WO2005015633A2 - Dispositif de refroidissement pour evacuer la chaleur perdue par des composants electriques ou electroniques ou un module, et systeme de refroidissement - Google Patents

Dispositif de refroidissement pour evacuer la chaleur perdue par des composants electriques ou electroniques ou un module, et systeme de refroidissement Download PDF

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Publication number
WO2005015633A2
WO2005015633A2 PCT/DE2004/001441 DE2004001441W WO2005015633A2 WO 2005015633 A2 WO2005015633 A2 WO 2005015633A2 DE 2004001441 W DE2004001441 W DE 2004001441W WO 2005015633 A2 WO2005015633 A2 WO 2005015633A2
Authority
WO
WIPO (PCT)
Prior art keywords
cooler
sheets
cooling fins
cooling
coolant
Prior art date
Application number
PCT/DE2004/001441
Other languages
German (de)
English (en)
Other versions
WO2005015633A3 (fr
Inventor
Jürgen SCHULZ-HARDER
Karl Exel
Ingo Baumeister
Original Assignee
Curamik Electronics Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Curamik Electronics Gmbh filed Critical Curamik Electronics Gmbh
Publication of WO2005015633A2 publication Critical patent/WO2005015633A2/fr
Publication of WO2005015633A3 publication Critical patent/WO2005015633A3/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • Cooling device for dissipating heat loss from an electrical or electronic component or assembly and cooler
  • the invention relates to a cooling device according to the preamble of claim 1 and to a cooler according to the preamble of claim 13.
  • a cooling device (US Pat. No. 6,234,290) in which the power loss or heat generated by a processor is transferred via a cooling circuit with a liquid coolant (water) to an external cooler provided on the outside of the computer in the form of a finned cooler, using a primary cooler provided in the immediate vicinity of the component to be cooled and through which the coolant flows, and a secondary cooler provided on the external cooler and also through which the coolant flows.
  • a cooling circuit with a liquid coolant (water) to an external cooler provided on the outside of the computer in the form of a finned cooler, using a primary cooler provided in the immediate vicinity of the component to be cooled and through which the coolant flows, and a secondary cooler provided on the external cooler and also through which the coolant flows.
  • a pelletizer cooler is provided in the known cooling device between the component to be cooled and the primary cooler, and with the disadvantage, among other things, that the power supply for the pelletier cooler must be brought directly to the component to be cooled, which, at higher currents, can, for example, lead to malfunctions in the function of the component to be cooled, that additional space in the immediate vicinity of the component to be cooled is claimed by the pelletier cooler, which is a desirable goal dense and compact design for the circuit board having the cooling component contradicts, and that, in addition, the Pelltier cooler causes a temperature increase on the primary cooler and at least on the line for removing the coolant in the immediate vicinity of the component, as a result of which the space surrounding the component to be cooled is created additionally heated and the desired cooling effect is thereby deteriorated.
  • the object of the invention is to show a cooling device with which an improved cooling effect is possible, in particular even with a small and compact design of the external cooler.
  • a cooling device is designed according to claim 1.
  • the cooling fins of e.g. the cooler forming the secondary cooler is formed by a multiplicity of cooling fins which are spaced apart from one another and which each form at least one fin interior which is closed to the outside and through which the coolant flows.
  • the lamellae are flat and each consist, for example, of two sheets, at least one of which is provided with a recess on one surface side, by removing and / or displacing the sheet material. To form the lamella interior is the
  • the sheets are made flat on their opposite sides.
  • the depression is produced, for example, by embossing and / or by an etching process.
  • the at least two sheets forming the respective cooling lamella each have at least one depression.
  • the two sheets are then connected to one another with their sides having the depressions, so that these depressions complement one another to form the at least one lamella interior.
  • planar design of the cooling fins or of the sheets forming these cooling fins enables a very compact structure, but also simplifies the manufacture of the cooler, in that the individual sheets and the spacers between the cooling fins, which determine the spacing between the cooling fins, are connected to one another stacked and connected to one another, for example, by means of the known direct bonding or (in the case of sheets made of copper or a copper alloy) by means of the known DCB method.
  • the sheets used have a thickness that is in the range of about 0.1 to 2 mm. Characterized in that the depressions forming the respective lamella interior are produced by etching and / or embossing and the plates are otherwise flat, the cooling lamellae are made very thin-walled, which likewise contributes to improving the cooling effect.
  • the distance between adjacent cooling fins is also on the order of 0.1 to 2 mm.
  • projections are provided in the area of the depressions, which then complement each other in the cooling fins to form solid, continuous posts.
  • Metal with high thermal conductivity ie with a thermal conductivity greater than 160 W / mK °, ie copper / copper alloy or aluminum / aluminum alloy, is particularly suitable as the material for the cooling fins.
