WO2004068925A1 - Dispositif de positionnement-fixation pour fixer des objets sur des substrats - Google Patents

Dispositif de positionnement-fixation pour fixer des objets sur des substrats Download PDF

Info

Publication number
WO2004068925A1
WO2004068925A1 PCT/DE2003/004152 DE0304152W WO2004068925A1 WO 2004068925 A1 WO2004068925 A1 WO 2004068925A1 DE 0304152 W DE0304152 W DE 0304152W WO 2004068925 A1 WO2004068925 A1 WO 2004068925A1
Authority
WO
WIPO (PCT)
Prior art keywords
positioning device
holder
gripper
housing
placement
Prior art date
Application number
PCT/DE2003/004152
Other languages
German (de)
English (en)
Inventor
Gerhard Jonke
Rudolf Schmid
Christian THÜRINGEN
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO2004068925A1 publication Critical patent/WO2004068925A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • B25B11/007—Vacuum work holders portable, e.g. handheld
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools

Definitions

  • Positioning device for placing objects on substrates
  • the invention relates to a placement positioning device with a gripper connected to a vacuum for picking up and placing objects on substrates, the gripper being mounted on a movable holder between two ends of a range of movement in a linearly movable manner in a placement direction.
  • Conventional placement positioning devices such as those used in turret placement heads, have a movable holder which is guided so that it can move linearly between two ends of a movement range in a placement direction.
  • the gripper is biased by a spring in the mounting direction against the movable holder.
  • the objects to be placed are often electrical components. These are sucked onto the gripper using a vacuum, for example.
  • the vacuum is passed through openings in the gripper and the holder to the tip of the gripper. It is therefore necessary to connect the gripper and holder to one another by means of a seal in a vacuum-tight and linearly movable manner.
  • a sealing membrane has so far been used, which is arranged between the gripper tip and the holder and provides a corresponding sealing effect between the holder and the gripper tip over the entire range of movement of the gripper relative to the holder.
  • the holder can be connected to the gripper in a vacuum-tight manner by means of a bellows. This is done in particular by gluing the end regions of the bellows to the gripper and to the holder. However, it is also possible to thermally brace the bellows with the corresponding connection surfaces on the gripper and holder.
  • a bellows In addition to the vacuum tightness, a bellows also has spring properties. As a result, the previously common spring between holder and gripper can be saved.
  • a metal bellows has excellent torsional rigidity.
  • an anti-rotation device can be dispensed with in the linear mounting of the gripper relative to the holder.
  • the device according to the invention has a housing which at least partially coaxially surrounds the holder, and the electrical rotary drive for the gripper is formed by providing its stator in the housing and its rotor on the gripper.
  • both the anti-rotation lock in the linear guidance between the holder and the gripper can be omitted, as well as the sealing membrane and the spring between the holder and the gripper, the invention also applies when using an electric rotary drive in the placement-positioning device extremely compact dimensions possible.
  • a linear guide can be provided on the housing for mounting the placement positioning device relative to a placement head, which has a plurality of placement positioning devices of the same type.
  • the linear guide is attached directly to the housing, i. H.
  • the axis of movement of the linear guide is at a small distance from the axis of rotation of the gripper of the placement-positioning device according to the invention.
  • this distance is approximately as large as or somewhat smaller than the outer diameter of the housing of the placement positioning.
  • the seal has an annular shape with a cross-shaped cross section.
  • the holder or the gripper can be provided with a rotationally symmetrical encoder, the rotary movement of which can be detected by a sensor arranged on the housing.
  • the rotationally symmetrical encoder is made of magnetoresistive material, so that, in cooperation with a corresponding sensor, an interpolating detection of the rotary movement that is effective between the increments of the encoder is also possible.
  • the figure shows a schematic sectional view through a preferred embodiment of the device according to the invention.
  • a preferred embodiment of the placement-positioning device has a hollow shaft 110 which serves as a gripper.
  • the hollow shaft 110 is connected via a connecting element 115 to a pipette seat 140 which serves as a gripper and is suitable for receiving a vacuum pipette 145 which serves as a gripper tip for receiving objects 100, in particular electrical components.
  • the pipette seat 140 is arranged to be linearly movable relative to the hollow shaft 110.
  • an annular coupling element 117 is provided on the hollow shaft 110.
  • a metal bellows 120 is provided, which is glued to the coupling element 117 and to the connecting element 115 with one of its end regions.
  • the hollow shaft 110 and the pipette seat 140 are connected to one another in a vacuum-tight manner by means of the metal bellows 120 and can execute linear movements in a mounting direction A relative to one another.
  • the metal bellows 120 has a resilient effect in the mounting direction A.
  • the metal bellows is designed like a hollow cylinder with a diameter which changes like a wave in the course of the mounting direction A and an essentially constant wall thickness.
  • a rotor 210 of an electric drive is arranged rotationally symmetrically on the hollow shaft 110, which serves as a holder.
  • rotor 210 is constructed from electrical coils.
  • the stator 220 of the electrical rotary drive of the placement positioning device according to the preferred embodiment of the invention is provided in the housing 130 of the placement positioning device according to the invention.
  • the hollow shaft 110 is rotatably supported in the housing 130 by means of roller bearings 135.
  • Rolling bearings 150 with rolling bodies 155 are likewise provided between the pipette seat 140 and the housing 130, which enable a linear movement in the mounting direction A and a rotary movement of the pipette seat 140 relative to the housing 130.
  • the hollow shaft 110 there is also a rotationally symmetrical encoder wheel 230, in particular made of magnetoresistive material trained, arranged.
  • a sensor 235 which is non-rotatable relative to the housing 130, the rotational movement of the system comprising the rotor 210, the hollow shaft 110 and the pipette seat 140 can be detected relative to the housing 130 or the stator 220.
  • the housing 130 is surrounded by a cap 180, which extends in the attachment direction A, ie. H. extends along the hollow shaft 110 and has at its upper end a vacuum connection 185 for applying a vacuum to the hollow shaft 110 and the pipette seat 140.
  • the cap 180 is connected to the housing 130, e.g. B. by gluing.
  • a sealing ring 170 is provided between the housing 130, the cap 180 and the hollow shaft 110.
  • This sealing ring is designed in particular with a cross-shaped cross section, so that it enables a sealing effect on all four corner regions of the resulting annular cavity with a square cross section.
  • the sealing ring 170 enables damping of the rotary movement between the housing 130 and the hollow shaft 110 or the pipette seat 140.
  • a linear guide 160 is also attached directly to the housing 130.
  • the linear guide 160 can either be glued to the housing 130, be soldered to it, or be formed in one piece with it.
  • the line of movement 165 of the linear bearing 160 is arranged at a short distance from the axis of rotation D of the placement-positioning device.
  • the distance of the movement axis 165 of the linear bearing 160 from the axis of rotation D is approximately a distance corresponding to the diameter of the housing 130. This allows a high accuracy of an arrangement of the placement-positioning device according to the invention in a placement head.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

