WO2004108358A3 - Article de polissage conducteur pour polissage electrochimique et mecanique - Google Patents

Article de polissage conducteur pour polissage electrochimique et mecanique Download PDF

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Publication number
WO2004108358A3
WO2004108358A3 PCT/US2004/017827 US2004017827W WO2004108358A3 WO 2004108358 A3 WO2004108358 A3 WO 2004108358A3 US 2004017827 W US2004017827 W US 2004017827W WO 2004108358 A3 WO2004108358 A3 WO 2004108358A3
Authority
WO
WIPO (PCT)
Prior art keywords
polishing
conductive
article
electrochemical mechanical
polishing article
Prior art date
Application number
PCT/US2004/017827
Other languages
English (en)
Other versions
WO2004108358A2 (fr
Inventor
Yongqi Hu
Alain Duboust
Antoine P Manens
Stan D Tsai
Paul D Butterfield
Yan Wang
Feng Q Liu
Siew S Neo
Liang-Yuh Chen
Yuan A Tian
Sen-Hou Ko
Robert A Ewald
Original Assignee
Applied Materials Inc
Yongqi Hu
Alain Duboust
Antoine P Manens
Stan D Tsai
Paul D Butterfield
Yan Wang
Feng Q Liu
Siew S Neo
Liang-Yuh Chen
Yuan A Tian
Sen-Hou Ko
Robert A Ewald
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/455,895 external-priority patent/US20040020789A1/en
Priority claimed from US10/455,941 external-priority patent/US6991528B2/en
Application filed by Applied Materials Inc, Yongqi Hu, Alain Duboust, Antoine P Manens, Stan D Tsai, Paul D Butterfield, Yan Wang, Feng Q Liu, Siew S Neo, Liang-Yuh Chen, Yuan A Tian, Sen-Hou Ko, Robert A Ewald filed Critical Applied Materials Inc
Priority to JP2006515213A priority Critical patent/JP2006527483A/ja
Publication of WO2004108358A2 publication Critical patent/WO2004108358A2/fr
Publication of WO2004108358A3 publication Critical patent/WO2004108358A3/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H5/00—Combined machining
    • B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
    • B23H5/08—Electrolytic grinding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Nanotechnology (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Composite Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

La présente invention concerne des modes de réalisation d'un article de polissage destiné au traitement d'un substrat. Dans un mode de réalisation, l'invention se rapporte à un article de polissage destiné au traitement d'un substrat, qui comprend une couche de tissu sur laquelle est disposée une couche conductrice. La couche conductrice peut être tissée ou non tissée. La couche conductrice peut être composée d'un matériau mou et, dans un mode de réalisation, la surface exposée peut être plate.
PCT/US2004/017827 2003-06-06 2004-06-07 Article de polissage conducteur pour polissage electrochimique et mecanique WO2004108358A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006515213A JP2006527483A (ja) 2003-06-06 2004-06-07 電気化学機械的研磨用の導電性研磨機器

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US10/455,895 US20040020789A1 (en) 2000-02-17 2003-06-06 Conductive polishing article for electrochemical mechanical polishing
US10/455,941 2003-06-06
US10/455,895 2003-06-06
US10/455,941 US6991528B2 (en) 2000-02-17 2003-06-06 Conductive polishing article for electrochemical mechanical polishing

Publications (2)

Publication Number Publication Date
WO2004108358A2 WO2004108358A2 (fr) 2004-12-16
WO2004108358A3 true WO2004108358A3 (fr) 2005-06-09

Family

ID=33513860

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/017827 WO2004108358A2 (fr) 2003-06-06 2004-06-07 Article de polissage conducteur pour polissage electrochimique et mecanique

Country Status (4)

Country Link
JP (1) JP2006527483A (fr)
KR (2) KR20060055463A (fr)
TW (1) TWI285576B (fr)
WO (1) WO2004108358A2 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100721196B1 (ko) * 2005-05-24 2007-05-23 주식회사 하이닉스반도체 연마패드 및 이를 이용한 화학적기계적연마장치
US20070158201A1 (en) * 2006-01-06 2007-07-12 Applied Materials, Inc. Electrochemical processing with dynamic process control
WO2016123505A1 (fr) * 2015-01-30 2016-08-04 Applied Materials, Inc. Tampons de polissage mécano-chimique nanofibreux multicouches
EP3571009A4 (fr) * 2017-01-20 2021-01-20 Applied Materials, Inc. Article de polissage en plastique mince pour applications cmp
JP7113626B2 (ja) * 2018-01-12 2022-08-05 ニッタ・デュポン株式会社 研磨パッド
CN117083152A (zh) * 2021-03-03 2023-11-17 应用材料公司 电机转矩监测期间的压力信号以提供空间分辨率
CN116065225B (zh) * 2023-03-31 2023-06-16 太原理工大学 一种异形微细管内壁电解抛光装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020119286A1 (en) * 2000-02-17 2002-08-29 Liang-Yuh Chen Conductive polishing article for electrochemical mechanical polishing
EP1361023A2 (fr) * 2002-05-07 2003-11-12 Applied Materials, Inc. Article de polissage pour le polissage mecano-électrochimique de substrats

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3448023A (en) * 1966-01-20 1969-06-03 Hammond Machinery Builders Inc Belt type electro-chemical (or electrolytic) grinding machine
US5911619A (en) * 1997-03-26 1999-06-15 International Business Machines Corporation Apparatus for electrochemical mechanical planarization
GB9721494D0 (en) * 1997-10-09 1997-12-10 Minnesota Mining & Mfg Abrasive articles and their preparations
ATE327864T1 (de) * 2001-04-24 2006-06-15 Applied Materials Inc Leitender polierkörper zum elektrochemisch- mechanischen polieren

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020119286A1 (en) * 2000-02-17 2002-08-29 Liang-Yuh Chen Conductive polishing article for electrochemical mechanical polishing
EP1361023A2 (fr) * 2002-05-07 2003-11-12 Applied Materials, Inc. Article de polissage pour le polissage mecano-électrochimique de substrats

Also Published As

Publication number Publication date
WO2004108358A2 (fr) 2004-12-16
TW200520893A (en) 2005-07-01
JP2006527483A (ja) 2006-11-30
KR20070104686A (ko) 2007-10-26
KR20060055463A (ko) 2006-05-23
TWI285576B (en) 2007-08-21

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