WO2004094764A3 - Low cost capacitors manufactured from conductive loaded resin-based materials - Google Patents
Low cost capacitors manufactured from conductive loaded resin-based materials Download PDFInfo
- Publication number
- WO2004094764A3 WO2004094764A3 PCT/US2004/011860 US2004011860W WO2004094764A3 WO 2004094764 A3 WO2004094764 A3 WO 2004094764A3 US 2004011860 W US2004011860 W US 2004011860W WO 2004094764 A3 WO2004094764 A3 WO 2004094764A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- conductive
- fiber
- loaded resin
- combination
- conductive loaded
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Capacitors are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of nonmetal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like. The conductive loaded resin-based capacitors can be formed using methods such as injection molding compression molding or extrusion. The conductive loaded resin-based material used to form the capacitors can also be in the form of a thin flexible woven fabric that can readily be cut to the desired shape.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US46336203P | 2003-04-16 | 2003-04-16 | |
| US60/463,362 | 2003-04-16 | ||
| US47877203P | 2003-06-16 | 2003-06-16 | |
| US60/478,772 | 2003-06-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2004094764A2 WO2004094764A2 (en) | 2004-11-04 |
| WO2004094764A3 true WO2004094764A3 (en) | 2005-09-15 |
Family
ID=33313438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US2004/011860 WO2004094764A2 (en) | 2003-04-16 | 2004-04-16 | Low cost capacitors manufactured from conductive loaded resin-based materials |
Country Status (1)
| Country | Link |
|---|---|
| WO (1) | WO2004094764A2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB201002038D0 (en) | 2010-02-09 | 2010-03-24 | Bae Systems Plc | Electrostatic capacitors |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07162220A (en) * | 1993-12-08 | 1995-06-23 | Furukawa Electric Co Ltd:The | Antenna module |
| US20030124259A1 (en) * | 2001-10-05 | 2003-07-03 | Kodas Toivo T. | Precursor compositions for the deposition of electrically conductive features |
| US20040031690A1 (en) * | 1997-04-17 | 2004-02-19 | Sekisui Chemical Co., Ltd. | Conductive particles and method and device for manufacturing the same, anisotropic conductive adhesive and conductive connection structure, and electronic circuit components and method of manufacturing the same |
-
2004
- 2004-04-16 WO PCT/US2004/011860 patent/WO2004094764A2/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07162220A (en) * | 1993-12-08 | 1995-06-23 | Furukawa Electric Co Ltd:The | Antenna module |
| US20040031690A1 (en) * | 1997-04-17 | 2004-02-19 | Sekisui Chemical Co., Ltd. | Conductive particles and method and device for manufacturing the same, anisotropic conductive adhesive and conductive connection structure, and electronic circuit components and method of manufacturing the same |
| US20030124259A1 (en) * | 2001-10-05 | 2003-07-03 | Kodas Toivo T. | Precursor compositions for the deposition of electrically conductive features |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2004094764A2 (en) | 2004-11-04 |
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