WO2004077531A1 - Dispositif pour saisir, maintenir et orienter avec un faible contact des composants plats sensibles aux contacts - Google Patents

Dispositif pour saisir, maintenir et orienter avec un faible contact des composants plats sensibles aux contacts Download PDF

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Publication number
WO2004077531A1
WO2004077531A1 PCT/DE2004/000342 DE2004000342W WO2004077531A1 WO 2004077531 A1 WO2004077531 A1 WO 2004077531A1 DE 2004000342 W DE2004000342 W DE 2004000342W WO 2004077531 A1 WO2004077531 A1 WO 2004077531A1
Authority
WO
WIPO (PCT)
Prior art keywords
projection
base plate
holding
holding plate
plate
Prior art date
Application number
PCT/DE2004/000342
Other languages
German (de)
English (en)
Inventor
Josef Zimmermann
Adolf Zitzmann
Bostjan Briski
Original Assignee
Technische Universität München
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technische Universität München filed Critical Technische Universität München
Publication of WO2004077531A1 publication Critical patent/WO2004077531A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67793—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with orientating and positioning by means of a vibratory bowl or track
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment

Definitions

  • the present invention relates to a device for low-contact gripping, holding and aligning touch-sensitive flat components.
  • touch sensitive flat components such as. B. wafers to grip and move from a point A to point B
  • various designs are known from the prior art. It is also often necessary to lend the flat components to a technologically predetermined orientation.
  • efforts are being made to reduce the number of gripping operations determined by the process, since the likelihood of damage to the component or at least the detachment of particles increases with each additional gripping operation.
  • DE 202 12 107 describes a gripping device with a gripper with a controllable manipulator for components whose position is undefined when picked up by the gripper.
  • One or more pictures are taken of an optical recording device.
  • the image information is fed to an evaluation and control device which influences the movement of the gripper.
  • this device is only suitable for mechanically stable components.
  • DE 101 21 1 1 5 describes a special holding device for wafers which grasp and hold the wafer exclusively at the edge. This device enables a pivoting movement of 180 degrees and thus also one easy inspection of the bottom of the wafer. However, this device requires sufficient stiffness of the wafer.
  • DE 102 32 080 describes a special electrostatic gripper which reduces heating of the wafer to a minimum and can be operated at a low voltage. Although these grippers work in principle without contact, their area of application is very limited. With the electrostatic grippers, only wafers can be gripped on which no current or voltage sensitive structures are present.
  • a device for low-contact gripping, holding and aligning touch-sensitive flat components is provided with the following features:
  • a holding plate with a recess is arranged on a base plate.
  • the base plate has a protrusion that extends through the recess.
  • the projection has a flat surface and is dimensioned such that the surface of the projection lies in the same plane as the surface of the holding plate.
  • a device for generating ultrasonic vibrations is coupled to the side of the base plate. It is known from the prior art to keep components in a floating state by means of ultrasonic vibrations. The construction is designed so that the flat surface of the projection swings so that an overlying component such. B. a wafer, floating on it without contact.
  • the surface and the dimensions of the protrusion are chosen so that a component with a predetermined surface geometry is supported sufficiently without contact. It is thus clear to the person skilled in the art that partial support is sufficient for a relatively rigid component, while support that is as large as possible must be provided for a relatively large and / or thin, ie film-like component, so that the unsupported surface sections do not come under the influence of gravitational force lower.
  • the arrangement described above is very flat, so that a component can be removed from a narrow slot. If the component hovers on the projection, side stops must be used to prevent the component from sliding off the device.
  • a holding device is therefore provided which holds the component laterally.
  • the controllable holding device is operatively connected to the holding plate and can preferably be attached to the holding plate. In order to rotate and / or move the floating component into a predetermined position, the holding plate is rotated and / or moved.
  • the lateral holding device causes the floating component to follow the movement of the holding plate exactly.
