TW200520893A - Conductive polishing article for electrochemical mechanical polishing - Google Patents

Abstract

Embodiments of a polishing article for processing a substrate are provided. In one embodiment, a polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer has an exposed surface adapted to polish a substrate. The fabric layer may be woven or non-woven. The conductive layer may be comprised of a soft material and, in one embodiment, the exposed surface may be planar.

Description

200520893 (ii) Description of the invention [Technical field to which the invention belongs] The present invention relates to a substrate and equipment. Surface-thinned manufacturing [previous technology] The next quarter-millimeter multilayer metal is one of the key technologies for the next 127th generation of ultra-large body circuit (ULSI) ... ^ The core layer The connection structure needs to be formed in a high aspect ratio hole, a spoon layer hole, a wiring and other characteristic structures. The reliability of the interconnected characteristic structure in the case of Ting 4 is very important for the success of ULSI and for the continuous efforts to improve 度 θ, power, and quality on each substrate or grain. In the manufacture of integrated circuits and other electronic components, dielectric materials are deposited on or removed from the surface of a substrate, and semiconductors and dielectric materials can be deposited using a variety of techniques. The deposition techniques commonly used in modern processes include physical vapor deposition (PVD), which is also known as sputtering, chemical pain deposition (CVD), plasma enhanced chemistry, and chemical plating (ECP). When the material layer is sequentially deposited and removed, the entire surface of the uppermost surface of the substrate will be non-planar, so the rain will be flat. Flattening a surface, or "grinding" a surface, is a treatment that removes fresh matter from the surface of the substrate to form a substantially uniform, flat, w surface. Flattening removes unwanted topologies and surface defects, such as the surface of raw sugar, knots 3, 2005, 20,893 pieces of material, 沾 μ, 、, 袼, 袼 crystal damage, scratches, and contaminated layers or substances, Last time was very useful. Cheng Dingshiyuan reported that by removing too many deposits that are used to fill the characteristic contamination, the structure is also formed into a characteristic structure on a substrate and provides a uniform outer metal. + The surface area% is also useful for chemical conversion and treatment. Chemical mechanical flattening, or chemical mechanical polishing (CMP), is a technique commonly used in the field during the on-site alpha process. CMP uses a chemical composition, typically-mud f ^ ^ 4 and its fluid medium to selectively remove substances from the substrate. In conventional CMP technology, a substrate carrier or polishing head is mounted on a carrier assembly and is in contact with a polishing pad in a CMP apparatus. The carrier head assembly provides a controlled pressure on the substrate to force the substrate against the polishing pad. The polishing pad is moved relative to the substrate by an external driving force. The CMP device performs an abrasive or kneading motion between the surface of the substrate and the polishing pad, and simultaneously applies an abrasive composition to perform chemical and / or mechanical effects and remove substances from the surface of the substrate. One substance often used in the manufacture of integrated circuits is copper because it has the desired electronic characteristics. However, copper has its special manufacturing problems. For example, copper is difficult to pattern and etch, and new processes and techniques, such as damascene or dual damascene processes, are used to form copper substrate features. In the embedding process, a feature is defined in a dielectric material and then filled with steel. Dielectric materials with low dielectric constants, such as less than 3, are used in the manufacture of steel mosaic structures. The barrier layer material is conformally deposited on the surface of the feature structure formed on the dielectric layer before the copper material is deposited. A steel material is then deposited over the barrier layer and surrounding areas. However, 200520893 features. Structural steel filling often forms too much copper material on the surface of the substrate, and must be removed to form a steel-filled characteristic structure on the dielectric layer and prepare the substrate surface. For subsequent processing. A challenge on the abrasive steel material is that the interface between the conductive material and the barrier layer is usually non-planar and the remaining copper material is retained in the irregular portion formed by the non-bright surface interface β χ, the The conductive material and the barrier material are usually removed from the substrate at different rates. The above two situations will cause too much conductive material f to be left behind to form residues on the surface of the substrate. Different densities and sizes of characteristic structures on the surface of the substrate 'the surface of the substrate will have different surface topologies. Different surface topologies on which the steel material extends along the surface of the substrate will be removed at different rates' This will make effective steel material removal on the substrate surface and final flatness of the substrate surface difficult to achieve. One solution to remove all unwanted copper material from the substrate surface is to overgrind the substrate. Material surface. ", Excessive grinding of certain materials can cause the formation of topological defects, such as depressions in characteristic structures: depressions, which are called disk-shaped, or excessive removal of dielectric materials, which It is called erosion. Defects in the topography caused by dishing or erosion will further cause additional materials, such as the uneven removal of the barrier material below it, and produce an Substrate surface with poor grinding quality 另一 Another problem with copper surface grinding is caused by the use of a low-k dielectric material to form copper inlays on the substrate surface. Low-k dielectric materials, Such as carbon-doped silicon oxide, under the traditional grinding pressure (ie, 16Psi), which is called downforce, it will be deformed or cracked, which will be detrimental to the grinding quality of the substrate 200520893- Influence and adversely affect the formation of the element. For example, the relative rotational movement between the substrate and the polishing pad will induce a shear force on the surface of the substrate and deform the low-k material to form defects on the topology, which It will have an adverse effect on subsequent grinding. One solution to grinding steel in low dielectric constant materials is to use electromechanical polishing (ECMP) technology to grind the steel. ECMP technology uses electrochemical decomposition while using Handling small machines The base material is ground to remove the conductive material from the surface of the base material. The electrochemical decomposition is performed by applying a bias voltage between a cathode and the surface of the base material to remove the conductive material from the base material. The material surface is removed to the surrounding solution. In an embodiment of the ECMP system, the bias voltage is applied by a circle of conductive contacts in electrical communication with the substrate surface on a substrate support device. However, the contact ring has been observed to exhibit an uneven current distribution on the surface of the substrate, resulting in uneven decomposition results. Mechanical polishing is performed by placing the substrate on a conventional polishing pad. The position of the contact is implemented by providing relative movement between the daggers. However, conventional polishing pads will limit the electrolyte flow to the surface of the base color. In addition, the polishing pads may contain insulation and edge materials which will interfere Applying a bias voltage to the surface of the substrate causes an uneven decomposition of the conductive material on the surface. Therefore, there is a need for an improved abrasive for removing conductive materials on the surface of a substrate. [Summary of the Invention] The present invention generally provides an article of manufacture and an apparatus for planarizing a layer on a substrate, using an electrochemical deposition technique, an electrochemical decomposition technique, a grinding technique, and combinations thereof.

In one aspect, an abrasive for grinding a substrate includes a body having a surface suitable for grinding the substrate and at least one conductive element. The conductive element is at least partially buried in the body. The conductive element may include a plurality of fibers coated with a conductive material, a conductive filler, or a combination thereof, which may be disposed in an adhesive. The conductive element may include a hybrid fiber coated with a conductive material, which is at least partially buried in the body, a synthetic fiber coated with a conductive material, a conductive filler, or a mixture thereof, and an adhesive, which is partially buried In the body, or a mixture thereof. The conductive element may have a contact surface extending beyond a plane defined by the abrasive surface, and may include a coil, one or more loops, one or more strands, a hybrid fiber material, or Its mixture. Several perforations may be formed in the abrasive to facilitate the flow of matter therethrough.

In another aspect, an abrasive is provided for treating the surface of a substrate, such as a conductive layer deposited on the substrate. The abrasive article includes a body 'having at least a plurality of fiber portions coated with a conductive material, a plurality of conductive fillers, or a combination thereof, and is suitable for grinding such substrates. Several holes and several grooves can be formed on the abrasive to facilitate the flow of material therethrough. In yet another aspect, the abrasives can be placed in a device to process a substrate, the device including a tray, a permeable tray placed in the tray, the abrasive or manufactured article set An electrode on the permeable disc, an electrode placed in the susceptor located between the permeable disc and the bottom of the susceptor, and a grinding head suitable for maintaining the substrate during a process. 7 200520893 In another aspect, the abrasives can be used to treat a method as a conductive abrasive. The + π I method includes providing a device containing an enclosure; The abrasive is solid at the beginning of the year, ._ ν is in the enclosure; at a flow rate of approximately 2 (Gas per minute per minute (GPM)), a-, conductive, hydration to the enclosure; the base The material is located near the conductive abrasive in the conductive solution; one surface of the substrate is in contact with the electric abrasive in the conductive solution; a bias voltage is applied between an electrode and the conductive abrasive; With another team-to, and to remove at least a part of the surface of the substrate surface.

An abrasive surface for processing a substrate ^ an exposed surface of a support layer is suitable for abrasive 'In another embodiment of the present invention, the object includes at least an interposer layer connected to one and one conductive layer. between. The conductive layer has a substrate. The hardness of the support layer is less than conductive @, and the hardness of the insertion layer is greater than that of the supporting floor.

In still another embodiment of the present invention, an abrasive for treating a substrate includes at least an interposer layer 'which is connected between a conductive layer and a support layer. The conductive layer is penetrated by at least one pore. The insertion layer and the support layer include a first hole formed in the conductive layer, the diameter of which is larger than the diameter of a second hole formed in the insertion layer and the support layer. . [Embodiment] The words and words used herein should be given meanings generally used by those skilled in the art 'unless they are otherwise defined. Chemical mechanical polishing should include, but is not limited to, polishing the surface of a substrate by chemical action, mechanical action, or a combination of chemical and mechanical actions. Electromilling should include, but not limited to, 200520893. It is limited to the planarization of a substrate by the application of electrochemical action, such as anode decomposition. Electrochemical mechanical polishing (ECMP) should include, but is not limited to, the application of electrochemical action, mechanical action, or a combination of electrochemical and mechanical action to remove a substance from the surface of a substrate to remove a substrate.材 FLAT. Electrochemical mechanical plating (ECMPP) should include, but is not limited to, electrochemically depositing a substance on a substrate and simultaneously applying by electrochemical action, mechanical action, or a combination of both electrochemical and mechanical action To flatten the deposited material. Anodic decomposition should include, but is not limited to, the result of directly or indirectly applying an anodic bias to a substrate which causes conductive materials to be removed from the surface of a substrate and run into the surrounding electrolyte. The abrasive surface is broadly defined as the part of the manufactured article that is at least partially in contact with a substrate surface during the manufacturing process, or electrically couples the manufactured article to a substrate surface (either directly or indirectly through a conductive medium) ). Grinding equipment FIG. 1 shows a processing equipment 100 having at least one station suitable for electrochemical deposition and chemical mechanical polishing, such as an electrochemical mechanical polishing (ECMp) station 102 and at least one conventional polishing station 106 which are arranged in a On a single platform or tool. One abrasive tool that can benefit from the present invention is a MIRRA® chemical mechanical abrasive grinder manufactured by Applied Materials, Inc. of Santa Clara, California.

The exemplary apparatus 100 in FIG. 1 generally includes two ECMP 200520893 stations 102 and a polishing station 1 () 6. These stations can be used to treat a substrate surface. For example, a substrate having a characteristic definition formed thereon and filled with a barrier layer and then placed on the barrier layer with a conductive material, which can remove conductivity in two steps in two ECMP stations 102 Material, the barrier layer is removed by a polishing station 106 to form a planarized surface. The exemplary apparatus 100 generally includes a base j 108 that supports one or more ECMP stations 102, one or more grinding stations 106, a transfer station u0, and a turret 112. The transfer station 110 transfers the substrate 114 back and forth to the apparatus 100 by a loading robot 116. The loading robot arm 11 (5 typically transports the substrate 114 between the transfer station H0 and a factory interface 120, which includes a cleaning module 122, a measuring device 104, and one or more substrate storage boxes 118. An example of the measuring device 104 is a NovaScamTM Integrated Thickness Monitoring system manufactured by Nova Measuring Instruments, Inc., located in Phoenix, Arizona, USA. Alternatively, the loading robot 116 (or the factory interface 120) may The material is transferred to one or more other processing tools (not shown), such as a chemical vapor deposition tool, a physical vapor deposition tool, an etching tool, and the like. In one embodiment, the transfer station 110 includes at least one input Buffer station 124 'An output buffer station 126, a transfer robot arm 132, and a loading cup 1 and piece 128. The loading robot arm 116 places a substrate 114 on the input buffer station 124. The transfer robot arm 132 has Each of the two gripper assemblies has a pneumatic gripper finger to grip the edge of the substrate. The transport robot arm 132 lifts the substrate 114 from the input buffer station 124 and rotates the substrate Grab 10 200520893 Jiyi and the substrate 1 1 4 is used to move the substrate 1 1 4 onto the loading cup assembly 1 2 8 and then lower the substrate 11 4 onto the loading cup assembly 1 2 8. This rotation The tower 112 supports a plurality of grinding heads 130, and each grinding head is loaded with a substrate 114 during processing. The turret 112 will be conveyed by the grinding head 130 to the conveying station 110 and the one or more ECMP stations 102 And the one or more grinding stations 106. A turret 11 2 that can benefit from the present invention is disclosed in US Patent No. 5,804,507, issued to Tolies et al. On September 8, 1998, which The case is incorporated herein by reference. Generally, the turret 112 is disposed in the center of the base 108. The turret 112 typically includes a plurality of arms 138. Each arm 138 generally supports a Grinding head 1 3 0. An arm 13 8 is not shown in the first figure to clearly see the conveying station 11 0. The turret 11 2 is markable, so that the grinding head 130 can be defined by the user. The sequence is moved between the stations 102, 106 and the conveying station 110. Generally, when the substrate 114 is set in the ECMP station 102 or the polishing station 106, the polishing head 130 The substrate 114 is received. The configuration of the ECMP station 102 and the polishing station 106 on the device 100 allows the substrate 1 14 to be held in the same polishing head 130 by moving the substrate to the station and the station. They are sequentially electroplated or ground. One type of grinding head that can be used in the present invention is a TITAN HEAD ™ substrate carrier manufactured by Applied Materials, Inc. of Santa Clara, California. An example of a grinding head 130 that can be used in the grinding apparatus 100 described herein is described in U.S. Patent No. 6,024,630, issued to Shen Don et al. On February 25, 2000, which is hereby incorporated by reference Incorporated in 200520893 article. In order to conveniently control the grinding apparatus 100 and the processing performed thereon, a controller 140 including a central processing unit (CPU) 142, a memory 144, and a support circuit 146 is connected to the grinding apparatus 100. The CPU 142 may be any type of computer processor that can be used in industrial facilities to control different devices and pressures. The memory M4 is connected to the CPU 142. Memory 144 or computer-readable media, which can be one or more commercially available memories such as dynamic access memory (RAM), read-only memory (ROM), floppy disks, hard disks, or other lines Digital storage 'local or remote. A support circuit 146 is connected to the CPU 142 to support the processor in a conventional manner. These circuits include caches, power supplies, clock circuits, input / output circuits, subsystems, and the like. The power for operating the grinding apparatus 100 and / or the controller 14 is provided by a power supply 150. Illustratively, the power supply 150 shown is connected to multiple components of the grinding equipment 100, including the transfer station 110, the factory interface 120, the loading robot arm 116, and the controller 14 〇. In these embodiments, different electrical percentages are supplied to the grinding: two or more components of 100 are prepared. The upper grinding head 130. Figure 2 shows a cross-section view of an ECMP station 102 supported. The ECMP station 102 generally includes a tray 202 cover 208. On a base 108 that implements 100. ‘A conductive fluid such as an electric

The pole 204, the abrasive 205, a disc 206, and in one example, the carrier 202 is coupled to the grinding equipment. The carrier 202 generally defines a container or electrolytic cell 12 200520893 and a solution 220 is contained therein. The electrolyte 220 used to process the substrate 114 may include a metal, such as copper " shor " gold " silver, or other materials that may be deposited on or removed from the substrate 114 electrochemically.