La présente invention concerne un dispositif de positionnement-fixation pour fixer des objets (100), notamment des composants électriques, sur des substrats, ledit dispositif comprenant un support mobile (110), un élément de préhension (140) guidé pour pouvoir effectuer un mouvement linéaire dans une direction de fixation (A), contre le support entre deux extrémités d'une zone de déplacement, en particulier une pipette à vide (145) qui sert de pointe de préhension et permet la préhension d'objets grâce à la production d'une dépression. Le support (110) et l'élément de préhension (140) sont reliés au moyen d'un soufflet métallique (120), les actions de guidage, d'étanchéification et de rappel étant réunies en un seul composant, le soufflet métallique (120).
PCT/DE2003/004152 2003-01-22 2003-12-16 Dispositif de positionnement-fixation pour fixer des objets sur des substrats WO2004068925A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10302388 2003-01-22
DE10302388.7 2003-01-22

Publications (1)

Publication Number Publication Date
WO2004068925A1 true WO2004068925A1 (fr) 2004-08-12

Family

ID=32797266

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2003/004152 WO2004068925A1 (fr) 2003-01-22 2003-12-16 Dispositif de positionnement-fixation pour fixer des objets sur des substrats

Country Status (1)

Country Link
WO (1) WO2004068925A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102826383A (zh) * 2012-10-08 2012-12-19 深圳市景颢光电科技有限公司 一种取放料组件
CN107521974A (zh) * 2017-09-07 2017-12-29 广东金弘达自动化科技股份有限公司 一种带有视觉检测装置的转载机构
DE102018103398A1 (de) * 2018-02-15 2019-08-22 Asm Assembly Systems Gmbh & Co. Kg Pneumatisch aktuierbares Federelement zum Steuern der auf ein Bauelement wirkenden Bestückkraft
CN112512292A (zh) * 2019-09-16 2021-03-16 先进装配系统有限责任两合公司 补偿喉口游隙来减小贴装力的光学放置检测

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4530635A (en) * 1983-06-15 1985-07-23 The Perkin-Elmer Corporation Wafer transferring chuck assembly
US5909837A (en) * 1997-05-09 1999-06-08 Quad Systems Corporation Contactless bonding tool heater
US6012222A (en) * 1995-04-10 2000-01-11 Fuji Machine Mfg. Co., Ltd. Electronic-component mounting head, electronic-component mounting apparatus, and electronic-component mounting method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4530635A (en) * 1983-06-15 1985-07-23 The Perkin-Elmer Corporation Wafer transferring chuck assembly
US6012222A (en) * 1995-04-10 2000-01-11 Fuji Machine Mfg. Co., Ltd. Electronic-component mounting head, electronic-component mounting apparatus, and electronic-component mounting method
US5909837A (en) * 1997-05-09 1999-06-08 Quad Systems Corporation Contactless bonding tool heater

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102826383A (zh) * 2012-10-08 2012-12-19 深圳市景颢光电科技有限公司 一种取放料组件
CN102826383B (zh) * 2012-10-08 2014-06-25 深圳市景颢光电科技有限公司 一种取放料组件
CN107521974A (zh) * 2017-09-07 2017-12-29 广东金弘达自动化科技股份有限公司 一种带有视觉检测装置的转载机构
DE102018103398A1 (de) * 2018-02-15 2019-08-22 Asm Assembly Systems Gmbh & Co. Kg Pneumatisch aktuierbares Federelement zum Steuern der auf ein Bauelement wirkenden Bestückkraft
CN110167327A (zh) * 2018-02-15 2019-08-23 先进装配系统有限责任两合公司 一种为控制作用于元件的贴装力的可气动操控弹簧元件
DE102018103398B4 (de) 2018-02-15 2019-10-10 Asm Assembly Systems Gmbh & Co. Kg Pneumatisch aktuierbares Federelement zum Steuern der auf ein Bauelement wirkenden Bestückkraft
CN112512292A (zh) * 2019-09-16 2021-03-16 先进装配系统有限责任两合公司 补偿喉口游隙来减小贴装力的光学放置检测
CN112512292B (zh) * 2019-09-16 2022-03-04 先进装配系统有限责任两合公司 补偿喉口游隙来减小贴装力的光学放置检测

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