WO2004079294A3 - Profilage de structures a surface complexe utilisant l'interferometrie a balayage - Google Patents

Profilage de structures a surface complexe utilisant l'interferometrie a balayage Download PDF

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Publication number
WO2004079294A3
WO2004079294A3 PCT/US2004/007014 US2004007014W WO2004079294A3 WO 2004079294 A3 WO2004079294 A3 WO 2004079294A3 US 2004007014 W US2004007014 W US 2004007014W WO 2004079294 A3 WO2004079294 A3 WO 2004079294A3
Authority
WO
WIPO (PCT)
Prior art keywords
scanning interferometry
models
characterizing
surface structures
test object
Prior art date
Application number
PCT/US2004/007014
Other languages
English (en)
Other versions
WO2004079294A2 (fr
Inventor
Groot Peter J De
Robert Stoner
Lega Xavier Colonna De
Original Assignee
Zygo Corp
Groot Peter J De
Robert Stoner
Lega Xavier Colonna De
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zygo Corp, Groot Peter J De, Robert Stoner, Lega Xavier Colonna De filed Critical Zygo Corp
Priority to JP2006506943A priority Critical patent/JP4791354B2/ja
Priority to KR1020057016623A priority patent/KR101169293B1/ko
Priority to EP04718562.4A priority patent/EP1604169B1/fr
Priority to CN2004800123237A priority patent/CN1784588B/zh
Publication of WO2004079294A2 publication Critical patent/WO2004079294A2/fr
Publication of WO2004079294A3 publication Critical patent/WO2004079294A3/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02001—Interferometers characterised by controlling or generating intrinsic radiation properties
    • G01B9/0201—Interferometers characterised by controlling or generating intrinsic radiation properties using temporal phase variation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0675—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating using interferometry
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02055—Reduction or prevention of errors; Testing; Calibration
    • G01B9/02056—Passive reduction of errors
    • G01B9/02057—Passive reduction of errors by using common path configuration, i.e. reference and object path almost entirely overlapping
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02083—Interferometers characterised by particular signal processing and presentation
    • G01B9/02084—Processing in the Fourier or frequency domain when not imaged in the frequency domain
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02083—Interferometers characterised by particular signal processing and presentation
    • G01B9/02088—Matching signals with a database
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/0209—Low-coherence interferometers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2290/00—Aspects of interferometers not specifically covered by any group under G01B9/02
    • G01B2290/70—Using polarization in the interferometer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Mathematical Physics (AREA)
  • Databases & Information Systems (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Instruments For Measurement Of Length By Optical Means (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)

Abstract

L'invention concerne un procédé consistant à comparer une information pouvant provenir d'un signal d'interférométrie à balayage pour un premier emplacement de surface d'un objet à tester avec l'information correspondant à de multiples modèles de l'objet à tester, les multiple modèles étant paramétrés par une série de caractéristiques pour l'objet à tester. L'information correspondant à de multiples modèles peut contenir l'information concernant au moins une composante d'amplitude d'une transformée d'un signal d'interférométrie à balayage correspondant à chacun des modèles de l'objet à tester.
PCT/US2004/007014 2003-03-06 2004-03-08 Profilage de structures a surface complexe utilisant l'interferometrie a balayage WO2004079294A2 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006506943A JP4791354B2 (ja) 2003-03-06 2004-03-08 走査干渉分光を用いた複雑な表面構造のプロファイリング
KR1020057016623A KR101169293B1 (ko) 2003-03-06 2004-03-08 주사 간섭측정을 이용한 복합 표면 구조의 프로파일링
EP04718562.4A EP1604169B1 (fr) 2003-03-06 2004-03-08 Procede de mesure du profil de structures a surface complexe utilisant l'interferometrie a balayage
CN2004800123237A CN1784588B (zh) 2003-03-06 2004-03-08 使用扫描干涉测量形成复杂表面结构的轮廓以及对其表征

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US45261503P 2003-03-06 2003-03-06
US60/452,615 2003-03-06