  • FIG. 1 shows a simplified representation of a cooling device for cooling an electrical or electronic component
  • FIG. 2 shows a side view of a cooler of the device of FIG. 1 used as a secondary cooler
  • 3 shows a partial illustration of the cooler of FIG. 2, partly in section through a lamella formed by two cooler layers or metal sheets
  • 4 and 5 the two surface sides of a cooler layer with a greater length
  • FIG. 1, 1 is an electronic component which is, for example, the processor of a computer or a PC and which is in the usual way on one
  • Printed circuit board 2 is provided together with further components, not shown.
  • the cooling device 3 in FIG. 1 is used, which in a closed cooling circuit for a heat-transporting agent or coolant (e.g. water, possibly with additives), a primary cooler 4 through which the coolant can flow (also
  • a secondary cooler 5 through which the coolant flows, which together with a fan 6 forms an external cooler 7, a circulating pump 8 and an expansion tank or reservoir 9 for the coolant.
  • the coolant circuit is completely filled with the coolant, so that with respect to the coolant there is a circuit that is not interrupted by gas and / or air and thus only a low output is required for the circulating pump 8 even when the primary cooler and secondary cooler 5 are arranged at different heights ,
  • the primary cooler 4 which connects with a flat or substantially flat heat-transfer surface 4.1 via an intermediate layer 10 made of a deformable heat-conducting material, preferably from a thermal paste, to the likewise flat or essentially flat surface of the component, consists for example of several layers or Layers made of a metal with high thermal conductivity, for example made of copper or a copper alloy.
  • the inner layers arranged between the two outer layers are provided with a multiplicity of openings and thereby form a flow path branching in all three spatial axes within the housing of the primary cooler 4.
  • Such a cooler also micro cooler is for example in the
  • the material of the heat-transferring intermediate layer 10 is selected so that it has a thermal conductivity greater than 0.5 W / mK °.
  • the primary cooler 4 is further designed such that the sum of all inner surfaces that are in direct contact with the coolant is larger than the surface dimension of the heat-transfer surface 4.1, preferably at least by a factor of 3.
  • the circulation pump 8 and the reservoir 9 are arranged in a line 11 which runs between a first connection of the primary cooler 1 and a first connection of the secondary cooler 5.
  • the second connections of the primary cooler 4 and the secondary cooler 5 are connected to one another via a second line 12.
  • the secondary cooler 5 or the external cooler 7 formed by it and the primary cooler are spatially separated from one another, ie the primary cooler 4 is located in the interior of a device housing, where the component 1 is also provided, while the external cooler 7 is provided on an outer surface of the housing.
  • the secondary cooler 5 is shown in more detail in FIGS. 2-6. It consists of a plurality of cooling fins 13 and 14, each of which is designed as a thin, rectangular plate and of which the cooling fins 13 have a somewhat greater length than the cooling fins 14.
  • the cooling fins 13 and 14 are each provided in parallel, but at a distance from one another, so that there is a gap or space 15 between two adjacent fins for the passage of an air flow generated by the fan 6.
  • the individual cooling fins 13 and 14 are arranged in such a way that, starting from the upper end of the secondary cooler 5 in FIG. 2, first three cooling fins 14 follow one another and then a higher number of cooling fins 13. At the lower end of the secondary cooler 5 in FIG following the lowest cooling fin 13, three cooling fins 14 are again provided.
  • a special feature of the secondary cooler 5 is that the cooling medium flows through all the cooling fins 13 and 14, i.e. one of each
  • each cooling fin 13 and 14 or each channel 16 has an inlet and an outlet for the coolant. All inlets are connected to a common connection 17 and all outlets are connected to a common connection 18.
  • the distance between two adjacent slats 13 and 14, ie the width of each gap 15 is, for example, in the order of 0.1 to 2 mm.
  • the thickness of each cooling fin 13 or 14 is on the order of 0.1 to 4 mm.
  • each cooling fin 13 consists of two sheets or cooling layers 13.1 and each cooling fin 14 consists of two sheets or cooling layers 14.1.
  • the sheets 13.1 and 14.1 in the illustrated embodiment are made of copper or a copper alloy.
  • the sheets 13.1 are each provided with a continuous opening 19 or 20 in the area of their narrow sides, these openings being produced, for example, when the sheets 13.1 are punched.
  • each sheet 13.1 is provided on one surface side with a recess 21 by means of a suitable etching process, in such a way that the material of the sheet 13.1 surrounding this recess 21 and not removed by the etching process has a self-contained frame or edge surrounding the recess 21 22 forms.
  • the recess 21 is adapted to the shape of the sheet 13.1 such that the edge 22 has a constant width in the embodiment shown. Furthermore, the corner areas of the recess 21 are rounded.
  • a plurality of solid projections 23 are formed within the recess 21, again by the fact that the material of the sheet 13.1 on these projections has not been etched away, ie the areas forming the projections 23 were covered with an etching resist (eg photoresist) during the etching process.
