WO2005020627A1 - Speaker module assembly of multichannel headphone - Google Patents

Speaker module assembly of multichannel headphone Download PDF

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Publication number
WO2005020627A1
WO2005020627A1 PCT/KR2004/002103 KR2004002103W WO2005020627A1 WO 2005020627 A1 WO2005020627 A1 WO 2005020627A1 KR 2004002103 W KR2004002103 W KR 2004002103W WO 2005020627 A1 WO2005020627 A1 WO 2005020627A1
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WO
WIPO (PCT)
Prior art keywords
sound
hole
speaker units
detachable
inner frame
Prior art date
Application number
PCT/KR2004/002103
Other languages
French (fr)
Inventor
Sung-Il Kim
Original Assignee
Mm Gear Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mm Gear Co., Ltd. filed Critical Mm Gear Co., Ltd.
Publication of WO2005020627A1 publication Critical patent/WO2005020627A1/en

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1058—Manufacture or assembly
    • H04R1/1075—Mountings of transducers in earphones or headphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1008—Earpieces of the supra-aural or circum-aural type
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1058—Manufacture or assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/32—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only
    • H04R1/34—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by using a single transducer with sound reflecting, diffracting, directing or guiding means
    • H04R1/345—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by using a single transducer with sound reflecting, diffracting, directing or guiding means for loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2205/00—Details of stereophonic arrangements covered by H04R5/00 but not provided for in any of its subgroups
    • H04R2205/022—Plurality of transducers corresponding to a plurality of sound channels in each earpiece of headphones or in a single enclosure