The holder 202 may be a bowl-shaped member made of a plastic such as a fluoropolymer, TELFON, PFA, PE, PES, or other substances that are compatible with electroplating or electromilling chemicals. The multiple tray 202 has a bottom 210 including a hole 216 and a drainage channel 214. A hole 216 is provided in the center of the bottom 210 to allow a shaft 2 1 2 to pass therethrough. A seal 2 1 8 is provided between the hole 216 and the shaft 212 and allows the shaft 212 to rotate while preventing the fluid in the holder 202 from flowing out of the hole 2 1 6. The holder 202 typically includes the electrode 204, the disk 206, and the abrasive article 205 disposed therein. An abrasive object 205, such as a polishing pad, is disposed and supported on a disc 206 in the holder 202.

The electrode 204 is a counter electrode that is the substrate 114 and / or the abrasive 205 that is in contact with the surface of the substrate. The abrasive article 200 is at least partially conductive and during electrochemical processing, such as an electrochemical mechanical plating process (ECMPP) including electrochemical deposition and chemical mechanical polishing 'or electrochemical decomposition, can be used together with the substrate as a electrode. The electrode 204 may be an anode or a cathode, depending on whether a positive bias (anode) or a negative bias (cathode) is applied between the electrode 204 and the abrasive 205. For example, in the process of "depositing a substance from an electrolyte onto the surface of the substrate", the electrode 204 acts as an anode and the surface of the substrate and / or the abrasive 205 acts as a cathode. When the substance is to be removed from the surface of a substrate, if it is decomposed by applying a bias voltage, the electrode 204 is used as a cathode and the surface of the material and / or the abrasive material 205 is used as the decomposition treatment. anode. The electrode 204 is disposed between the disk 206 and the bottom 21 of the support plate 202 and is immersed in the electrolyte 220. The electrode 204 may be a plate-like member, a plate having a plurality of holes formed therein, or a plurality of electrode members provided in a permeable membrane or a trough. A permeable membrane (not shown) can be placed between the disc 206 and the electrode 20 or between the electrode 204 and the abrasive 205 to filter out bubbles such as hydrogen bubbles from the water surface and reduce defects. Form and apply current or power more uniformly between them. The electrode 204 is made of a substance to be deposited or removed, such as copper, aluminum, gold, silver, tungsten, and other substances that can be electrochemically deposited on the substrate 114. For electrochemical removal processes, such as anodic decomposition, the electrode 204 includes a non-consumable electrode other than the material to be deposited, such as brass, carbon, or carbon for copper decomposition. Fig. 18 is a plan view illustrating one embodiment of an electrode 204 having a plurality of regions which can be independently electrically biased. These areas help control the lateral width of the current through the processing tank to control the removal of material (or deposition) through the diameter of the substrate. In the embodiment shown in FIG. 18, the electrode 204 includes three concentric regions 1902, 1904, 1906, which are independently biased by a power source 1910. The areas I902 and I904 may be separated by a dielectric spacer. Although the areas 1902, 1904, and 1906 are shown in the figure as having a concentric ring configuration, these areas can also be replaced, such as a radial configuration, a fan configuration, an arc configuration, One of grid configuration, strip configuration, island configuration, and wedge configuration. Abrasive 205 can be a fluid environment and processing regulations compatible 14 200520893

Material cushion, net or strap. In the embodiment shown in FIG. 2, the abrasive material 205 is circular and is placed on the upper end of the support plate 202, and the lower surface is supported by the disk 206. The abrasive 205 includes at least a portion of a conductive material, such as one or more conductive elements, for contacting the surface of the substrate during processing. The abrasive 205 may be a conductive abrasive material or a composite of a conductive abrasive material deposited on a conventional abrasive material. For example, the conductive material can be deposited on a branch material between the disc 206 and the abrasive 205 to fit the abrasive and the hardness and / or hardness tester during processing.

The support plate 202, the cover 208, and the disc 206 are movably disposed on the base 108. The support plate 202, the cover 208, and the disk 206 can be moved axially toward the base 108 to provide a margin of 13 for the grinding head 13 when the turret 112 indicates that the substrate is between the ECMP and the grinding stations 102, 106. A disk 206 is disposed in the carrier 202 and is coupled to the shaft 212. The shaft 212 is substantially coupled to a motor 221 provided under the base 108. The motor 224 rotates the disk 2006 at a predetermined speed in response to a signal from the controller 14o. The disc 206 may be a perforated supporting structure made of a substance that is compatible with the electrolyte 220 and does not adversely affect grinding. The disc 206 can be made of a polymer such as a fluoropolymer, PE, TELFon, PFA, PES, HDPE, UHMW, or the like. The disc 206 may be fixed in the receiving plate 202 by using a fixing member, such as a screw, or other mechanisms, to be pressed into the housing. The disk 206 is spaced apart from the electrode 204 to provide a wider processing window, thereby reducing the sensitivity of the deposited material and removed material to the size of the electrode 204. The disc 206 is substantially permeable to the electrolyte 22. In the embodiment, the disc 9 ^ 206 includes a plurality of perforations or channels. The 222-shaped perforation includes holes, holes, openings, or partial or complete penetration (such as an abrasive). ~ L way. The size and density of the perforations are selected. The disk 206 provides 仏 a, -z, and the force is evenly distributed on the substrate 114. — In one aspect of the disk 206, it includes a perforation having a central diameter (0.5 mm) to about 0.4 inches (10 mm) in diameter. Wear; between about 30% to about 80% of the abrasive. The electrolyte flow of 50% perforation has the least adverse effect on the grinding process. The perforation of the disc 206 is aligned with the abrasive 205 to provide a solution mass flow through the disc 206 and the abrasive 205 to the substrate. The abrasive article 20 5 can be placed on the disc using a mechanical clip or a conductive adhesive. Although the following abrasive article is described as being used in an electrochemical (ECMP) process, the present invention can also be used with conductive abrasive articles and electrochemical It is carried out in the process of the reaction. Examples of such electrochemical processes include electrochemical deposition, which involves the grinding of an abrasive material, and the application of a uniform polarizing material to deposit a conductive material without the use of a conventional bias application device, and electrochemical machinery. (ECMPP) It includes a group of electrochemical deposition and chemical mechanical polishing. In operation, the abrasive 205 is set on the disk 206 in the liquid of the holder 202. A substrate 114 on the polishing head is in the electrolyte and is in contact with the polishing object 205. The electrolyte flows through the perforations in the circular abrasive 205 and is distributed on the substrate through the grooves. On a real • on it. The object (for example, can be improved by a density of about 0.02 holes. Generally, sufficient electrical surface. Other mechanical effects of mechanical grinding are used in electrolytic coatings pressed into a base plating process. It is placed on the plate 206 and the surface. 200520893 Electric power from a power source is then applied to the conductive abrasive 205 and the electrode 204, and the conductive material in the electrolyte, such as copper, is passed through one of the foregoing anodes. The decomposition method was removed.

The electrolyte 220 flows from a container 233 to a volume 232 through a nozzle 270. The electrolyte 220 is prevented from overflowing to the processing area 2 3 2 through a plurality of holes 1 3 4 provided in the skirt portion 254. The holes 2 3 4 generally provide a path through the cover 208 for the electrolyte 220 to leave the processing area 232 and flow into the lower portion of the tray 202. The hole 234 is located approximately between a lower surface of the depression 258 and the central portion 252. Since at least a portion of the holes 234 are typically higher than the surface of the substrate 4 at the processing location, the electrolyte 220 will fill the processing area 232 and contact the abrasive 205 with the substrate. Therefore, the substrate 114 is in contact with the electrolyte 220 via a complete range of relative distances between the cover 208 and the disk 206.

The electrolytic solution 220 collected in the tray 202 generally flows through the drain port 2 1 4 on the bottom 2 10 and enters the fluid delivery system 2 7 2. The fluid delivery system 272 typically includes a container 233 and a pump 242. The electrolytic solution 220 flowing into the fluid delivery system 272 is collected in the container 233. Pump 242 transfers electrolyte 220 from container 23 3 through a supply tube 244 to nozzle 270, where electrolyte 220 is recovered through the ECMP station 102. A filter 240 is disposed between the container 233 and the nozzle 2 70 to remove particles and accumulated substances that may be present in the electrolytic solution 220. The electrolytic solution may include a commercially available electrolytic solution. For example, on removing copper-containing substances, the electrolyte may include a sulfuric acid-based electrolyte or a phosphoric acid-based 17 200520893-based electrolyte, such as potassium phosphate (K3P04), or a combination thereof. The electrolytic solution may also include a derivative of a sulfuric acid-based electrolytic solution, such as copper sulfate, and a derivative of a phosphonic acid-based electrolytic solution, such as copper phosphonate. Electrolytes having a perchloric acid-acetic acid solution and derivatives thereof can also be used. In addition, the present invention can be implemented using electrolyte components (such as brighteners) traditionally used in electroplating or electromilling additives. One source of the electrolyte is Ultrafill 2000, an electrolyte produced by Shipley Leonel, a + company of Rohm and Hass, based in Philadelphia, PA, USA. An example of a suitable electrolyte composition is described in US Patent Application No. 10/03 8,066, filed January 3, 2002, the entire contents of which are incorporated herein by reference. The electrolyte is provided to the electrochemical cell to provide a dynamic flow rate on the substrate surface, or at a flow rate of approximately 20 gallons per minute (GPM), such as approximately 0.5 GPM and approximately 20 GPM (eg, approximately 2 GPM) Provided between the surface of the substrate and an electrode. I believe that the above electrolyte flow rate is sufficient to empty the abrasive material and chemical by-products from the surface of the substrate, and replenish the electrolyte to improve the polishing rate. Xin When mechanical abrasion is used in the grinding process, the substrate 11 4 and the abrasive 205 are rotated relative to each other to remove substances from the surface of the substrate. Mechanical abrasion can be performed by physical contact with conductive abrasives and traditional abrasive materials. The substrate 11 4 and the abrasive 2 05 are respectively rotated at a rotation speed of about 5 rP m or higher, for example, between about 10 rp m and about 50 rpm. In one embodiment, a high-speed grinding process can be used. The high-speed system 18 200520893 includes rotating the abrasive 205 at a platform speed of about 150 rpm or higher (for example, about 150 rpm and about 75 Orpm); and the substrate U4 can rotate at about 150 rpm and about 500 rpm (For example, about 300 rpm and about 50 rpm). Further description of the high-speed grinding process using abrasives, processes, and equipment described herein is disclosed in U.S. Patent Application Serial No. 60 / 308,330, entitled "Method and Apparatus for Chemical

Mechanical Polishing of Semiconductor Substrate ''

Applied on July 25, 2001. Other movements, including movements or bending movements through the surface of the substrate, can also be performed during the manufacturing process. When contacting the substrate surface, a pressure of about 6 psi or less can be applied between the abrasive 205 and the surface of the substrate, such as about 2 psi or less. For a substrate containing a low dielectric constant substance, the pressure used between the substrate 114 and the abrasive article 205 during grinding of the substrate may be about 2 psi or less. In one aspect, a conductive abrasive pressure between about 0.1 psi and about 0.2 psi can be used to grind the substrate, as previously described.

In anodic decomposition, a potential difference or bias voltage is applied between the electrode 204 (as a cathode) and the polishing surface 310 of the abrasive 205 (as an anode) (see FIG. 3). The substrate in contact with the abrasive is polished by the conductive abrasive surface 310, while the bias is applied to the conductive support element. This bias can remove conductive materials, such as copper-containing materials that travel on the surface of the substrate. The means for establishing the bias may include applying a voltage of about volts or less to the surface of the substrate. A voltage between about 0.1 volts and about 10 volts can be used to decompose the copper-containing material from the surface of the substrate into the electrolyte. The bias voltage can also produce a current density between about 0.1 mA / cm2 and about 50 mA / cm2. 19 200520893 degrees' or about 0.1 ampere for a substrate of 2000 mm amps About 20 σ J ^ flow. The two sources I of the process should be used to establish a potential difference and perform anodic decomposition. For example, 1 :: varies depending on the requirements for removing material from the substrate surface.物 205。 205. : The anode potential that changes the gate can be provided to the conductive abrasive subpulse signal. It can also be applied by electronic pulse modulation technology. The electronic pulse modulation technique includes, ^ applying a fixed current density or voltage to the substrate for a period of ^ Jpl. P „, 3, and then applying a fixed reverse voltage to the base for continued one The second segment, 3, repeats the first and second steps. For example, the electric shock modulation technology you stone 1 uses a voltage from about -0.1 volts to about -15 volts to about 0.001 to 15 volts. -Variable potential. A Jinde is about to penetrate the grinding pattern and density on the grinding medium,-general letter and traditional edge contact pins 丄 August * the same edge removal rate and comparison In comparison with a low central removal rate, the earth material can be biased relative to the abrasive 205 to create materials such as metals, which can be uniformly decomposed from the surface of the substrate into the electrolyte. Conductive materials such as copper-containing substances can be about 1 5000 Angstroms / minute or slightly lower: such as between about ⑽angstroms / minute to about 15,000 angstroms / minute, the rate is removed from a part of the surface of the substrate. In an embodiment of the invention, The copper material to be removed is less than 12,000 angstroms thick, and a voltage may be applied to the conductive abrasive 205 to provide a Removal rate between 100 Angstroms per minute and 8000 Angstroms per minute. In the subsequent electro-grinding process, the substrate can be further ground or wiped to remove the barrier layer material, remove surface defects from the dielectric material, < The use of conductive abrasives to improve the flatness of the polishing process. Appropriate cleaning processes and compositions 20 200520893 are disclosed in US Patent Application Serial No. 09 / 569,968, commonly filed on May 11, 2000, The full text is incorporated herein by reference. Abrasive Material The abrasive material described herein may be formed of a conductive material, the conductive material including at least a conductive abrasive material or a conductive element formed of a dielectric or conductive abrasive material. In one embodiment, the conductive abrasive material may include several conductive fibers, conductive fillers, or combinations thereof. The conductive fibers, conductive fillers, or combinations thereof may be distributed in the abrasive material. The conductive fibers may include at least conductive or Dielectric materials (such as dielectric or conductive polymers or carbon-based materials), those that are at least partially coated or covered with conductive materials (including metals, carbon-based materials, conductive ceramic materials) 'Conductive alloy or a combination thereof.' These conductive fibers may be in the form of fibers or threads, conductive fibers or conductive fabrics, one or more loops, coils or conductive fiber loops, etc. Multi-layer conductive materials (such as multi-layer conductive fabrics or fibers ) Can be used to form conductive abrasives

