WO2004050287A1 - Verfahren zur lötbefestigung miniaturisierter bauteile auf einer grundplatte - Google Patents
Verfahren zur lötbefestigung miniaturisierter bauteile auf einer grundplatte Download PDFInfo
- Publication number
- WO2004050287A1 WO2004050287A1 PCT/EP2003/013519 EP0313519W WO2004050287A1 WO 2004050287 A1 WO2004050287 A1 WO 2004050287A1 EP 0313519 W EP0313519 W EP 0313519W WO 2004050287 A1 WO2004050287 A1 WO 2004050287A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- base plate
- component
- metal layer
- soldering material
- area
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 50
- 238000005476 soldering Methods 0.000 title claims description 69
- 239000000463 material Substances 0.000 claims abstract description 113
- 229910000679 solder Inorganic materials 0.000 claims abstract description 80
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 4
- 239000002184 metal Substances 0.000 claims description 104
- 229910052751 metal Inorganic materials 0.000 claims description 104
- 239000000758 substrate Substances 0.000 claims description 16
- 230000005855 radiation Effects 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 5
- 230000008569 process Effects 0.000 description 7
- 239000000155 melt Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000007711 solidification Methods 0.000 description 4
- 230000008023 solidification Effects 0.000 description 4
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000002241 glass-ceramic Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000005297 pyrex Substances 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910007116 SnPb Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000012876 carrier material Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K33/00—Specially-profiled edge portions of workpieces for making soldering or welding connections; Filling the seams formed thereby
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10606—Permanent holder for component or auxiliary PCB mounted on a PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0475—Molten solder just before placing the component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present invention relates to a method for the high-precision fastening of miniaturized components on a base plate by means of a solder connection.
- the invention relates both to a laser soldering method for fixing micro-optical components on a base plate which is at least partially laser-transparent and coated with a metal layer, and to the base plate obtained by the method and a substrate for use in the method.
- WO 99/26754 describes a method for soldering miniaturized components onto a base plate.
- the base plate is at least partially coated with a grid-shaped metal pattern or a metal structure.
- the pattern structure can be formed by a grid of surface elements or a series of preferably perpendicularly intersecting strips which form a grid or any other structure which is characterized by a uniform alternation of metal areas and free areas.
- the sheet elements may take a rectangular shape, a square shape, a round shape or any shape suitable for use in this method.
- Sample step size should be at least one order of magnitude smaller than the dimensions of the side of the component to be fastened.
- the solder material is preferably on the side of the component or to be fastened optionally applied to the metal pattern of the base plate.
- the component is arranged above the base plate, the metal pattern and the solder material layer of the component or the solder material layer on the metal pattern and the side of the component being in a contact-free, vertically spaced opposite position. Then thermal energy is supplied from the uncoated side of the base plate for melting solder to the layer of solder material on the coated side on which the component is also arranged until the solder material drips, whereby the drop of solder material creates the space between the component and the base plate for mutual fastening crowded.
- the metallized pattern areas provide a mounting area for the solder material, while the metal-free areas allow a sufficient amount of energy to pass through the base plate to melt the solder material.
- the thermal energy is supplied, part of the energy thus passes through the uncoated areas of the metal pattern.
- the part that reaches the areas of the metal pattern coated with metal either heats up the metal layer or is reflected.
- the energy is preferably applied by means of a laser beam. Due to the lattice structure of the metal pattern on the base plate, the selection of a suitable light absorption coefficient for the metal layer is particularly problematic, since on the one hand the base plate must not overheat and on the other hand a certain minimum temperature is required to carry out the process.
- the metal pattern usually covers about 70% of the surface of the base plate with metal.
- Base plate high tensions and warpage after performing the soldering process.
- a parasitic local deformation can occur in the area of the soldered connection due to the high voltages.
- the known method described above enables accuracies of approximately 2 microns in the 6 degrees of freedom to be achieved. Especially for the assembly of components that Micro-optical elements contain or carry, but still higher assembly accuracy is required.
- the object of the present invention is to provide a method for fastening a miniaturized component, in particular having at least one micro-optical element, on a base plate by means of a soldered connection, which is characterized by an increased positional accuracy of the components compared to the known methods and a high level of economy.
- the base plate is coated with a metal layer by means of a solder connection to fasten a miniaturized component, in particular a micro-optical element, with its base area on a base plate, the metal layer being applied continuously over a large area and thus being uninterrupted.
- the base plate and the metal layer form a so-called substrate.
- a solder material is applied to the metal layer of the base plate.
