WO2005016587A1 - Procede de determination de la position de la surface d'une piece a l'interieur d'une machine d'usinage laser - Google Patents

Procede de determination de la position de la surface d'une piece a l'interieur d'une machine d'usinage laser Download PDF

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Publication number
WO2005016587A1
WO2005016587A1 PCT/EP2004/050535 EP2004050535W WO2005016587A1 WO 2005016587 A1 WO2005016587 A1 WO 2005016587A1 EP 2004050535 W EP2004050535 W EP 2004050535W WO 2005016587 A1 WO2005016587 A1 WO 2005016587A1
Authority
WO
WIPO (PCT)
Prior art keywords
workpiece
mark
calibration curve
distance
carrier
Prior art date
Application number
PCT/EP2004/050535
Other languages
German (de)
English (en)
Inventor
Uwe Metka
Original Assignee
Hitachi Via Mechanics, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Via Mechanics, Ltd. filed Critical Hitachi Via Mechanics, Ltd.
Publication of WO2005016587A1 publication Critical patent/WO2005016587A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation

Definitions

  • the invention relates to a method for determining the surface-height position of a workpiece within a laser processing machine, a laser beam being directed via an optical deflection unit and focusing optics onto the workpiece, which is arranged on a carrier and can be moved three-dimensionally therewith.
  • Laser processing machines for drilling, structuring and labeling workpieces are used in a wide variety of technical fields.
  • such machines are used for processing electrical circuit carriers, such as printed circuit boards, especially where miniaturized circuit carriers with high packing density require very fine bores and conductor structures in the range of 100 ⁇ and less and where high processing speed is also required . Since the accuracy of the machining depends on the focus of the laser beam on the surface to be machined, it is important to know or set the working distance between the focusing optics and the workpiece surface to be machined as precisely as possible.
  • the aim of the invention is to provide a simple method for determining the high position of the workpiece surface within the machine and thus also the distance between the workpiece surface and the focusing optics, which uses the optical properties of the systems present in such a machine, so that none of them are complex Additional instruments are required.
  • this aim is achieved in that at least one mark arranged on the surface of the wearer is measured by means of a camera in a plurality of predetermined height positions of the wearer, a predetermined measurement distance formed by the mark resulting in different measured values depending on the respective height position from which a calibration curve is derived and stored, that the predetermined measuring distance is then also formed with at least one mark arranged on the surface of the workpiece and measured by means of the camera at a certain height position of the wearer, and that the height position is compared by comparing a measurement value obtained in this way with the calibration curve the workpiece surface is determined.
  • a camera is used to determine the height of the workpiece, which is present in any case in such laser machines since, among other things, it records markings for the horizontal orientation of the workpiece.
  • a calibration curve is now directly on the surface of the carrier or processing ti 200310317
  • a camera is provided, the beam path of which is guided separately from the laser beam and the focusing optics of which is guided via a separate imaging unit.
  • the measuring distance is determined by the extent of the mark in a predetermined horizontal direction, that is, for example, by a line width of the mark.
  • the calibration curve recorded in this way like a measurement curve recorded with the brand of the workpiece, each has a minimum which corresponds to the focus distance of the brand from the imaging unit. The difference between the minima of these two curves is then directly the height or thickness of the workpiece.
  • This method is preferably used for lasers with a longer wavelength, for example for CO 2 lasers.
  • the marks on the carrier and on the workpiece are observed by the camera via the focusing optics of the laser, and the measuring distance is determined by the distance between two horizontally displaced positions of the mark are determined, ie in each height position the carrier is horizontally displaced horizontally by the predetermined measuring distance, the mark being recorded by the camera in each of the two horizontally displaced positions.
  • the virtual distance between the two measuring positions measured in each height position of the carrier then results in the calibration curve, and a measuring distance is determined by two image recordings of a mark located on the surface of the workpiece in likewise two horizontal positions offset by the measuring distance 200310317
  • Calibration curve immediately gives the high value for the surface of the workpiece.
  • the distance between the focusing optics and the processing plane in laser processing machines can thus be measured at almost any point on the workpiece and can be optimized by means of an active control, without the need for additional equipment, which would also mean increased financial expenditure.
  • the method can be used several times, for example for measuring the flatness of the machining table, for measuring the tolerances of the workpieces, both the tolerances within the workpiece and the tolerances between two workpieces.
  • FIG. 1 shows a schematic arrangement for carrying out a first embodiment of the method according to the invention
  • FIG. 2 shows a calibration curve obtained with the structure of FIG. 1 on the surface of a processing table in comparison with a measurement curve obtained on a workpiece
  • 3a and 3b show the apparatus structure for a second embodiment of the method according to the invention, the beam path of the camera running over the focusing optics of the laser and the processing table being shown in two horizontally offset positions and
  • FIGS. 3a and 3b shows a calibration curve obtained with the arrangement according to FIGS. 3a and 3b.
  • FIG. 1 shows a possible apparatus construction for carrying out a method according to the invention with separate ones
  • a laser beam 2 emitted by a laser 1 is shown schematically, which is directed via a deflection device 3 and a focusing optics 4 in the form of an f- ⁇ lens to a work table 5 or a workpiece 6 arranged thereon.
  • This camera 7 is usually used to determine the horizontal position of the workpiece on the processing table in two directions x and y.
  • the camera 7 also determines the vertical position of the processing table 5 with respect to the z axis.
  • the processing table 5 can be adjusted to different height positions, for example from z -3 to z 0 to z 3 .
  • a mark 9 is attached to the work table, which in the example of FIG. 1 has the shape of an indicated cross, whereby a mark property, for example the line width B or the bar length, is determined as the measuring distance.
  • a 9 * mark is also provided on the workpiece at least once.
  • the processing table 5 is first measured without a workpiece, the mark 9 being recorded by the camera at different z positions, for example z -3 to Z 3 .
  • the predetermined measuring distance for example the line width B
  • the line width B is plotted as a function of the respective height position or 7 position, so that a curve profile as shown in FIG. 2 is obtained on the basis of the imaging properties of the imaging optics 8.
  • a b-value is thus assigned to each z-position, with which the measuring distance, ie the line width B, is measured at this corresponding height position.
  • the measurement values obtained in this way are plotted as calibration points EP -3 to EP 3 over the corresponding z values and thus form a calibration curve EK1.
  • the mark 9 * attached to the workpiece can be measured in the same way.
  • B measured values are again obtained, which are shown in FIG. 2 as measuring points MP -3 to MP 3 and together one 200310317
  • Figure 3 shows a slightly modified arrangement compared to Figure.
  • the beam path of the camera 7 is directed directly through the focusing optics 4 of the laser beam, which is not shown in this picture, so that the observation of the mark 9 on the processing table 5 or 9 * on the workpiece 6 is carried out via the Focusing optics 4 takes place.
  • two image recordings according to FIGS. 3a and 3b are now carried out in each of the possible z positions (z_ 3 to z 3 ), the processing table being horizontally one between the positions of FIGS. 3a and 3b exactly defined value Dx is moved, whereby a measuring distance Dx is fixed. This measuring distance Dx between the two image recordings is measured with a different virtual value in each height position.
  • the virtual distance determined is a direct measure of the height of the workpiece. For the illustration in FIG. 4, this means, for example, that the measuring point MA is determined at a high position zo of the table 5, the measurement in the two positions of the 200310317
  • Figures 3a and 3b gives a virtual distance that the height position z. equivalent.
  • the height or thickness of the workpiece thus corresponds to the difference ⁇ z between the height positions z 0 and zi.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Laser Beam Processing (AREA)

