers may also be utilized in accordance with the embodiments of the present invention, depending on such parameters as, e.g., the output wavelength(s) of the LED die sources.
- plastic fibers may be susceptible to solarization and/or bleaching with applications involving deep blue or UN light sources.
- the fiber(s) can be used to transport the light to a specific location with low optical loss by total internal reflection.
- the light receiving fibers do not only serve to transport light - by translating the fibers from the wider spacing of the LED die array to a tighter spacing or spacings at the output aperture, such as a tight packed fiber bundle, light from the (relatively) dispersed LED array can be effectively concentrated into a very small area.
- the optical design of the exemplary light receiving fiber core and cladding provide for shaping the light beams emerging from the bundled ends due to the Numerical Aperture (NA) of the fibers at the input end as well as the output end.
- NA Numerical Aperture
- the light receiving fibers perform light concentrating and beam shaping, as well as light transportation.
- the optical fibers 132 may further include fiber lenses on one or more of the output ends 133 of the optical fibers.
- the light receiving ends 132 of the optical fibers may further include fiber lenses on one or more of the output ends 133 of the optical fibers.
- a fiber array connector 134 can be utilized to support the first ends of each optical fiber of array 130.
- the fiber array connector 134 comprises a rigid material, such as a molded plastic material, with a plurality of apertures having a pattern corresponding to the pattern of optical concentrators 120. Each aperture receives the input end 132 of an optical fiber of array 130 and can provide for straightforward bonding thereto.
- an interconnect circuit layer rigid or flexible, can be utilized to provide thermal management for and electrical connection to the LED dies 104.
- the interconnect circuit layer can comprise a multilayer structure, such as 3MTM Flexible (or Flex) Circuits, available from 3M Company, Saint Paul, MN.
- the multilayer interconnect layer can comprise a metal mounting substrate 112, made of e.g., copper or other thermally conductive material, an electrically insulative dielectric layer 114, and a patterned conductive layer 113, where the LED dies are operatively connected to bond pads (not shown) of the conductive layer 113.
- Electrically insulative dielectric layer 114 may comprise of a variety of suitable materials, including polyimide, polyester, polyethyleneterephthalate (PET), polycarbonate, polysulfone, or FR4 epoxy composite, for example.
- Electrically and thermally conductive layer 113 may comprise of a variety of suitable materials, including copper, nickel, gold, aluminum, tin, lead, and combinations thereof, for example.
- one or more groups of the LED dies 104 are interconnected with each other, but separate from other groupings of LED dies, to provide for pixelated radiation output.
- Nias (not shown) can be used to extend through the dielectric layer 114.
- the metal mounting substrate 112 can be mounted on a heat sink or heat dissipation assembly 140. The substrate 112 can be separated from heat sink 140 by a layer 116 of electrically insulative and thermally conductive material.
- heat sink 140 can further comprise a series of thermal conductor pins to further draw heat away from the LED die array during operation.
- each bare LED die 104 can reside in a recessed portion of the dielectric surface 114, directly on the metal/circuit layer 113.
- Example implementations of interconnect circuitry are described in a currently pending and co- owned application entitled "Illumination Assembly" (U.S. Application No. 10/727,220).
- a more rigid FR4 epoxy based printed wiring board structure can be utilized for electrical interconnection.
- a low cost circuit can be prepared by patterning conductive epoxy or conductive ink onto a suitable substrate as required to connect the LED die array.
- Solid state light device 100 further includes a support structure.
- the support structure is configured as a housing 150, having an input aperture 152 and an output aperture 154.
- the housing 150 can be formed, e.g., by a molding process.
- the housing 150 provides strain relief for the array of waveguides 130 between the input and output ends and can prevent damage to the waveguides 130 from outside sources.
- housing 150 can provide a rigid support that is preferred for vehicular applications, such as those described in more detail below.
- the support structure can further include a bandmg 156 that is disposed in contact with a perimeter portion of the second ends of waveguides 130.
- the banding 156 can aid in distributing the output ends 134 of waveguides 130 in a selected output pattern, as is described in further detail below.
- the fiber array connector 134 can include a ridge or indentation to receive the input aperture 152 of housing 150. While the housing 150 may be bonded or otherwise attached to fiber array connector 134, in an exemplary embodiment, the housing 150 is snap fit on fiber array connector 134.
- the fibers are first loaded into the fiber array connector and bonded to the connector.
- a fixture (not shown) can be utilized to group fibers in rows to have an ordered grouping. The fixture can comprise multiple partitions that repeatably position each fiber from the input end to the output end.
- the fixture can be designed so that the fibers do not cross over one another and have a predictable location for the output ends.
- a rigid or flexible banding e.g. ceramic or polymer material
- the support structure can include a housing that can be slid over the fibers and banding and can be secured to the fiber array connector.
- the banding can be secured within the output aperture of the housing through the use of conventional adhesives or bonding elements.
- the support structure can comprise an encapsulate material that is formed throughout and around the fiber bundle(s).
- support structure 150 can comprise an adhesive material, such as a binding epoxy, which can be applied to a portion of the waveguides 130, such that when the adhesive sets, the waveguides are fixed in a desired pattern.
- the binding epoxy is also useful in providing support for the output ends of the fibers for polishing.
- the binding epoxy or adhesive can have a temporary or permanent set.
- Overall alignment can be provided by one or more alignment pins 160, which can be used to align fiber array connector 134, concentrator array 120, interconnect circuit layer 110 and heat sink 140 together.
- a series of alignment holes, such as alignment holes 162 shown in Fig. 2 can be formed in each of the aforementioned parts of the device 100 to receive the alignment pins 160.
- Fig. 2 illustrates the footprint of the solid state light device 100.
- an array of sixty (60) LED dies 104 can be provided on an interconnect circuit layer 110, which is thermally coupled to heat sink 140, in a substantially rectangular array pattern.
- the array of LED dies can comprise a substantially greater or lesser number of LED dies 104.
- each LED die has a width of about 300 micrometers, and each LED die 104 can be spaced from its nearest neighbor by more than a LED die width, the solid state light source of the present invention can provide a high overall power density, a compact footprint area
- the footprint of the output ends can be smaller, the same as, or greater than the footprint at the input ends.
- the footprint of the output ends of the fibers 133 can be even more compact, on the order of about 0.1 in 2 to 1 in 2 ( 0.65 cm 2 to 6.5 cm 2 ), in exemplary embodiments.
- a side view of solid state light device 100 is shown in Fig. 3.
- interconnect circuit layer 110 (having LED dies mounted thereon) is disposed on heat sink 140, which further includes heat dissipation pins 142 that extend in an opposite direction from the output aperture 154.
- the housing 150 can include protrusions 153 to allow for snap fitting onto fiber array connector 134.
- the array of optical concentrators 120 is disposed between the fiber array connector 134 and the interconnect layer 110.
- fibers 130 are supported by the fiber array connector 134 and the banding 156, which is disposed within the output aperture 154 of housing 150.
- an exemplary construction of the solid state light device includes a fiber-concentrator alignment mechanism that reduces misalignment between an individual optical fiber 131 of the fiber array and an individual optical concentrator 121 of the concentrator array.
- the fiber array connector 134 can further include a protrusion portion 135 that engages in a depression portion 125 of the optical concentrator array substrate.
- fiber 131 is received in an aperture of the fiber array connector 134.
- the fiber array connector is then disposed on the optical concentrator substrate such that protrusion 135 is received by depression 125.
- the output aperture 126 of optical concentrator 121 can be substantially flush with the input end of fiber 131.