- the component is then arranged above the base plate, the soldering material and the base area of the component being in a contact-free, vertically spaced opposite position which forms a space.
- the solder material By supplying thermal energy from the underside of the base plate in a region that is essentially limited to the fastening section, the solder material is caused to melt, so that a Drop formation of the molten solder material fills the space between the metal layer and the base of the component for mutual fastening - if necessary supported by lowering the component.
- the mutual fastening is produced by solidifying the solder material.
- the higher absorption coefficient of the metal layer causes a reduction in the laser beam power required for soldering by 40% compared to the method of WO 99/26754.
- a laser power of less than 10 W for 2 seconds is therefore sufficient to carry out the soldering.
- the laser beam is absorbed by the metal layer much better than in the known method. It is therefore possible to use alloys with a higher melting point.
- the absorption coefficient of the metal layer only has to be maximized in order to enable soldering on different types of base plates, whereas the soldering power of the laser only has to be adapted to the thermal expansion of the base plate.
- Fastening section in which the component is to be fastened with its base on the base plate, the metal layer is, however, essentially uninterrupted and continuously flat. It is feasible to apply several surface elements to a base plate in a pattern, which are each continuous and planar, but each surface element represents its own fastening section on which the component is to be fixed, so that the projection of the base surface of the component is completely different from that a surface element is covered.
- Continuous surface also does not necessarily mean a metal layer with an absolutely uniform layer thickness, but rather an essentially closed surface which essentially does not have any interruptions, apart from small interruptions, which arise in particular with thin layer thicknesses, but are not artificially produced in the form of a pattern structure , having.
- the solder material is in the form of a flat piece, for example the shape of a
- the component is then placed with its base over the soldering material.
- An energy source such as a laser, is aligned under the base plate and gives one Energy beam from the bottom of the base plate. The energy beam penetrates the base plate and hits the metal layer on the top of the base plate.
- the metal layer is heated locally to a limited extent and thus heats the soldering material, comparable to a hotplate.
- the solder material flat piece melts and takes on a drop-like shape in the liquefied state due to the surface tension of the solder.
- the solder material expands by a few hundred microns due to the heating. The drop shape and the expansion reduce the distance between the solder material and the base of the component. This results in the base surface of the component being wetted with solder material, so that a solder connection can be produced.
- the solder material is discrete in the form of a plurality of spaced-apart solder material elements, for example in the form of a, at least on a partial region of the metal layer of the base plate Dot pattern, or continuously applied in the form of an uninterrupted layer. This section is much larger than the actual fastening section, which an individual component takes up. If necessary, the entire metal layer is coated with the solder material.
- An energy source for example a laser, is aligned under the base plate, as in the above method, and emits an energy beam from the underside of the base plate. The energy beam penetrates the base plate and hits the metal layer.
- a solder material in the form of a flat piece in particular a truncated cylinder, is arranged on the base plate, the cross section of the flat piece being smaller than the cross section of the base area of the component, so that the projection of the base area of the component onto the metal layer of the base plate has the cross section of the flat piece - completely covered before melting.
- the base of the miniaturized component must have good wettability for solder material.
- This base surface can be flat or convex, for example in the form of a convex spherical surface section or a convex cylindrical surface section.
- a spherical base surface simplifies exact alignment of the component due to the symmetry.
- the base plate Since the energy is supplied from that side of the base plate which is opposite the side coated with the metal layer, and thus the energy is supplied for heating the metal layer through the base plate, it is necessary to choose a base plate which is essentially transparent to the wavelength of the energy applied. If a laser beam is used as an energy source, the base plate should have a high transparency for the laser beam wavelength.
- the coefficient of thermal expansion of the base plate and the metal layer must correspond to the extent that there is no tearing or swelling of the
- Metal layer should come during or after the application of energy. Ideally, that is
- Coefficient of thermal expansion of the base plate equal to that of the metal layer.
- the one used to make the base plate Material should be able to withstand high thermal loads, since when the energy is supplied, for example by means of laser or UV, part of the energy conducted through the base plate is inevitably absorbed by the base plate.
- the base plate is a material with poor thermal conductivity, for example glass, ceramic or glass ceramic, there is a high energy concentration in the locally limited area. In the event of an unsuitable choice of material, this could lead to material failure.
- the base plate that has a large coefficient of thermal expansion, since the orientation of the optical components changes if the base plate heats up. This would inevitably lead to optical errors in the optical system.