Conductive fiber materials can include essentially dielectric or conductive fiber coated materials. Suitable dielectric fiber materials such as polyamide, polyimide, nylon polymerization, polyethylene, polystyrene, polycarbonate (such as propylene / ethylene / styrene copolymer combination) and the like. The invention also includes the use of fables. Polymer materials that are conductive in nature, such as 21 200520893 polyacetylene, solid polymer conductors (PEDT), whose trade names are Baytorn ™, polyaniline, polyrole, polyphene, carbon, and others. Another example of a conductive polymer is a polymer-precious metal mixed substance. The polymer-precious metal mixed substance is generally chemically passive to the surrounding electrolyte. For example, a polymer-precious metal compound having an oxidation-resistant precious metal ❶ polymer-precious metal compound is a platinum-polymer mixed substance. An example of a conductive abrasive material (including conductive fibers) has been disclosed in detail in US Patent Application Serial No. 10 / 033,732 in the current application, which was filed on December 27, 2001 and is entitled "Conductive Polishing Article F〇r Electrochemical" Mechanical Polishing ", the full text of which is incorporated herein for reference. The invention also includes the use of such organic or inorganic materials as fiber materials. The fibrous material may be solid or naturally hollow. The fiber length ranges from about 1 μm to about 1 000 mm, and the diameter ranges from about 0.01 μm to about 1 mm. In the aspect, for conductive polymer composites and foam materials (such as conductive fibers deposited in polyoxyacetate), the fiber diameter can range from about 5 μm to about 200 μm, and the length-to-width ratio to diameter is about 5 or higher, for example, about 0 or higher. The cross-sectional area of the fiber can be circular, elliptical, star-shaped, snowflake-like, or any other shape of processed dielectric or conductive fiber. High aspect ratios having a length between about 5 mm and about 1000 mm and a diameter between about 5 μm to about 10000 μm. Weaving fabrics can be used to form mesh 'loops, fibers, or fabrics of conductive fibers. These fibers may also have elastic systems ranging between about 104 psi and about 108 psi. However, the present invention should cover any elastic coefficient sufficient to provide abrasives and smooth, elastic fibers in the aforementioned processes. 22 200520893 Conventional materials deposited on this conductive or dielectric fiber material generally include conductive inorganic compounds such as metals, metal alloys, carbon-based materials, conductive ceramic materials, metal inorganic compounds, or combinations thereof. Examples of metals that can be used for the coating of conductive materials herein include precious metals, tin, lead, copper, nickel, cobalt, and combinations thereof. Precious metals include gold, platinum, palladium, iridium, baht, rhodium, ruthenium, iron, and combinations thereof, with gold and platinum being preferred. In addition to the foregoing, the invention encompasses the use of other metals for coating conductive materials. Carbon-based materials include carbon black, graphite, and carbon particles that can be fixed to the fiber surface. Examples of ceramic materials include niobium carbide (NbC), zirconium carbide (ZrC), tantalum carbide (TaC), titanium carbide (TiC), tungsten carbide (wc), and combinations thereof. In addition to the foregoing, the invention encompasses other metals, other carbon-based materials, and other ceramic materials that can be used for coating conductive materials. Metal inorganic compounds include, for example, copper sulfide or danjenite, Cu9S5 deposited on polymer fibers (such as acrylic or nylon fibers). This danjenite coated fiber is Thunderon® (trade name), which is marketed by Nihon SanmoDyeing Co., Ltd. The Thunderon (R) fiber generally has a coating of danjenite (Cu9S5) of about 0.30 μm and about 0%, and has been found to have a conductivity of about 40 Q / cm. The conductive coating can be directly deposited on the fiber by electroplating, coating, physical vapor deposition, chemical deposition, bonding or combining conductive materials, etc. In addition, the conductive material can also be deposited by nucleation or seeding, 9 Ah, steel, cobalt, or nickel can be used to improve the performance between the conductive material and the fiber material. The conductive material can be deposited on various dielectrics or electrical fibers of different lengths, and on 1 π-shaped loops made of dielectric or conductive fiber materials, foam materials, and fabrics or fibers. on. 23 200520893 An example of a suitable conductive fiber is a polyethylene coated with gold. Examples of other suitable conductive fibers include gold-plated acrylic fibers (acrylic cotton) and rayon-coated nylon fibers. An example of a conductive fiber using a nucleation material is a nylon seed layer coated with a copper seed layer and a gold layer is deposited on the steel layer.

The conductive filler may include carbon-based materials or conductive particles and fibers. Examples of the conductive carbon-based material include carbon foam, carbon fiber, carbon nanotube, carbon nonofoam, carbon aerosol, graphite, and combinations thereof. Examples of conductive particles or fibers include polymers that are conductive in nature, dielectric or conductive particles coated with a conductive material, conductive materials coated with a dielectric filler material, and conductive inorganic particles including metal particles such as gold, platinum, Particles of tin, lead, and other metals or metal alloys), conductive talman particles, and combinations thereof. The conductive filler may be partially or completely coated with a metal (such as a noble metal), a carbon-based material, a conductive ceramic material, a metal inorganic compound, or a community thereof (as described above). An example of a filling material is carbon fiber = graphite coated with copper or nickel. Conductive fillers can be round, oval,

Straight bars with aspect ratio (such as 2 or higher), or any other processed 2 material. Filler material is broadly defined herein as a material that can be deposited on a second material to alter the physical, chemical or electronic properties of the second material. As such,

The filler material may also include a dielectric or conductive fiber material partially or completely coated with a conductive metal, or a conductive polymer as described herein. Partial or 6-layer dielectric coated in a conductive metal or conductive polymer. ^ U 丨 Electrical appliances or conductive fiber materials can also be complete fibers or fiber sheets. The conductive material is used for coating dielectric and conductive fibers, and filler. 24 200520893 Provide the desired conductive height to form the conductive abrasive material. Generally speaking, the coating of the conductive material is deposited on the fiber and / or the filler material to a degree between about 0.001 μm and about 50 μm, and for example, the temperature is about 0 μm. Twist and between about 10 μπα. Diagnosis 1 Coating generally forms fibers or fillers with a resistivity of about 100 Ω-cm (for example, Λ * about 0.001 Ω-cm and about 32 Ω-οιη). The lightning and electrical resistivity covered by the invention depend on the fiber or filler and the coating used, and include the electrical resistivity of the material coating, such as the inscription, whose electrical resistivity at 0 ° C A 9.8ΐμΩ (; Examples of suitable conductive fibers of 1ηβ include nylon fibers coated with copper, copper, or cobalt, and nylon fibers deposited on copper, brocade, or coating μ with gold, with a total fiber diameter of about 3 〇 and about 90 μm. The conductive abrasive material may include a combination of the conductive or dielectric fibers (which

The dielectric fiber is at least / Otto L >. The wound is coated or covered with additional conductive materials and conductive fibers) to achieve the desired vine, snow, secret, and sweetness. An example of a composition is the use of gold-coated nylon fibers and graphite as a conductive material that includes at least a portion of a conductive abrasive material. The conductive fiber material, the conductive filler material, or a combination thereof may be dispersed in the bonding material. Ge forms a composite conductive abrasive material. Traditional abrasive materials are a form of bonding material. Traditional abrasive materials are generally dielectric materials ' such as dielectric polymer materials. Examples of dielectric polymer abrasive materials include polyurethane and polyurethane mixed with filler, polycarbonate, polysulfide (键), TeflonTM polymer, polystyrene, EPDM rubber ) Or a combination thereof, and other abrasive materials for abrasive material surfaces. Conventional abrasive materials may include dry 25 200520893 fibers impregnated in urethane or in the form of beads. The present invention encompasses any abrasive material known to be used in conjunction with the conductive fibers and fillers described herein as a bonding material (known as a polymeric substrate).

Additives may be added to the bonding material to help distribute the conductive fibers, conductive fillers, or combinations thereof in the polymeric material. Additives can be used to improve the electrical properties of mechanical, thermal, and abrasive materials formed from fibers and / or fillers and bonding materials. Additives include cross-linkers for improving polymer cross-linking and dispersants for distributing conductive fibers or conductive fillers for more uniform distribution in the bonding material. Examples of the crosslinked material include amino compounds, silane crosslinked materials, polyisocyanate compounds, and combinations thereof. Examples of dispersants include N-substituted long-chain alkenyl butane dithioimines, high molecular weight organic acid amine salts, and polar functional groups (such as amines, amino compounds, imines, thioimines, hydroxides) Root, acetic acid) or methyl acrylic or acrylic acid derivatives. In addition, sulfur-containing compounds such as hydrothioacetic acid and related esters have been found to be effective dispersants for fillers in gold-coated fibers and bonding materials. The number and types of additives covered by the present invention may be adjusted for the fiber or filler material and the bonding material used, and the foregoing examples are illustrative, and should not be considered or interpreted as limitations of the present invention. In addition, a mesh of conductive fibers and / or filler materials may be formed in the bonding material by providing a sufficient amount of conductive fibers and / or conductive filler materials to form a physical continuous or electronic continuous medium or phase in the bonding material. . The conductive fiber and / or conductive filler generally includes at least about 2% to about 85% by weight, such as about 5% and about 60% of abrasive material, when combined with a polymeric bonding material. The fiber coated with conductive material and the fiber optionally coated with conductive filler 26 200520893 The blended fiber or fabric of the material can be placed in a binder + the fiber material can be blended to form sand and thread. "Coating agent or coating with V electrical material to polymerize into conductive mesh. The yarn == can be in the conductive elements in the glue, or can be mixed with the fabric or the fiber center line ... abrasive materials or such conductive fibers, The 4-person flying jitter can be combined with a binding agent to form a combined conductive abrasive material. ^ M ^ ^ j ^ 7 m ^ ^ < I mixture examples include epoxy U ® a silicone, cyanoformat , Polyimide, auxiliary amines, polyamines, polysaccharides, fluorinated derivatives, or yt ^ ^, additional conductive materials, such as conductive polymers, additional The guides or their compositions can be used with the mussel mixture to achieve the desired conductivity 导电 ... ^ other abrasive properties. The conductive fibers and / or authentic materials may include between about 2% to u ^ ^ about 85 / 〇, for example, about 5% and about 60% of the abrasive material. The conductive fiber and / or 埴 古 # μ π / true charge material can be used to form a conductive abrasive material or abrasive, and these ground hemp materials 枓 or The abrasive has a volume or surface resistance of about 50 n-cm or less (彳, spoon 3 Ω cm or less). In one embodiment of the abrasive, , The abrasive or the abrasive surface of the abrasive has a resistance of about 1 Ω cm or lower. Generally speaking, the composition of the conductive abrasive material or conductive abrasive material and the traditional abrasive material can provide a volume resistance or about 50 Ω cm Conductive abrasives with a surface resistance of or lower volume. Examples of the components of the conductive abrasive and conventional abrasive materials include gold or carbon-based fibers with a resistance of 1 Ω-cm or less, deposited in a sufficient amount on In the conventional polyurethane abrasive material, an abrasive material having a volume resistance of about MΩ-cm or lower is made. Traditional research 27 200520893 made of the conductive fiber and / or filler described here

Abrasive materials generally have mechanical properties that do not degrade under a stable electric field and avoid degradation in acid or alkaline electrolytes. The conductive material and any bonding material are bonded to provide the same mechanical properties. If possible, conventional abrasive materials used in conventional abrasive materials may also be used. For example, conductive abrasive materials, whether alone or in combination with a bonding material, have a hardness value of about 100 or less for the D-type hardness of polymer materials. This is a U.S. test based in Philadelphia, PA, and Measured by the Society of Materials (ASTM). In one aspect, the conductive material has a Shore D hardness value of about 80 degrees or less for the polymer material. The conductive abrasive portion 31o generally includes a surface rough chain degree of about 500 mm or less. The characteristics of the polishing pad are generally designed to reduce or minimize scratches on the surface of the substrate during mechanical polishing and when a bias is applied to the surface of the substrate. In one aspect, the abrasive structure is formed by a A single layer of conductive abrasive material described herein is placed on a support. In another aspect, research

The abrasive article may include a variety of material layers, including at least one conductive material on the surface of the substrate or providing a conductive surface to contact the substrate and at least one object support or bottom pad. Partial cross-section of Yi Ling Ta W Grinding 205 in FIG. 3 includes a composite abrasive article with a shoulder, and an electro-abrasive portion 310 is used to polish the surface of the substrate and an object supporting portion 320. The conductive abrasive portion 31 may include a conductive abrasive material, a conductive fiber and / or a conductive filler as described herein. 4310 may include a conductive material dispersed in a polymeric material and including a filler. The conductive fiber may be provided in the deaf conductive fiber may include a conductive conductive material provided in a polymer binder generally having a hardness and a coefficient lower than that of copper. Examples include other conductive metals softer than copper, including gold, tin, Bar-tin alloy, platinum, and non-scratch abrasive substrates, the present invention also covers other fillers. In addition, the abrasive part of the conductive material may include a fabric in the form of a conductive fiber loop or a conductive fiber blend. The conductive abrasive portion 310 may also be composed of a plurality of conductive fabrics or fibers). An example of the conductive abrasive portion 3 1 0 includes gold and graphite placed in polyurethane. Other examples Graphite particles and / or carbon fibers in silicone. Other gold or tin particles in the aminoacetic acid substrate. In another embodiment, the abrasive particles 360 described in the conductive abrasive portion. The abrasive particles 360 exposed on the conductive abrasive portion 310 are generally configured to remove the ground substrate layer, thereby exposing the underlying metal to the electrolyte and enhancing the polishing rate during the process. The particles 360 are ground to destroy the ceramic polymer particles of the passive layer formed on the metal surface. The polymer particles may be solid or may be in the conductive abrasive portion, the conductive fiber and / or the conductive compound binder. The flexible conductive material. Soft person. Flexible conductive material Gold to winter ceramic compound Lead. If the size is small enough and the hardness is higher than copper, the conductive pans have multiple loops, coils to form conductive cloth or conductive materials (for example, multiple layers coated with nylon fibers include placing in polyurethane or consumption including distribution in poly 3 1 0 may It has at least some parts here that are exposed surfaces 370. The passive surface electrochemical reaction of the metal surface of the abrasive grains, for example, includes the strength of porcelain, inorganic, organic or sponge body which reduces the wear rate of the abrasive part. 29 200520893 The support 1 〇Λ Λ 〇 generally has a phase similar to the conductive grinding portion 31 〇 < smaller straight or t J ^ again ... The invention also covers a large width or diameter # conductive grinding section and melons larger than #部 320。 Although shown here is a trouble-like conductive grinding section 31〇OTHER Hideshi # 亍 闹 不 架 1010 object support section 320, the present invention also covers the conductive grinding section 31〇, 铷 * 盍 盍 4 as a rectangle The surface or ellipse is left to shape, such as an elliptical surface. The present invention also covers the conductive abrasive part 31, the material support part 320, or both of which can form a linear mesh or band-shaped material. "The support part 320 may include In the grinding process Can

