WO2004062843A2 - Universal remover for electronic components and unsoldering paste for removing surface mount electronics components - Google Patents

Universal remover for electronic components and unsoldering paste for removing surface mount electronics components Download PDF

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Publication number
WO2004062843A2
WO2004062843A2 PCT/MX2004/000001 MX2004000001W WO2004062843A2 WO 2004062843 A2 WO2004062843 A2 WO 2004062843A2 MX 2004000001 W MX2004000001 W MX 2004000001W WO 2004062843 A2 WO2004062843 A2 WO 2004062843A2
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WO
WIPO (PCT)
Prior art keywords
grs
alloy
tin
lead
paste
Prior art date
Application number
PCT/MX2004/000001
Other languages
Spanish (es)
French (fr)
Other versions
WO2004062843A3 (en
Inventor
Mauricio Vargas Martinez
Rositere Lopez Partida
Original Assignee
Mauricio Vargas Martinez
Rositere Lopez Partida
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mauricio Vargas Martinez, Rositere Lopez Partida filed Critical Mauricio Vargas Martinez
Publication of WO2004062843A2 publication Critical patent/WO2004062843A2/en
Publication of WO2004062843A3 publication Critical patent/WO2004062843A3/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/018—Unsoldering; Removal of melted solder or other residues
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits

Definitions

  • This desoldering paste is used to remove electronic components, without the need for expensive and / or special tools such as: hot air machines, nozzles, tips, extractors, special gases, etc.
  • the printed circuit board suffers these damages in its substrate and conductive tracks due to the temperature applied by the nozzle and the desoldering station.
  • a process for the preparation of desoldering paste which comprises contacting a mixture:
  • Tin lead alloy With an approximate range of 25% to 41% mercury and another range of 59% to 75% Tin lead alloy in a range 63% (lead) .37% (tin) to 60% (lead) 40% (Tin).
  • the alloy is pulverized and 1750 grams mixed. of this alloy with 500 grs. from the following base.
  • Figure 3 shows the correct way to remove or remove the electronic component (5) from the printed circuit (6) which consists of gently prying at one end of the electronic component (5) with the tip (10) of a small screwdriver (9) of the watch type. Once this has been done, the electronic component (5) can be removed without damage to it and also without damage to the printed circuit (6).

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
  • Paints Or Removers (AREA)
  • Disintegrating Or Milling (AREA)

Abstract

The invention relates to a method of preparing a universal detacher for electronic components, comprising a desoldering paste for removing any type of electronic component. The invention comprises the alloying of tin, lead and mercury, together with zinc chloride, potato starch, petrolatum, camphor, eucalyptus and a colouring agent, which produces a desoldering paste for electronic components. The inventive desoldering paste can be used to retrieve any piece of electronic circuitry in full and without causing any damage.

