WO2004090502A3 - Systeme d'imagerie spectrale de substrat entier pour planarisation chimico-mecanique (cmp) - Google Patents

Systeme d'imagerie spectrale de substrat entier pour planarisation chimico-mecanique (cmp) Download PDF

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Publication number
WO2004090502A3
WO2004090502A3 PCT/US2004/010326 US2004010326W WO2004090502A3 WO 2004090502 A3 WO2004090502 A3 WO 2004090502A3 US 2004010326 W US2004010326 W US 2004010326W WO 2004090502 A3 WO2004090502 A3 WO 2004090502A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
cmp
whole
imaging system
spectral imaging
Prior art date
Application number
PCT/US2004/010326
Other languages
English (en)
Other versions
WO2004090502A2 (fr
Inventor
Scott A Chalmers
Randall S Geels
Thomas F A Bibby
Original Assignee
Filmetrics Inc
Scott A Chalmers
Randall S Geels
Thomas F A Bibby
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Filmetrics Inc, Scott A Chalmers, Randall S Geels, Thomas F A Bibby filed Critical Filmetrics Inc
Priority to EP04758852A priority Critical patent/EP1622743A4/fr
Priority to JP2006509672A priority patent/JP2006522493A/ja
Publication of WO2004090502A2 publication Critical patent/WO2004090502A2/fr
Publication of WO2004090502A3 publication Critical patent/WO2004090502A3/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

La présente invention concerne des systèmes et des procédés permettant de capturer une pluralité d'images unidimensionnelles représentant sensiblement toute la surface d'un substrat en une seule révolution d'une plaque tournante soutenant un tampon de polissage en contact opérationnel avec la surface du substrat au cours d'une planarisation chimico-mécanique. Une image bidimensionnelle comprenant des données de trame, qui peut comprendre une image spectrale, est dérivée de la pluralité d'images unidimensionnelles. Les données de trame fournissent des informations utiles au traitement chimico-mécanique ultérieur du substrat.
PCT/US2004/010326 2003-04-01 2004-04-01 Systeme d'imagerie spectrale de substrat entier pour planarisation chimico-mecanique (cmp) WO2004090502A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP04758852A EP1622743A4 (fr) 2003-04-01 2004-04-01 Systeme d'imagerie spectrale de substrat entier pour planarisation chimico-mecanique (cmp)
JP2006509672A JP2006522493A (ja) 2003-04-01 2004-04-01 Ｃｍｐのための基板全体用スペクトル画像形成システム

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US45987603P 2003-04-01 2003-04-01
US60/459,876 2003-04-01
US46944903P 2003-05-05 2003-05-05
US60/469,449 2003-05-05

Publications (2)

Publication Number Publication Date
WO2004090502A2 WO2004090502A2 (fr) 2004-10-21
WO2004090502A3 true WO2004090502A3 (fr) 2005-01-20

Family

ID=33162216

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/010326 WO2004090502A2 (fr) 2003-04-01 2004-04-01 Systeme d'imagerie spectrale de substrat entier pour planarisation chimico-mecanique (cmp)

Country Status (4)

Country Link
US (1) US20040259472A1 (fr)
EP (1) EP1622743A4 (fr)
JP (1) JP2006522493A (fr)
WO (1) WO2004090502A2 (fr)

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US7544617B1 (en) * 2005-06-29 2009-06-09 Iowa State University Research Foundation, Inc. Die scale control of chemical mechanical polishing
US20070077671A1 (en) * 2005-10-03 2007-04-05 Applied Materials In-situ substrate imaging
CN102490112B (zh) * 2006-10-06 2015-03-25 株式会社荏原制作所 加工终点检测方法、研磨方法及研磨装置
US20090305610A1 (en) * 2008-06-06 2009-12-10 Applied Materials, Inc. Multiple window pad assembly
JP5474093B2 (ja) * 2009-01-16 2014-04-16 アプライド マテリアルズ インコーポレイテッド 窓支持部を具備する研磨パッドおよび研磨システム
US20130017762A1 (en) * 2011-07-15 2013-01-17 Infineon Technologies Ag Method and Apparatus for Determining a Measure of a Thickness of a Polishing Pad of a Polishing Machine
US9095952B2 (en) 2013-01-23 2015-08-04 Applied Materials, Inc. Reflectivity measurements during polishing using a camera
JP6423600B2 (ja) 2014-03-12 2018-11-14 株式会社荏原製作所 膜厚測定装置、及び、研磨装置
KR101664794B1 (ko) * 2015-08-04 2016-10-12 주식회사 케이씨텍 화학 기계적 연마 장치
US9970754B2 (en) 2015-08-26 2018-05-15 Industrial Technology Research Institute Surface measurement device and method thereof
US11557048B2 (en) 2015-11-16 2023-01-17 Applied Materials, Inc. Thickness measurement of substrate using color metrology
US10565701B2 (en) 2015-11-16 2020-02-18 Applied Materials, Inc. Color imaging for CMP monitoring
US10298570B2 (en) * 2016-03-03 2019-05-21 Ams Sensors Singapore Pte. Ltd. Optoelectronic systems and method for operating the same
TWI743176B (zh) 2016-08-26 2021-10-21 美商應用材料股份有限公司 獲得代表在基板上的層的厚度的測量的方法，及量測系統和電腦程式產品
WO2020068345A1 (fr) 2018-09-24 2020-04-02 Applied Materials, Inc. Vision artificielle en tant qu'entrée dans un algorithme de commande de procédé cmp
KR20210064387A (ko) 2018-10-22 2021-06-02 어플라이드 머티어리얼스, 인코포레이티드 휘도 히스토그램을 사용한 잔류물 검출
US11100628B2 (en) 2019-02-07 2021-08-24 Applied Materials, Inc. Thickness measurement of substrate using color metrology
CN115104001A (zh) 2020-06-29 2022-09-23 应用材料公司 根据基于机器学习的基板图像处理进行膜厚度估计

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US6758723B2 (en) * 2001-12-28 2004-07-06 Ebara Corporation Substrate polishing apparatus

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US5081421A (en) * 1990-05-01 1992-01-14 At&T Bell Laboratories In situ monitoring technique and apparatus for chemical/mechanical planarization endpoint detection
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US6261155B1 (en) * 1997-05-28 2001-07-17 Lam Research Corporation Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
US6621584B2 (en) * 1997-05-28 2003-09-16 Lam Research Corporation Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing
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US6657737B2 (en) * 1999-12-13 2003-12-02 Ebara Corporation Method and apparatus for measuring film thickness
US6758723B2 (en) * 2001-12-28 2004-07-06 Ebara Corporation Substrate polishing apparatus

Non-Patent Citations (1)

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Title
See also references of EP1622743A4 *

Also Published As

Publication number Publication date
WO2004090502A2 (fr) 2004-10-21
JP2006522493A (ja) 2006-09-28
EP1622743A2 (fr) 2006-02-08
EP1622743A4 (fr) 2007-04-04
US20040259472A1 (en) 2004-12-23

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