# ^% # ECMP Injured Passive Substances Diminished or Damaged During the Period. For example, the material support portion may be composed of abrasive materials, including printed materials, such as polyurethane mixed with polyurethane, Pingyao & Jiuxing polyanalyte, polyphenylene sulfide (pp three Glue (EPDM), TeflOnTM Ethylene Propylene Rubber ^ ^ #. Mouthpiece or composition thereof, and other abrasive materials used for abrasive material surface. ^ Quality, such as compressed and impregnated with t Felt-type fibers in methanoformate are used to absorb the thousands of pressures applied between the grinding object 205 and the grinding head 130 during the manufacturing process. The soft material can be Xiao type and 2 Shi type A The hardness value is between about 20 and about 90.% Alternatively, the support portion of the object is made of a conductive material, which is suitable for% winding around the electrolyte without harming the grinding, ^ ^ ^. ^ m It includes a conductive precious metal or conductive polymer to provide conductivity to all metals, such as gold, platinum, palladium, iridium, chain, money, ruthenium, and iron. And its composition, of which gold and beginning are better .: y * 祖 strives to Electrolyte phase, such as copper, can be used when these materials are insulated from the surrounding electrolyte due to h & metal (such as the conventional abrasive material 30 200520893 or noble metal). When the material support 320 is more conductive The conductive polishing portion a 31G is high. The material supporting portion 320 may have, for example, the conductive polishing portion 310 and the covering property (ie, low resistivity). Compared with the object supporting portion 320 of 10 Ω + platinum, It has a resistivity ni q 〇 of 1.0Ω-cm or lower (because the resistance of the branch # section is 9.81 μΩ-οιη at 0). The conductive support portion. _ 0 can provide earth and stone uniform bias during grinding Or current to minimize the electrical resistance along the surface of the object, such as the radius of the object, to decompose the IW pole throughout the surface of the substrate table 4. The conductive object supports

The part 320 can also be connected to a power source to transmit power to the conductive abrasive part. Generally speaking, the conductive abrasive part 31 is a material suitable for the use of materials and used for grinding.物 支 320。 Thing 320. The present invention encompasses other devices that can connect the conductive abrasive portion 31 to the two-object abrasive portion 320, such as by stamping or laminating. The bonding may be conductive or dielectric depending on the manufacturing process or the manufacturer's desire. The material support part 3 20 can be fixed on a support part, such as a disc 206, by an adhesive or a mechanical clip. Alternatively, if the abrasive object 205 may include only a conductive abrasive portion "0 1 0, and

The conductive abrasive portion can be fixed to another 5? (E.g., a disc 206) by an adhesive or a mechanical clamp. The conductive polishing portion 310 and the object selection portion 32 of the polishing object 205 can generally pass through the electrolyte. A plurality of perforations may be formed in the conductive polishing portion 310 and the object support portion 320, respectively, to help the liquid flow therethrough. The perforations allow electrolyte to flow through and contact the surface during the manufacturing process. The perforations may be provided therein during manufacture, such as in a fabric room in conductive fibers or fabrics, or may be mechanically provided and molded to penetrate these materials. The through holes 31 200520893 can partially or completely form a layer 205 through which an abrasive is passed. The perforations of the conductive abrasive portion 310 and the perforations of the object support portion 32 may be aligned with each other to facilitate liquid circulation therebetween. Examples of the perforations 35 formed in the abrasive 205 include holes in the abrasive, wherein the holes have a diameter between about 0.02 inches (0.05 mm) and about 0.4 inches (10 Public examination). The thickness of the abrasive article 205 can be between about 0.1 mm and about 5 mm. For example, the perforations may be separated from each other by a distance of between about 0.1 inches and about 1 inch. The abrasive article 205 has a perforation density between about 20% to about 80% to provide a sufficient flow of a substance of electrolyte solution throughout the surface of the abrasive article. However, the present invention also covers perforation densities that are less or higher than the perforations described herein for controlling the flow of liquid therethrough. In one example, a perforation density of about 50% was found to provide sufficient electrolyte to provide uniform anodic decomposition from the surface of the substrate. The perforation density described herein is broadly described as the volume of abrasive material covered by the perforations. The perforation density includes when the perforations are formed in the abrasive article 205 'the total number of the surface or the abrasive article body and the diameter or perforation size. The 5 inch, male, and degree are selected to provide a uniform electrolyte distribution through the abrasive article 05 to the surface of the substrate. Generally speaking, the perforation size, perforation density, and perforation of both the conductive grinding mouth P knife 310 and the material support portion 32 will be configured and calibrated, and the full provision of passing through the conductive grinding portion > 31 ° and the electrolyte flow from the object support portion 32 () to the surface of the substrate. The chip can be placed in the grinding object 205 again to promote the electrolyte to flow through the 32 200520893 grinding object 205, so as to provide a right or effective electrolyte flow for anodic decomposition or electroplating process. The grooved hemp can be formed in a single layer or in multiple layers. The present invention also covers grinding that can be performed on the upper layer or contact the surface of the substrate Grooves on the surface. In order to provide 9 ^ or controlled electrolyte flow to the surface of the abrasive, one of the perforations does not connect the perforations to the research σ | & Can communicate with the groove. Or 'the perforations, all or the groove in the abrasive 205. Examples of grooves used to promote electrolytic pan, uncle ^ liquid maneuver include straight grooves, arc grooves , Concentric circular grooves, 1-valent common grooves, and spiral grooves. The grooves formed in the abrasive 205 have a square, circular, semi-circular, or other shape that helps flow through the groove. The shape of the surface of the abrasive. The grooves can intersect each other. The grooves can be arranged in a pattern, as if arranged in the grinding The surface-XY pattern or-a triangular pattern t formed on the abrasive surface, or a combination thereof to improve the flow of the electrolyte on the surface of the substrate. The grooves may be spaced apart from each other by about 30 mils ( mil) to about 300 mils. Generally, the groove width on the abrasive is about 5 mils to about 30 mils', but its size can be changed according to the needs of grinding. Examples of trench patterns include trenches that are about 10 mils wide and about 60 mils apart from each other. Any suitable trench configuration, size, diameter, and spacing can be used to provide the desired electrolyte flow The other sections and groove configurations are shown in detail in October 2001. U.S. Patent Application No. 60 / 328,434 is currently under examination and entitled "Meth〇d And Apparatus For Polishing" Substrates ", the full text of which is incorporated herein by reference. The electrolyte can be transported by forming perforations in at least part of the groove to improve the electrolyte flow to more evenly distribute the additional electrolyte in the base. As of December 2001, 10 / 026,854, its full $ A perforated ^ groove is a grounded circular pad 440 with a groove 446 to allow the electrolyte to flow 0.1 inches and about 1 inch (0.5 mm) and the number of about 0. The shape can vary with the composition . The groove 442 is 448 to assist the case between the base material and the abrasive, including the circular groove in the center of Fig. 4 and the angular pattern of Tulou 5. FIG. 5 is a view of a grinding process having a polishing groove 542. The perforations 546 can also be placed on the abrasive object 548; reinforce, even by treating the surface of the groove material of the substrate, and the treated electrolyte will be renewed by the perforation flow. Examples of pad perforations and grooves are disclosed in more detail. U.S. Patent Application Serial No. L, filed on 20th, is incorporated herein by reference. Examples of the abrasives of the grooves are described below. Fig. 4 A plan view of an example of an abrasive. The abrasive article 2 5 shows a number of perforations of sufficient size and structure to the surface of the substrate. The perforations 446 are approximately f from each other. The perforations may be annular perforations having a diameter between about 0.02 inches and 4 inches (10 mm). In addition, the used equipment, processing parameters, and fresh electrolyte of the 002 volume solution of the grinding surface 205 formed in the grinding object 205 are perforated to the voids of the substrate. The grooves 442 may have different views and a generally circular XY pattern on the polishing surface 448 and a top view of another embodiment of the third embodiment shown in FIG. 6, the polishing pad The χ-γ pattern on the grinding part 548 of color 540 can be placed at the intersection of vertical and horizontal grooves, a straight groove, a horizontal groove, or a place other than the groove 542. . Perforation 546 and groove

34 200520893 5 4 2 is set on the inner diameter 5 5 0 of the abrasive and the outer diameter 5 5 0 of the polishing pad 5 4 4 is free of perforations and grooves.

FIG. 6 shows another embodiment of the patterned abrasive object 640. In this embodiment, the grooves are arranged in an X-Y pattern and have grooves 645 arranged diagonally which intersect with the grooves 642 of the X-Y pattern. The diagonal grooves 645 may be disposed at an angle of about 30 degrees to about 60 degrees between the X-Y grooves 642. The perforation 646 may be provided at the intersection of the XY groove 642, the intersection of the XY groove 642 and the diagonal groove 645, along the grooves 642 and 645, or without the groove 642 on the abrasive 648. 645 places. Perforations 646 and grooves 642 are provided on the inner diameter 650 of the abrasive and the outer diameter 650 of the polishing pad 644 is free of perforations and grooves. Other examples of groove patterns (such as spiral grooves, layer-wound grooves, and turbine grooves, etc.) are described in more detail in the application of October 1, 2001, which is currently under review. US Patent Provisional Application Serial No. 60 / 328,434, entitled "Method And Apparatus For Polishing Substrates", the entirety of which is incorporated herein by reference.

In addition to the perforations and grooves in the abrasive article 205, the conductive grinding section 3 10 may be embossed to include the surface texture. Embossments also improve the transfer of electrolytes, removed substrates, by-products, and particulates. The relief can also reduce scratches on the abrasive substrate and change the friction between the abrasive substrate and the abrasive material. The embossed surface texture can be evenly distributed on the conductive abrasive portion 31. The surface texture of the relief may include, for example, pyramids, islands, structures that intersect with circles, rectangles, squares, and other geometric shapes. The present invention covers other textured structures embossed on the conductive abrasive portion 3 10. The embossed surface can cover the guide 35 200520893 electromill. The surface area of 卩 310 is five to ninety-five, for example, the surface area of the conductive abrasive portion 310 is fifteen to ninety percent. Conductive Abrasive Surface FIG. 7A is a partial top view of one embodiment of a conductive fabric or fabric 700 that can be used to form the conductive abrasive portion 3-1 of the abrasive article 205. The conductive fabric or fabric is composed of an interwoven fabric 7 10, which is coated with a conductive material as described above. In one embodiment, the woven or basket_weave pattern of the interweaving fabric 710 in the vertical 720 and horizontal 730 directions (shown in the plane of FIG. 7A) is illustrated in FIG. 7A. The invention also covers other fabrics used to form the conductive fabric or fabric 700, such as yarns or different interweaving, weaving, or screen patterns. In one aspect, the fabric 710 is interwoven to provide a channel 740 in the fabric 700. The channels 740 allow electrolyte or fluids (including ions and electrolyte compounds) to flow through the fabric 700. The conductive fabric 700 may be placed in a polymer binder, such as polyurethane. The conductive filler may also be placed in the above-mentioned polymer binder. Fig. 7B is a partial cross-sectional view of the conductive fabric or fabric 700 placed on the object support portion 320 of the object 205. The conductive fabric or fabric 700 can be placed in a continuous layer or multiple layers above the object support portion 320, and the object support portion includes any perforation 350 formed in the object support portion 320. The fabric or print 700 can be fixed to the support 32 by an adhesive. When immersed in electrolyte, the fabric 700 is adapted to allow the electrolyte to flow through the fibers, weaves, or channels formed in the fabric. The intermediate layer may also be selectively provided between the fabric or fabric 700 and the object supporting portion 320. The intermediate layer is permeable or may include several perforations aligned with the perforations 320 for the electrolyte to flow through the object.

Alternatively, if the channels 740 are determined to be insufficient for the electrolyte to effectively flow through the fabric 700 (for example, metal ions cannot diffuse therebetween), the fabric 700 may also be provided with perforations to increase the electrolyte flow therethrough. The fabric 700 generally increases the flow rate of the electrolyte by about 20 gallons per minute. FIG. 7C is a partial cross-sectional view of the fabric or fabric 700. The fabric or fabric 700 can be patterned with several perforations 750 to match the pattern of perforations 350 in the support 320. Alternatively, some or all of the perforations may not be aligned with the perforations 350 of the object support 320. The alignment or misalignment of the perforations allows the operator or manufacturer to control the electrolyte flow rate or volume through the abrasive used to contact the surface of the substrate.

An example of this fabric 700 is an interwoven blue weave having a fiber width of about 8 and about 10, the fiber including at least one nylon fiber coated with gold. Examples of such fibers are nylon fibers, the nylon fibers having an inscription, copper, or copper of about 0.1 μm, and gold of about 2 μm on the base, copper, or nickel. Alternatively, a conductive mesh may be used at the conductive fabric or fabric 700. The conductive mesh may include at least conductive fibers, conductive fillers, or at least a portion of a conductive fabric 700 or coated with a conductive bonding agent. The conductive binder includes at least a non-metal conductive polymer or a composite of conductive materials placed in a polymer compound. Conductive fillers (such as graphite powder, graphite sheet, graphite fiber 37 200520893 dimension, carbon fiber, carbon powder, black carbon, metal particles or fibers coated in conductive materials ·) and polymer materials (such as polyurethane ) And the like can be used to form the conductive bonding agent. The conductive material-coated fibers described herein can also be used as a conductive filler for a conductive binder. For example, carbon fibers or gold-coated nylon fibers can also be used to form a conductive bond. If needed, the conductive bonding agent may also include a number of additives to help disperse conductive fillers and / or fibers, improve the adhesion between polymers and fillers and / or fibers, and improve the mechanical, thermal, and electrical properties of conductive bonding agents characteristic. Examples of additives that can be used to improve adhesion include epoxy resins, silicones, urethanes, polyamides, or combinations thereof. The composition of the conductive filler and / or fibers and the polymer material may also be used to provide specific characteristics, such as conductivity, adhesion, and durability coefficient. For example, the conductive bonding agent includes at least a conductive filler that can be used in conjunction with the materials and processes described herein, and its weight percentage is between about 2 and about 85. Materials that can be used as conductive fillers and conductive binders are detailed in U.S. Patent Application Serial No. 10 / 〇33,732, dated December 27, 2001, which is incorporated herein by reference in its entirety. The thickness of the conductive bonding agent is between about 1 mm and 0 mm, for example, between about 10 mm and about 1 mm. A multilayer conductive bonding agent can be applied to the conductive web. The conductive mesh can be made in the same manner as the conductive fabric or fabric 700 shown in Figs. 7] 3 and 7C. The conductive bonding agent may be applied to the conductive web in a multilayer manner. In one aspect, the conductive bonding agent is applied to the conductive mesh after the mesh is perforated to protect the exposed portion of the mesh during the perforation process. 38 200520893 In addition, a conductive primer can be placed on the conductive mesh before the conductive bond is applied to improve the adhesion of the conductive bond to the conductive mesh. The conductive primer can be made of the same material as the conductive bonding fiber, and the composition can be changed so as to have an adhesiveness between raw materials larger than that of the conductive bonding agent. A suitable conductive primer material may have a resistance below about 100 Ω / cm, such as a resistance between about 0.0001 Ω / cm and about 32 Q / cm. Alternatively, a conductive foil may be used at the conductive fabric or fabric 700, as shown in FIG. 7D. The conductive foil generally includes a metal foil 78 °, which is disposed in a conductive bonding agent 790 or coated with a conductive bonding agent 7 90 on the support layer 320. Examples of metal foil formation include metal-coated fabrics, conductive materials, etc. Conductive materials include copper, nickel, and cobalt and precious metals such as gold, platinum, palladium, iridium, baht, rhodium, ruthenium, e, tin, lead, and combinations thereof Materials, of which gold, tin and noodles are preferred). The conductive foil may also include a non-metallic conductive foil, such as a copper sheet, a carbon fiber woven mesh foil. The conductive foil may also include a metal-coated fabric of a dielectric or conductive material, such as copper, nickel, tin, or gold-coated fabric of a nylon fiber. The conductive foil may also include a fabric of a conductive or dielectric material coated with the aforementioned conductive bonding material. The conductive foil also includes a metal frame, a metal screen, or a metal mesh connected with conductive metal wires or metal bars (such as copper metal wires) in the middle, which can be coated with a conductive bonding material in the foregoing manner. The invention also encompasses the use of other materials forming the metal foil here. The conductive bonding agent 790 described herein can encapSUiate the metal edge 780, making the metal foil 78 ° a conductive metal, such as copper, which can be observed to interact with the surrounding electrolyte. The conductive foil may be provided with a plurality of perforations as described above. Although not shown here, the conductive foil may be coupled to a conductive metal wire to bias the abrasive surface with a power supply. The conductive bonding agent 790 can be used as a conductive mesh or fabric 700 and can be applied to the metal foil 780 in a multilayer manner. In one aspect, the conductive bonding agent 790 is applied to the metal foil 7 80 after being perforated to protect the portion of the metal foil 7 80 exposed by the perforation process .

