WO2004092672A3 - Amorphous carbon layer for heat exchangers - Google Patents
Amorphous carbon layer for heat exchangers Download PDFInfo
- Publication number
- WO2004092672A3 WO2004092672A3 PCT/US2004/010619 US2004010619W WO2004092672A3 WO 2004092672 A3 WO2004092672 A3 WO 2004092672A3 US 2004010619 W US2004010619 W US 2004010619W WO 2004092672 A3 WO2004092672 A3 WO 2004092672A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- amorphous carbon
- heat exchangers
- carbon layer
- heat exchanger
- layer
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
- C23C16/509—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Thermal Sciences (AREA)
- Plasma & Fusion (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Vapour Deposition (AREA)
- Laminated Bodies (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Carbon And Carbon Compounds (AREA)
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006509754A JP2006526075A (en) | 2003-04-10 | 2004-04-08 | Amorphous carbon layer for heat exchanger |
BRPI0409103-5A BRPI0409103A (en) | 2003-04-10 | 2004-04-08 | heat exchanger, substrate, and process for depositing an amorphous carbon layer on a substrate |
EP04759186A EP1611405A2 (en) | 2003-04-10 | 2004-04-08 | Amorphous carbon layer for heat exchangers |
NO20055165A NO20055165L (en) | 2003-04-10 | 2005-11-03 | Amorphous carbon layer for heat exchanger |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/410,211 | 2003-04-10 | ||
US10/410,211 US20040200599A1 (en) | 2003-04-10 | 2003-04-10 | Amorphous carbon layer for heat exchangers and processes thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2004092672A2 WO2004092672A2 (en) | 2004-10-28 |
WO2004092672A3 true WO2004092672A3 (en) | 2004-12-23 |
Family
ID=33130753
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2004/010619 WO2004092672A2 (en) | 2003-04-10 | 2004-04-08 | Amorphous carbon layer for heat exchangers |
Country Status (7)
Country | Link |
---|---|
US (1) | US20040200599A1 (en) |
EP (1) | EP1611405A2 (en) |
JP (1) | JP2006526075A (en) |
CN (1) | CN1802881A (en) |
BR (1) | BRPI0409103A (en) |
NO (1) | NO20055165L (en) |
WO (1) | WO2004092672A2 (en) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4423989B2 (en) * | 2004-02-05 | 2010-03-03 | トヨタ自動車株式会社 | Thermoelectric generator for internal combustion engine |
TWI268755B (en) * | 2005-03-21 | 2006-12-11 | Mitac Tech Corporation | Chip heat dissipation system and manufacturing method and structure of heat exchange device thereof |
US7352584B1 (en) | 2005-05-10 | 2008-04-01 | Chien-Min Sung | Diamond-like carbon coated devices |
CN1870863B (en) * | 2005-05-28 | 2011-06-08 | 鸿富锦精密工业(深圳)有限公司 | Casing of portable electronic device and its manufacturing method |
JP4735309B2 (en) * | 2006-02-10 | 2011-07-27 | トヨタ自動車株式会社 | Cavitation erosion resistant member and method of manufacturing the same |
CN100412228C (en) * | 2006-06-08 | 2008-08-20 | 哈尔滨工业大学 | Composite reinforcing and treating method for alumium or alumium alloy substrate surface through ion implantation and deposition |
US7968473B2 (en) * | 2006-11-03 | 2011-06-28 | Applied Materials, Inc. | Low temperature process for depositing a high extinction coefficient non-peeling optical absorber for a scanning laser surface anneal of implanted dopants |
TW201020336A (en) * | 2008-11-20 | 2010-06-01 | Yu-Hsueh Lin | Method for plating film on surface of heat dissipation module and film-plated heat dissipation module |
CN101736312B (en) * | 2008-11-26 | 2012-11-21 | 林玉雪 | Method for coating surface of radiation module and coated radiation module |
CN103890937B (en) * | 2011-10-20 | 2017-05-03 | 科卢斯博知识产权有限公司 | Bulk amorphous alloy heat sink |
DE102018101453A1 (en) * | 2018-01-23 | 2019-07-25 | Borgwarner Ludwigsburg Gmbh | Heating device and method for producing a heating rod |