Publications (2)

Publication Number Publication Date
WO2004079294A2 WO2004079294A2 (fr) 2004-09-16
WO2004079294A3 true WO2004079294A3 (fr) 2005-05-19

Family

ID=32962738

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/007014 WO2004079294A2 (fr) 2003-03-06 2004-03-08 Profilage de structures a surface complexe utilisant l'interferometrie a balayage

Country Status (4)

Country Link
JP (3) JP4791354B2 (fr)
KR (1) KR101169293B1 (fr)
CN (1) CN1784588B (fr)
WO (1) WO2004079294A2 (fr)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7324214B2 (en) * 2003-03-06 2008-01-29 Zygo Corporation Interferometer and method for measuring characteristics of optically unresolved surface features
GB0415766D0 (en) * 2004-07-14 2004-08-18 Taylor Hobson Ltd Apparatus for and a method of determining a characteristic of a layer or layers
KR101006423B1 (ko) * 2005-01-20 2011-01-06 지고 코포레이션 객체 표면의 특성을 결정하기 위한 간섭계
GB0502677D0 (en) * 2005-02-09 2005-03-16 Taylor Hobson Ltd Apparatus for and a method of determining a surface characteristic
KR101321861B1 (ko) * 2005-11-15 2013-10-25 지고 코포레이션 광학적으로 분석되지 않은 표면 형상의 특징을 측정하는방법 및 간섭계
DE102006007573B4 (de) * 2006-02-18 2009-08-13 Carl Mahr Holding Gmbh Verfahren und Vorrichtung zur 3D-Geometrieerfassung von Objektoberflächen
US7916927B2 (en) * 2007-01-16 2011-03-29 Asml Netherlands B.V. Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
WO2009079334A2 (fr) * 2007-12-14 2009-06-25 Zygo Corporation Analyse de la structure de surface à l'aide de l'interférométrie à balayage
JP4940122B2 (ja) * 2007-12-21 2012-05-30 株式会社日立製作所 ハードディスクメディア上のパターンの検査方法及び検査装置
JP5302631B2 (ja) * 2008-11-08 2013-10-02 株式会社堀場製作所 光学測定装置、プログラム、及び計測方法
US8619263B2 (en) * 2010-01-06 2013-12-31 Panasonic Corporation Film thickness measuring apparatus using interference and film thickness measuring method using interference
EP2482031A1 (fr) * 2011-01-26 2012-08-01 Mitutoyo Research Center Europe B.V. Procédé et appareil d'exécution des mesures d'épaisseur de film à l'aide d'une interférométrie lumineuse blanche
EP2541193A1 (fr) 2011-06-27 2013-01-02 Hexagon Technology Center GmbH Procédé de mesure d'éloignement interférométrique pour la mesure de surfaces et un tel appareil de mesure
CN104797961B (zh) * 2012-11-21 2018-02-02 3M创新有限公司 光学扩散膜及其制备方法
JP6186215B2 (ja) * 2013-09-04 2017-08-23 株式会社日立エルジーデータストレージ 光計測装置及び光断層観察方法
WO2017116787A1 (fr) * 2015-12-31 2017-07-06 Zygo Corporation Procédé et appareil d'optimisation de la performance optique d'interféromètres
KR102395533B1 (ko) 2016-11-18 2022-05-06 지고 코포레이션 간섭계의 광학적 성능을 최적화하기 위한 방법 및 장치
CN108169175B (zh) * 2016-12-08 2022-07-26 松下知识产权经营株式会社 光检测系统
CN108168715B (zh) * 2016-12-08 2021-02-19 松下知识产权经营株式会社 光检测装置
FR3089286B1 (fr) 2018-11-30 2022-04-01 Unity Semiconductor Procédé et système pour mesurer une surface d’un objet comprenant des structures différentes par interférométrie à faible cohérence
JP7358185B2 (ja) * 2019-10-15 2023-10-10 株式会社ディスコ 厚み計測装置、及び厚み計測装置を備えた加工装置
CN111386441B (zh) 2020-02-24 2021-02-19 长江存储科技有限责任公司 用于半导体芯片表面形貌计量的系统
CN111356897B (zh) 2020-02-24 2021-02-19 长江存储科技有限责任公司 用于半导体芯片表面形貌计量的系统和方法
WO2021168613A1 (fr) 2020-02-24 2021-09-02 Yangtze Memory Technologies Co., Ltd. Systèmes et procédés de métrologie de topographie de surface de puce semi-conductrice
CN111406198B (zh) 2020-02-24 2021-02-19 长江存储科技有限责任公司 用于半导体芯片表面形貌计量的系统和方法
CN112066909B (zh) * 2020-08-24 2022-04-08 南京理工大学 一种基于倾斜平面高精度提取的抗振动干涉测量方法
CN113405486B (zh) * 2021-05-26 2022-06-21 天津大学 基于白光干涉时频域分析的薄膜形貌检测系统及方法
CN113639661B (zh) * 2021-08-11 2022-10-14 中国科学院长春光学精密机械与物理研究所 形貌检测系统及形貌检测方法
CN114910015A (zh) * 2022-04-29 2022-08-16 深圳市中图仪器股份有限公司 白光干涉信号的重建方法
CN114910016B (zh) * 2022-04-29 2024-04-12 深圳市中图仪器股份有限公司 白光干涉信号的重建装置
CN116625275B (zh) * 2023-03-31 2024-02-13 东莞理工学院 一种基于光场信息融合的超薄多层图形微纳结构三维重构方法
CN117906529B (zh) * 2024-03-18 2024-05-28 板石智能科技(深圳)有限公司 倾斜空间平面自动平衡方法、装置、电子设备及存储介质