- multiple input ends of the fibers can be polished at the same time so that the fiber ends are positioned with respect to the optical concentrators for sufficient optical coupling, hi addition, in the example construction of Fig. 4, the receiving aperture 123 of optical concentrator 121 can be disposed to be proximate to or to surround the perimeter of an emission surface of a corresponding LED die 104.
- FIG. 4 further shows a cross section of an exemplary multiple layer interconnect 110, which comprises a conductive epoxy 115 to bond LED die 104 10 interconnect layer 110.
- First and second electrically conductive layers 113, 111 that can comprise, e.g., nickel and gold, or other conductive materials, provide electrical traces to each LED die in the array, with dielectric layer 114 (e.g., polyimide) disposed to provide electrical insulation.
- a substrate 112 e.g., copper
- the solid state light device can provide a highly directional and/or shaped output emission, in one or more directions simultaneously.
- the output ends 133 of fiber array 130 can be patterned to provide a rectangular or square output.
- Figs. 5A-5F illustrate alternative reconfigurable output end patterns for the fiber array that can be employed depending on the type of illumination that is required for a particular application.
- Fig. 5 A shows a hexagonal output fiber pattern 133 A
- Fig. 5B shows a circular output fiber pattern 133B
- Fig. 5C shows a ring-shaped output fiber pattern 133C
- Fig. 5D shows a triangular output fiber pattern 133D
- Fig. 5E shows a line- shaped output fiber pattern 133E.
- a segmented output pattern 133F can be provided, where multiple separate fiber output groupings can be utilized for specific targeted illumination.
- the banding that secures the output ends of the fibers can be formed from a material with flexibility, such as lead, tin, and zinc-based materials and alloys (or the like), in some applications, the fiber output pattern can be reconfigurable. As shown in Figs.
- the output of the solid state light device can be steerable, so that one or more different directions can be illuminated simultaneously or alternatively.
- Fig. 6A shows fiber output ends 233 arranged, e.g., in three different groupings, 233A, 233B, and 233C.
- the solid state light device when utilized as a vehicular headlight, can provide output illumination in a forward direction through output ends 233A under normal operation.
- the LED dies that correspond to the output fibers 233B can be activated (by, e.g., a trigger signal such as a turn signal indicator or by turning the steering wheel a set amount) so that additional illumination can be provided in that side direction through output fibers 233B.
- a steerable illumination system can be provided utilizing a laterally extended output arrangement of fibers, such as shown in Fig. 5E, whereby the pixelation control circuitry described below (see e.g., Figs. 9A and 9B) can activate blocks of illuminated fibers from one side to the other, e.g., during a turn or other event.
- the output illumination can be directed towards (or away from) the direction of the rum, depending on the application.
- a non-mechanical approach can be used to provide steerable output illumination from the solid state light device.
- a construction is shown that can be utilized to stabilize and support the different fiber groupings.
- a banding 256 is provided at the output ends of the optical fibers.
- the banding 256 can provide a first aperture 254, a second aperture 254A and a third aperture 254B, where the fibers disposed in apertures 254A and 254B will output light in different directions from the fibers disposed in aperture 254.
- the banding 256 can be connected to or integral with housing 250, as part of the support structure for the solid state light device.
- the solid state light device can generate steerable light from a single bundle of fiber output ends.
- fiber output ends 133 can be provided in the same location, such as output aperture 254 from Fig. 6B.
- a portion of these output ends, identified as fiber output ends 129, are angle polished at a different angle, or even substantially different angle (e.g., by 10 to 50 degrees with respect to the fiber axis), than the remainder of fiber output ends 133. The resulting emission will be directed in a different direction from that of the output of fiber ends 133.
- the solid state light device when utilized as a vehicular headlight, can provide output illumination in a both a forward direction (through output ends 133) and a side direction (through output fibers 129).
- fibers extending from fiber array connector 734 can be bundled into multiple offset fiber bundles, central bundle 730A and side bundles 730B and 730C.
- Light emitted by the output ends of the fiber bundles is received by a multi-focus lens 750, such as an aspheric lens, that further directs the output from the offset bundles into desired different illumination regions 751 A, 75 IB, and 75 IC.
- the solid state light device can be utilized as an illumination source, such as in a vehicle headlight application.
- attachment to an existing headlight receptacle can be accomplished through the use of flanges 139, shown in Fig. 8.
- Flanges 139 can be disposed on the perimeter portion of e.g., the fiber array connector 134.
- the flange can be designed to engage in a locking slot of such a receptacle.
- the flanges may be formed on other components of the solid state light device, such as the housing or optical concentrator substrate. According to another embodiment of the present invention, as shown in Fig.
- an illumination system 300 that allows for pixelated light control that can be used for aperture shaping and/or dynamic beam movement.
- System 300 includes a solid state light source 301 that is constructed in a manner similar to solid state light source 100 described above.
- a controller 304 is coupled to solid state light source 301 via wiring 302 and connector 310, which can be connected to the interconnect circuit layer.
- a power source 306 is coupled to the controller 304 to provide power/current to the solid state light source 301.
- controller 304 is configured to selectively activate individual LED dies or groups of LED dies that are contained in solid state light source 301.
- the illumination system 300 can provide a pixelated output.
- Fig. 9B shows an example control circuit 305 that can provide pixelation to the array of LED dies contained in the solid state light device. In this example, sixty LED dies
- LD1-LD60 are provided in the LED die array, which are grouped into three large groupings (314A - 314C) of twenty LED dies each, which are each further divided into smaller subgroups or channels (e.g., LD1-LD5) of five LED dies each. Overall, twelve channels of five LED dies each can be separately controlled in this exemplary embodiment.
- a first grouping of LED dies can comprise red emitting LED dies
- a second grouping of LED dies can comprise blue emitting LED dies
- a third grouping of LED dies can comprise green emitting LED dies.
- first, second, and third groupings of LED dies can comprise "white" emitting LED dies.
- the interconnect circuit layer is also designed to provide separate interconnection for the different LED die groupings. Different types of LED die groupings, and greater or lesser numbers of LED dies, can also be utilized in accordance with the principles described herein. With this configuration, separate RGB LED die channels can be driven to provide "white” or other colored output. In addition, should a particular diode channel fail or be dimmed due to LED die deterioration, adjacent channels can be driven at higher currents so that the output illumination appears to remain unchanged. Because of the (relatively) wide LED die spacing and/or the thermal management capabilities of the interconnect layer, greater drive currents to some of the LED die channels will not adversely affect overall performance. In addition, temperature sensors (not shown) can be disposed on the interconnect circuit layer (or other suitable locations) to sense temperature changes at or near different
- control circuit 305 can be used to vary the amount of current in a particular channel to compensate for a general decrease in light output in that channel due to the elevated temperature.
- circuit 305 receives a voltage through power supply 306.
- the voltage is converted into a regulated output current/voltage supply by boost converter chips 312A- 312C, and their associated electronics (not shown), hi this manner, voltage variations from power source 306 can be mitigated, with the current/voltage supplied to the LED dies being maintained at a regulated level.
- Chips 312A-312C can comprise, e.g., LM2733 chips available from National Semiconductor.
- driving voltage/current parameters can be about 20 Volts at 80 - 100 mA, thus providing a total of about 1.0 to 1.2 A for the entire LED die array.
- the driving current/voltage is then supplied to the different LED die channels within the array.
- each LED die would nominally require about 20 mA bias current, with a bias threshold increasing as the current increases, approaching about 4.0 V for an exemplary GaN-based LED die array.