Definitions

  • the present invention relates to a speaker module assembly of multichannel headphones, and more particularly, to a speaker module assembly of multichannel headphones which can improve performance of a product by modularizing parts.
  • Unpleasant noise is generated due to interference or unnecessary reflection and diffusion between sound waves generated from the multichannel speaker units.
  • the parts are not modularized to perform a function to guide or tune the sound wave and simply attached to the case or fixed thereto. Thus, replacement of parts is impossible, efficiency in assembly is lowered, and considerably production costs and time are needed, so that productivity is lowered greatly.
  • the present invention provides a speaker module assembly of multichannel headphones in which various parts for improving sound quality such as a separation member, a guide member, an open hole, a sound wave mixing room, a sound field protrusion, and an echo prevention hole are modularized by assembling the parts so that the sound quality is improved and sound waves generated from speaker units are precisely controlled and tuned to improve sound wave separation, form a sound field, reduce noise, and prevent echo.
  • the present invention provides a speaker module assembly of multichannel headphones in which various parts are assembled together and modularized to perform a function to guide or tune a sound wave so that replacement of the parts is easy, assembly is made easy, and production costs and time are reduced, thus greatly improving productivity.
  • the present invention provides a speaker module assembly of multichannel headphones in which an ear cover is detachable for hygienic use and a buffer member having a heat retaining material is provided to the ear cover so that the ear portion can be cooled in summer or warmed in winter.
  • a speaker module assembly of multichannel headphones comprising a plurality of speaker units, an inner frame having a shape of enclosing an entire surface of the speaker units, and having a unit hole formed in a lower surface of the inner frame where the speaker units are attached, a separation member formed on an upper surface of the inner frame to make sound waves generated from the speaker units maintain their characteristics, and a plurality of guide members formed between the separation members to guide the sound waves generated from the speaker units toward a center portion of the inner frame, a lower case having a shape of enclosing a rear surface of each of the speaker units by covering the lower surface of the inner frame, and having an open hole through which part of back sound (reverse phase sound) generated from rear surfaces of the speaker units is exhausted outside, an upper case having a shape of covering the upper surface of the inner frame, and having a hearing hole formed at a center portion of the upper case through which the sound waves generated from the speaker units are transferred to an ear of a hearer, a plurality of lower case having a shape of en
  • the detachable member of the ear cover is assembled in a twist cap manner with the inner wall surface of the sound wave mixing room of the upper case, and the buffer member includes a heat retaining material which is assembled to the detachable member in a detachable manner by being cooled and warmed using a refrigerant and a microwave.
  • a speaker module assembly of multichannel headphones various parts for improving sound quality are modularized by assembling the parts so that, in addition to the sound quality, a degree of separation of sound waves, a sound field forming effect, a noise reduction effect, and an echo prevention effect can be improved by precisely controlling and tuning the sound waves generated from the speaker units. Also, replacement of parts is simple, assembly work is made easy, and production costs and time is reduced, so that productivity is improved greatly.
  • the ear cover since the ear cover is detachably coupled, the ear cover is hygienic. Since the ear cover includes the buffer member having a heat retaining material, the ear portion can be cooled or warmed in summer or winder.
  • FIG. 1 is an exploded perspective view illustrating a speaker module assembly of multichannel headphones according to an embodiment of the present invention
  • FIG. 2 is a bottom view of the lower case of FIG. 1
  • FIG. 3 is a plan view of FIG. 2
  • FIG. 4 is a plan view of the inner frame of FIG. 1
  • FIG. 5 is a bottom view of FIG. 4
  • FIG. 6 is a plan view of the upper case of FIG. 1
  • FIG. 7 is a bottom view of FIG. 6
  • FIG. 8 is an exploded perspective view illustrating the ear cover of FIG. 1.
  • a speaker module assembly of multichannel headphones includes a plurality of speaker units 10, an upper case 20 enclosing the speaker units 10, a lower case 30, an inner frame 40 detachably installed between the upper case 20 and the lower case 30, and an ear cover 50.
  • the speaker units 10, as shown in FIG. 5, may include a center unit 1 1 at the center, a front unit 12 at the left, a rear unit 13 at the right, and a separate woofer unit or a vibration unit which is not shown.
