WO2005019500A1 - Method of recovery of metals from etching solutions - Google Patents
Method of recovery of metals from etching solutions Download PDFInfo
- Publication number
- WO2005019500A1 WO2005019500A1 PCT/EP2004/009304 EP2004009304W WO2005019500A1 WO 2005019500 A1 WO2005019500 A1 WO 2005019500A1 EP 2004009304 W EP2004009304 W EP 2004009304W WO 2005019500 A1 WO2005019500 A1 WO 2005019500A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- etching solution
- spent
- metal
- nickel
- copper
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/46—Regeneration of etching compositions
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B15/00—Obtaining copper
- C22B15/0063—Hydrometallurgy
- C22B15/0084—Treating solutions
- C22B15/0089—Treating solutions by chemical methods
- C22B15/0091—Treating solutions by chemical methods by cementation
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B23/00—Obtaining nickel or cobalt
- C22B23/04—Obtaining nickel or cobalt by wet processes
- C22B23/0453—Treatment or purification of solutions, e.g. obtained by leaching
- C22B23/0461—Treatment or purification of solutions, e.g. obtained by leaching by chemical methods
- C22B23/0469—Treatment or purification of solutions, e.g. obtained by leaching by chemical methods by chemical substitution, e.g. by cementation
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B3/00—Extraction of metal compounds from ores or concentrates by wet processes
- C22B3/20—Treatment or purification of solutions, e.g. obtained by leaching
- C22B3/44—Treatment or purification of solutions, e.g. obtained by leaching by chemical processes
- C22B3/46—Treatment or purification of solutions, e.g. obtained by leaching by chemical processes by substitution, e.g. by cementation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Definitions
- This invention relates generally to etching and more specifically to the recover of metals from a spent etching solution.
- etching or photochemical machining is well known in the art.
- an etching solution is selectively applied to an article to remove unwanted material through a process of chemical interaction with the metal.
- One of the common etching solutions comprises a ferric chloride solution (FeCls).
- the ferric chloride etching solution is used to etch a variety of materials including metals that contain iron, copper and nickel.
- the etching is caused by the oxidative power of iron IE ions.
- the concentration of the nickel II and or the copper II ion increases in the etching solutions while the concentrations of the iron HI decreases and the concentrations of the iron II increases.
- the ferric chloride solution reduces to a ferrous chloride (FeCt ⁇ ) solution which contains metal ions through the interaction of the ferric chloride with the article being etched.
- the ferrous chloride solution can be converted back to a ferric chloride (FeCl3) solution through a process of regeneration which leaves a sludge of waste material.
- FeCl3 ferric chloride
- the etching process produces large amounts of waste or spent etching solutions which can contain large amounts of nickel and or copper. Generally, the sludge that remains from the regeneration must be carefully disposed of so as to avoid any adverse environmental impact.
- the spent etching solutions could be refined to recover the metals in the spent etching solution. More specifically, If the spent etching solutions contains nickel and copper it would be preferable to recover the nickel and copper from the spent etching solution rather than having to dispose of the spent etching solution with nickel and copper.
- the present invention comprises a process where the metals in the spent etching solution are separated and recovered from the spent etching solution by converting a residue metal, such as copper or nickel, to a metal powder.
- the metal powder can then be removed from the spent etching solution thereby decreasing the amount of sludge that needs to disposed of as well as allowing one to recover the metals for reuse.
- a method of etching and a method of regenerating a spent etching solution comprising adding metal particles to a spent etching solution to precipitate the residue metal or metals in the spent etching solution in the form of metal powders, removing the metal powders from the spent etching solution and recovering the metals in the metal powder for future use.
- the remaining portion of the spent etching solution can then be regenerated to produce a fresh batch of etching solution.
- the Figure is a schematic representation of an etching system having an etchant regeneration system that includes apparatus for separating etched metal from a spent etching solution and for regeneration of the spent etching solution to create a fresh batch of etching solution.
- the Figure shows an etchant regeneration system 10 comprising a first etching stage wherein an article 11 is subjected to a spray of etching solution 9 from a set of spray nozzles 12 and 13.
- the fresh etching solution which is contained in a container 8, is directed onto the article 11 though a set of spray nozzles 12 that direct etchant on one side of article 11 and a second set of spray nozzles 13 direct etchant on the other side of article 11.
- spray etching is shown, other etching techniques such as immersion of the article in the etching solution 9 can be used.
- the etching solution 9 removes unwanted material from the article, which is then carried away by the spent etching solution 14.
- the spent etching solution 14 and the unwanted material is then collected in a container 15.