The conductive bonding agent described herein can be applied to the conductive fabric 700, the foil 780 or the mesh. After drying and curing, the bonding agent is then cured on the fabric, pig or web. Other suitable processes including injection molding, compression molding, lamination, pressure cooker, extrusion, or a combination of these methods can also be used to encapsulate the conductive fabric, web, or foil. Thermoplastic and thermosetting bonding agents can also be used.

The conductive bonding agent and the bonding agent between the metal foil compounds of the conductive foil may also be formed by a plurality of perforations (diameter or width of about 0 · 丨 μιη and about 1 mm) on the metal foil, or by the A conductive primer is applied between the metal foil and the conductive bonding agent to strengthen it. The conductive primer may be the same material as the aforementioned conductive primer for webs. Figure 7E is a cross-sectional view of another embodiment of a conductive fabric or fabric 798 that can be used to form the lower layer 792 of the conductive abrasive portion 310, which is one of the abrasives 205. The conductive fabric or fabric may be composed of interwoven or non-woven fibers 710. The fibers 710 may be formed or coated with a previously mentioned conductive material. Examples of non-woven fibers include spunbond or melt blown polymers, and other non-woven fabrics. 40 200520893 The conductive abrasive portion 310 includes an upper layer 7 94 composed of a conductive material. The upper layer 794 includes an abrasive surface 796 opposite the lower layer 792. The upper layer 794 $ has a sufficient thickness to smooth out the irregularities of the lower layer 792 to provide a flat and flat abrasive surface 796 to contact the substrate during the manufacturing process. In one embodiment, the abrasive surface 7 9 6 has a thickness in a range of less than or equal to about 1 mm, and a surface roughness in a range of less than or equal to about 500 mm.

The upper layer 7 9 4 may be composed of any conductive material. In one embodiment, the upper layer 794 is formed of a soft material (such as gold, tin, palladium, palladium-tin alloy, platinum or lead, and other ceramic composites, conductive metals, and alloys that are softer than copper). The upper layer 794 may optionally include the aforementioned bonding material therein to help remove the passive layer on the metal surface of the substrate during grinding.

Alternatively, the upper layer 794 may be composed of a non-conductive material, which substantially covers the conductive polishing portion 310 but leaves at least a part of the conductive polishing portion so that the conductive polishing portion 3 10 can be electrically connected to the upper A ground substrate is placed on layer 794. In the above configuration, the upper layer 794 can help reduce scratches and prevent the conductive portion 3 1 0 from entering any of the exposed features during grinding. A non-conductive upper layer 794 may include several perforations to keep the conductive abrasive portion 3 10 exposed. Fig. 7F is another embodiment of a grinding object 205 having a window 702 formed therein. The window 702 is configured to position a sensor 704 under the grinding object 205 to sense a metric indicator of the grinding performance. For example, the sensor 704 may be an eddy current sensor or an interferometer or other sensor. In an embodiment, the interferometer sensor that can generate a collimated light beam is irradiated on one side of the substrate 11 to be polished during the manufacturing process. The interference between the reflected signals is an indicator of the thickness of the material layer to be ground. One of the sensors that is gainable in this case is described in U.S. Patent No. 5,893,796 filed by Birang et al. On April 13, 1999, the entire contents of which are incorporated herein by reference.

The window 702 includes a fluid grid 706 that substantially prevents process fluid from flowing out of the area contacting the disk 206 that covers the sensor 704. The fluid grid 706 is generally selected to be transmissive (eg, with minimal or no effect or interference) to the signal that penetrates. The fluid grid 706 may be a separate element, such as a piece of polyurethane coupled to the abrasive material 205 in the window 702, or may include one or more layers including the abrasive material 205, such as a piece located on the conductive portion 3 1 0 or Polyester film sheet under the object support part or sub-pad part 3 2 0. Alternatively, the fluid grid 706 may be disposed between the layers between the abrasive 205 and the disc 206, such as the electrode 204 or other layers. In another alternative configuration, the fluid grid 706 may be disposed in a channel 708 aligned with the window 702 (with a sensor therein). In these embodiments, the conductive portion 3110 includes at least several layers, such as an upper layer 794 and a lower layer 792, and the penetrating material 706 may be provided in at least one layer including the conductive portion 310, as in Section 7F. As shown. It should be understood that other configurations of the conductive abrasive (including the embodiments and other configurations described herein) may be designed to include a window. Conductive element in a lapping surface 42 200520893 In another aspect, the conductive fibers and fillers described herein can be used to form differentiated conductive elements, which are provided in an abrasive material to form the conductive abrasive of the present invention物 205。 205. The abrasive material may be a conventional abrasive material or a conductive abrasive material, such as a conductive composition of conductive fibers or fillers placed in a polymer as described above. The surface of the conductive element may form a plane having a surface of an abrasive object, or may extend on a plane of the surface of the abrasive object. The conductive element may extend on the surface of the abrasive object at approximately 5 mm. Although the following illustrates the use of conductive elements with a specific structure and configuration in the abrasive material, the present invention also covers various conductive fibers and fillers and materials made from them, such as fabrics, which can also be considered conductive element. In addition, although it is not shown here, the description of the abrasive article described below may include an abrasive article with the aforementioned perforation and groove patterns (illustrated in Figures 4 and 6), and other pattern configurations can be related to this. The conductive elements described herein are combined and described in detail below. 8A to 8B are schematic diagrams illustrating an upper surface and a wearing surface of one embodiment of an abrasive article 800. The abrasive article 800 is provided with conductive elements. The abrasive article 800 generally includes a body 810 having a grinding surface 820 for contacting the substrate during the manufacturing process. The body 810 typically includes at least a dielectric or polymer material ' such as a dielectric polymer material (e.g., polyurethane). The abrasive surface 820 has one or more openings, grooves, trenches or dimples 8 30 formed therein to at least partially receive the conductive element 840. The conductive element 840 may be generally provided to have a coplanar contact surface 850 or to extend above a plane defined by the grinding surface 8200. The contact surface 85 ° is generally configured (for example, provided with a flexible, elastic, bendable, or compressive plastic surface) so as to have the largest electrical contact with the conductive element 84 ° when contacting the substrate. During grinding, the contact pressure used can force the contact surface 850 into a position coplanar with the grinding surface 820. The body 810 is generally manufactured so that it can penetrate into the electrolyte through several through holes 860 formed therein. The abrasive article 800 may have a perforation density, which is about 20% to 80% of the surface area of the abrasive article 810 to provide sufficient electrolyte flow to help uniform anodic dissolution from the surface of the substrate. . The body 8 1 0 — 1 includes a dielectric material, such as the conventional abrasive material described above. The dimples 83 formed in the body 81o are generally configured to maintain the conductive element 84o during the manufacturing process, and thus can be changed in shape and orientation. In the embodiment shown in FIG. 8A, the dimples 830 are a number of "X" or a plurality of rectangular cross sections (disposed on the surface of the abrasive surface) and forming an interactive link at the center of the abrasive 800 The grooves of the cross pattern 87 °. The invention also covers other cross sections, such as inverse trapezoids and rounded shapes, where the grooves can contact the surface of the substrate (as described above). Alternatively, the dimples 83 0 (and the conductive elements 84 0 provided therein) can be arranged at irregular intervals, or they can be set in a radial, lateral or vertical orientation, or they can be linear, curved, concentric, internal Curly curve or other intersecting segment area. FIG. 8C is a series of schematic diagrams of a series of conductive elements 8440 arranged radially above the body 810. Each element 840 is physically or electrically separated by a space 875. The spacer 875 may be a dielectric abrasive material for these components or a part of a dielectric interconnect, such as a plastic interconnect. Alternatively, the spacer 8 75 may be a segment of abrasive material, which lacks the abrasive material or the conductive element 840 to prevent physical contact between the conductive elements 840. In the above-mentioned separation element configuration, each conductive element 840 can be individually connected to a power supply by a conductive path 890 (such as a metal wire). Referring back to FIGS. 8A and 8B, the conductive element 84 is generally provided in the body 810 to form one of the major resistances of the abrasive or a major surface resistance of about 20 ω_cm or lower. In one aspect of the abrasive, the resistance of the abrasive is about 2Ω-cm or less. The conductive element 840 generally has a mechanical property that does not degrade under a continuous electric field, and can resist degradation in an acidic or alkaline electrolyte. The conductive element 84 can be maintained in the recesses 83 by mounting, clamping, adhesive or any other method. In one embodiment, the conductive element 840 has sufficient flexibility, elasticity, or flexibility to maintain electrical contact between the contact surface 850 and the substrate during the manufacturing process. The sufficient deflection, elastic or bendable material has a similar hardness to the conductive material 840 as compared with the abrasive material, and a hardness of about 100 or less. For polymer materials, a conductive anti-reflection conductive 7L piece 840 with a hardness similar to Xiao hardness D of about 80 or less can also be used. A flexible material, such as a fibrous material that can be bent or bent, can also be used as the conductive member 84. Can the conductive element 840 be more compliant? The material is more compliant to avoid the high local pressure caused by the conductive element 840 during grinding. As shown in Figures 8 Α and 8 Β, the conductive element 84 is embedded in an abrasive surface 81 placed on the element support portion or the sub-pad S15 in the embodiment. 〇. The 45 200520893 and other perforations 860 pass through the grinding surface 810 and the support portion 8 1 5 surrounding the conductive element 840. An example of the conductive element 840 includes coating a conductive material or a conductive filler with a dielectric or conductive fiber mixed with a polymer material, such as a polymer-based adhesive, for manufacturing the aforementioned conductive (and anti-wear) composite. . The conductive element 840 may also include a conductive polymer material or the aforementioned other conductive materials to improve electrical characteristics. Example: The conductive element includes at least a composite of conductive epoxide and at least one coated with gold and carbon or graphite filler on a nylon fiber (such as coating the nylon fiber with about ^ claw cobalt, steel or Nickel, and conductive fibers (about 2 μm gold on nylon fibers) to improve the conductivity of the composite, and the foregoing are set in the polyurethane body. FIG. 8D is a schematic cross-sectional view of another embodiment of an abrasive article 800 having a plurality of conductive elements disposed therein. The conductive element 84 may be generally provided with a coplanar contact surface, or may extend on a plane defined by the polishing surface 820. The conductive element 84 may include a conductive fabric 700 (as described above) and place, package, or wrap it around the conductive component 845. Alternatively, various conductive fibers and / or fillers can be placed, encapsulated, or wrapped around the conductive component 845. The conductive element 845 may include at least one metal, such as a noble metal as described above, or other conductive materials suitable for electro-grinding processes, such as copper. The conductive element 840 may also include a composite of the fabric and the aforementioned bonding material, wherein the fabric forms the outer contact portion of the conductive element 840, and the adhesive generally forms an internal support structure. The conductive element 84 may also include a hollow tube having a rectangular cross-sectional area, wherein the tube wall system 46 200520893 is formed of a hard conductive fabric 700 and a binding agent as described above.

A connector 890 is used to couple the conductive element 840 to a power source (not shown) to electrically bias the conductive element 840 during the manufacturing process. The connector 890 is generally a metal wire, tape, or other conductive fluid-compatible conductor, or has a cover or coating that protects the connector 8 90 from the effects of process liquids. The connector 890 may be coupled to the conductive element 840 by stamping, welding, stacking, brazing, clamping, crimping, riveting, fixing, conductive adhesive, or other means or components. Examples of materials that can be used in the connector 89 ° include insulated copper, graphite, titanium, platinum, alloy, τ #milk, stainless steel, and HASTELOY⑧ conductive materials and other suitable materials. The coating surrounding the connector 890 may include polymers such as carbon compounds, polyvinyl chloride (PVC), and polyimide. In the embodiment shown in Fig. 8A, a 'connector 890 can be connected to each conductive element 840 by the edge portion of the abrasive article 800. Alternatively, the connectors 890 may be provided through the body 810 of the abrasive object 800. In another embodiment, the connector 89 can be coupled to— 嗖

The conductive mesh grid (not shown) in the valley shoulder groove is electrically coupled to the conductive element 840 through the body. FIG. 9A illustrates another embodiment of an abrasive material 900. The abrasive material 900 includes a body 902 having one or more elements 904 disposed on an abrasive surface 906 and at least partially conductive. The conductive element 904 generally includes a plurality of fibers, cords, and / or bendable fingers that are bendable or retractable and are suitable for contacting a substrate surface simultaneously during the manufacturing process. These fibers are composed of a material that is at least partially conductive, for example, a fiber composed of a dielectric material coated with a conductive material 47 200520893. The fiber may also be solid or hollow in the natural state to reduce or increase the compliance or bendability of the fiber.