- Suitable materials for the base plate are, for example, glass,
- Sapphire ceramic, glass ceramic, silicon or pyrex.
- Other suitable materials are known from the prior art.
- the metal layer can be formed from several layers of different metals and alloys and optionally coated with an antioxidant, flux, etc.
- the alloy of the metal layer should preferably be low-oxidation and contain gold.
- a sapphire piece or a Pyrex wafer with a thickness of approximately 1 to 2 millimeters is selected as the base plate.
- the wafer is coated with a metal layer made of chrome, nickel and gold.
- the metal layer has a thickness of approximately 1 micron.
- Soldering material is selected, for example, SnPb or Sn96Ag4, which fills a gap between the metal layer and the base of the component of 0.2 to 0.5 millimeters.
- the shrinking of the soldering material during cooling necessarily causes the component to be vertically offset perpendicular to the base plate. It has good repeatability and forms a function from the gap between the base plate and the base surface of the component. To compensate for this vertical shrinkage, it is possible to position the component accordingly higher and to take the shrinkage into account when prepositioning.
- the mounting accuracy is further increased in that, especially in the case of an inclined component, the cross section of the soldering material, for example the diameter of the flat piece, is reduced, so that this cross section is smaller than that of the base area of the component.
- the diameter d of the flat solder piece is smaller than that
- Diameter D of the base of the component At the latest after the solder material has solidified, the diameter of the solidified solder material is smaller than the diameter D of the base area. This results in lower asymmetries during solidification of the soldering material, which can result in particular from the fact that the soldering material cools much faster at the transverse surfaces than in the middle. Especially when installing a component at an incline, it is therefore advantageous to create a soldered connection with little soldering material, since in this case shrinkage does not have such an effect. In addition, fewer tensions occur in this case, which result from the cooling and the associated shrinkage, so that the manufacturing accuracy is further increased.
- the method is particularly suitable for use in an automatic, flux-free laser soldering process, since essentially all the necessary steps can be carried out by handling robots that have highly precise position sensors. In this way, each component can be freely positioned in the room with high precision in all 6 degrees of freedom.
- the free positionability which is not necessarily limited by predetermined areas on the base plate, is a further advantage of the
- the entire base plate is coated with the metal layer, it is possible to position the component in any position on the base plate either by freely positioning a flat piece of solder material or in the case of a layer of solder material.
- micro-optical components which is aligned in all 6 degrees of freedom.
- the miniaturized component can thus be used as a holder for a micro-optical element, e.g. a lens, an optical fiber, a laser diode, etc., serve.
- a micro-optical element e.g. a lens, an optical fiber, a laser diode, etc.
- Such micro-optical components typically have a diameter of the order of 2.6 mm and a height of 3.5 mm.
- a possible example of a holding device for a micro-optical component can be found in EP 1127287 B1.
- a further embodiment of the invention represents a base plate with a plurality of miniaturized components arranged within a component area of the base plate, each of which has at least one micro-optical element. At least the component area of the base plate is coated on the top with at least one metal layer, the metal layer on the top of the base plate at least in the component area applied continuously and is therefore uninterrupted. The components are fastened to the base with a solder connection on the metal layer.
- the base plate is transparent to laser radiation.
- the component area is a partial area of the base plate on which several parts are arranged on the coherent metal layer.
- the metal layer is applied continuously over the entire surface of the base plate and is therefore essentially uninterrupted. In this case, the component area is formed by the entire base plate.
- the solder material of the solder joint preferably has a concave outer surface.
- At least one of the several components comprises a holder for holding a support part, to which the at least one micro-optical element is fixed, the holder being connected to the support part and the support part being connected to the micro-optical element by means of soldering points.
- a holder is also described in EP 1127287 B1.
- the substrate for use in the method according to the invention is formed by a base plate which is transparent to laser radiation and which is coated on one side with at least one metal layer which is applied substantially continuously over the entire side and is therefore essentially uninterrupted. If necessary, the substrate is coated with a layer of soldering material, which is continuously applied to at least a portion of the metal layer of the base plate, so that the layer of soldering material in the portion is uninterrupted. Alternatively, the layer of solder material is in one at least in a partial area on the metal layer of the base plate Pattern of a plurality of spaced solder elements applied.