  • the speaker unit 10 may include various multichannel speaker units such as 4 channels, 4.1 channels, 5 channels, 5.1 channels, 6 channels, 6.1 channels,
  • the inner frame 40 as shown in 4 and 5, encloses the front surfaces of the speaker units 10 and has a lower surface in which a unit hole 40a where each of the speaker units 10 is attached and an upper surface on which a separation member 41 to maintain independency of sound waves generated from the speaker units 10 is formed.
  • a plurality of guide members 42 to concentrate the sound waves generated from the speaker units 10 into a center portion of the upper case 20 is formed between the separation member 41.
  • a ring type separation member 41 1 is formed at a position corresponding to the center unit 1 1 and a ring type guide member 421 is formed inside coaxially with the ring type separation member 411.
  • a comb teeth type separation member 412 is formed at each of positions corresponding to the front unit 12 and the rear unit 13.
  • a plurality of comb teeth type guide members 422 are formed in the separation member 412.
  • the ring type guide member 421 installed at a position corresponding to the center unit 1 1 does not consider reflection because the sound wave generated from the center unit 11 is not directly transferred to the ear of the hearer.
  • the comb teeth type separation member 412 and the comb teeth type guide members 422 installed at positions corresponding to the front unit 12 and the rear unit 13 are formed as a plurality of comb teeth in a radial shape considering reflection at a predetermined rate to maintain a degree of separation of sound waves.
  • the lower case 30, as shown in FIGS. 2 and 3 has a shape of covering a lower surface of the inner frame 40 to enclose a rear surface of each of the speaker units 10 separately.
  • An open hole 31 is formed in the lower case 30 such that part of back sound (reverse phase sound) is exhausted to the outside.
  • a close contact member 32 closely contacting the center unit 11 , the front unit 12, and the rear unit 13 is formed on the lower case 30.
  • An echo prevention hole 33a connected to an echo prevention hole 33b of the inner frame 40 as shown in FIGS. 4 and 5 and an echo prevention hole 33c of the upper case 20 as shown in FIGS. 6 and 7 is formed in the close contact member 32 to prevent a speaker echo phenomenon.
  • part of the back sound generated from the rear sides of the speaker units 10 is exhausted to the outside through the open hole 31 of the lower case 30 so that a speaker enclosure is open, thus working as an open type speaker which provides dynamic and subtle sound.
  • the upper case 20 as shown in FIGS. 6 and 7, has a shape of covering the upper surface of the inner frame 40 and includes a hearing hole 20a at a center portion thereof to transfer the sound waves generated from the speaker units 10 to the ear of the hearer.
  • a plurality of lower surface sound field protrusions 21 forming a sound field of a sound wave reflected before escaping the hearing hole 20a are formed on the lower surface of the upper case 20.
  • a sound wave mixing room 22a and a wall surface 22 constituting a predetermined space where the sound waves escaping the hearing hole 20a are mixed and resonates are formed on the upper case 20.
  • a plurality of upper surface sound field protrusions 23 forming a sound field are arranged on an upper surface of an inner wall surface of the sound wave mixing room 22a.
  • a corresponding concave 24 closely contacting and corresponding to the separation member 41 and the guide member 42 of the inner frame 40 is formed on the upper case 20,
  • a vibration unit 14 can be formed on one side of the upper case 20.
  • the ear cover 50 is detachably assembled to an inner wall surface of the sound wave mixing room 22a formed on the upper case 20.
  • the ear cover 50 includes a detachable member 51 where a through hole 51a is formed corresponding to the hearing hole 20a, a net 52 covering the through hole 51a of the detachable member 51 , and a buffer member 53 having a shape of enclosing the detachable member 51 , detachable with the detachable member 51 , and contacting the ear of the hearer to provide a sense of cushion.
  • the detachable member 51 of the ear cover 50 is assembled to the wall surface 22 of the sound wave mixing room 22a of the upper case 20 in a twist cap manner of being coupled to or detached from each other by a rotation groove 54 of FIG. 8 and a rotation protrusion 25 of FIG. 1 that is forcibly engaged with the rotation groove 54.
  • the buffer member 53 has a heat retaining material inside and is assembled to the detachable member 51 in a detachable manner.
  • the buffer member 53 can be used after being kept in a refrigerator, so the ear can be kept cool while the user enjoys sound for a long time.
  • the buffer member 53 can be used after being heated using a microwave, so the ear can be kept warm while the user enjoys sound for a long time. Also, since a property of the heat retaining material can prevent rapid heating or cooling of the ear without using the refrigerator or microwave, merely using the buffer member 53 having the heat retaining material enables comfortable hearing.