- a resistor/thermistor chain 316 can be included in circuit 305 to set the overall maximum current for each LED die channel.
- a switch set 318 comprising a corresponding number of LED die channel electronic switches, can be provided, whereby each LED die channel is coupled/decoupled to ground (or to power, depending on the switch set arrangement relative to the LED die channels) in order to activate each particular LED die channel.
- the switch set 318 can be automatically controlled by a microcontroller (not shown) or a remote switch (e.g., a turn signal), based on the illumination parameters required for a particular application.
- this circuit architecture permits many implementations and permutations, as would be understood by one of ordinary skill in the art given the present description.
- the control circuit 305 can be implemented to drive all LED dies with the same current, or alternatively, a given LED die channel can be turned on/off automatically or on command.
- FIG. 10 shows a schematic illustration of an exemplary solid state light device 401 utilized in a "cool" headlamp application.
- solid state light device 401 which can be configured in accordance with the embodiments described above, is disposed in a headlight compartment 402 of an automobile or other vehicle (not shown).
- Light device 401 can be secured in compartment 402 through the use of slidably engaging flanges 439 that are configured to slide and lock within slots 438 of a receptacle.
- Optical element 415 can be designed to provide a selected output pattern that complies with current safety organization (e.g., NHTSA) standards.
- Example optical elements can include aspheric/anamorphic optical elements, and or discontinuous and/or non-analytic (spline) optical elements.
- Fig. 11 shows a schematic dental curing application, where solid state light device 501 (having a similar constmction to that shown in Figs. 1 A and IB, and/or other embodiments herein) is contained in dental curing apparatus 500.
- the > solid state light device 501 can be disposed in a handle portion 510 of dental curing apparatus 500.
- the output fibers used to receive and guide the output from the LED dies or other solid state light generating sources may extend through a light delivery arm 525 that can be placed directly over the curable material.
- UN and/or blue radiation sources may be utilized depending on the curing aspects of the materials receiving the illumination.
- Fig. 12 shows a schematic bulk material curing apparatus, such as a web curing station.
- the adhesive agent is often a blue/UV curable material that must be cured to a different material substrate.
- high intensity discharge and arc lamps are often utilized to perform the curing process.
- Fig. 12 provides a solution to the heating problems found in conventional curing systems, where a curing station 600 comprises a solid state light device 604 (constructed similarly to those embodiments described above), where the heat dissipation or heat sink component of the solid state light device is located in a heat exchange unit 602. As discussed above, heat generated by the radiation sources of the solid state light device is drawn away from the direction of the light output by proper LED die spacing, thermally conductive interconnect circuitry, and/or heat sinks.
- solid state light device 604 can deliver highly concentrated radiation to radiation-curable materials, thus reducing the deleterious effects caused by poor depth of cure.
- the concentrated output of the LED dies or other radiation-generating source can be collected and guided by the waveguide array, disposed in strain relief housing 630, and delivered to a radiation curable material 650 disposed on a substrate 652.
- the substrate 652 can be disposed on a moving platform or conveyor belt to provide for continual curing of large quantities of material.
- the output ends of the waveguides e.g.
- the solid state light source described herein can be utilized in a projection system. Because of the ability to provide pixelated output, the LED die array can comprise different output color LED dies for RGB output. In addition, the output can be multiplexed for progressive scanning to provide a suitable projection image. Further, the solid state light device of the embodiments described above can be utilized as a source for backlighting in LCD displays. In particular, when using phosphor coated dies for "white" emission, pixelated white LED dies can provide an increased contrast ratio for LCD displays.
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Abstract
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Priority Applications (2)
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EP04796581A EP1700144A1 (en) | 2003-12-02 | 2004-10-27 | Solid state light device |
JP2006542578A JP2007513378A (en) | 2003-12-02 | 2004-10-27 | Solid state optical device |
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US10/726,225 | 2003-12-02 | ||
US10/726,225 US7329887B2 (en) | 2003-12-02 | 2003-12-02 | Solid state light device |
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EP (1) | EP1700144A1 (en) |
JP (1) | JP2007513378A (en) |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006007388A1 (en) * | 2004-06-16 | 2006-01-19 | 3M Innovative Properties Company | Solid state light device |
KR100735254B1 (en) | 2005-12-09 | 2007-07-03 | 삼성전자주식회사 | Optical fiber array module, fabrication method thereof and portable terminal |
US8439529B2 (en) | 2004-10-29 | 2013-05-14 | Osram Opto Semiconductors Gmbh | Lighting device, automotive headlights and method for producing a lighting device |
US10132484B2 (en) | 2005-05-02 | 2018-11-20 | Kavo Dental Technologies, Llc | LED-based dental exam lamp |
Families Citing this family (113)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9167959B1 (en) * | 2010-03-26 | 2015-10-27 | Optech Ventures, Llc | Illumination for enhanced contrast in debridement apparatus and method |
US6200134B1 (en) | 1998-01-20 | 2001-03-13 | Kerr Corporation | Apparatus and method for curing materials with radiation |
US7182597B2 (en) | 2002-08-08 | 2007-02-27 | Kerr Corporation | Curing light instrument |
CN100383573C (en) * | 2002-12-02 | 2008-04-23 | 3M创新有限公司 | Illumination system using a plurality of light sources |
JP2006516828A (en) * | 2003-01-27 | 2006-07-06 | スリーエム イノベイティブ プロパティズ カンパニー | Phosphorescent light source element and manufacturing method |
US7456805B2 (en) * | 2003-12-18 | 2008-11-25 | 3M Innovative Properties Company | Display including a solid state light device and method using same |