In the embodiment shown in FIG. 9A, the conductive elements 904 are coupled to the conductive sub-element 913 of a base 909. The conductive sub-element 913 includes the aforementioned at least partially conductive fibers. Examples of the sub-element 9 1 3 include a gold-coated nylon fiber or a carbon fiber (as described above). The base 909 also includes a conductive material and is coupled to a connector 990. The base 909 can also be coated with a layer of conductive material (such as copper), which can be dissociated by the polishing pad during grinding 'and it is generally believed that the layer of conductive material will prolong the processing time of the conductive fiber. The conductive element 904 is generally placed in a recess 908 formed in the ground surface 906. The conductive element 904 is oriented between 0 ° and 90 ° with respect to the ground surface 906. In these embodiments, the orientation of the conductive element 904 is perpendicular to the abrasive surface 906, and the conductive element 904 may be partially disposed on the abrasive surface 906.

The cavity 908 has a lower mounting portion 910 and an upper gap 912. The mounting portion 910 is configured to receive the base 909 ′ of the conductive element 904 and to install the base or other materials. The conductive element = the hollow portion 912 is provided in the recess 908 and the polished surface. _get along. The gap portion 912 is generally larger in cross section than the mounting portion 910, so that the electrical component 904 contacts a base to allow the X ^, Kouqu, and the grinding at the same time, without the need to provide the substrate and the grinding surface 906. Picture 9B; ^; Figure 7 is another embodiment of abrasive article 900, which has 48 200520893 conductive surface 940 and several separated conductive elements 920 formed therein. The conductive element 920 includes at least several dielectric material fibers coated with a conductive material, which are disposed vertically on the conductive surface 940 of the abrasive object 205 and are horizontally arranged with each other. The conductive element 920 of the abrasive article 900 is generally oriented to be between 0 and 90 degrees with respect to a conductive surface 940, and may be tilted in the direction of any pole relative to a line orthogonal to the conductive surface 940 ^ The conductive element 9 20 is formed over the length of the polishing pad (as shown in FIG. 9B), or it can be placed only in a selected area of the polishing pad. The contact height of the conductive element 920 on the abrasive surface may be approximately 5 mm. The diameter of the material including the conductive element 92 is between about 1 mil (one thousandth of an inch) and about j mil. The height of the grinding surface and the diameter of the conductive element 92 may be changed according to the grinding process performed. The conductive element 920 is flexible or elastic enough to deform under contact pressure, while maintaining electrical contact with the surface of a substrate, thereby reducing or minimizing traces on the surface of the substrate. In the embodiment shown in Figures 98 and 9B, the surface of the substrate can only contact the conductive element of the abrasive object 205. The conductive element is positioned to provide a uniform surface on the surface of the abrasive object 2G5. ，，， ～～ " Electrococcalidae, adhesives ,,, and adhesives are adhered to the conductive surface ^ ^ 介 ...; ^ conductive surface. The non-conductive cleavage agent can provide an "electric coating" to the conductive surface 94. It is provided in μ ^^ through the conductive surface 940 and any electrolyte on the edge of the ring-galvanic grinding W ^ contact surface 940 It may be a circular pad or a linear mesh or ribbon-shaped micro-object 205. A series of perforated 49 200520893 holes (not shown) can be noisy in the conductive surface 940 to provide electrolyte flow between them. Although not shown here, the conductive plate may be disposed on a support pad of a conventional abrasive material to position and process the abrasive article 900 on a rotary or linear polishing platform.

FIG. 10A is a schematic perspective view illustrating an embodiment of an abrasive object 1000 composed of a conductive element 1 (K) 4. Each conductive element 1004 generally includes a first end 1008 and a second end 10 including a loop or ring 1006 provided in a recess 1012 formed on the abrasive surface 1024. 1〇. Each conductive element 10 04 can be coupled to a bonding conductive element to form a plurality of loops 1006 extending above the abrasive surface 1024. In the embodiment shown in FIG. 10A, each loop 1006 is made of a fiber coated with a conductive material, and a tether base is stuck in the recess 1012. Linked by 1014. An example of the loop 1006 is a nylon fiber coated with gold.

The contact height of the loop 1006 above the contact surface is between about 0.5 mm to about 2 mm and the diameter of the material including the loop is between about 1 mil (one thousandth) Inches) to about 50 mils. The tether base 1014 may be a conductive material, such as titanium, copper, platinum, or copper-plated platinum. The wire base 1014 can also be plated with a conductive material, such as copper, which can be decomposed from the grindstone during grinding. The conductive material layer used by Xianxin on the line base 1014 can be used as a sacrificial layer to decompose the lower loop 1006 material or the line base 101 4 material to extend the conductive element 1004. Life. The 50 200520893 and other conductive elements 1004 can be oriented to be between 0 ° and 90 ° with respect to a ground surface 1024 and can be tilted in the direction of either pole relative to a line orthogonal to the conductive surface 1024. The conductive element 1004 is coupled to a power source through an electrical connector 1 030. FIG. 10B is a schematic perspective view illustrating another embodiment of an abrasive article 1⑽0 composed of a conductive element 1004. The conductive element 1004 includes at least a singular coil 1005 of a metal wire, which is composed of a fiber coated with a conductive material (as described above). The coil 1 005 is coupled to a conductive component 1007 provided on a base 1014. The coil 1005 can surround the conductive substrate, and a piece of clothing can be wound around the base 1014 or adhered to the surface of the base 104. The conductive strip may include at least a conductive material, such as gold, and generally includes a conductive material that does not facilitate chemical reactions, such as gold or titanium, and any electrolyte used in a grinding process, or a sacrificial material layer 100. 9 (such as copper) may be provided on the base 1014. The sacrificial material layer 1009 is generally a material having a higher chemical reactivity than the conductive component 1007, such as copper, so that the chemically reactive material is preferentially removed during the electric grinding or during the anode decomposition of the grinding process ( Compared with the material of conductive component 1 0 07 and coil 1 05). The conductive component 1007 can be coupled to a power source through an electrical connector 1030. A biasing member may be disposed between the conductive element and the body to provide a biasing force to force the conductive element away from the body and contact a substrate surface during grinding. An example of the biasing member 108 is shown in FIG. 10B. However, the present invention also covers the aforementioned conductive elements. For example, a biasing member can be used as shown in Figures 8 A-8D, 9A, 10A-10D. The biasing member is made of an elastomer 51 200520893 substance or device and can be a compression spring, a flat spring, a coil spring, a foamed polymer such as a foamed polyurethane (eg, PORON ® polymer), an elastomer, a bubble, or other component or device that can squeeze the conductive element. The biasing member can also be a flexible or elastic material, such as a flexible foam or an air-filled hose, which can be used to bias the conductive element to resist and improve the substrate surface φ during grinding. The biased conductive element may form a plane having a surface of the abrasive article or may extend above a plane of the surface of the abrasive article.

Fig. 10C shows a schematic perspective view of another embodiment of an abrasive article 1000. The abrasive article 1000 has a plurality of conductive elements 1004 arranged in a radial pattern from the center to the edge of the substrate. The conductive elements may be spaced 15 degrees, 30 degrees, 45 degrees, 60 degrees, and 90 degrees relative to each other, or a combination thereof. The conductive elements 1004 are generally spaced apart to provide a uniform current or power source to grind the substrate. The conductive elements can be further spaced to prevent contact with each other. A wedge-shaped portion 1 004 of a dielectric abrasive substance of the body 10 2 6 can be constructed to electrically isolate the conductive elements 1004. A spacer or recessed area 1060 is also formed in the abrasive object to space the conductive elements 1004 from each other. The conductive element 1004 may be in the form of a loop as shown in FIG. 10A or a vertically extending fiber as shown in FIG. 9B. Fig. 10D is a schematic perspective view illustrating an alternative embodiment of the conductive element 1004 of Fig. 10A. The conductive element 1 004 includes at least one woven mesh or fabric of interwoven conductive fibers 1 06 (as described above), and has a first end formed in the grinding surface 1024 and provided in the groove 12 And the second end 52 200520893 1010 'to form a continuous conductive surface for contacting the substrate. The web or fabric can be one or more layers of interwoven fibers. The woven mesh or fabric including at least the conductive element 1004 is illustrated in a single layer in the 10D drawing. The conductive element 10 04 may be coupled to a conductive base 1014 and may extend above the abrasive surface 1024 'as shown in FIG. 10A. The conductive element 1004 can be coupled to a power source through a plurality of electrical connectors 1030 connected to the conductive base 1014.

Figure 10E is a schematic partial perspective view showing another embodiment of the conductive element 1004. The conductive element 1004 has a body 1026 that can fix the conductive element to the abrasive. A channel 1050 is formed in the body 1024 of the abrasive and intersects the groove 1070 of the conductive element 1004. An insert 1055 is provided in the channel 1050. The insert 1055 includes a conductive material such as gold or the same material as the conductive element 1006. The connector 1 0 3 0 can then be placed in the channel 1055 and in contact with the insert 1055. The connectors 1030 can be coupled to a power source. An end portion 1075 of the conductive element 1004 may be in contact with the insert 105 to allow a current to pass therethrough. The end 1075 of the conductive element 1 004 and the connector 1030 are then fixed to the conductive insert 1055 by a dielectric insert 1060. The present invention also covers each cycle of providing the conductive element 1004 1006 is a spaced-apart channel along the length of the conductive element 1004, or a channel only on both ends of the conductive element 1004. Figures 11A-C are schematic side views illustrating the elastic capabilities of the loop or ring of the aforementioned series of conductive materials. An abrasive object 1100 includes at least an abrasive surface 111 provided on a sub-pad 1120 (formed on a pad support portion 1130 having a groove or groove 1140 therein). A conductive element containing at least a dielectric material loop or 53 200520893 ring 1 1 50 (which is also coated with a conductive material) 丨 4 2 is placed in one of the grooves 1170 on a base 1155 and communicates with an electrical Contact window 1145 is associated. The substrate 1160 is in contact with the abrasive article 11000 and moves relative to the surface of the abrasive article 1100. When the substrate contacts the conductive element 1142, the loop 115o will compress into the groove 1140 while maintaining electrical contact with the substrate 116o (as shown in Figure 11B when the substrate moves a sufficient distance to no longer contact When the conductive element 11 42, the elastic loop 1 150 will return to the uncompressed shape for another process, as shown in Figure 11C. A further example of a conductive polishing pad is described on December 27, 2001. US Patent Provisional Application No. 10/03 3,73 2, the entire contents of which are incorporated herein by reference.

In the foregoing description, the power source may be coupled to the abrasive object 205 by using a connector or a power transmitting element. The power transfer element is disclosed in more detail in US Patent Provisional Application No. 10 / 033,732, filed on December 27, 2001, the entire contents of which are incorporated herein by reference. Returning now to Figure 1 1 A-11 C, the power supply can be coupled to the conductive element 11 40 by using an electrical contact window 11 45, which includes the groove or groove 1170 (formed in Conductive pad or mounting portion of the polishing pad). In the embodiment shown in FIG. 11A, the conductive element 1140 is mounted on a metal plate (such as gold), and the metal plate is mounted on a support portion, such as a disc 206. Alternatively, the electrical contact window can also be provided on a grounding material between a conductive element and a ground material, such as between the conductive element 840 and the body 8 10 (as shown in Figures 8A and 8B). The electrical contact windows are then connected to a power source by wires (not shown), as shown in the figure above. Figures 12A-1 2D are schematic top and side views of an embodiment of an abrasive article having several extensions (not shown) connected to a power source. The power supply can provide current carrying capability, that is, the anode is biased to form a substrate surface for anodic decomposition in an ECMP process. The power source may be connected to the abrasive object by one or more conductive contact windows, wherein the contact windows are wound around the conductive abrasive part and / or the object support part of the abrasive object. One or more power sources may be connected to the abrasive through the one or more contact windows to form different bias or currents on the surface portion of the substrate. Alternatively, one or more wires may be formed in the conductive abrasive portion and / or the object support portion, and the wires are coupled to the power source. Figure 12A is an upper plan view of an embodiment of a conductive polishing pad, wherein the polishing pad is coupled to a power source through a conductive connector. The conductive polishing portion may have a plurality of expansion portions (eg, an arch, a separate plug) formed on the conductive polishing portion i 2 10, and the width of the conductive polishing portion is larger than the object support portion 1220. The expansion units are coupled to a power source through a connector 1225 to provide current to the abrasive object 205. In FIG. 12b, the expansion portion 1215 may be formed to extend parallel or laterally from the plane of the conductive polishing portion 1210 and extend beyond the diameter of the polishing support portion 1220. The pattern of the perforations and grooves is shown in FIG. FIG. 12B is a schematic cross-sectional view of an embodiment of a connector 1225, t 55 200520893 The connector 1 2 2 5 is connected to a power source (not shown 1232, the electrical connector is electrically coupled to the expansion can also be coupled) It can be used to fix the object 1 230. Several grinding parts 1 2 1 0 and the solid 1236 can contain at least 1234, and the distance such as gold, titanium, and titanium liquid reacts, for example. Although this embodiment also includes conductivity FIG. 12C is an example of a fixed object 1240 of one of the tables or discs 206 1 2 2 5, and the conductive object 1 242 of the charging part 1 2 1 5 may be provided on the supporting part and formed on the supporting part. Alternatively, an electrical object is provided on the solid body and coupled through a conductive path 1 232 (eg, a metal wire). The connector includes a conductive grinding part 121o connected to the conductive circuit scale 1234 and a conductive fixing part 1230 (such as a screw) filling part 1215. Bolt 12 "A conductive solid spacer 1 2 3 6 fixing the conductive abrasive portion 1210 therebetween, such as a washer, may be provided between the conductive material 1 230 and the bolt 1 23 8. The spacers-a conductive Material. The fixture 1230, the electrical connector 1236 and the bolt 1 238 can be made of conductive materials, such as copper or copper. If the material (such as copper) will be electrolyzed with the material used, the material can be covered with a passive state with the electrolyte The material is not shown here, and the conductive fixture can be replaced by a solid clamp, a conductive adhesive tape, or a conductive adhesive. A support 1260 (such as a flat upper surface shown in FIG. 2) is coupled to a power source A schematic cross-sectional view of a connector (not shown). The connector 1225 includes at least one screw or bolt, which has a length sufficient to pass through the enlarged grinding portion 1 2 1 0 to couple the support portion 2 60. A space between the conductive grinding part 1210 and the fixing object 1240. It is generally applicable to receive the fixing object 1 2 4 0. The aperture 1 2 4 6 can accept the fixed coupling shown in FIG. 12C in the surface of 60 mm A fixed object 1240 coupled with a supporting part 1260 and the conductive research can be borrowed Room 1210. The support 56 200520893 Department 1 2 6 0 can be connected to a power source by a conductive path 1 2 3 2 (such as a metal wire), or connected to a ground platform or processing room, or integrated in 1. The power of the grinding platform or processing chamber to provide electrical connection with the conductive grinding portion 1210. The conductive path 1232 may be integrated with the support portion 1260 or extended from the support portion 1260 (as shown in FIG. 12B) ). In a further embodiment, the fixing object 1240 may be one of the supporting portion 1260 (which extends through the conductive grinding portion 215 and is fixed by a bolt 1248, as shown in FIG. 12D). Φ Figures 12E and 12F show a side outline and an exploded perspective view of another embodiment for supplying power to an abrasive object 1270. The abrasive object 1 270 has a power connector 1285 provided between a abrasive part 1280 and an object support part 1290 The grinding part 1280 may be made of a conductive abrasive material as described above, or may include several of the aforementioned conductive elements 1 275. The conductive elements 1275 may be physically insulated from each other, as shown in FIG. 12F. The Formed in the abrasive surface The conductive element 1 275 is suitable for electrically contacting the electrical connector 1285, for example, through a conductive base of the component. Φ The electrical connector 1285 may include at least one metal interconnecting element 1275, and a plurality of interconnecting lines. The parallel metal wire of element 1275, the metal wires of a plurality of independent connection elements 1275, or the metal wire of a connection element 1275 to one or more power woven mesh interconnecting elements. The independent power supply coupled to the independent metal wires and elements can be · With different applied power sources, these inline metal wires and components can provide uniform power to these components. The power connector 2 8 5 can cover part or all of the diameter or width of the abrasive. The 200512893 connector in Figure 1 2F is a metal wire braid of a connection element 1 2 5 5. It is an example of a connection element in a network. The electrical coupler 1 2 8 5 can be connected to a power source via a conductive path 1 2 8 7 (such as a metal wire), or to a ground or processing room, or integrated into a grinding platform or processing room. A power source for providing electrical connection with the conductive polishing portion 1210. Abrasive elements in abrasive surfaces

13A-B are top and cross-sectional views of another embodiment of the conductive object 1400. The conductive object 1400 includes a plurality of abrasive features extending from a polishing surface 1402 of a conductive portion 1404 of the conductive object 1400. The abrasive feature may be abrasive particles (refer to FIG. 3), or may be an insignificant abrasive element 1406 shown in FIGS.