  • the dimensioning of the base plate and the holding plate depends on the shape of the flat component. Furthermore, the dimensioning depends on the spatial conditions from which the flat component is to be removed or into which the flat component is to be inserted or inserted.
  • the vibration generating means are designed in connection with the overall construction so that the holding plate also hovers on the base plate. So that the holding plate does not slide off the base plate, it is z. B. held by the drive device which is arranged on the base plate.
  • a feature recognition and control device which recognizes a predetermined feature of the flat component and generates position coordinates of the feature, on the basis of which the drive device is actuated, which moves the holding plate with the flat component into a predetermined position.
  • the feature detection device is integrated in the holding plate. This measure results in a particularly slim design of the overall device.
  • FIG. 1 shows a perspective illustration of the principle of the invention.
  • a holding plate 3 with a recess 5 is arranged on a base plate 2.
  • the base plate 2 has an annular projection 4 which extends through the recess 5.
  • the projection 4 has a flat surface and is dimensioned such that the surface of the projection 4 lies in the same plane as the surface of the holding plate 3.
  • On the side of the base plate 2 is a device 6 for generating ultrasonic vibrations coupled.
  • the construction is designed such that the wafer 1 floats on the surface of the projection 4 without contact. Since the wafer is flat and sufficiently rigid, it does not touch the surface of the holding plate 3. Because of the high rigidity of this wafer 1, the surface of the projection 4 can be relatively small.
  • Wafers must be aligned with their crystal direction before processing.
  • a so-called “notch” 10 ie a notch or another geometric feature, is provided for the wafers. If, for example, the wafer 1 was removed from a magazine by a first method step in order to bring it to a processing station The position of the notch can already be determined in this time.
  • the drive device which has a motor 8a and a drive wheel 8b for driving the holding plate 3
  • the wafer 1 held by small clamping pins 7 is rotated until the notch 10 is detected by means of a sensor arrangement 9.
  • the motor 8a is switched off. It is also possible to provide a plurality of sensors on the circumference of the wafer 1, so that the notch 10 is recognized after a smaller angle of rotation, in which case forward or rotated backwards, depending on which angle of rotation is smaller.
  • the sensor arrangement 9 for recognizing the optical feature 10 is arranged above the wafer. If the device is used as a gripper to remove a wafer from a narrow slot in a magazine, this embodiment of the sensor arrangement 9 is disruptive.
  • At least one reflection sensor is integrated in the holding plate 3 in order to detect the notch.
  • the wafer 1 is released by means of the controllable holding device 7, so that the
  • Holding plate 3 rotates under the wafer 1, whereby the floating wafer 1 does not rotate due to its inertia.
  • the wafer 1 is again fixed at the edge by the holding device 7.
  • the fixed wafer 1 can be rotated into a predetermined orientation by means of the drive device 8a, b.
  • the drive device must have the function of a stepper motor.
  • the holding plate 3 smaller than the wafer.
  • the effective area between the drive wheel 8b and the holding plate 3 is then to be designed by a specialist so that the wafer is not touched.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

La présente invention concerne un dispositif pour saisir, maintenir et orienter avec un faible contact des composants plats (1). Ce dispositif présente les caractéristiques suivantes : il comporte une plaque de base (2) et une plaque de maintien (3), ladite plaque de base (2) présentant une saillie (4) qui traverse un évidement (5) de la plaque de maintien (3), le bord supérieur de la saillie (4) se trouvant dans le plan de la surface de la plaque de maintien (3) ; il comporte en outre un moyen de génération de vibrations (6), qui sert à générer des vibrations de la plaque de base (2) pouvant maintenir en sustentation le composant plat (1) se trouvant sur la plaque de maintien (2) ; et il comporte également un dispositif de maintien (7) commandé, servant à bloquer par son bord le composant plat (1), ainsi qu'un dispositif d'entraînement (8a, 8b) servant à déplacer la plaque de maintien (2) dans un sens prédéterminé ou à lui donner une orientation prédéterminée.
PCT/DE2004/000342 2003-02-25 2004-02-25 Dispositif pour saisir, maintenir et orienter avec un faible contact des composants plats sensibles aux contacts WO2004077531A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10308250 2003-02-25
DE10308250.6 2003-02-25