US20070261792A1 (en) * | 2004-02-23 | 2007-11-15 | Anderson Gordon L | Locator Tool Assembly for Paint Replacement Films |
US7213958B2 (en) * | 2004-06-30 | 2007-05-08 | 3M Innovative Properties Company | Phosphor based illumination system having light guide and an interference reflector |
US7182498B2 (en) * | 2004-06-30 | 2007-02-27 | 3M Innovative Properties Company | Phosphor based illumination system having a plurality of light guides and an interference reflector |
US7204631B2 (en) * | 2004-06-30 | 2007-04-17 | 3M Innovative Properties Company | Phosphor based illumination system having a plurality of light guides and an interference reflector |
US7255469B2 (en) * | 2004-06-30 | 2007-08-14 | 3M Innovative Properties Company | Phosphor based illumination system having a light guide and an interference reflector |
US7204630B2 (en) * | 2004-06-30 | 2007-04-17 | 3M Innovative Properties Company | Phosphor based illumination system having a plurality of light guides and an interference reflector |
US7390097B2 (en) * | 2004-08-23 | 2008-06-24 | 3M Innovative Properties Company | Multiple channel illumination system |
US8113830B2 (en) | 2005-05-27 | 2012-02-14 | Kerr Corporation | Curing light instrument |
US7479660B2 (en) | 2005-10-21 | 2009-01-20 | Perkinelmer Elcos Gmbh | Multichip on-board LED illumination device |
DE102005061204A1 (en) * | 2005-12-21 | 2007-07-05 | Perkinelmer Elcos Gmbh | Lighting device, lighting control device and lighting system |
US20070171638A1 (en) * | 2006-01-24 | 2007-07-26 | Sbc Knowledge Ventures, L.P. | Apparatus and methods for transmitting light over optical fibers |
US7413327B2 (en) * | 2006-04-10 | 2008-08-19 | The Boeing Company | Vehicle lighting fixture |
US7625103B2 (en) * | 2006-04-21 | 2009-12-01 | Cree, Inc. | Multiple thermal path packaging for solid state light emitting apparatus and associated assembling methods |
US7648257B2 (en) | 2006-04-21 | 2010-01-19 | Cree, Inc. | Light emitting diode packages |
WO2008045681A1 (en) * | 2006-10-06 | 2008-04-17 | 3M Innovative Properties Company | Backlight modules for autostereoscopic 3d display devices and scanning backlights for lcd devices |
US8498695B2 (en) | 2006-12-22 | 2013-07-30 | Novadaq Technologies Inc. | Imaging system with a single color image sensor for simultaneous fluorescence and color video endoscopy |
US8258682B2 (en) * | 2007-02-12 | 2012-09-04 | Cree, Inc. | High thermal conductivity packaging for solid state light emitting apparatus and associated assembling methods |
US7677777B2 (en) * | 2007-02-21 | 2010-03-16 | Magna International, Inc. | LED apparatus for world homologation |
TWI378580B (en) * | 2007-03-07 | 2012-12-01 | Everlight Electronics Co Ltd | Socket led device |
TWI448644B (en) * | 2007-05-07 | 2014-08-11 | Cree Inc | Light fixtures |
DE102007028075B4 (en) * | 2007-06-15 | 2009-03-12 | Zett Optics Gmbh | LED light source and method for driving and stabilizing an LED light source |
KR101425796B1 (en) * | 2007-10-08 | 2014-08-04 | 삼성전자주식회사 | Multi-metal waveguide and Manufacturing method thereof |
FR2922306B1 (en) * | 2007-10-12 | 2009-11-20 | Sp3H | SPECTROMETRY DEVICE FOR ANALYSIS OF A FLUID |
FR2922303B1 (en) | 2007-10-12 | 2010-05-07 | Sp3H | SPECTROMETRY DEVICE FOR ANALYSIS OF A FLUID |
FR2922304B1 (en) * | 2007-10-12 | 2009-11-20 | Sp3H | SPECTROMETRY DEVICE FOR ANALYSIS OF A FLUID |
KR100963966B1 (en) * | 2007-11-21 | 2010-06-15 | 현대모비스 주식회사 | ??? unit and optical source module therewith |
DE102007063262A1 (en) * | 2007-12-17 | 2009-06-18 | Storz Endoskop Produktions Gmbh | Illumination device for generating light and for coupling the light into a proximal end of a light guide cable of an observation device for endoscopy or microscopy |
JP5117878B2 (en) * | 2008-02-13 | 2013-01-16 | 富士フイルム株式会社 | Endoscope light source device |
BRPI0906187A2 (en) | 2008-03-18 | 2020-07-14 | Novadaq Technologies Inc. | image representation method and system for the acquisition of nir images and full color images |
WO2009117148A2 (en) * | 2008-03-21 | 2009-09-24 | Nanogram Corporation | Metal silicon nitride or metal silicon oxynitride submicron phosphor particles and methods for synthesizing these phosphors |
DE102008022414B4 (en) * | 2008-05-06 | 2013-03-14 | Rüdiger Lanz | Illuminants for use in street lighting and a device for street lighting |
US8378661B1 (en) * | 2008-05-29 | 2013-02-19 | Alpha-Omega Power Technologies, Ltd.Co. | Solar simulator |
JP2010072494A (en) * | 2008-09-19 | 2010-04-02 | Sanyo Electric Co Ltd | Illuminating device and projection video display apparatus |
US8189189B1 (en) | 2008-10-08 | 2012-05-29 | Herendeen Robert O | LED sensor for process control |
US8384682B2 (en) * | 2009-01-08 | 2013-02-26 | Industrial Technology Research Institute | Optical interactive panel and display system with optical interactive panel |
US8247886B1 (en) | 2009-03-09 | 2012-08-21 | Soraa, Inc. | Polarization direction of optical devices using selected spatial configurations |
US9066777B2 (en) | 2009-04-02 | 2015-06-30 | Kerr Corporation | Curing light device |
US9072572B2 (en) | 2009-04-02 | 2015-07-07 | Kerr Corporation | Dental light device |
WO2010138805A2 (en) * | 2009-05-29 | 2010-12-02 | The Regents Of The University Of Michigan | Solid state light source based on hybrid waveguide-down-converter-diffuser |
US9583678B2 (en) | 2009-09-18 | 2017-02-28 | Soraa, Inc. | High-performance LED fabrication |
KR101107561B1 (en) * | 2009-11-12 | 2012-01-31 | (주)화이버 옵틱코리아 | Led illuminating device |
US8348430B2 (en) * | 2009-12-17 | 2013-01-08 | Alcon Research, Ltd. | Photonic lattice LEDs for ophthalmic illumination |
US20110148304A1 (en) * | 2009-12-22 | 2011-06-23 | Artsyukhovich Alexander N | Thermoelectric cooling for increased brightness in a white light l.e.d. illuminator |
US8317382B2 (en) * | 2009-12-23 | 2012-11-27 | Alcon Research, Ltd. | Enhanced LED illuminator |
US8258524B2 (en) | 2010-01-26 | 2012-09-04 | Sharp Kabushiki Kaisha | Light emitting diode device |
US10147850B1 (en) | 2010-02-03 | 2018-12-04 | Soraa, Inc. | System and method for providing color light sources in proximity to predetermined wavelength conversion structures |
US20110186874A1 (en) * | 2010-02-03 | 2011-08-04 | Soraa, Inc. | White Light Apparatus and Method |
US20120327375A1 (en) * | 2010-03-09 | 2012-12-27 | Mikio Sakamoto | Illumination device and projection display device using the same |
US9314374B2 (en) * | 2010-03-19 | 2016-04-19 | Alcon Research, Ltd. | Stroboscopic ophthalmic illuminator |
DE102010036496A1 (en) | 2010-04-23 | 2011-10-27 | Degudent Gmbh | Method and device for coupling radiation emitted by LEDs |