  • an etching resist eg photoresist
  • the sheet 13.1 is mirror-symmetrical to a central axis M, which is also the longitudinal axis of the rectangular sheet 13.1 and which, among other things. also intersects the axes of the two openings 19 and 20. Due to this mirror-symmetrical design, which also relates to the arrangement of the projections 23, it is possible for the manufacture of each cooling lamella to place two such plates 13.1 with their sides having the recess 21 on one another, so that both plates 13.1 along their edges 22 and also then rest against each other with the free ends of their projections 23.
  • the two sheets 13.1 are connected to one another in a suitable manner at the edges 22 and on the projections 23, for example using the DCB process, so that the two depressions 21 form the channel 16 that is not closed on the entire circumference of the cooling fin 13 and two projections 23 complement each other to form a solid post 24 that connects the two surface sides of the cooling fin 13 to one another and in particular also mechanically stabilizes the cooling fin 13.
  • the distribution of the projections 23 and thus also the posts 24 is selected such that a coolant flow results between the two openings 19 and 20, one opening of which forms the inlet for the coolant and the other opening forms the outlet for the coolant is distributed as evenly as possible over the entire recess or over the entire channel 16.
  • the density of the projections 23 in the vicinity of the central axis M and in the region between the two openings 19 and 20 is greater than at a greater distance from the central axis M.
  • the projections 23 or through the posts 24 formed by them there is also a Swirling and / or deflection of the coolant when flowing through the chamber 16 reached.
  • the total area of the cooling fin interior 16 in contact with the coolant is significantly increased, so that this total area is larger than the area that the two surface sides of the cooling fin 13 each have.
  • the sheets 14.1 are formed analogously to the sheets 13.1, with the recess 21a, the peripheral edge 22a and the projections 23a, which then form the continuous posts 24a in the corresponding channel 16 when two sheets 14.1 are connected to form a cooling lamella 14.
  • the distance between the openings 19 and 20 is identical for the sheets 13.1 and 14.1.
  • the distances between the individual cooling fins 13 and 14 are realized in that intermediate rings 25 are provided on the outer surface of these cooling fins, the inner diameter of which is equal to the diameter of the openings 19 and 20, and each has the outer surface of a cooling fins 13 and 14 on both sides are connected.
  • the rings 25 are made of copper or a copper alloy, for example.
  • the connection between the rings 25 and the cooling fins 13 and 14 is realized, for example, by DCB technology.
  • connection flanges likewise preferably consist of copper or a copper alloy and are connected by means of the DCB technology to the adjacent surface side of the cooling fin 14 which is uppermost in FIG.
  • the production can be carried out in such a way that the individual sheets 13.1 and 14.1, the intermediate rings 25 and the connecting flanges or connecting sleeves 17.1 and 18.1 are placed on rods of an auxiliary device made of a heat-resistant material and are thus arranged in a stack, which is then heated to the process temperature of the DCB process is heated so that the elements are connected to one another after cooling.
  • swirl elements 26 made of metal, for example of copper or of a copper alloy, which are also fastened with the help of DCB technology between the cooling fins 13 and 14 and during manufacture (DCB process) as Spacers act, via which the individual sheets 13.1 and 14.1 are transmitted during the production of pressing forces.
  • the depressions 21 and 21a with the projections 23 and 23a and with the peripheral edge 22 and 22a in another way, for example by embossing the flat material used for the sheets, in such a way that the sheets 13.1 or 14.1 lie flat during embossing, therefore they are flat or essentially flat on their side facing away from the recess 21 or 21 a and on the other side they only have the recess with the projections and the closed peripheral edge, so that thin cooling fins through which the coolant flows are obtained.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente invention concerne un nouveau dispositif qui sert à évacuer la chaleur perdue par un composant électrique ou électronique ou par un module, au niveau d'un système de refroidissement externe éloigné dans l'espace. Ledit dispositif comprend un circuit d'agent de refroidissement disposé entre le composant ou le module et le système de refroidissement externe, comprenant au moins un système de refroidissement primaire qui peut être parcouru par l'agent de refroidissement et sert à prendre en charge la chaleur perdue par le composant ou le module, et au moins un système de refroidissement secondaire qui peut être parcouru par l'agent de refroidissement, au niveau du système de refroidissement externe, le système de refroidissement secondaire comprenant une pluralité d'ailettes de refroidissement.
PCT/DE2004/001441 2003-07-30 2004-07-06 Dispositif de refroidissement pour evacuer la chaleur perdue par des composants electriques ou electroniques ou un module, et systeme de refroidissement WO2005015633A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10334502.7 2003-07-30
DE2003134502 DE10334502A1 (de) 2003-07-30 2003-07-30 Kühlvorrichtung zum Abführen von Verlustwärme von einem elektrischen oder elektronischen Bauelement oder einer Baugruppe sowie Kühler