- a common etchant such as ferric chloride (FeCFi) is used as the etching solution.
- FeCFi ferric chloride
- the removal of the metal from the article leaves a spent etching solution 14 comprising a ferrous chloride solution (FeCl2) containing a reside of metal and metal ions from the etched material.
- FeCl2 ferrous chloride solution
- the spent etching solution 14 contains copper
- the spent etching solution 14 contains nickel
- the metals which are normally included as part of the sludge, remain therein when the ferrous chloride solution is regenerated to produce a fresh batch of ferric chloride solution.
- Etchant regeneration methods include the use of sodium chlorate and hydrochloric acid, ozone and hydrochloric acid, electrolysis with hydrochloric acid and use of chlorine gas.
- a method and system for regeneration of ferric chloride enchant is shown and described more fully in U.S. patent 5,277,010.
- the spent etchant solution 14 which contains metal and or metal ions is transferred, via a conduit to a second container 17.
- a pivotally mounted bucket carrier 18 which is suspend by a support 19 carries a number of metal particles 20 which are shown be dumped into the spent etching solution 14 that is located in container 17.
- the metal particles comprise iron particles of various shapes and sizes.
- the particles can be in the form of sheets or wires. In general, it is preferred to have at least one dimension of the particle in the range of a millimeter to a centimeter.
- the process can be performed at room temperature or can be performed at higher or lower temperatures with the temperature the primary factor in determining the rate of precipitation.
- the length of time to precipitate out the metal can range from a few minutes to hours depending on the amount of solution as well as the amount of residue metal in the spent etching solution.
- iron particles 20 are submerged in the spent etching solution. As the iron particles contact the etching solution the metal is precipitated from the spent etching solution in the form of metal powder.
- the metal is precipitated from the spent etching solution in the form of metal powder.
- a spent etching solution that contains iron and residue metals such as nickel and copper it has been found that the addition of iron metal particles to the spent etching solution causes the nickel and copper in the etching solution to precipitate out of the spent etching solution in the form of metal powders.
- the spent etching solution 14 is subjected to the iron particles the spent etching solution 14 with the precipitate therein is directed to a separator 26 though a conduit 25.
- the metal powder can now be removed or separated from the solution with a separator through a process of sedimentation, centrifugation, filtration or similar process.
- the nickel powder is directed from separator 26 to a container 28 thorough a conduit 27 and the copper powder is directed from the separator 26 to a container 30 through a conduit 29.
- the copper powder and nickel powder can then be reused in the formation of copper and nickel metals.
- the spent etching solution which now has the copper and nickel removed, flows into a container 32 through a conduit 31.
- the spent etching solution in container 32 can now be regenerated to form a fresh batch of etching solution.
- a source of chlorine 35 can direct chlorine into the ferrous chloride solution through a conduit 36 to convert the ferrous chloride solution to a ferric chloride etching solution.
- a conduit 38 and a pump 40 pump the batch of regenerated etching solution to the fresh etching solution 9 contained in container 8.
- the metal iron precipitates nickel and copper from used or spent etching solutions in the form of a metal powder that separates from the iron without forming adhering layers or large inter grown metal deposits.
- the process is based on the reducing power of metallic iron and it is believed the reactions for nickel and copper can be summarized as follows: Ni 2+ +Fe me t a ⁇ ⁇ Ni me t a ⁇ + Fe 2+ and Cu 2+ 4- Fe me t a ⁇ ⁇ Cu meta ⁇ +
- Fe + while the residual ferric chloride etching solutions is reduced according to the equation Fe 3+ + Fe me t a ⁇ ⁇ 3Fe 2+ .
- the reduced solution contains Fe 2+ ions and chloride ions.