US9450143B2 (en) | 2010-06-18 | 2016-09-20 | Soraa, Inc. | Gallium and nitrogen containing triangular or diamond-shaped configuration for optical devices |
TWI520386B (en) * | 2010-07-29 | 2016-02-01 | 神基科技股份有限公司 | Structure of led assembly and manufacturing method thereof |
US8297790B2 (en) | 2010-08-18 | 2012-10-30 | Lg Innotek Co., Ltd. | Lamp device |
US8573801B2 (en) | 2010-08-30 | 2013-11-05 | Alcon Research, Ltd. | LED illuminator |
KR101742678B1 (en) * | 2010-09-17 | 2017-06-01 | 엘지이노텍 주식회사 | Lamp apparatus |
TWI440794B (en) | 2010-09-27 | 2014-06-11 | Ind Tech Res Inst | Solar light simulator |
US10267506B2 (en) * | 2010-11-22 | 2019-04-23 | Cree, Inc. | Solid state lighting apparatuses with non-uniformly spaced emitters for improved heat distribution, system having the same, and methods having the same |
WO2012120380A1 (en) * | 2011-03-08 | 2012-09-13 | Novadaq Technologies Inc. | Full spectrum led illuminator |
US8952615B2 (en) * | 2011-06-14 | 2015-02-10 | Freescale Semiconductor, Inc. | Circuit arrangement, lighting apparatus and method of crosstalk-compensated current sensing |
US8686431B2 (en) | 2011-08-22 | 2014-04-01 | Soraa, Inc. | Gallium and nitrogen containing trilateral configuration for optical devices |
US20130187540A1 (en) | 2012-01-24 | 2013-07-25 | Michael A. Tischler | Discrete phosphor chips for light-emitting devices and related methods |
US8896010B2 (en) | 2012-01-24 | 2014-11-25 | Cooledge Lighting Inc. | Wafer-level flip chip device packages and related methods |
US8907362B2 (en) | 2012-01-24 | 2014-12-09 | Cooledge Lighting Inc. | Light-emitting dies incorporating wavelength-conversion materials and related methods |
DE102012206971A1 (en) * | 2012-04-26 | 2013-10-31 | Osram Gmbh | OPTICAL DEVICE AND LIGHTING DEVICE |
AT512865B1 (en) * | 2012-05-09 | 2014-12-15 | Zizala Lichtsysteme Gmbh | Lighting device for a motor vehicle headlight and light module and motor vehicle headlight with lighting device |
WO2013181594A1 (en) * | 2012-06-01 | 2013-12-05 | Revolution Display | Light-emitting assembly and light-emitting floor system |
JP2014010918A (en) * | 2012-06-27 | 2014-01-20 | Sharp Corp | Luminaire and vehicle headlight |
US9978904B2 (en) | 2012-10-16 | 2018-05-22 | Soraa, Inc. | Indium gallium nitride light emitting devices |
CN104969058B (en) * | 2012-12-07 | 2017-08-08 | Sp3H公司 | Airborne equipment and method for analyzing the fluid in Thermal Motor |
FR2999333A1 (en) * | 2012-12-07 | 2014-06-13 | Sp3H | Method for controlling spectrometer to analyze e.g. hydrocarbons used as fuel of heat engine in e.g. terrestrial vehicle, involves adjusting integration duration of photosensitive cells to determined value of integration duration |
TWI473141B (en) * | 2012-12-13 | 2015-02-11 | Eternal Materials Co Ltd | A radiation curing apparatus |
AT513738B1 (en) * | 2012-12-20 | 2014-07-15 | Zizala Lichtsysteme Gmbh | Lighting unit for a headlight |
AT513816B1 (en) | 2012-12-20 | 2015-11-15 | Zizala Lichtsysteme Gmbh | Light guide unit for a lighting unit of a headlamp and lighting unit and headlamp |
US9761763B2 (en) | 2012-12-21 | 2017-09-12 | Soraa, Inc. | Dense-luminescent-materials-coated violet LEDs |
AT513917B1 (en) * | 2013-02-05 | 2014-11-15 | Zizala Lichtsysteme Gmbh | Lighting unit for a headlight and headlights |
US9419189B1 (en) | 2013-11-04 | 2016-08-16 | Soraa, Inc. | Small LED source with high brightness and high efficiency |
DE102013113511A1 (en) * | 2013-12-05 | 2015-06-11 | Karl Storz Gmbh & Co. Kg | Endoscope, exoscope or microscope and method for illuminating an operating area of an endoscope, exoscope or microscope |
WO2015119858A1 (en) | 2014-02-05 | 2015-08-13 | Cooledge Lighting Inc. | Light-emitting dies incorporating wavelength-conversion materials and related methods |
KR20160007766A (en) * | 2014-06-27 | 2016-01-21 | 삼성전자주식회사 | Light emitting module |
JP2018501833A (en) * | 2014-11-14 | 2018-01-25 | ボストン サイエンティフィック サイムド,インコーポレイテッドBoston Scientific Scimed,Inc. | Surgical laser system and laser device |
EP3240501B1 (en) | 2015-02-27 | 2020-05-06 | Colgate-Palmolive Company | Oral treatment system |
KR102507965B1 (en) * | 2015-03-26 | 2023-03-10 | 코닌클리케 필립스 엔.브이. | light source |
AT517885B1 (en) * | 2015-10-23 | 2018-08-15 | Zkw Group Gmbh | Microprojection light module for a motor vehicle headlight for generating aberration-free light distributions |
US10356334B2 (en) | 2015-11-13 | 2019-07-16 | Novadaq Technologies ULC | Systems and methods for illumination and imaging of a target |
EP4155716A1 (en) | 2016-01-26 | 2023-03-29 | Stryker European Operations Limited | Image sensor assembly |
USD916294S1 (en) | 2016-04-28 | 2021-04-13 | Stryker European Operations Limited | Illumination and imaging device |
US10869645B2 (en) | 2016-06-14 | 2020-12-22 | Stryker European Operations Limited | Methods and systems for adaptive imaging for low light signal enhancement in medical visualization |
US11172560B2 (en) | 2016-08-25 | 2021-11-09 | Alcon Inc. | Ophthalmic illumination system with controlled chromaticity |
DE102016122861A1 (en) * | 2016-11-28 | 2018-05-30 | HELLA GmbH & Co. KGaA | Lighting device for vehicles |
WO2018145193A1 (en) | 2017-02-10 | 2018-08-16 | Novadaq Technologies ULC | Open-field handheld fluorescence imaging systems and methods |
JP6865396B2 (en) * | 2017-02-27 | 2021-04-28 | パナソニックIpマネジメント株式会社 | Lighting equipment, lighting systems, and moving objects |
JP6907002B2 (en) * | 2017-04-06 | 2021-07-21 | 株式会社小糸製作所 | Three-dimensional surface display device and vehicle display device |
US10222022B2 (en) * | 2017-07-06 | 2019-03-05 | Valeo North America, Inc. | Covered fiber bundle for lighting modules |
DE102017115739A1 (en) | 2017-07-13 | 2019-01-17 | Karl Storz Se & Co. Kg | Imaging medical instrument such as an endoscope, an exoscope or a microscope |
US10596952B2 (en) * | 2017-09-13 | 2020-03-24 | Shanghai Koito Automotive Lamp Co., Ltd. | Intelligent lighting system for automobile lamp, automobile lamp assembly and automobile |
EP3604902A1 (en) * | 2018-08-03 | 2020-02-05 | ZKW Group GmbH | Optical device for a motor vehicle headlight comprising light guides |
EP3608585A1 (en) * | 2018-08-07 | 2020-02-12 | ZKW Group GmbH | Projection device from a plurality of micro-optics systems and a light module for a motor vehicle headlamp |
CN110887013B (en) * | 2018-09-07 | 2021-12-31 | Sl株式会社 | Vehicle lamp |
KR102570603B1 (en) * | 2019-01-28 | 2023-08-24 | 아크소프트 코포레이션 리미티드 | Proximity ambient light sensor package |
US20200338220A1 (en) * | 2019-04-27 | 2020-10-29 | Gerald Ho Kim | UV-C Illumination System For Disinfection |