Publications (2)

Publication Number Publication Date
WO2005015633A2 true WO2005015633A2 (fr) 2005-02-17
WO2005015633A3 WO2005015633A3 (fr) 2005-03-17

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PCT/DE2004/001441 WO2005015633A2 (fr) 2003-07-30 2004-07-06 Dispositif de refroidissement pour evacuer la chaleur perdue par des composants electriques ou electroniques ou un module, et systeme de refroidissement

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DE (1) DE10334502A1 (fr)
WO (1) WO2005015633A2 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5777259A (en) * 1994-01-14 1998-07-07 Brush Wellman Inc. Heat exchanger assembly and method for making the same
US6234240B1 (en) * 1999-07-01 2001-05-22 Kioan Cheon Fanless cooling system for computer
US20020185260A1 (en) * 2000-11-21 2002-12-12 Calaman Douglas P. Liquid cooled heat exchanger with enhanced flow
US6600649B1 (en) * 2002-05-24 2003-07-29 Mei-Nan Tsai Heat dissipating device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5777259A (en) * 1994-01-14 1998-07-07 Brush Wellman Inc. Heat exchanger assembly and method for making the same
US6234240B1 (en) * 1999-07-01 2001-05-22 Kioan Cheon Fanless cooling system for computer
US20020185260A1 (en) * 2000-11-21 2002-12-12 Calaman Douglas P. Liquid cooled heat exchanger with enhanced flow
US6600649B1 (en) * 2002-05-24 2003-07-29 Mei-Nan Tsai Heat dissipating device

Also Published As

Publication number Publication date
WO2005015633A3 (fr) 2005-03-17
DE10334502A1 (de) 2005-03-17

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