Publications (1)

Publication Number Publication Date
WO2004077531A1 true WO2004077531A1 (fr) 2004-09-10

Family

ID=32920621

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2004/000342 WO2004077531A1 (fr) 2003-02-25 2004-02-25 Dispositif pour saisir, maintenir et orienter avec un faible contact des composants plats sensibles aux contacts

Country Status (1)

Country Link
WO (1) WO2004077531A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009037673A2 (fr) * 2007-09-22 2009-03-26 Dynamic Micro Systems Mécanisme intégré de transfert de tranches
DE102010022625A1 (de) 2010-06-04 2011-12-08 Festo Ag & Co. Kg Handhabungssystem zur Handhabung von Gegenständen
EP3933507A1 (fr) * 2020-06-29 2022-01-05 Canon Kabushiki Kaisha Appareil de transport, appareil de traitement de substrat et procédé de fabrication d'article

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6002840A (en) * 1997-09-30 1999-12-14 Brooks Automation Inc. Substrate transport apparatus
WO2000061474A1 (fr) * 1999-04-14 2000-10-19 Technische Universität München Institut Für Werkzeugmaschinen Und Betriebswissenschaften Dispositif pour prendre, tenir et positionner des composants sans contact
US20020044863A1 (en) * 2000-08-08 2002-04-18 Jurgen Hoppner Handler for the transporting of flat substrates for application in the semi-conductor industry
US20020192056A1 (en) * 2001-06-13 2002-12-19 Applied Materials, Inc. Method and apparatus for transferring a semiconductor substrate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6002840A (en) * 1997-09-30 1999-12-14 Brooks Automation Inc. Substrate transport apparatus
WO2000061474A1 (fr) * 1999-04-14 2000-10-19 Technische Universität München Institut Für Werkzeugmaschinen Und Betriebswissenschaften Dispositif pour prendre, tenir et positionner des composants sans contact
US20020044863A1 (en) * 2000-08-08 2002-04-18 Jurgen Hoppner Handler for the transporting of flat substrates for application in the semi-conductor industry
US20020192056A1 (en) * 2001-06-13 2002-12-19 Applied Materials, Inc. Method and apparatus for transferring a semiconductor substrate

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
REINHART G ET AL: "Abstract: non-contact wafer handling using high-intensity ultrasonics", 2001 PROCEEDINGS IEEE/SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE AND WORKSHOP. (ASMC). MUNICH, GERMANY, APRIL 23 - 24, 2001, IEEE/SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE AND WORKSHOP, NEW YORK, NY : IEEE, US, vol. CONF. 12, 23 April 2001 (2001-04-23), pages 139 - 140, XP010544814, ISBN: 0-7803-6555-0 *

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009037673A2 (fr) * 2007-09-22 2009-03-26 Dynamic Micro Systems Mécanisme intégré de transfert de tranches
WO2009037673A3 (fr) * 2007-09-22 2009-09-03 Dynamic Micro Systems Mécanisme intégré de transfert de tranches
US7976263B2 (en) 2007-09-22 2011-07-12 David Barker Integrated wafer transfer mechanism
DE102010022625A1 (de) 2010-06-04 2011-12-08 Festo Ag & Co. Kg Handhabungssystem zur Handhabung von Gegenständen
WO2011151004A1 (fr) 2010-06-04 2011-12-08 Festo Ag & Co. Kg Système de manipulation pour la manipulation d'objets
DE212011100058U1 (de) 2010-06-04 2012-11-13 Festo Ag & Co. Kg Handhabungssystem zur Handhabung von Gegenständen
EP3933507A1 (fr) * 2020-06-29 2022-01-05 Canon Kabushiki Kaisha Appareil de transport, appareil de traitement de substrat et procédé de fabrication d'article
US11569119B2 (en) 2020-06-29 2023-01-31 Canon Kabushiki Kaisha Conveyance apparatus, substrate processing apparatus, and method of manufacturing article

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