Description

Removedor Universal de Componentes Electrónicos, Pasta Desoldadora para retirar componentes electrónicos de montaje superficial discretos y convencionales.Universal Electronic Component Remover, Desoldering Paste to remove discrete and conventional surface mount electronic components.
CAMPO DE LA INVENCIÓNFIELD OF THE INVENTION
Electrónica de Consumo, Industrial, Comunicaciones en General, Computación, Robótica y toda área electrónica que emplee componentes unidos por soldadura.Consumer Electronics, Industrial, General Communications, Computing, Robotics and any electronic area that uses components joined by welding.
OBJETO DE LA INVENCIÓNOBJECT OF THE INVENTION
Esta pasta desoldadora sirve para retirar componentes electrónicos, sin necesidad de herramientas costosas y/o especiales como: Maquinas de aire caliente, boquillas, puntas, extractores, gases especiales, etc.This desoldering paste is used to remove electronic components, without the need for expensive and / or special tools such as: hot air machines, nozzles, tips, extractors, special gases, etc.
ANTECEDENTESBACKGROUND
Actualmente los componentes electrónicos de montaje superficial se encuentran cada vez con mayor proporción en todas las aplicaciones de la electrónica, gracias a esto, la mayoría de los procesos involucrados en la fabricación y funcionamiento de los diferentes equipos electrónicos se ha agilizado considerablemente, trayendo como consecuencia grandes ventajas para los fabricantes que pueden ofrecer equipos mas compactos sin sacrificar sus prestaciones.Currently, the surface-mounted electronic components are increasingly in proportion to all applications of electronics, thanks to this, most of the processes involved in the manufacture and operation of the different electronic equipment has been considerably streamlined, bringing as a consequence great advantages for manufacturers that can offer more compact equipment without sacrificing their performance.
Sin embargo todas estas ventajas pueden revertirse en un momento dado, cuando el técnico reparador tenga que reemplazar algunos de estos componentes.However, all these advantages can be reversed at any given time, when the repair technician has to replace some of these components.
Hoy en día se realiza el reemplazo de componentes electrónicos en el banco de servicio empleando diferentes métodos como:Nowadays, electronic components are replaced at the service bank using different methods such as:
a) Estaciones desoldadoras de aire caliente.a) Hot air desoldering stations.
b) Boquillas especiales para estaciones desoldadoras las cuales tienen un tamaño determinado para cada tipo de componente que se va a retirar.b) Special nozzles for desoldering stations which have a specific size for each type of component to be removed.
c) Sopletes con mezcla de gases.c) Torches with gas mixture.
d) Pistolas de aire caliente.d) Hot air guns.
e) Puntas especiales.e) Special tips.
Todos estos métodos anteriores tienen las siguientes desventajas:All these previous methods have the following disadvantages:
a) Son Costososa) They are expensive
b) Se requiere de capacitación especial. c) Requieren de diferentes tipos de accesorios que encarecen su operación.b) Special training is required. c) They require different types of accessories that make their operation more expensive.
d) No cualquier técnico puede adquirir estas herramientas.d) Not any technician can acquire these tools.
e) Operan a altas temperaturas con lo que ponen en riesgo a los componentes electrónicos, tarjetas de circuito impreso que llevan a los componentes y a otros componentes periféricos.e) They operate at high temperatures, putting electronic components, printed circuit boards that carry components and other peripheral components at risk.
Por ejemplo: Para retirar un componente electrónico con una estación desoldadora se debe en primer lugar, utilizar una boquilla del tamaño y forma del componente, después, aplicar aire caliente a presión a una temperatura superior al grado de fusión de la soldadura la cual generalmente es de 360a C, esto calentaría la soldadura que se encuentra en las terminales y que la unen a las pistas del circuito impreso, pero que también calientan el cuerpo del componente a remover dejándolo inservible, además de que el flujo de aire caliente se expande y afecta a otros componentes que están alrededor del componente que estamos retirando.For example: To remove an electronic component with a desoldering station, it is first necessary to use a nozzle of the size and shape of the component, then apply hot air under pressure at a temperature higher than the degree of fusion of the weld which is generally from 360 to C, this would heat the solder that is in the terminals and that join it to the tracks of the printed circuit, but that also heat the body of the component to be removed leaving it unusable, in addition to the flow of hot air expanding and It affects other components that are around the component we are removing.
También la tarjeta de circuito impreso resiente estos daños en su sustrato y pistas conductivas debido a la temperatura aplicada por la boquilla y la estación desoldadora.Also the printed circuit board suffers these damages in its substrate and conductive tracks due to the temperature applied by the nozzle and the desoldering station.
DESCRIPCIÓN DETALLADA DE LA INVENCIÓN.DETAILED DESCRIPTION OF THE INVENTION.
Se describe un procedimiento para la preparación de pasta desoldadora que comprende poner en contacto una mezcla:A process for the preparation of desoldering paste is described which comprises contacting a mixture:
Con un rango aproximado de un 25% a un 41 % de mercurio y otro rango de un 59 % a un 75% de aleación de Plomo Estaño en un rango 63% (plomo).37% (estaño) a 60% (plomo) 40% (Estaño).With an approximate range of 25% to 41% mercury and another range of 59% to 75% Tin lead alloy in a range 63% (lead) .37% (tin) to 60% (lead) 40% (Tin).