Abstract

Provided is a speaker module assembly of multichannel headphones including a plurality of speaker units, an inner frame enclosing an entire surface of the speaker units and having a unit hole, a separation member, and a plurality of guide members, a lower case enclosing a rear surface of each of the speaker units and having an open hole, an upper case covering the upper surface of the inner frame and having a hearing hole, a plurality of lower surface sound field protrusions formed on a lower surface of the upper case, a sound wave mixing room and a wall surface forming a predetermined space, and a plurality of upper surfaces sound field protrusions to form a sound field, and an ear cover assembled detachably to the inner wall surface of the sound wave mixing room and having a detachable member where a through hole is formed, a net covering the through hole of the detachable member, and a buffer member having a shape of enclosing the detachable, detachable from the detachable member and contacting the ear of the hearer to form a predetermined sense of cushion.

Description

SPEAKER MODULE ASSEMBLY OF MULTICHANNEL HEADPHONE
Technical Field The present invention relates to a speaker module assembly of multichannel headphones, and more particularly, to a speaker module assembly of multichannel headphones which can improve performance of a product by modularizing parts.
Background Art In conventional multichannel headphones, a plurality of speaker units are installed. The speaker unit is typically installed on one of an upper case or a lower case. Accordingly, improvement of sound quality is not considered in view of structure. A severe echo phenomenon occurs when sound waves generated from the respective speaker units are mixed together. Front sound generated in the front of the speaker unit and rear sound generated at the rear of the speaker unit are not controlled structurally so as to provide optimal sound quality. Thus, in the conventional multichannel headphones, since sound separation among front/rear/center/woofer speaker units is not clear, a multichannel effect is not sufficiently worked. Since control of the front sound and the rear sound is impossible, the sound cannot be tuned to be a desired sound quality. Unpleasant noise is generated due to interference or unnecessary reflection and diffusion between sound waves generated from the multichannel speaker units. Also, in the conventional multichannel headphones, since various parts are assembled together, the parts are not modularized to perform a function to guide or tune the sound wave and simply attached to the case or fixed thereto. Thus, replacement of parts is impossible, efficiency in assembly is lowered, and considerably production costs and time are needed, so that productivity is lowered greatly.
Disclosure of Invention To solve the above and/or other problems, the present invention provides a speaker module assembly of multichannel headphones in which various parts for improving sound quality such as a separation member, a guide member, an open hole, a sound wave mixing room, a sound field protrusion, and an echo prevention hole are modularized by assembling the parts so that the sound quality is improved and sound waves generated from speaker units are precisely controlled and tuned to improve sound wave separation, form a sound field, reduce noise, and prevent echo. The present invention provides a speaker module assembly of multichannel headphones in which various parts are assembled together and modularized to perform a function to guide or tune a sound wave so that replacement of the parts is easy, assembly is made easy, and production costs and time are reduced, thus greatly improving productivity. The present invention provides a speaker module assembly of multichannel headphones in which an ear cover is detachable for hygienic use and a buffer member having a heat retaining material is provided to the ear cover so that the ear portion can be cooled in summer or warmed in winter. According to an aspect of the present invention, a speaker module assembly of multichannel headphones comprising a plurality of speaker units, an inner frame having a shape of enclosing an entire surface of the speaker units, and having a unit hole formed in a lower surface of the inner frame where the speaker units are attached, a separation member formed on an upper surface of the inner frame to make sound waves generated from the speaker units maintain their characteristics, and a plurality of guide members formed between the separation members to guide the sound waves generated from the speaker units toward a center portion of the inner frame, a lower case having a shape of enclosing a rear surface of each of the speaker units by covering the lower surface of the inner frame, and having an open hole through which part of back sound (reverse phase sound) generated from rear surfaces of the speaker units is exhausted outside, an upper case having a shape of covering the upper surface of the inner frame, and having a hearing hole formed at a center portion of the upper case through which the sound