WO2021016119A1 (en) * | 2019-07-19 | 2021-01-28 | Schott Corporation | Emitter array and light combiner assembly |
CN110906282A (en) * | 2020-01-02 | 2020-03-24 | 北京理工大学重庆创新中心 | Lamp with variable color temperature and color based on optical light collector |
US11163100B2 (en) | 2020-01-28 | 2021-11-02 | Lucifer Lighting Company | Light fixtures having waveguides and related methods |
USD995885S1 (en) | 2020-01-28 | 2023-08-15 | Lucifer Lighting Company | Waveguide for multi-zone illumination light fixtures |
DE102020123031A1 (en) | 2020-09-03 | 2022-03-03 | Karl Storz Se & Co. Kg | Lighting device with optical fiber detection |
CN112130251A (en) * | 2020-09-21 | 2020-12-25 | 中国科学院长春光学精密机械与物理研究所 | Optical fiber positioner and positioning method thereof |
CN115095837B (en) * | 2022-05-06 | 2024-03-15 | 中国第一汽车股份有限公司 | Variable luminous car lamp system realized based on optical fiber and control method thereof |
Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0249934A2 (en) * | 1986-06-18 | 1987-12-23 | Mitsubishi Rayon Co., Ltd. | Optical fiber device |
EP0490292A2 (en) * | 1990-12-07 | 1992-06-17 | Stanley Electric Co., Ltd. | Light irradiating apparatus having light emitting diode used as light source |
US5567032A (en) * | 1993-12-03 | 1996-10-22 | Robert Bosch Gmbh | Illuminating device for vehicles |
US5713654A (en) * | 1994-09-28 | 1998-02-03 | Sdl, Inc. | Addressable laser vehicle lights |
US6045240A (en) * | 1996-06-27 | 2000-04-04 | Relume Corporation | LED lamp assembly with means to conduct heat away from the LEDS |
DE19923187A1 (en) * | 1999-05-20 | 2000-11-23 | Daimler Chrysler Ag | Lighting system for motor vehicle for producing deflected light matching the travel situation including several lighting means arranged unmovable on vehicle longitudinal half |
EP1067332A2 (en) * | 1999-07-09 | 2001-01-10 | Hella KG Hueck & Co. | Vehicle lamp |
EP1108949A1 (en) * | 1997-07-29 | 2001-06-20 | SDL, Inc. | Addressable vehicular lighting system |
DE10005795A1 (en) * | 2000-02-10 | 2001-08-23 | Inst Mikrotechnik Mainz Gmbh | Controllable headlights |
US6290382B1 (en) * | 1998-08-17 | 2001-09-18 | Ppt Vision, Inc. | Fiber bundle combiner and led illumination system and method |
DE20120770U1 (en) * | 2001-12-21 | 2002-03-28 | Osram Opto Semiconductors Gmbh | Surface-mounted LED multiple arrangement and lighting device with it |
US6414801B1 (en) * | 1999-01-14 | 2002-07-02 | Truck-Lite Co., Inc. | Catadioptric light emitting diode assembly |
DE10110835A1 (en) * | 2001-03-06 | 2002-09-19 | Osram Opto Semiconductors Gmbh | Illuminating deviec with numerous LED modules fitted on cooler surface |
WO2002086972A1 (en) * | 2001-04-23 | 2002-10-31 | Plasma Ireland Limited | Illuminator |
DE10134381A1 (en) * | 2001-07-14 | 2003-01-23 | Hella Kg Hueck & Co | Light source bearer, preferably for vehicle lights, is stamped metal grid with at least two folded regions per LED, whereby each LED contact vane is arranged between legs of folded region |
US20030042493A1 (en) * | 2001-08-31 | 2003-03-06 | Yuri Kazakevich | Solid-state light source |
DE10162404A1 (en) * | 2001-12-19 | 2003-07-03 | Hella Kg Hueck & Co | Circuit arrangement for driving LEDs especially in motor vehicle, has power component and LED arranged on common circuit board or common conducting film |
FR2840151A1 (en) * | 2002-05-27 | 2003-11-28 | Valeo Vision | Support device for light-emitting diode (LED) for use in automobile signaling system, and method for manufacturing such device |
Family Cites Families (101)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US489771A (en) * | 1893-01-10 | Sole-leveling machine | ||
US3825335A (en) | 1973-01-04 | 1974-07-23 | Polaroid Corp | Variable color photographic lighting system |
US3902059A (en) | 1974-02-15 | 1975-08-26 | Esquire Inc | Light reflector system |
US4254453A (en) | 1978-08-25 | 1981-03-03 | General Instrument Corporation | Alpha-numeric display array and method of manufacture |
DE3069386D1 (en) | 1979-12-22 | 1984-11-08 | Lucas Ind Plc | Motor vehicle lamp reflector |
JPS6019564A (en) | 1983-07-13 | 1985-01-31 | Fuji Photo Film Co Ltd | Side printer |
US5693043A (en) | 1985-03-22 | 1997-12-02 | Massachusetts Institute Of Technology | Catheter for laser angiosurgery |
US4755918A (en) | 1987-04-06 | 1988-07-05 | Lumitex, Inc. | Reflector system |
US4914731A (en) | 1987-08-12 | 1990-04-03 | Chen Shen Yuan | Quickly formed light emitting diode display and a method for forming the same |
US4897771A (en) | 1987-11-24 | 1990-01-30 | Lumitex, Inc. | Reflector and light system |
US5146248A (en) | 1987-12-23 | 1992-09-08 | North American Philips Corporation | Light valve projection system with improved illumination |
US4964025A (en) | 1988-10-05 | 1990-10-16 | Hewlett-Packard Company | Nonimaging light source |
US5155336A (en) | 1990-01-19 | 1992-10-13 | Applied Materials, Inc. | Rapid thermal heating apparatus and method |
US5227008A (en) | 1992-01-23 | 1993-07-13 | Minnesota Mining And Manufacturing Company | Method for making flexible circuits |
DE4301716C2 (en) | 1992-02-04 | 1999-08-12 | Hitachi Ltd | Projection exposure device and method |
US5299222A (en) | 1992-03-11 | 1994-03-29 | Lightwave Electronics | Multiple diode laser stack for pumping a solid-state laser |
US5301090A (en) * | 1992-03-16 | 1994-04-05 | Aharon Z. Hed | Luminaire |
US5293437A (en) | 1992-06-03 | 1994-03-08 | Visual Optics, Inc. | Fiber optic display with direct driven optical fibers |
US5317484A (en) | 1993-02-01 | 1994-05-31 | General Electric Company | Collection optics for high brightness discharge light source |
US5810469A (en) | 1993-03-26 | 1998-09-22 | Weinreich; Steve | Combination light concentrating and collimating device and light fixture and display screen employing the same |
US5534718A (en) | 1993-04-12 | 1996-07-09 | Hsi-Huang Lin | LED package structure of LED display |
US5420768A (en) | 1993-09-13 | 1995-05-30 | Kennedy; John | Portable led photocuring device |
US5882774A (en) | 1993-12-21 | 1999-03-16 | Minnesota Mining And Manufacturing Company | Optical film |
US5580471A (en) | 1994-03-30 | 1996-12-03 | Panasonic Technologies, Inc. | Apparatus and method for material treatment and inspection using fiber-coupled laser diode |
DE4429913C1 (en) | 1994-08-23 | 1996-03-21 | Fraunhofer Ges Forschung | Device and method for plating |
DE4430778C2 (en) | 1994-08-30 | 2000-01-27 | Sick Ag | Tube |
US5611017A (en) | 1995-06-01 | 1997-03-11 | Minnesota Mining And Manufacturing Co. | Fiber optic ribbon cable with pre-installed locations for subsequent connectorization |