- Fig. La, lb the arrangement of a component, a soldering material formed as a small flat piece and a substrate before (Fig. La) and after (Fig. Lb) the establishment of the solder connection;
- FIG. 2a, 2b the arrangement of a component, a soldering material formed as a large flat piece and a substrate before (FIG. 2a) and after (FIG. 2b) the making of the soldering connection;
- FIG. 5a, 5b a component and a substrate with a layer of solder material applied continuously over a wide area before (FIG. 5a) and after (FIG. 5b) the making of the soldered connection; and
- Fig. 6 shows a component that a holder for holding a
- Support part on which a micro-optical element is fixed comprises.
- FIGS. 1 a and 2 a each show a base plate 1 with an upper side 8 and a lower side 9 in a state before a soldered connection is made.
- the base plate 1 which is transparent for laser radiation, is coated on its upper side 8 with a metal layer 5, which is applied continuously over a large area, so that it is essentially uninterrupted.
- the base plate 1 and the metal layer 5 form a so-called substrate.
- the fastening section 7 is the section on which a single component 2 is to be fastened or is fastened.
- a miniaturized component 2 which carries a micro-optical element 3, is arranged above the fastening section 7 of the base plate 1 in such a way that the soldering material 6a, 6b and a convex base surface 4 of the component 2 are in a contact-free, vertically spaced opposite position, forming a vertical space ,
- the component 2 is positioned and held with high precision by means of a robot station (not shown), the vertical shrinkage to be expected being taken into account.
- the soldering material 6a designed as a flat piece has a diameter d1 that is smaller than the diameter D of the base area 4 of the component 2, so that dl ⁇ D, whereas the unmelted soldering material 6b in FIG.
- the metal layer 5 is strongly heated, at least within the fastening section 7, and acts like a kind of hotplate, so that the solder material 6a , 6b melts, forms a drop due to the surface tension, wets the base area 4, closes the intermediate space and thus creates a connection between the metal layer 5 and the base area 4.
- the laser radiation 11 is then deactivated again and the solidification of the molten solder material 6a ', 6b' is awaited.
- Figures lb and 2b show the state after making this connection with the molten solder 6a ', 6b'.
- shrinking of the soldering material 6a ', 6b' reduces the vertical distance between the component 2 and the base plate 1.
- the diameter of the molten solder 6a ', 6b' is smaller than D.
- the molten solder 6a 'in FIG. 1b here has a smaller diameter than the molten solder 6b' in FIG. 2b.
- the side surface of the molten solder 6a ', 6b' has a concave shape.
- a component 2 and a substrate are made from
- the patterned solder layer 6c is on the whole
- a locally delimited laser beam 11 melts several soldering material elements 6c ′′ of the soldering material layer 6c into a drop of soldering material 6c ′, which, as in FIGS. 1a / 1b and 2a / 2b, the connection between the base area 4 of the component 2 and the
- Metal layer 5 of the base plate 1 creates. 5a and 5b, on the other hand, show a component 2 and a substrate with a layer of solder material 6d applied continuously over a surface area before (FIG. 5a) and after (FIG. 5b) the making of the soldered connection.
- a laser beam 11 melts part of the
- Soldering material 6d which forms a drop of soldering material 6d 'and establishes the connection between the component 2 and the base plate 1.
- FIG. 6 shows an embodiment of a component 2 which comprises a holder 2 'for holding a support part 2''to which a micro-optical element 3 is fixed, the holder 2' with the support part 2 '' and the support part 2 ''connected to the micro-optical element 3 by means of solder points 10 are.