US11931966B2 (en) | 2018-01-26 | 2024-03-19 | Cellink Bioprinting Ab | Systems and methods for optical assessments of bioink printability |
US11186736B2 (en) | 2018-10-10 | 2021-11-30 | Cellink Ab | Double network bioinks |
WO2020157077A2 (en) * | 2019-01-28 | 2020-08-06 | Cellink Ab | A compact fluorescence microscope and a cell monitoring system |
US11826951B2 (en) | 2019-09-06 | 2023-11-28 | Cellink Ab | Temperature-controlled multi-material overprinting |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0344485A (en) * | 1989-07-12 | 1991-02-26 | Matsushita Refrig Co Ltd | Fin material for heat exchanger |
US5031029A (en) * | 1990-04-04 | 1991-07-09 | International Business Machines Corporation | Copper device and use thereof with semiconductor devices |
US5786633A (en) * | 1992-01-23 | 1998-07-28 | Siemens Aktiengesellschaft | Semiconductor module having high insulating power and high thermal conductivity |
US6131533A (en) * | 1996-08-15 | 2000-10-17 | Citizen Watch Co., Ltd. | Jig for forming hard carbon film over inner surface of guide bush using the jig |
JP2002228391A (en) * | 2001-01-30 | 2002-08-14 | Daikin Ind Ltd | Air heat exchanger with fins |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5840427A (en) * | 1996-05-21 | 1998-11-24 | Teledyne Industries Incorporated | Method for making corrosion resistant electrical components |
US5981000A (en) * | 1997-10-14 | 1999-11-09 | International Business Machines Corporation | Method for fabricating a thermally stable diamond-like carbon film |
US6301333B1 (en) * | 1999-12-30 | 2001-10-09 | Genvac Aerospace Corp. | Process for coating amorphous carbon coating on to an x-ray target |
US6713179B2 (en) * | 2000-05-24 | 2004-03-30 | Guardian Industries Corp. | Hydrophilic DLC on substrate with UV exposure |
US6788841B2 (en) * | 2002-01-16 | 2004-09-07 | Genvac Corporation | Diamond-like carbon heat sink for reflective optical switches and devices |
US6891324B2 (en) * | 2002-06-26 | 2005-05-10 | Nanodynamics, Inc. | Carbon-metal nano-composite materials for field emission cathodes and devices |
-
2003
- 2003-04-10 US US10/410,211 patent/US20040200599A1/en not_active Abandoned
-
2004
- 2004-04-08 JP JP2006509754A patent/JP2006526075A/en not_active Abandoned
- 2004-04-08 WO PCT/US2004/010619 patent/WO2004092672A2/en not_active Application Discontinuation
- 2004-04-08 CN CN200480015652.7A patent/CN1802881A/en active Pending
- 2004-04-08 EP EP04759186A patent/EP1611405A2/en not_active Withdrawn
- 2004-04-08 BR BRPI0409103-5A patent/BRPI0409103A/en not_active IP Right Cessation
-
2005
- 2005-11-03 NO NO20055165A patent/NO20055165L/en not_active Application Discontinuation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0344485A (en) * | 1989-07-12 | 1991-02-26 | Matsushita Refrig Co Ltd | Fin material for heat exchanger |
US5031029A (en) * | 1990-04-04 | 1991-07-09 | International Business Machines Corporation | Copper device and use thereof with semiconductor devices |
US5786633A (en) * | 1992-01-23 | 1998-07-28 | Siemens Aktiengesellschaft | Semiconductor module having high insulating power and high thermal conductivity |
US6131533A (en) * | 1996-08-15 | 2000-10-17 | Citizen Watch Co., Ltd. | Jig for forming hard carbon film over inner surface of guide bush using the jig |
JP2002228391A (en) * | 2001-01-30 | 2002-08-14 | Daikin Ind Ltd | Air heat exchanger with fins |
Also Published As
Publication number | Publication date |
---|---|
JP2006526075A (en) | 2006-11-16 |
WO2004092672A2 (en) | 2004-10-28 |
NO20055165L (en) | 2005-11-03 |
CN1802881A (en) | 2006-07-12 |
EP1611405A2 (en) | 2006-01-04 |
BRPI0409103A (en) | 2006-04-04 |
US20040200599A1 (en) | 2004-10-14 |
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