US5574817A (en) | 1995-06-01 | 1996-11-12 | Minnesota Mining And Manufacturing Company | Fiber optic ribbon cable assembly and method of manufacturing same |
US5629996A (en) | 1995-11-29 | 1997-05-13 | Physical Optics Corporation | Universal remote lighting system with nonimaging total internal reflection beam transformer |
US6239868B1 (en) | 1996-01-02 | 2001-05-29 | Lj Laboratories, L.L.C. | Apparatus and method for measuring optical characteristics of an object |
US5661839A (en) | 1996-03-22 | 1997-08-26 | The University Of British Columbia | Light guide employing multilayer optical film |
US5816694A (en) | 1996-06-28 | 1998-10-06 | General Electric Company | Square distribution reflector |
DE19626176A1 (en) | 1996-06-29 | 1998-01-08 | Deutsche Forsch Luft Raumfahrt | Lithography exposure device and lithography method |
FI103074B1 (en) | 1996-07-17 | 1999-04-15 | Valtion Teknillinen | spectrometer |
US6608332B2 (en) | 1996-07-29 | 2003-08-19 | Nichia Kagaku Kogyo Kabushiki Kaisha | Light emitting device and display |
US5808794A (en) | 1996-07-31 | 1998-09-15 | Weber; Michael F. | Reflective polarizers having extended red band edge for controlled off axis color |
US5709463A (en) | 1996-08-13 | 1998-01-20 | Delco Electronics Corporation | Backlighting for bright liquid crystal display |
US5727108A (en) | 1996-09-30 | 1998-03-10 | Troy Investments, Inc. | High efficiency compound parabolic concentrators and optical fiber powered spot luminaire |
US6104446A (en) | 1996-12-18 | 2000-08-15 | Blankenbecler; Richard | Color separation optical plate for use with LCD panels |
US6587573B1 (en) * | 2000-03-20 | 2003-07-01 | Gentex Corporation | System for controlling exterior vehicle lights |
JPH10319871A (en) | 1997-05-19 | 1998-12-04 | Kouha:Kk | Led display device |
US6952504B2 (en) | 2001-12-21 | 2005-10-04 | Neophotonics Corporation | Three dimensional engineering of planar optical structures |
US5967653A (en) | 1997-08-06 | 1999-10-19 | Miller; Jack V. | Light projector with parabolic transition format coupler |
US6340824B1 (en) | 1997-09-01 | 2002-01-22 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device including a fluorescent material |
US5909037A (en) | 1998-01-12 | 1999-06-01 | Hewlett-Packard Company | Bi-level injection molded leadframe |
US6200134B1 (en) | 1998-01-20 | 2001-03-13 | Kerr Corporation | Apparatus and method for curing materials with radiation |
US5959316A (en) | 1998-09-01 | 1999-09-28 | Hewlett-Packard Company | Multiple encapsulation of phosphor-LED devices |
WO2000036336A1 (en) | 1998-12-17 | 2000-06-22 | Koninklijke Philips Electronics N.V. | Light engine |
EP1031326A1 (en) * | 1999-02-05 | 2000-08-30 | Jean-Michel Decaudin | Device for photo-activation of photosensitive composite materials especially in dentistry |
US6155699A (en) | 1999-03-15 | 2000-12-05 | Agilent Technologies, Inc. | Efficient phosphor-conversion led structure |
US6556734B1 (en) | 1999-04-19 | 2003-04-29 | Gemfire Corporation | Electrical connection scheme for optical devices |
US6193392B1 (en) | 1999-05-27 | 2001-02-27 | Pervaiz Lodhie | Led array with a multi-directional, multi-functional light reflector |
TW493054B (en) | 1999-06-25 | 2002-07-01 | Koninkl Philips Electronics Nv | Vehicle headlamp and a vehicle |
US6901090B1 (en) | 1999-09-10 | 2005-05-31 | Nikon Corporation | Exposure apparatus with laser device |
DE69910390T2 (en) | 1999-10-15 | 2004-07-22 | Automotive Lighting Italia S.P.A., Venaria Reale | Lighting device for motor vehicles with a strongly discontinuous reflector surface |
US6784982B1 (en) | 1999-11-04 | 2004-08-31 | Regents Of The University Of Minnesota | Direct mapping of DNA chips to detector arrays |
US6350041B1 (en) | 1999-12-03 | 2002-02-26 | Cree Lighting Company | High output radial dispersing lamp using a solid state light source |
TW465123B (en) | 2000-02-02 | 2001-11-21 | Ind Tech Res Inst | High power white light LED |
US6318886B1 (en) | 2000-02-11 | 2001-11-20 | Whelen Engineering Company | High flux led assembly |
DE10006738C2 (en) | 2000-02-15 | 2002-01-17 | Osram Opto Semiconductors Gmbh | Light-emitting component with improved light decoupling and method for its production |
US6625351B2 (en) | 2000-02-17 | 2003-09-23 | Microfab Technologies, Inc. | Ink-jet printing of collimating microlenses onto optical fibers |
US6224216B1 (en) * | 2000-02-18 | 2001-05-01 | Infocus Corporation | System and method employing LED light sources for a projection display |
US20040009510A1 (en) * | 2000-03-06 | 2004-01-15 | Scott Seiwert | Allosteric nucleic acid sensor molecules |
JP4406490B2 (en) | 2000-03-14 | 2010-01-27 | 株式会社朝日ラバー | Light emitting diode |
US6603258B1 (en) | 2000-04-24 | 2003-08-05 | Lumileds Lighting, U.S. Llc | Light emitting diode device that emits white light |
US6570186B1 (en) | 2000-05-10 | 2003-05-27 | Toyoda Gosei Co., Ltd. | Light emitting device using group III nitride compound semiconductor |
DE10033502A1 (en) | 2000-07-10 | 2002-01-31 | Osram Opto Semiconductors Gmbh | Optoelectronic module, process for its production and its use |
US6527411B1 (en) | 2000-08-01 | 2003-03-04 | Visteon Corporation | Collimating lamp |
US6614103B1 (en) | 2000-09-01 | 2003-09-02 | General Electric Company | Plastic packaging of LED arrays |
DE10051159C2 (en) | 2000-10-16 | 2002-09-19 | Osram Opto Semiconductors Gmbh | LED module, e.g. White light source |
AT410266B (en) | 2000-12-28 | 2003-03-25 | Tridonic Optoelectronics Gmbh | LIGHT SOURCE WITH A LIGHT-EMITTING ELEMENT |
DE10065624C2 (en) | 2000-12-29 | 2002-11-14 | Hans Kragl | Coupling arrangement for optically coupling an optical waveguide to an electro-optical or opto-electrical semiconductor converter |
TW490863B (en) | 2001-02-12 | 2002-06-11 | Arima Optoelectronics Corp | Manufacturing method of LED with uniform color temperature |
US6541800B2 (en) | 2001-02-22 | 2003-04-01 | Weldon Technologies, Inc. | High power LED |
US20020126479A1 (en) | 2001-03-08 | 2002-09-12 | Ball Semiconductor, Inc. | High power incoherent light source with laser array |
US20020171047A1 (en) | 2001-03-28 | 2002-11-21 | Chan Kin Foeng | Integrated laser diode array and applications |
US6874910B2 (en) | 2001-04-12 | 2005-04-05 | Matsushita Electric Works, Ltd. | Light source device using LED, and method of producing same |
JP3962219B2 (en) | 2001-04-26 | 2007-08-22 | 貴志 山田 | Phototherapy device using polarized light |
US7001057B2 (en) | 2001-05-23 | 2006-02-21 | Ivoclar Vivadent A.G. | Lighting apparatus for guiding light onto a light polymerizable piece to effect hardening thereof |
DE10127542C2 (en) | 2001-05-31 | 2003-06-18 | Infineon Technologies Ag | Coupling arrangement for optically coupling a light guide to a light receiver |