La cual debe ser fundida en un crisol con un rango de temperatura de 1250aC a 1500aC, después precipitar hasta conseguir el estado sólido de la aleación.Which must be melted in a crucible with a temperature range of 1250 to C to 1500 to C, then precipitate until the solid state of the alloy is achieved.
Se pulveriza la aleación y se mezcla 1750 grs. de esta aleación con 500 grs. de la siguiente base.The alloy is pulverized and 1750 grams mixed. of this alloy with 500 grs. from the following base.
Cloruro de Zinc 81.5 grs., Fécula de papa 81.5 grs., Petrolato 141.12 grs., Alcanfor 2.94 grs. Eucalipto 1.47 grs. Ycolorante artificial 1.47 grs (Opcional)Zinc Chloride 81.5 grs., Potato starch 81.5 grs., Petrolato 141.12 grs., Camphor 2.94 grs. Eucalyptus 1.47 grs. Artificial Yolor 1.47 grs (Optional)
Dando como resultado la pasta desoldadora descrita anteriormente.Resulting in the desoldering paste described above.
BREVE DESCRIPCIÓN DE LOS DIBUJOSBRIEF DESCRIPTION OF THE DRAWINGS
a) En la figura 1 se puede ver que se toman aproximadamente 2.5 grs. de la mezcla (2) del recipiente (1) con la ayuda de un palillo de dientes (3). Esta mezcla deberá aplicarse directamente sobre todas las terminales (4) del componente electrónico (5) que se desea retirar del circuito impreso (6). b) En la figura 2 se puede ver la aplicación de una temperatura en un rango de 250°C a 300°C con la punta (7) de un cautín de lápiz (8). Este cautín deberá tener una potencia aproximada de 25 watts. La punta (7) del cautín (8) deberá de pasar de manera uniforme sobre todas las terminales (4) fundiendo la mezcla (2) con la soldadura que une las terminales (4) del componente electrónico (5) con el circuito impreso (6).a) In Figure 1 you can see that approximately 2.5 grs are taken. of the mixture (2) of the container (1) with the help of a toothpick (3). This mixture must be applied directly to all terminals (4) of the electronic component (5) that you want to remove from the printed circuit (6). b) In Figure 2 you can see the application of a temperature in a range of 250 ° C to 300 ° C with the tip (7) of a pencil soldering iron (8). This soldering iron should have an approximate power of 25 watts. The tip (7) of the soldering iron (8) must pass evenly over all terminals (4) by melting the mixture (2) with the solder that joins the terminals (4) of the electronic component (5) with the printed circuit ( 6).
c) En la figura 3 se ve la forma correcta para remover o quitar el componente electrónico (5) del circuito impreso (6) el cual consiste en hacer palanca suavemente en un extremo del componente electrónico (5) con la punta (10) de un desarmador (9) pequeño del tipo relojero. Una vez hecho lo anterior el componente electrónico (5) podrá ser retirado sin daños para este y también sin daños para el circuito impreso (6).c) Figure 3 shows the correct way to remove or remove the electronic component (5) from the printed circuit (6) which consists of gently prying at one end of the electronic component (5) with the tip (10) of a small screwdriver (9) of the watch type. Once this has been done, the electronic component (5) can be removed without damage to it and also without damage to the printed circuit (6).
Como complemento: los residuos de este proceso se retiran con rrialla desoldadora y se limpian con alcohol isopropilico . con este método es posible retirar y recuperar cualquier componente electrónico en un tiempo aproximado de 5 segundos.As a complement: the residues of this process are removed with desoldering iron and cleaned with isopropyl alcohol. With this method it is possible to remove and recover any electronic component in approximately 5 seconds.
MÉTODO PARA LLEVAR ACABO LAINVENCION.METHOD FOR CARRYING OUT THE INVENTION.
1.- Se toma aproximadamente 2.5 grs. De la mezcla y se aplica directamente sobre los terminales del componente que se va a retirar con la ayuda de un palillo de dientes (figura No. 1)1.- It takes approximately 2.5 grs. Mix the mixture and apply directly to the terminals of the component to be removed with the help of a toothpick (figure No. 1)
2.- se aplica una temperatura aproximada de entre 250aC y 300aC con la punta de un cautín de lápiz ( el cual debe ser de una potencia promedio de 25 watts) pasándolo uniformemente sobre la mezcla aplicada y sus terminales del componente que se va a retirar (figura No.2)2.- an approximate temperature of between 250 to C and 300 to C is applied with the tip of a pencil soldering iron (which must be of an average power of 25 watts) by passing it evenly over the applied mixture and its terminals of the component that is going to be removed (figure No.2)
3.- Una vez hecho lo anterior se hace palanca suavemente en un extremo del componente (figura No. 3) que se va a retirar y se podrá levantar sin daños para el componente ni para el circuito impreso, los residuos de esta operación se retiran con malla desoldadora y se pueden limpiar con alcohol isopropilico. Con este método es posible retirar cualquier componente en un tiempo aproximado de 5 segundos.3.- Once this is done, gently pry at one end of the component (figure No. 3) that is to be removed and can be lifted without damage to the component or the printed circuit, the residues of this operation are removed With desoldering mesh and can be cleaned with isopropyl alcohol. With this method it is possible to remove any component in an approximate time of 5 seconds.
NOTA: se procedió a retirar un componente de mismas características sin esta pasta desoldadora y el tiempo para retirar se incrementa en 30 minutos además de poner en riesgo al componente y al circuito impreso, en el cual dicho componente estaba soldado. NOTE: a component with the same characteristics was removed without this desoldering paste and the time to remove is increased by 30 minutes in addition to putting the component and the printed circuit at risk, in which said component was welded.