- the solution can be oxidized by chorine to produce a fresh Ferric chloride . etching solution for further use.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geology (AREA)
- Geochemistry & Mineralogy (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- ing And Chemical Polishing (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/645,278 | 2003-08-21 | ||
US10/645,278 US20050042156A1 (en) | 2003-08-21 | 2003-08-21 | Method of recovery of metals from etching solutions |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005019500A1 true WO2005019500A1 (en) | 2005-03-03 |
Family
ID=34194297
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2004/009304 WO2005019500A1 (en) | 2003-08-21 | 2004-08-19 | Method of recovery of metals from etching solutions |
Country Status (2)
Country | Link |
---|---|
US (1) | US20050042156A1 (en) |
WO (1) | WO2005019500A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103741143A (en) * | 2013-12-31 | 2014-04-23 | 遂宁市广天电子有限公司 | Circulating treatment system and method for etching solution |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7404904B2 (en) * | 2001-10-02 | 2008-07-29 | Melvin Stanley | Method and apparatus to clean particulate matter from a toxic fluid |
JP7097062B2 (en) * | 2018-07-30 | 2022-07-07 | 株式会社アステック入江 | How to stop the treatment of iron chloride etching waste liquid |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59157283A (en) * | 1983-02-24 | 1984-09-06 | Takayoshi Sekine | Reutilizing method of waste etching liquid for printed circuit board |
JPS62191428A (en) * | 1986-02-19 | 1987-08-21 | Toagosei Chem Ind Co Ltd | Removal of nickel from aqueous ferrous chloride |
JPS62192588A (en) * | 1986-02-19 | 1987-08-24 | Toagosei Chem Ind Co Ltd | Removing method for chromium and nickel contained in iron chloride aqueous solution |
JPS6333584A (en) * | 1986-07-25 | 1988-02-13 | Tsurumi Soda Kk | Treatment of spent copper etching solution |
JPH01167235A (en) * | 1987-12-23 | 1989-06-30 | Daiso Co Ltd | Regeneration of ferric chloride solution |
RU1798383C (en) * | 1990-11-01 | 1993-02-28 | Харьковский государственный университет им.А.М.Горького | Method of regeneration of spent etching solution containing ferrous and ferric chloride and copper |
JPH05263273A (en) * | 1992-03-17 | 1993-10-12 | Toagosei Chem Ind Co Ltd | Method for removing and recovering nickel in aqueous iron chloride solution |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
MY115542A (en) * | 1996-06-28 | 2003-07-31 | Astec Irie Co Ltd | Method for recovering etchand from etching waste liquid containing iron chloride |
-
2003
- 2003-08-21 US US10/645,278 patent/US20050042156A1/en not_active Abandoned
-
2004
- 2004-08-19 WO PCT/EP2004/009304 patent/WO2005019500A1/en active Application Filing
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59157283A (en) * | 1983-02-24 | 1984-09-06 | Takayoshi Sekine | Reutilizing method of waste etching liquid for printed circuit board |
JPS62191428A (en) * | 1986-02-19 | 1987-08-21 | Toagosei Chem Ind Co Ltd | Removal of nickel from aqueous ferrous chloride |
JPS62192588A (en) * | 1986-02-19 | 1987-08-24 | Toagosei Chem Ind Co Ltd | Removing method for chromium and nickel contained in iron chloride aqueous solution |
JPS6333584A (en) * | 1986-07-25 | 1988-02-13 | Tsurumi Soda Kk | Treatment of spent copper etching solution |
JPH01167235A (en) * | 1987-12-23 | 1989-06-30 | Daiso Co Ltd | Regeneration of ferric chloride solution |
RU1798383C (en) * | 1990-11-01 | 1993-02-28 | Харьковский государственный университет им.А.М.Горького | Method of regeneration of spent etching solution containing ferrous and ferric chloride and copper |
JPH05263273A (en) * | 1992-03-17 | 1993-10-12 | Toagosei Chem Ind Co Ltd | Method for removing and recovering nickel in aqueous iron chloride solution |
Non-Patent Citations (9)
Title |
---|
DATABASE WPI Section Ch Week 198739, Derwent World Patents Index; Class E31, AN 1987-274398, XP002308381 * |
DATABASE WPI Section Ch Week 199345, Derwent World Patents Index; Class L03, AN 1993-357567, XP002308380 * |
DATABASE WPI Section Ch Week 199419, Derwent World Patents Index; Class L03, AN 1994-157645, XP002307588 * |
PATENT ABSTRACTS OF JAPAN vol. 009, no. 005 (C - 260) 10 January 1985 (1985-01-10) * |
PATENT ABSTRACTS OF JAPAN vol. 012, no. 040 (C - 474) 5 February 1988 (1988-02-05) * |
PATENT ABSTRACTS OF JAPAN vol. 012, no. 047 (C - 475) 12 February 1988 (1988-02-12) * |
PATENT ABSTRACTS OF JAPAN vol. 012, no. 242 (C - 510) 8 July 1988 (1988-07-08) * |
PATENT ABSTRACTS OF JAPAN vol. 013, no. 431 (C - 640) 26 September 1989 (1989-09-26) * |
PATENT ABSTRACTS OF JAPAN vol. 018, no. 040 (C - 1155) 21 January 1994 (1994-01-21) * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103741143A (en) * | 2013-12-31 | 2014-04-23 | 遂宁市广天电子有限公司 | Circulating treatment system and method for etching solution |
Also Published As
Publication number | Publication date |
---|---|
US20050042156A1 (en) | 2005-02-24 |
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