US6777870B2 (en) | 2001-06-29 | 2004-08-17 | Intel Corporation | Array of thermally conductive elements in an oled display |
TW567619B (en) | 2001-08-09 | 2003-12-21 | Matsushita Electric Ind Co Ltd | LED lighting apparatus and card-type LED light source |
US20030068113A1 (en) | 2001-09-12 | 2003-04-10 | Siegfried Janz | Method for polarization birefringence compensation in a waveguide demultiplexer using a compensator with a high refractive index capping layer. |
JP4067801B2 (en) | 2001-09-18 | 2008-03-26 | 松下電器産業株式会社 | Lighting device |
US20030057421A1 (en) | 2001-09-27 | 2003-03-27 | Tzer-Perng Chen | High flux light emitting diode having flip-chip type light emitting diode chip with a transparent substrate |
JP2005505796A (en) * | 2001-10-10 | 2005-02-24 | シーメンス アクチエンゲゼルシヤフト | Display device |
US7144248B2 (en) * | 2001-10-18 | 2006-12-05 | Irwin Dean S | Device for oral UV photo-therapy |
US20030091277A1 (en) | 2001-11-15 | 2003-05-15 | Wenhui Mei | Flattened laser scanning system |
US6560038B1 (en) | 2001-12-10 | 2003-05-06 | Teledyne Lighting And Display Products, Inc. | Light extraction from LEDs with light pipes |
US6928226B2 (en) | 2002-03-14 | 2005-08-09 | Corning Incorporated | Fiber and lens grippers, optical devices and methods of manufacture |
US7095922B2 (en) | 2002-03-26 | 2006-08-22 | Ngk Insulators, Ltd. | Lensed fiber array and production method thereof |
US6960035B2 (en) | 2002-04-10 | 2005-11-01 | Fuji Photo Film Co., Ltd. | Laser apparatus, exposure head, exposure apparatus, and optical fiber connection method |
US6894712B2 (en) | 2002-04-10 | 2005-05-17 | Fuji Photo Film Co., Ltd. | Exposure head, exposure apparatus, and application thereof |
JP3707688B2 (en) | 2002-05-31 | 2005-10-19 | スタンレー電気株式会社 | Light emitting device and manufacturing method thereof |
US20030233138A1 (en) * | 2002-06-12 | 2003-12-18 | Altus Medical, Inc. | Concentration of divergent light from light emitting diodes into therapeutic light energy |
US20030235800A1 (en) | 2002-06-24 | 2003-12-25 | Qadar Steven Abdel | LED curing light |
US7029277B2 (en) * | 2002-10-17 | 2006-04-18 | Coltene / Whaledent Inc. | Curing light with engineered spectrum and power compressor guide |
US20040164325A1 (en) | 2003-01-09 | 2004-08-26 | Con-Trol-Cure, Inc. | UV curing for ink jet printer |
US7157839B2 (en) | 2003-01-27 | 2007-01-02 | 3M Innovative Properties Company | Phosphor based light sources utilizing total internal reflection |
US6950454B2 (en) * | 2003-03-24 | 2005-09-27 | Eastman Kodak Company | Electronic imaging system using organic laser array illuminating an area light valve |
US7300164B2 (en) * | 2004-08-26 | 2007-11-27 | Hewlett-Packard Development Company, L.P. | Morphing light guide |
-
2003
- 2003-12-02 US US10/726,225 patent/US7329887B2/en not_active Expired - Fee Related
-
2004
- 2004-10-27 EP EP04796581A patent/EP1700144A1/en not_active Withdrawn
- 2004-10-27 JP JP2006542578A patent/JP2007513378A/en active Pending
- 2004-10-27 CN CNB200480041274XA patent/CN100565253C/en not_active Expired - Fee Related
- 2004-10-27 KR KR1020067013161A patent/KR20060110341A/en active IP Right Grant
- 2004-10-27 WO PCT/US2004/035709 patent/WO2005062089A1/en active Application Filing
- 2004-11-11 TW TW093134525A patent/TW200527718A/en unknown
Patent Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0249934A2 (en) * | 1986-06-18 | 1987-12-23 | Mitsubishi Rayon Co., Ltd. | Optical fiber device |
EP0490292A2 (en) * | 1990-12-07 | 1992-06-17 | Stanley Electric Co., Ltd. | Light irradiating apparatus having light emitting diode used as light source |
US5567032A (en) * | 1993-12-03 | 1996-10-22 | Robert Bosch Gmbh | Illuminating device for vehicles |
US5713654A (en) * | 1994-09-28 | 1998-02-03 | Sdl, Inc. | Addressable laser vehicle lights |
US6045240A (en) * | 1996-06-27 | 2000-04-04 | Relume Corporation | LED lamp assembly with means to conduct heat away from the LEDS |
EP1108949A1 (en) * | 1997-07-29 | 2001-06-20 | SDL, Inc. | Addressable vehicular lighting system |
US6290382B1 (en) * | 1998-08-17 | 2001-09-18 | Ppt Vision, Inc. | Fiber bundle combiner and led illumination system and method |
US6414801B1 (en) * | 1999-01-14 | 2002-07-02 | Truck-Lite Co., Inc. | Catadioptric light emitting diode assembly |
DE19923187A1 (en) * | 1999-05-20 | 2000-11-23 | Daimler Chrysler Ag | Lighting system for motor vehicle for producing deflected light matching the travel situation including several lighting means arranged unmovable on vehicle longitudinal half |
EP1067332A2 (en) * | 1999-07-09 | 2001-01-10 | Hella KG Hueck & Co. | Vehicle lamp |
DE10005795A1 (en) * | 2000-02-10 | 2001-08-23 | Inst Mikrotechnik Mainz Gmbh | Controllable headlights |
DE10110835A1 (en) * | 2001-03-06 | 2002-09-19 | Osram Opto Semiconductors Gmbh | Illuminating deviec with numerous LED modules fitted on cooler surface |
WO2002086972A1 (en) * | 2001-04-23 | 2002-10-31 | Plasma Ireland Limited | Illuminator |
DE10134381A1 (en) * | 2001-07-14 | 2003-01-23 | Hella Kg Hueck & Co | Light source bearer, preferably for vehicle lights, is stamped metal grid with at least two folded regions per LED, whereby each LED contact vane is arranged between legs of folded region |
US20030042493A1 (en) * | 2001-08-31 | 2003-03-06 | Yuri Kazakevich | Solid-state light source |
DE10162404A1 (en) * | 2001-12-19 | 2003-07-03 | Hella Kg Hueck & Co | Circuit arrangement for driving LEDs especially in motor vehicle, has power component and LED arranged on common circuit board or common conducting film |
DE20120770U1 (en) * | 2001-12-21 | 2002-03-28 | Osram Opto Semiconductors Gmbh | Surface-mounted LED multiple arrangement and lighting device with it |
FR2840151A1 (en) * | 2002-05-27 | 2003-11-28 | Valeo Vision | Support device for light-emitting diode (LED) for use in automobile signaling system, and method for manufacturing such device |
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US8439529B2 (en) | 2004-10-29 | 2013-05-14 | Osram Opto Semiconductors Gmbh | Lighting device, automotive headlights and method for producing a lighting device |
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Also Published As
Publication number | Publication date |
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CN100565253C (en) | 2009-12-02 |
JP2007513378A (en) | 2007-05-24 |
US20050140270A1 (en) | 2005-06-30 |
CN1914527A (en) | 2007-02-14 |
TW200527718A (en) | 2005-08-16 |
KR20060110341A (en) | 2006-10-24 |
US7329887B2 (en) | 2008-02-12 |
EP1700144A1 (en) | 2006-09-13 |
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