Claims

REIVINDICACIONESHabiendo descrito de manera suficiente y clara mi invención, considero como una novedad y por lo tanto reclamo como de mi exclusiva propiedad, lo contenido en las siguientes cláusulas: CLAIMS Having described my invention sufficiently and clearly, I consider it a novelty and therefore claim as my exclusive property, the content of the following clauses:
1.- Procedimiento para la preparación de la pasta desoldadora caracterizado en:1.- Procedure for the preparation of the desoldering paste characterized in:
a) Formar una aleación de Plomo, Estaño y Mercurio en los siguientes rangos:a) Form an alloy of Lead, Tin and Mercury in the following ranges:
Con un rango aproximado de un 25% a un 41 % de mercurio y otro rango de un 59 % a un 75% de aleación de Plomo Estaño en un rango 63% (plomo).37% (estaño) a 60% (plomo) 40% (Estaño). La cual debe ser fundida en un crisol con un rango de temperatura de 1250aC a 1500aC, después precipitar hasta conseguir el estado sólido de la aleación.With an approximate range of 25% to 41% mercury and another range of 59% to 75% Tin lead alloy in a range 63% (lead) .37% (tin) to 60% (lead) 40% (Tin). Which must be melted in a crucible with a temperature range of 1250 to C to 1500 to C, then precipitate until the solid state of the alloy is achieved.
b) Triturar finamente esta aleación hasta obtener un granulado uniforme.b) Finely crush this alloy until a uniform granulate is obtained.
b) Mezclar con la siguiente base:b) Mix with the following base:
Cloruro de Zinc 81.5 grs., Fécula de papa 81.5 grs., Petrolato 141.12 grs., Alcanfor 2.94 grs. Eucalipto 1.47 grs. Y colorante artificial 1.47 grs. (Opcional) En una proporción de 77.77% de aleación y un 22.23% de base.Zinc Chloride 81.5 grs., Potato starch 81.5 grs., Petrolato 141.12 grs., Camphor 2.94 grs. Eucalyptus 1.47 grs. And artificial coloring 1.47 grs. (Optional) In a proportion of 77.77% alloy and 22.23% base.
2.- El procedimiento de reivindicación con la cláusula 1 caracterizado en que se hace una aleación de Plomo Estaño en un rango 63% (plomo).37% (estaño) a 60% (plomo) 40% (Estaño).2.- The claim process with clause 1 characterized in that an alloy of Tin Lead is made in a range 63% (lead) .37% (tin) to 60% (lead) 40% (Tin).
3.- El procedimiento de reivindicación caracterizado en que se hace una aleación de Estaño Plomo 59% y Mercurio 41 % a una temperatura de 1500aC3.- The process of claim characterized in that an alloy of Tin Tin 59% and Mercury 41% is made at a temperature of 1500 to C
4.- El procedimiento de reivindicación caracterizado en precipitar la aleación que pasa de estado liquido a estado sólido.4. The claim process characterized in precipitating the alloy that passes from a liquid state to a solid state.
5.- El procedimiento de reivindicación caracterizado en pulverizar la aleación descrita en el inciso 45.- The claim process characterized in spraying the alloy described in item 4
6.- El proceso de reivindicación caracterizado en mezclar la aleación pulverizada con cloruro de Zinc 81.5 grs. Y Fécula de papa 81.5 grs.6.- The claim process characterized in mixing the powdered alloy with Zinc chloride 81.5 grams. And potato starch 81.5 grs.
7.- El procedimiento de reivindicación caracterizado en que se mezcla el resultado del incisoδcon Petrolato 141.12 grs, Alcanfor 2.94 grs. Eucalipto 1.47 grs. Colorante 1.47 grs opcional. 7.- The process of claim characterized in that the result of the subsection is mixed with Petrolatum 141.12 grs, Camp 2.94 grs. Eucalyptus 1.47 grs. Coloring 1.47 grs optional.
PCT/MX2004/000001 2003-01-09 2004-01-08 Universal remover for electronic components and unsoldering paste for removing surface mount electronics components WO2004062843A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
MXPA/A/2003/000255 2003-01-09
MXPA03000255A MXPA03000255A (en) 2003-01-09 2003-01-09 Universal detacher for electronic components, comprising a desoldering paste for removing standard, discrete, surface-mounted electronic components.