waves generated from the speaker units are transferred to an ear of a hearer, a plurality of lower surface sound field protrusions formed on a lower surface of the upper case to form a sound field of the sound waves which are reflected before escaping from the hearing hole, a sound wave mixing room and a wall surface forming a predetermined space where the sound waves escaping from the hearing hole are mixed and reverberate, and a plurality of upper surfaces sound field protrusions to form a sound field which is formed on an upper surface of an inner wall surface of the sound wave mixing room, and an ear cover assembled detachably to the inner wall surface of the sound wave mixing room formed on the upper case, and having a detachable member where a through hole is formed corresponding to the hearing hole, a net covering the through hole of the detachable member, and a buffer member having a shape of enclosing the detachable, detachable from the detachable member and contacting the ear of the hearer to form a predetermined sense of cushion. The detachable member of the ear cover is assembled in a twist cap manner with the inner wall surface of the sound wave mixing room of the upper case, and the buffer member includes a heat retaining material which is assembled to the detachable member in a detachable manner by being cooled and warmed using a refrigerant and a microwave.
Effect of the Invention As described above, in a speaker module assembly of multichannel headphones according to the present invention, various parts for improving sound quality are modularized by assembling the parts so that, in addition to the sound quality, a degree of separation of sound waves, a sound field forming effect, a noise reduction effect, and an echo prevention effect can be improved by precisely controlling and tuning the sound waves generated from the speaker units. Also, replacement of parts is simple, assembly work is made easy, and production costs and time is reduced, so that productivity is improved greatly. In addition, since the ear cover is detachably coupled, the ear cover is hygienic. Since the ear cover includes the buffer member having a heat retaining material, the ear portion can be cooled or warmed in summer or winder.
Brief Description of the Drawings FIG. 1 is an exploded perspective view illustrating a speaker module assembly of multichannel headphones according to an embodiment of the present invention; FIG. 2 is a bottom view of the lower case of FIG. 1 ; FIG. 3 is a plan view of FIG. 2; FIG. 4 is a plan view of the inner frame of FIG. 1 ; FIG. 5 is a bottom view of FIG. 4; FIG. 6 is a plan view of the upper case of FIG. 1 ; FIG. 7 is a bottom view of FIG. 6; and FIG. 8 is an exploded perspective view illustrating the ear cover of FIG. 1.
Best Mode for Carrying Out the Invention Referring to FIG. 1 , a speaker module assembly of multichannel headphones according to an embodiment of the present invention includes a plurality of speaker units 10, an upper case 20 enclosing the speaker units 10, a lower case 30, an inner frame 40 detachably installed between the upper case 20 and the lower case 30, and an ear cover 50. The speaker units 10, as shown in FIG. 5, may include a center unit 1 1 at the center, a front unit 12 at the left, a rear unit 13 at the right, and a separate woofer unit or a vibration unit which is not shown. In addition, the speaker unit 10 may include various multichannel speaker units such as 4 channels, 4.1 channels, 5 channels, 5.1 channels, 6 channels, 6.1 channels,
7 channels, and 7.1 channels. The inner frame 40, as shown in 4 and 5, encloses the front surfaces of the speaker units 10 and has a lower surface in which a unit hole 40a where each of the speaker units 10 is attached and an upper surface on which a separation member 41 to maintain independency of sound waves generated from the speaker units 10 is formed.
A plurality of guide members 42 to concentrate the sound waves generated from the speaker units 10 into a center portion of the upper case 20 is formed between the separation member 41. A ring type separation member 41 1 is formed at a position corresponding to the center unit 1 1 and a ring type guide member 421 is formed inside coaxially with the ring type separation member 411. A comb teeth type separation member 412 is formed at each of positions corresponding to the front unit 12 and the rear unit 13. A plurality of comb teeth type guide members 422 are formed in the separation member 412. Thus, the separation member 41 maintains independency of a sound wave and simultaneously guides the generated sound wave to an ear of a hearer so as not to mix different sorts of sound waves generated from the speaker units 10. The ring type guide member 421 installed at a position corresponding to the center unit 1 1 does not consider reflection because the sound wave generated from the center unit 11 is not directly transferred to the ear of the hearer. In contrast, the comb teeth type separation member 412 and the comb teeth type guide members 422 installed at positions corresponding to the front unit 12 and the rear unit 13 are