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US5587792A (en) * 1993-06-21 1996-12-24 Nishizawa; Seiji Apparatus and method for measuring thickness of thin semiconductor multi-layer film
US5900633A (en) * 1997-12-15 1999-05-04 On-Line Technologies, Inc Spectrometric method for analysis of film thickness and composition on a patterned sample
EP0929094A2 (fr) * 1998-01-07 1999-07-14 International Business Machines Corporation Procédé et appareil pour mesurer la profondeur d'une interface enterrée
US6242739B1 (en) * 1998-04-21 2001-06-05 Alexander P. Cherkassky Method and apparatus for non-destructive determination of film thickness and dopant concentration using fourier transform infrared spectrometry

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GB9213159D0 (en) * 1992-06-22 1992-08-05 British Tech Group Method of and apparatus for interferometrically inspecting a surface of an object

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5398113A (en) * 1993-02-08 1995-03-14 Zygo Corporation Method and apparatus for surface topography measurement by spatial-frequency analysis of interferograms
US5587792A (en) * 1993-06-21 1996-12-24 Nishizawa; Seiji Apparatus and method for measuring thickness of thin semiconductor multi-layer film
US5900633A (en) * 1997-12-15 1999-05-04 On-Line Technologies, Inc Spectrometric method for analysis of film thickness and composition on a patterned sample
EP0929094A2 (fr) * 1998-01-07 1999-07-14 International Business Machines Corporation Procédé et appareil pour mesurer la profondeur d'une interface enterrée
US6242739B1 (en) * 1998-04-21 2001-06-05 Alexander P. Cherkassky Method and apparatus for non-destructive determination of film thickness and dopant concentration using fourier transform infrared spectrometry

Also Published As

Publication number Publication date
JP2010133976A (ja) 2010-06-17
KR20050116372A (ko) 2005-12-12
KR101169293B1 (ko) 2012-07-30
JP2006519992A (ja) 2006-08-31
JP4791354B2 (ja) 2011-10-12
CN1784588B (zh) 2011-07-13
JP5443209B2 (ja) 2014-03-19
CN1784588A (zh) 2006-06-07
WO2004079294A2 (fr) 2004-09-16
JP2011169920A (ja) 2011-09-01

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