In one embodiment, the grinding element 1406 is a rod-shaped object received in each of the slots 1408 (formed in the grinding surface 142 of the conductive object 1400). The grinding element 1406 generally extends from the grinding surface 1402, and is configured to remove the passive layer of the metal surface of the substrate being polished, thereby exposing the underlying metal to the electrolyte and electrochemical activities to facilitate the manufacturing process. The grinding rate is increased during this period. The grinding element 1406 is formed of a sufficiently strong material such as ceramic, inorganic, organic, or polymer materials to destroy the passive layer formed on the metal surface. An example is a rod or bar made of a conventional abrasive pad, such as a polyurethane abrasive pad provided on the conductive object 1400. In the embodiment shown in Figures 13A-B, the grinding element 14 0 6 may have a flute hardness D of at least about 30 degrees, or sufficiently hard to wear away a passivated layer of material in the grinding. In an implementation of 58 200520893, the grinding element 1406 is harder and more elastic than copper, and the polymer particles can be solid or

1404) 〇 The grinding element 1 406 can be configured to have different geometries, or

Grid, parallel and center or other directions can also be used. In one embodiment, an elastic element 1410 may also be disposed in each of the slots 1408 located between the grinding element 1406 and the conductive portion 1404. The elastic element 1410 allows the abrasive element 1406 to move relative to the conductive portion 1404 'to provide higher flexibility to the substrate to uniformly remove the passive layer during grinding. In addition, the flexibility of the elastic element 丨 41 can be selected to adjust the relative pressure applied to the substrate by the abrasive element 1406 and the abrasive surface 1402 of the conductive portion 1404 to balance the removal of the passive layer The rate of formation of the passive layer allows the abrasive metal to be minimally exposed to the abrasive element 1406 and minimizes possible scratches. Conductive spheres extending from a ground surface. Figures 14A-B are top and cross-sectional views of an alternative embodiment of a conductive object 1500. The conductive object 1500 includes a plurality of conductive rolling objects 1506 that extend from the abrasive surface 1502 of an upper portion 1504 of one of the conductive objects 1500. During grinding, the rolling objects 1506 can be forced downward by the substrate to the same plane of the grinding surface 1502. The conductive rolling object embedded in the conductive object 1500 is 200520893, and the solid-state rolling process is periodically performed at 04-15, and the above-mentioned source is external to the electrical phase part. 06 1 material 15 to the base Coupling Rolling rate Electricity Electricity Conductivity High Divide this to move High or free to roll. The conductive rolling object 1 506 may be a sphere, a cylinder, a pin, an ellipsoid, or other shapes that will not scratch the substrate during the manufacturing process. In the embodiment shown in FIG. 14B, the conductive rolling element 1506 is a plurality of spheres provided in one or more conductive carriers 1 520. Each conductive carrier 1520 is disposed in a slot 1508, and the slot is formed in the abrasive surface 1502 of the conductive object 1500. The conductive rolling element 15 06 is generally extended from the abrasive surface 'and is configured to provide electrical contact with the metal surface of the substrate. The conductive roller 1506 may be formed of any conductive material, or formed of a core 1 522 at least partially coated with a conductive cover layer 1 525. In the embodiment shown in FIG. 14B, the conductive rolling element 1506 has a polymer core 1522, which is at least partially coated with a soft conductive material 1524. One example is a TORLONtm polymer core coated with a conductive gold layer with copper as the seed layer between TORLONtm and the gold layer. In one embodiment, the polymer core 1 522 may be selected from an elastic material, such as polyurethane, which deforms when the rolling material 1 506 contacts the substrate during grinding. When the rolling object 1506 is deformed, the contact area between the rolling object 1506 and the substrate is increased, so the current flow between the rolling object 1506 and the conductive layer can be improved, thereby improving the grinding result. The conductive rolling objects 1506 can be arranged in different shapes or randomly arranged on the polished surface. In one embodiment, the conductive rolling element 1506 can be arranged radially on the grinding surface 1502 of 200520893. However, other directions such as spiral, grid, parallel and center or other directions can also be used.

In the embodiment shown in FIG. 14B, an elastic component 1510 can be disposed in each slot 1508 between the conductive carrier 1520 and the conductive portion 1504. The elastic component 1510 can move the conductive rollers 1 506 (and the carrier 1520) relative to the conductive portion 1504, thereby providing better flexibility to the substrate and performing more uniform electricity during grinding. Sexual contact. A contact window (not shown) may also be formed in the conductive object 1 500 (refer to FIG. 7F) to facilitate process control. Fig. 15 is a cross-sectional view of another embodiment of a conductive object 1600. The conductive object 1600 generally includes a conductive portion 1602 suitable for contacting a substrate during grinding, an object supporting portion 1604, and an insertion pad 1606 sandwiched between the conductive portion 1602 and the object supporting portion 1604. The conductive portion 1602 and the material selection portion 1604 can be configured similarly to any of the foregoing embodiments or their equivalents. An adhesive layer 608 may be provided on each side of the insertion pad 1606 to transfer the insertion pad 1606 to the object support portion 1604 and the conductive portion 1602. The conductive part 1 602, the material support # 部 1 604, and the insertion pad 1606 can be coupled by several replacement methods, so that the components of the conductive object 1 600 can be more easily replaced with a single unit after the end of its service life. , Simplify the replacement, inventory and order management of the conductive object 1600. Alternatively, the supporting portion 1604 may be coupled to an electrode 204 and replaced with the conductive object 1600 to form a single single-open. Push & flat 70 The conductive object 61 200520893 1600 (optionally including the electrode 204) may also include a contact window formed therebetween, as shown in the aforementioned FIG. 7F.

The insert 塾 1 606 is generally harder than the abrasive support portion 1604, and is harder or harder than the conductive portion 1602. The present invention also covers that the insertion pad 1 606 may be softer than the conductive portion 1602. The hardness of the insertion pad 1606 is selected to provide rigidity to the conductive object 1660, so that the mechanical life of the conductive portion 1602 and the support portion 1604 can be extended, and the conductive object 1600 is improved. The 'wetness' results in a higher levelness of the ground surface. In one embodiment, the insertion pad 1606 has a hardness of less than or equal to the Xiao hardness d value of about 80. The object supporting portion 1604 has a hardness of less than or equal to the Xiao hardness a value of about 80, and the conductive portion 1602 has a hardness of less than or equal to a flute hardness of about 100. In another embodiment, the insertion pad 1606 has a thickness of less than or equal to 35 mils, and the object support portion 160 has a thickness of less than or equal to about 100 mils.

The insertion pad 1606 can be made of a dielectric material so that an electrical path can be established through the layers. The layer includes at least the conductive object 1600 (that is, the conductive part 1602, the insertion pad 1606, and the object support Stack of parts 1604). The electrical path can be established by immersing the conductive object 1600 or covering it with a conductive fluid (such as an electrolyte). To facilitate the establishment of an electrical path through the conductor 1600, the insertion pad 1606 may be at least of a permeable or permeable nature to allow electrolyte to flow therethrough. In one embodiment, the insertion pad 16 06 is made of a dielectric material (compatible with electrolytic liquid and electrochemical processes). The so-called compatible materials include polymers, such as polyurethane, polyester, polyester film, ethylene oxide, and polycarbonate fibers and the like. Alternatively, a conductive backing 1616 may be provided between the insertion pad 1606 and the conductive portion 1602. The conductive backing 丨 6 丨 〇 is generally equal to the potential across the conductive portion 1602, thereby improving the grinding uniformity. The same potential on the ground surface of the conductive portion 1602 can ensure good electrical contact between the conductive portion 1602 and the ground conductive material, especially when the conductive material is a residual material and is no longer a continuous layer Time (ie, islands of residual film). In addition, the conductive backing 1610 can provide mechanical strength of the conductive portion 1602, thereby increasing the service life of the conductive object 1600. The use of the conductive backing 1610 is of great benefit to these embodiments (such as the mechanical integrator through which the resistance of the conductive portion is greater than about 500 m-ohms and the conductive portion 1602 is enhanced). The conductive backing 1610 can also be used to improve the uniformity of the conductivity and reduce the resistance of the conductive portion 1 602. The conductive backing 1610 can be made of metal foil, metal sieve, metal-coated woven or non-woven fabric, and other suitable conductive metals that are compatible with the grinding process. In one embodiment, the conductive backing i 6 i 0 is stamped to the conductive portion 1602. The backing 1610 is configured so as not to affect the flow of the electrolyte between the conductive portion 1604 and the insertion pad 1 606. The conductive portion 1602 can be mounted on the conductive backing 1610 through stamping, lamination, injection molding, and other appropriate methods. FIG. 16 is a cross-sectional view of another embodiment of a conductive object 1700. The conductive object 1700 generally includes a conductive portion 1620 'which is suitable for contacting a substrate during grinding, a conductive backing 1610, an object supporting portion 1604 and an insert 63 200520893 pad 1 706, sandwiched between the conductive portion 1602 and the object supporting portion 1604 in a sandwich manner, and has a structure similar to the foregoing conductive object 1600.

In the embodiment shown in Fig. 16, the insertion pin 1706 is made of a material having a plurality of cells 1708. These chambers 1 708 are generally filled with air or other fluids and provide elasticity and compliance to enhance the process. These cells can be opened or closed in a size range between 0.1 micrometers and several millimeters, such as between 1 micrometer and 1 millimeter. The invention also covers other dimensions suitable for use with the insert pad 1706. The insertion pad 1706 may be at least permeable or permeable to allow electrolyte to flow therethrough. The insertion pad 17 06 may be made of a dielectric material compatible with the electrolyte and electrochemical processes. Suitable materials include, but are not limited to, foamed polymers (such as foamed polyurethane and polyester films). The insertion pad 1706 generally has a smaller compressibility than the object supporting portion or the auxiliary pad 1640, and has the characteristics of local independent deformation when under pressure.

FIG. 17 is a cross-sectional view of another embodiment of a conductive object 1800. The conductive object 1800 includes a conductive portion 1802 coupled to an object support portion 1804. Alternatively, 'the conductive object 1800 may include an insertion pad and a conductive backing (neither of which is shown in circle) provided between the conductive portion 1802 and the object supporting portion 1804. The conductive object 1 800 generally includes several penetrating apertures 1860, so that the electrolyte or other process fluid can pass through the conductive portion 1802 to grind the surface 1 808 above the conductive portion and the mounting surface below the support portion 1 804. between. Each of these apertures 1806 intersects with the upper abrasive surface 1808. The edge 1812 is defined as 64 200520893. 'A rounded corridor to eliminate any possible biting, burrs or surface irregularities. Parts, grooves, cones, or other structures that can be reduced. During the process, the sharp angle of the scratched substrate may include the edge of the edge 1 8 1 2 and smooth the edge 1 8 1 2 and promote the mark to the conductive part 1 8 0 2 In the examples formed by a polymer, 'slip the edges i 8 i 2 can be used by y before the polymer is fully cured

The way in which the pore diameter is 1 800 is formed. Tian Yi M ^ Hearing, therefore, these edges 1 8 12 in the remaining

Polymer ring curing period per horse: Road φ ^, Tian μ conductive port p 1 8 0 will become rounder when shrinking. Additionally or alternatively, the edges 1812 may be rounded by applying at least one of heat or pressure during or after the heat treatment. In the example 7, the edges 1812 can be polished, heated, or flame-treated to round off the transition between the abrasive surface 1 8 08 and the aperture 8 0 6 at the edge 8 8.

In another example, a polymer conductive part 〇2 can be made of a plastic material that repels a casting mold or a steel mold. The repulsive nature of the conductive part of the polymer 丨 8 〇 2 can form a surface tension, so that the stamped stress applied to the conductive part of the polymer 8 0 2 can remove the material from the scale mold, thereby making the apertures 1 The edge of 8 0 6 1 8 1 2 is rounded when cured. The apertures 1806 may be formed through the conductive object 1800 before or after assembly. In one embodiment, the aperture 1 806 includes a first hole 1814 formed in the conductive portion 1802 and a second hole 1 8 1 6 formed in the object support portion 1804. In the embodiments including an insertion pad, the second hole 18 1 6 is formed therein. Alternatively, at least one of the first hole 1 8 1 4 and the second hole 1 8 1 65 65200520893 has a large one of the second hole having the conductive moment and the center 1 802 has a relatively large pad damage to the conductive layer. In one embodiment, one row of perforations is performed after mechanical perforation of the insertion layer. Therefore, all of the above are used to promote the configuration to minimize the manufacturing process. Although and further, the patent scope can be formed in the conductive portion 1802. The diameter of the first hole 1 8 1 4 is the diameter of the second hole 1 8 1 6. Below the first hole 1 8 1 4 the smaller diameter of the hole 1 8 1 6 can provide lateral support around the first hole 丨 8 i 4 section 1 802 to improve the pad shear and resistance during grinding. Therefore, the pore diameter 1806 including a larger hole at the surface 1 808 (which is connected with the smaller hole below) will cause small deformation of the conductive portion, and at the same time minimize particle formation, and therefore minimize the substrate caused. defect. These apertures in electrical appliances can be formed by mechanical means (such as male / female perforation before or after). At one, the stamper system of the conductive part 1802 on the conductive backing is first installed, and the conductive part 1802 with the conductive backing and the insertion layer are perforated together. Starting calibration. In another embodiment, all layers are put together. The present invention also covers any other perforation techniques and sequences. Various embodiments of conductive materials suitable for electrochemical polishing of substrates are proposed. The conductive material can provide good compliance to the surface of the substrate, and evenly contact the surface to improve the abrasive surface. In addition, the conductive material is reduced in the scratches during the manufacturing process, which effectively reduces the occurrence of defects and can reduce costs. The foregoing is a description of various embodiments of the present invention, but other embodiments of the present invention can also be made without departing from the scope of the present invention and the scope defined by the following applications.