formed as a plurality of comb teeth in a radial shape considering reflection at a predetermined rate to maintain a degree of separation of sound waves. The lower case 30, as shown in FIGS. 2 and 3, has a shape of covering a lower surface of the inner frame 40 to enclose a rear surface of each of the speaker units 10 separately. An open hole 31 is formed in the lower case 30 such that part of back sound (reverse phase sound) is exhausted to the outside. A close contact member 32 closely contacting the center unit 11 , the front unit 12, and the rear unit 13 is formed on the lower case 30. An echo prevention hole 33a connected to an echo prevention hole 33b of the inner frame 40 as shown in FIGS. 4 and 5 and an echo prevention hole 33c of the upper case 20 as shown in FIGS. 6 and 7 is formed in the close contact member 32 to prevent a speaker echo phenomenon. Thus, part of the back sound generated from the rear sides of the speaker units 10 is exhausted to the outside through the open hole 31 of the lower case 30 so that a speaker enclosure is open, thus working as an open type speaker which provides dynamic and subtle sound. In addition, part of front sound (normal phase sound) generated from the front sides of the speaker units 10 is exhausted to the outside through the echo prevention holes 33a, 33b, and 33c of the lower case 30 so that echo of the front sound of the speaker units 10 is reduced, thus working as an echo prevention speaker. The upper case 20, as shown in FIGS. 6 and 7, has a shape of covering the upper surface of the inner frame 40 and includes a hearing hole 20a at a center portion thereof to transfer the sound waves generated from the speaker units 10 to the ear of the hearer. A plurality of lower surface sound field protrusions 21 forming a sound field of a sound wave reflected before escaping the hearing hole 20a are formed on the lower surface of the upper case 20. A sound wave mixing room 22a and a wall surface 22 constituting a predetermined space where the sound waves escaping the hearing hole 20a are mixed and resonates are formed on the upper case 20. A plurality of upper surface sound field protrusions 23 forming a sound field are arranged on an upper surface of an inner wall surface of the sound wave mixing room 22a. A corresponding concave 24 closely contacting and corresponding to the separation member 41 and the guide member 42 of the inner frame 40 is formed on the upper case 20, A vibration unit 14 can be formed on one side of the upper case 20. Accordingly, when the sound waves generated from the speaker units 10 are reflected from the upper case 20, unnecessary noise is diffused and reduced by the lower surface sound field protrusions 21 and the upper surface sound field protrusions 23 and mixed in the sound wave mixed room 22a. Thus, a sense of a sound field that provides the hearer with a sense of being present in a large place. The ear cover 50, as shown in FIG. 8, is detachably assembled to an inner wall surface of the sound wave mixing room 22a formed on the upper case 20. The ear cover 50 includes a detachable member 51 where a through hole 51a is formed corresponding to the hearing hole 20a, a net 52 covering the through hole 51a of the detachable member 51 , and a buffer member 53 having a shape of enclosing the detachable member 51 , detachable with the detachable member 51 , and contacting the ear of the hearer to provide a sense of cushion. The detachable member 51 of the ear cover 50 is assembled to the wall surface 22 of the sound wave mixing room 22a of the upper case 20 in a twist cap manner of being coupled to or detached from each other by a rotation groove 54 of FIG. 8 and a rotation protrusion 25 of FIG. 1 that is forcibly engaged with the rotation groove 54. The buffer member 53 has a heat retaining material inside and is assembled to the detachable member 51 in a detachable manner. When the ear of a user is heated by a long use or in summer, the buffer member 53 can be used after being kept in a refrigerator, so the ear can be kept cool while the user enjoys sound for a long time. When the user feels coldness in the ear in winter or outdoors, the buffer member 53 can be used after being heated using a microwave, so the ear can be kept warm while the user enjoys sound for a long time. Also, since a property of the heat retaining material can prevent rapid heating or cooling of the ear without using the refrigerator or microwave, merely using the buffer member 53 having the heat retaining material enables comfortable hearing. Since a technology related to the heat retaining material is already used for a facial pack or an icebox coolant, which can be modified and altered by those skilled in the art, a detailed description thereof will be omitted. While this invention has been particularly shown and described with reference to preferred embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. For example, the present invention can be applied to various types of multichannel speaker units and the outer appearance of the present invention is not limited to a design illustrated in the accompanying drawings.

