WO2004066455A3 - Projection illumination unit with an illumination system - Google Patents

Projection illumination unit with an illumination system Download PDF

Info

Publication number
WO2004066455A3
WO2004066455A3 PCT/EP2004/000330 EP2004000330W WO2004066455A3 WO 2004066455 A3 WO2004066455 A3 WO 2004066455A3 EP 2004000330 W EP2004000330 W EP 2004000330W WO 2004066455 A3 WO2004066455 A3 WO 2004066455A3
Authority
WO
WIPO (PCT)
Prior art keywords
illumination
projection
flushing gas
light source
gas flow
Prior art date
Application number
PCT/EP2004/000330
Other languages
German (de)
French (fr)
Other versions
WO2004066455A2 (en
Inventor
Otto Hahnemann
Original Assignee
Zeiss Carl Smt Ag
Otto Hahnemann
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zeiss Carl Smt Ag, Otto Hahnemann filed Critical Zeiss Carl Smt Ag
Publication of WO2004066455A2 publication Critical patent/WO2004066455A2/en
Publication of WO2004066455A3 publication Critical patent/WO2004066455A3/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70933—Purge, e.g. exchanging fluid or gas to remove pollutants

Landscapes

  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Toxicology (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

A projection illumination unit (1) is provided with an illumination device (3), comprising a light source, in particular a UV-light emitting laser, a projection lens (7), a reticle plane in which a reticle (5) is arranged, a wafer plane in which a wafer (2) is arranged and a flushing gas system, for flushing the interior of the projection lens (7) and/or the external regions, in particular, the reticle plane and the wafer plane. At least one device (25,32,33) for the monitoring of at least one flushing gas flow is provided, which interrupts the radiation from the light source to the projection lens (7) when the flushing gas flow rate drops below a given level. The device (25,32,33) for the monitoring of the flushing gas flow is connected to the light source by means of a controller. The controller (27) is provided with a timer arrangement (36).
PCT/EP2004/000330 2003-01-24 2004-01-17 Projection illumination unit with an illumination system WO2004066455A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2003102665 DE10302665A1 (en) 2003-01-24 2003-01-24 Projection exposure system with a lighting system
DE10302665.7 2003-01-24

Publications (2)

Publication Number Publication Date
WO2004066455A2 WO2004066455A2 (en) 2004-08-05
WO2004066455A3 true WO2004066455A3 (en) 2005-04-21

Family

ID=32694941

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2004/000330 WO2004066455A2 (en) 2003-01-24 2004-01-17 Projection illumination unit with an illumination system

Country Status (2)

Country Link
DE (1) DE10302665A1 (en)
WO (1) WO2004066455A2 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1004937A2 (en) * 1998-11-27 2000-05-31 Nikon Corporation Exposure apparatus and optical system therefor
US6295121B1 (en) * 1996-01-05 2001-09-25 Canon Kabushiki Kaisha Exposure apparatus
EP1143491A1 (en) * 1998-11-19 2001-10-10 Nikon Corporation Optical device, exposure system, and laser beam source, and gas feed method, exposure method, and device manufacturing method
WO2002054464A1 (en) * 2000-12-28 2002-07-11 Nikon Corporation Method and system for exposure

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6295121B1 (en) * 1996-01-05 2001-09-25 Canon Kabushiki Kaisha Exposure apparatus
EP1143491A1 (en) * 1998-11-19 2001-10-10 Nikon Corporation Optical device, exposure system, and laser beam source, and gas feed method, exposure method, and device manufacturing method
EP1004937A2 (en) * 1998-11-27 2000-05-31 Nikon Corporation Exposure apparatus and optical system therefor
WO2002054464A1 (en) * 2000-12-28 2002-07-11 Nikon Corporation Method and system for exposure
US20040141164A1 (en) * 2000-12-28 2004-07-22 Nikon Corporation Exposure method and exposure apparatus

Also Published As

Publication number Publication date
DE10302665A1 (en) 2004-08-12
WO2004066455A2 (en) 2004-08-05

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