Abstract

L'invention concerne un procédé de détermination de la position en hauteur de la surface d'une pièce (6) à l'intérieur d'une machine d'usinage laser, dans laquelle un faisceau laser (2) est dirigé sur la pièce (6), qui est placée sur un support (5), par l'intermédiaire d'un système optique de focalisation (4). Selon ledit procédé, au moins un repère (9), qui est placé sur la surface du support, est soumis, au moyen d'une caméra, à des mesures pour lesquelles le support est placé à plusieurs hauteurs (z--3 à z3) préallouées. Une distance de mesure (B) prédéterminée par le repère se traduit par des valeurs de mesure différentes pour les différentes hauteurs, valeurs de mesure à partir desquelles est dérivée une courbe d'étalonnage. Un repère (9*) placé sur la pièce (6) est soumis, de la même façon, à une mesure quand le support (5) se trouve à une hauteur prédéterminée. Par comparaison, avec la courbe d'étalonnage, de la valeur de la mesure effectuée sur la pièce, on obtient la hauteur exacte de la pièce.
PCT/EP2004/050535 2003-08-11 2004-04-16 Procede de determination de la position de la surface d'une piece a l'interieur d'une machine d'usinage laser WO2005016587A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10336861.2 2003-08-11
DE10336861A DE10336861B3 (de) 2003-08-11 2003-08-11 Verfahren zur Bestimmung der Oberflächenposition eines Werkstückes innerhalb einer Laserbearbeitungsmaschine

Publications (1)

Publication Number Publication Date
WO2005016587A1 true WO2005016587A1 (fr) 2005-02-24

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2004/050535 WO2005016587A1 (fr) 2003-08-11 2004-04-16 Procede de determination de la position de la surface d'une piece a l'interieur d'une machine d'usinage laser

Country Status (2)

Country Link
DE (1) DE10336861B3 (fr)
WO (1) WO2005016587A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997034206A1 (fr) * 1996-03-12 1997-09-18 Electro Scientific Industries, Inc. Systeme de positionnement d'outils multiples
US5948292A (en) * 1997-06-05 1999-09-07 Mitsubishi Denki Kabushiki Kaisha Laser beam machining apparatus, focus positioning device for laser beam machining apparatus, and converged laser beam diameter measuring device
US20030002055A1 (en) * 2001-06-29 2003-01-02 Alexander Kilthau Method of calibrating the optical system of a laser machine for processing electrical circuit substrates

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3209641B2 (ja) * 1994-06-02 2001-09-17 三菱電機株式会社 光加工装置及び方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997034206A1 (fr) * 1996-03-12 1997-09-18 Electro Scientific Industries, Inc. Systeme de positionnement d'outils multiples
US5948292A (en) * 1997-06-05 1999-09-07 Mitsubishi Denki Kabushiki Kaisha Laser beam machining apparatus, focus positioning device for laser beam machining apparatus, and converged laser beam diameter measuring device
US20030002055A1 (en) * 2001-06-29 2003-01-02 Alexander Kilthau Method of calibrating the optical system of a laser machine for processing electrical circuit substrates

Also Published As

Publication number Publication date
DE10336861B3 (de) 2004-12-09

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