66 200520893 [Brief description of the drawings] Therefore, the aspects described in the present invention can be more easily understood through the illustrations. For a brief description of the content described above, a clearer description can be obtained by referring to its embodiments and additional illustrations Way to get more detailed explanation.

It should be noted, however, that the figures shown are typical embodiments of the invention and therefore should not be considered as limiting the scope of the invention, as the invention may have other equivalent embodiments. Figure 1 is a plan view of an embodiment of the processing equipment of the present invention; Figure 2 is a sectional view of an embodiment of an ECMP station; Figure 3 is a partial sectional view of an embodiment of the abrasive article; An upper plan view of an embodiment of a grooved abrasive article; FIG. 5 is an upper plan view of another embodiment of the grooved abrasive article; and FIG. 6 is an illustration of another embodiment of the grooved abrasive article. Upper plan

Figure 7A is a plan view of a conductive fabric or fabric described herein; Figures 7B and 7C are partial cross-sectional views of an abrasive article having an abrasive surface, wherein the abrasive surface includes at least one conductive fabric or fabric; 7D The figure is a partial cross-sectional view of an embodiment including an abrasive article of a metal foil; FIG. 7E is another embodiment of an abrasive article including at least a fabric material; 67 200520893 FIG. 7F is a diagram with a window formed Another embodiment of the abrasive article therein; FIGS. 8A and 8B are schematic diagrams of an embodiment and a sectional view of an abrasive article having a conductive element, respectively; and FIGS. 8C and 8D are diagrams each having a conductive element A schematic diagram of the upper and cross sections of one embodiment of an abrasive article; Figures 9A and 9B are perspective views of other embodiments of an abrasive article having a conductive element; and Figure 10A is another embodiment of an abrasive article Partial perspective view; Figure 10B is a partial perspective view of another embodiment of an abrasive article; Figure 10C is a partial perspective view of another embodiment of an abrasive article; Figure 10D is another embodiment of an abrasive article Part of Figure 10E is a partial perspective view of another embodiment of an abrasive article; Figures 11A-11C are schematic side views of one embodiment of a substrate in contact with an abrasive article described herein Figures 1 2A-1 2D are schematic top and side views of an embodiment of an abrasive article, where the abrasive article has several extensions connected to a power source; Figure 13 AB is another embodiment of a conductive article Figs. 14A-B are top and cross-sectional views of another embodiment of a conductive object; Figs. 15-17 are cross-sectional views of an alternative embodiment of a conductive object; Fig. 18 is A plan view of one embodiment of an electrode. In order to facilitate understanding, the same reference numerals are used in each drawing to indicate 68 200520893 showing the same components. 〇 [Description of the main component symbols] 100 Processing equipment 102 Electrochemical mechanical polishing station 104 Measuring device 106 Grinding station 108 Base 110 Conveying station 112 Turret 114 Substrate 116 Loading robot arm 118 Substrate storage box 120 Factory interface 122 Cleaning module 124 Delivery buffer station 126 Output buffer station 128 Loading cup assembly 130 Grinding head 132 fm Sending robot arm 134 Hole 138 Arm 140 Control 142 CPU 144 Memory 146 Supporting circuit 150 Power supply 202 Mounting plate 204 Electrode 205 Abrasive object 206 Disk 210 Bottom 212 Shaft 214 Drain channel 216 Hole 218 Seal 220 Electrolyte 222 Channel 224 Motor 232 Volume 233 Container 234 Hole 240 Filter 242 Pump 244 Supply pipe 69 200520893 252 Central section 254 Skirt 258 Depression 270 Nozzle 2 72 Fluid delivery system 3 10 Grinding surface 320 Bottom pad portion 350 Perforation 360 Abrasive particles 370 Above grinding surface 440 Round pad 442 Groove 446 Perforation 448 Grinding surface 540 Grinding pad 542 Groove 544 Grinding pad 546 Perforation 548 Abrasive object 550 Inner diameter 640 Abrasive material 642 Groove 644 Grinding pad 645 Groove 646 Perforation 648 Abrasive material 650 Outer diameter 700 Fabric 710 Interwoven fabric 720 Vertical 730 Horizontal 740 Channel 750 Perforation 780 Metal foil 790 Conductive bonding agent 792 Lower layer 794 Upper layer 796 Polishing Surface 798 Fabric 800 Abrasive 810 Body 815 Vice pad 820 Grinding surface 830 Dimple 840 Conductive element 845 Conductive component 850 Contact surface 860 Perforation

70 200520893 870 Cross pattern 900 Abrasive material 904 Conductive element 908 Dimple 9 1 0 Mounting part 9 1 3 Conductive sub-element 940 Conductive surface 1 004 Conductive element 1006 Loop 1 008 First end 1010 Second end 1 0 1 4 series wire Base 1 024 polished surface 1 030 connector 1055 channel I 070 groove 1100 abrasive II 2 0 sub-mat 1 140 groove 1145 electrical contact window 1155 series base 1170 groove 1 2 1 5 extension 1 225 connector 8 7 5 pitcher 902 body 906 grinding surface 909 base 9 1 2 void portion 920 conductive element 1000 grinding object 1005 coil 1007 conductive component 1009 second end 1 0 1 2 recess 1 0 1 8 biasing member 1026 body 1 050 channel I 060 Insert 1075 End 1110 Polished surface II 3 0 Pad support 1142 Conductive element 11 50 loops 1160 Base material 1210 Conductive polishing part 1220 Polished support 1 230 Conductive fixture

71 200520893 1 2 3 2 Conductive path 1 2 3 6 Spacer 1240 Fixing 1 2 7 0 Grinding object 1 2 8 0 Grinding part 1 2 8 7 Conducting path 1400 Conducting object 1 4 0 4 Conducting part, 1408 Slot 1 5 0 0 conductive object 1 5 04 upper part 1 5 1 0 elastic component 1 5 2 2 core 1 6 0 0 conductive object 1604 object support 1 6 0 8 adhesive layer 1 7 0 0 conductive object 1708 nest 1 8 04 object support Part 1 8 1 2 Edge 1 8 1 6 Second hole 1904 Common center area 1 9 1 0 Power 1234 electrical connector 1 23 8 Bolt 1260 support 1 2 7 5 Conductive element 1 2 8 5 Electrical connector 1290 Physical support 1402 Grinding surface 1406 Grinding element 1 4 1 0 Elastic element 1 502 Grinding surface 1 5 06 Roller 1 520 Conductive carrier 1 524 Soft conductive material 1602 Conductive part 1606 Insertion pad 1 6 1 0 Conductive backing 1706 Insertion pad 1 800 Conductive Object 1 806 Aperture 1 8 1 4 First hole 1902 Concentric area 1 906 Concentric area

72

Claims (1)

200520893 Patent application scope: 1. An abrasive for treating a substrate, comprising at least: a fabric layer; and a conductive layer, which is placed on the fabric and has an exposed surface for polishing a substrate. 2. The abrasive article according to item 1 of the scope of patent application, wherein the fabric further comprises at least: a woven material. 3. The abrasive according to item 2 of the scope of patent application, wherein the woven material is at least one of coated with a soft conductive material or made of a soft conductive material. 4. The abrasive according to item 3 of the scope of the patent application, wherein the soft conductive material is composed of gold, tin, bar, εε-tin alloy, starting, boat, and metal alloy, and a ceramic composite that is softer than copper. Selected from the group. 5. The abrasive according to item 1 of the patent application scope, wherein the fabric further comprises at least a non-woven material. 6. The abrasive article according to item 1 of the scope of the patent application, wherein the conductive layer further includes at least: 73 200520893 soft metal, which is made of gold, tin, tin alloy, metal, alloy, and softer copper The group of ceramic composites makes at least one selected. 7. The abrasive according to item 1 of the scope of patent application, wherein the conductive layer further comprises at least a modulus and a hardness less than that of copper. 8. The abrasive article according to item 1 of the scope of patent application, wherein the exposed surface of the conductive layer has a flatness of less than or equal to about positive or negative 1 mm and a surface roughness of less than about 500 microns. 9. The abrasive article according to item 1 of the scope of patent application, wherein the conductive layer further includes at least: a plurality of abrasive particles disposed therein. 10. The abrasive article according to item 1 of the scope of patent application, wherein the conductive layer further comprises at least: a convex surface. 1 1. The abrasive article according to item 1 of the scope of patent application, wherein the conductive layer further comprises at least: a plurality of through holes penetrating therethrough. 74 200520893 1 2. The abrasive article according to item 1 of the scope of patent application, further comprising at least: a window, which penetrates the conductive layer and the fabric layer. 1 3. The abrasive article according to item 12 of the scope of patent application, wherein the window further comprises at least: a transparent material provided in at least one of the conductive layer or the fabric layer. 14. The abrasive article according to item 1 of the scope of patent application, further comprising at least: an object support layer made of a dielectric material having a hardness less than that of the conductive layer; and an insert layer, which is Coupled between the object support layer and the conductive layer, the hardness of the insertion layer is greater than the hardness of the object support layer. 15. The abrasive article according to item 14 of the scope of the patent application, wherein the insertion layer has a hardness less than or equal to about 80 Hardness D; wherein the conductive layer has a hardness less than about 80 Hardness D And wherein the support layer has a hardness less than or equal to about 80 A hardness. 16. The abrasive article according to item 14 of the scope of patent application, wherein the interposer further comprises at least one polymer material. 1 7. The abrasive article according to item 1 of the scope of patent application, further comprising: 75 200520893 a conductive backing, which is coupled to a fabric layer opposite to the conductive layer. 1 8. The abrasive article according to item 1 of the scope of patent application, further comprising: 袅 an electrode coupled to a fabric layer opposite to the conductive layer. 19. The abrasive article according to item 18 of the scope of the patent application, wherein the electrode further comprises at least: a plurality of regions that can be electrically biased independently. φ 2 0. The abrasive according to item 1 of the scope of patent application, which further comprises at least: a plurality of spheres which partially extend above the exposed surface of the conductive layer; and a soft conductive material which is at least Partially covering such spheres. 2 1. The abrasive according to item 20 of the patent application, wherein at least one of the spheres has a polymer core. 22. The abrasive article according to item 1 of the patent application scope, wherein the conductive layer further comprises at least: a polymer matrix having a conductive material provided therein. I 23. The abrasive according to item 22 of the scope of the patent application, wherein the conductive material 76 200520893 is made of gold and copper than 24. If applying for special materials is tin-clad copper cladding 25. If applying for hardness of special materials 26. If you ask for more than at least several lead and at least lead, 27. If you want for more than at least 〆 carbon-based 28 > Apply for the following materials for nano tube: conductive fiber, tin, handle, handle- Among the group consisting of tin alloys, platinum, lead and metal alloys made of soft ceramic composites, the abrasive material described in item 22 of the scope of interest, wherein the conductive material is used, and wherein the fabric layer further includes: The abrasive article according to Item 22, wherein the conductive material and the modulus are less than or equal to the hardness and modulus of copper. The abrasive article according to item 22 of the present invention, wherein the conductive material includes: electric particles, which include gold, tin, aluminum, titanium-tin alloy, and platinum. The conductive material includes: a material. The abrasive article according to Item 22, wherein at least one of the conductive materials: conductive particles, carbon powder, carbon fiber, carbon liangnan foam, carbon aerogel, graphite, Conductive polymers, dielectric materials or conductive 77 200520893 Conductive particles coated with materials, dielectric filler materials coated with conductive materials, conductive inorganic particles, metal particles, conductive ceramic particles, and combinations thereof. 29 · —An abrasive for treating a substrate, comprising at least: a conductive layer having a grinding surface suitable for grinding on a substrate; a support layer made of a material having a hardness less than that of the conductive layer Made of a hard dielectric material; an insertion layer 'is connected between the object support layer and the conductive layer, and the hardness of the insertion layer is greater than the hardness of the object support layer; and several apertures, which are Through the conductive layer, the insertion layer and the physical support layer, at least one of the apertures has a first hole formed on the upper surface of the conductive layer and a second hole formed below it, wherein the first hole has A diameter larger than the second hole. 30. The abrasive article according to item 29 of the scope of patent application, wherein the conductive layer further comprises at least: an abrasive layer adapted to grind a substrate thereon, and the abrasive layer comprises at least one polymer disposed on a polymer Conductive material in the binder. 31. The abrasive article as described in item 30 of the Shenyan patent scope, further comprising at least: ** a plurality of abrasive particles provided in the polymer binder. 32. The abrasive article according to item 30 of the scope of patent application, wherein the conductive layer 78 200520893 further includes at least: a fabric layer disposed under the abrasive layer. 3 3. The abrasive according to item 29 of the scope of patent application, further comprising: an electrode having a plurality of regions that can be independently biased. 34. The abrasive article according to item 33 of the scope of patent application, wherein the conductive layer, the object support layer and the electrode are formed in a single replaceable component. 35. A kind of abrasive for processing a substrate An object includes at least: a conductive layer having a grinding surface suitable for grinding on a substrate; an object supporting layer made of a dielectric material having a hardness less than that of the conductive layer; An insert layer is coupled between the object support layer and the conductive layer, and the hardness of the insert layer is greater than the hardness of the object support layer; an electrode is coupled to the object support layer opposite to the insert layer. And a window penetrating the electrode, the conductive layer, the insertion layer, and the object support layer, wherein the electrode, the conductive layer, the insertion layer, and the object support layer can form a single replaceable unit. 3 6. The abrasive article as described in item 35 of the scope of patent application, further comprising at least: 79 200520893 several apertures, which pass through at least one of the conductive layer, the insertion layer and the object support layer, and the At least one of the isopores has a first hole formed in the conductive layer, a second hole formed in the insertion layer, and a third hole formed in the object support layer, wherein the first hole The diameter is larger than the diameter of the second hole. 37. The abrasive according to item 36 of the scope of patent application, wherein the electrode further comprises: at least several regions that can be electrically biased independently. 38. The abrasive article according to item 36 of the scope of patent application, wherein the conductive layer further comprises at least: a first layer provided on the support layer of the object; and a second layer including at least A conductive material in a polymer matrix, and the second layer is disposed on the first layer. 39. The abrasive article according to item 38 of the scope of the patent application, wherein the conductive material is a ceramic composite made of gold, tin, Is, ε-tin alloy, alloy, metal alloy and copper, which is softer than copper Select from the group. 80