Publications (2)

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WO2004062843A2 true WO2004062843A2 (en) 2004-07-29
WO2004062843A3 WO2004062843A3 (en) 2004-09-23

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WO (1) WO2004062843A2 (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2299166A (en) * 1940-07-30 1942-10-20 Aluminum Co Of America Brazing light metals
FR1358800A (en) * 1963-05-30 1964-04-17 Method of manufacturing compressed powder welds
FR2189164A1 (en) * 1972-06-21 1974-01-25 Pilato Maurice Welding aluminium (alloys) to other metals - using a simple soldering iron using mercury contg solder
EP0433052A1 (en) * 1989-12-12 1991-06-19 International Business Machines Corporation Thermally dissipated soldering flux and method of use
EP0483763A2 (en) * 1990-10-31 1992-05-06 Hughes Aircraft Company Water-soluble soldering paste
US5378290A (en) * 1993-08-20 1995-01-03 Morgan Crucible Company Plc Flux

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6471594A (en) * 1987-09-10 1989-03-16 Furukawa Electric Co Ltd Corrosion resistant solder for heat exchanger

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2299166A (en) * 1940-07-30 1942-10-20 Aluminum Co Of America Brazing light metals
FR1358800A (en) * 1963-05-30 1964-04-17 Method of manufacturing compressed powder welds
FR2189164A1 (en) * 1972-06-21 1974-01-25 Pilato Maurice Welding aluminium (alloys) to other metals - using a simple soldering iron using mercury contg solder
EP0433052A1 (en) * 1989-12-12 1991-06-19 International Business Machines Corporation Thermally dissipated soldering flux and method of use
EP0483763A2 (en) * 1990-10-31 1992-05-06 Hughes Aircraft Company Water-soluble soldering paste
US5378290A (en) * 1993-08-20 1995-01-03 Morgan Crucible Company Plc Flux

Also Published As

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WO2004062843A3 (en) 2004-09-23
MXPA03000255A (en) 2005-02-14

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