Claims

What is claimed is: 1. A speaker module assembly of multichannel headphones comprising: a plurality of speaker units; an inner frame having a shape of enclosing an entire surface of the speaker units, and having a unit hole formed in a lower surface of the inner frame where the speaker units are attached, a separation member formed on an upper surface of the inner frame to make sound waves generated from the speaker units maintain their characteristics, and a plurality of guide members formed between the separation members to guide the sound waves generated from the speaker units toward a center portion of the inner frame; a lower case having a shape of enclosing a rear surface of each of the speaker units by covering the lower surface of the inner frame, and having an open hole through which part of back sound (reverse phase sound) generated from rear surfaces of the speaker units is exhausted outside; an upper case having a shape of covering the upper surface of the inner frame, and having a hearing hole formed at a center portion of the upper case through which the sound waves generated from the speaker units are transferred to an ear of a hearer, a plurality of lower surface sound field protrusions formed on a lower surface of the upper case to form a sound field of the sound waves which are reflected before escaping from the hearing hole, a sound wave mixing room and a wall surface forming a predetermined space where the sound waves escaping from the hearing hole are mixed and reverberate, and a plurality of upper surfaces sound field protrusions to form a sound field which is formed on an upper surface of an inner wall surface of the sound wave mixing room; and an ear cover assembled detachably to the inner wall surface of the sound wave mixing room formed on the upper case, and having a detachable member where a through hole is formed corresponding to the hearing hole, a net covering the through hole of the detachable member, and a buffer member having a shape of enclosing the detachable, detachable from the detachable member and contacting the ear of the hearer to form a predetermined sense of cushion.
2. The speaker module assembly of claim 1 , wherein the speaker units comprises a center unit at a center, a front unit at a left, a rear unit at a right, and a woofer unit, the inner frame comprises a ring type separation member formed at a position corresponding to the center unit, a ring type guide member coaxial with the ring type separation member and formed in the ring type separation member, a comb teeth type separation member formed at a position corresponding to the front unit and the rear unit, and a plurality of comb teeth type guide members between the comb teeth type separation members, and the lower case comprises a close contact member closely contacting each of the center unit, the front unit, and the rear unit, an echo prevention hole formed in the inner frame and outside the close contact member to prevent an echo phenomenon of front sound (normal phase sound) of the speaker units, and an echo prevent hole connected to the echo prevention hole of the upper case.
3. The speaker module assembly of claim 2, wherein the upper case closely contacts the separation member and the guide member of the inner frame and comprises a corresponding concave formed therein to correspond to the upper case and a vibration unit formed on a side of the upper case.
4. The speaker module assembly of claim 1 , wherein the detachable member of the ear cover is assembled in a twist cap manner with the inner wall surface of the sound wave mixing room of the upper case, and the buffer member includes a heat retaining material which is assembled to the detachable member in a detachable manner by being cooled and warmed using a refrigerant and a microwave.
PCT/KR2004/002103 2003-08-22 2004-08-20 Speaker module assembly of multichannel headphone WO2005020627A1 (en)

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KR20030058242A KR100496908B1 (en) 2003-08-22 2003-08-22 Speaker module assembly of multichannel headphone
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WO2010134652A1 (en) * 2009-05-22 2010-11-25 에스에프원(주) Resonance tube structure for multi-channel headphone
WO2010134653A1 (en) * 2009-05-22 2010-11-25 에스에프원(주) Multi-channel headphone system
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JP2003199187A (en) * 2001-12-17 2003-07-11 Zuisho Ko Headphone

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Publication number Priority date Publication date Assignee Title
KR100335171B1 (en) * 2000-09-25 2002-05-11 Mm Gear Multi-channel headphone system
US6483925B1 (en) * 2001-05-29 2002-11-19 Yao-Sheng Shen Headphone having several speakers
JP2003199187A (en) * 2001-12-17 2003-07-11 Zuisho Ko Headphone

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Publication number Priority date Publication date Assignee Title
WO2009067085A1 (en) * 2007-11-22 2009-05-28 Creative Technology Ltd An ear bud earphone with variable noise isolation, a cushion for an ear bud earphone and a corresponding method
CN102625223A (en) * 2011-01-31 2012-08-01 声特科技股份有限公司 Assembly method of integrated exterior earcap
CN102625223B (en) * 2011-01-31 2014-07-30 声特科技股份有限公司 Assembly method of integrated exterior earcap
EP2709379A1 (en) * 2012-09-17 2014-03-19 Sennheiser Communications A/S Ear appliance
CN103686511A (en) * 2012-09-17 2014-03-26 森海塞尔通信公司 Ear appliance

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