- the component 2 has a base area 4.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
Claims
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03780095A EP1567300B1 (de) | 2002-11-29 | 2003-12-01 | Verfahren zur Lötbefestigung miniaturisierter Bauteile auf einer Grundplatte, eine Grundplatte und ein Substrat |
JP2004556253A JP2006507946A (ja) | 2002-11-29 | 2003-12-01 | 小型の部品を基板に半田付けする方法 |
US10/536,251 US7504604B2 (en) | 2002-11-29 | 2003-12-01 | Method for soldering miniaturized components to a baseplate |
CA2507663A CA2507663C (en) | 2002-11-29 | 2003-12-01 | Method for soldering miniaturized components to a baseplate |
DE50303879T DE50303879D1 (de) | 2002-11-29 | 2003-12-01 | Verfahren zur Lötbefestigung miniaturisierter Bauteile auf einer Grundplatte, eine Grundplatte und ein Substrat |
AU2003288207A AU2003288207B2 (en) | 2002-11-29 | 2003-12-01 | Method for soldering miniaturised components to a base plate |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02026648.2 | 2002-11-29 | ||
EP02026648A EP1424156A1 (de) | 2002-11-29 | 2002-11-29 | Verfahren zum Löten von Miniaturbauteilen auf eine Trägerplatte |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004050287A1 true WO2004050287A1 (de) | 2004-06-17 |
Family
ID=32241307
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2003/013519 WO2004050287A1 (de) | 2002-11-29 | 2003-12-01 | Verfahren zur lötbefestigung miniaturisierter bauteile auf einer grundplatte |
Country Status (9)
Country | Link |
---|---|
US (1) | US7504604B2 (de) |
EP (2) | EP1424156A1 (de) |
JP (1) | JP2006507946A (de) |
CN (1) | CN100430172C (de) |
AT (1) | ATE329717T1 (de) |
AU (1) | AU2003288207B2 (de) |
CA (1) | CA2507663C (de) |
DE (1) | DE50303879D1 (de) |
WO (1) | WO2004050287A1 (de) |
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EP1747835A1 (de) * | 2005-07-27 | 2007-01-31 | Leica Geosystems AG | Verfahren zur hochpräzisen Befestigung eines miniaturisierten Bauteils auf einer Trägerplatte |
DE102017201679A1 (de) | 2017-02-02 | 2018-08-02 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Fügen von Bauteilen auf eine Trägerstruktur unter Einsatz von elektromagnetischer Strahlung |
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DE102009017659A1 (de) * | 2009-04-16 | 2010-10-28 | Schott Ag | Verfahren zur leitenden Verbindung eines Bauelementes auf einem transprenten Substrat |
ES2382862B1 (es) | 2009-10-26 | 2013-05-08 | BSH Electrodomésticos España S.A. | Encimera de cocción con al menos dos elementos de calentamiento y una disposición de la electrónica de potencia |
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JP2015106663A (ja) * | 2013-11-29 | 2015-06-08 | 住友電工デバイス・イノベーション株式会社 | 配線基板の接続方法、および配線基板の実装構造 |
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CN104842070B (zh) * | 2015-05-13 | 2017-10-17 | 北京万恒镭特机电设备有限公司 | 激光共晶焊接装置及其方法 |
DE102018102132B3 (de) | 2018-01-31 | 2019-01-03 | Tdk Electronics Ag | Verfahren zur Befestigung eines Kontaktelements bei einem elektrischen Bauteil und elektrisches Bauteil mit Kontaktelement |
CN113681522A (zh) * | 2021-08-23 | 2021-11-23 | 安徽光智科技有限公司 | 一种光学元件装配固定的方法 |
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-
2003
- 2003-12-01 AT AT03780095T patent/ATE329717T1/de not_active IP Right Cessation
- 2003-12-01 DE DE50303879T patent/DE50303879D1/de not_active Expired - Lifetime
- 2003-12-01 US US10/536,251 patent/US7504604B2/en active Active
- 2003-12-01 AU AU2003288207A patent/AU2003288207B2/en not_active Ceased
- 2003-12-01 CA CA2507663A patent/CA2507663C/en not_active Expired - Fee Related
- 2003-12-01 CN CNB2003801045334A patent/CN100430172C/zh not_active Expired - Fee Related
- 2003-12-01 WO PCT/EP2003/013519 patent/WO2004050287A1/de active IP Right Grant
- 2003-12-01 JP JP2004556253A patent/JP2006507946A/ja active Pending
- 2003-12-01 EP EP03780095A patent/EP1567300B1/de not_active Expired - Lifetime
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US6353202B1 (en) * | 1997-07-23 | 2002-03-05 | Infineon Technologies Ag | Apparatus and method for producing a chip-substrate connection |
WO1999026754A1 (de) * | 1997-11-20 | 1999-06-03 | Leica Geosystems Ag | Verfahren zur lötbefestigung miniaturisierter bauteile auf einer grundplatte |
US6394158B1 (en) * | 1997-11-20 | 2002-05-28 | Pac Tech Packaging Technologies Gmbh | Method and device for thermally bonding connecting surfaces of two substrates |
US6284998B1 (en) * | 1998-06-12 | 2001-09-04 | Visteon Global Technologies, Inc. | Method for laser soldering a three dimensional component |
WO2001037019A2 (en) * | 1999-11-15 | 2001-05-25 | Axsun Technologies, Inc. | Optical fiber active alignment process using support device with plastic deformation |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1747835A1 (de) * | 2005-07-27 | 2007-01-31 | Leica Geosystems AG | Verfahren zur hochpräzisen Befestigung eines miniaturisierten Bauteils auf einer Trägerplatte |
US7759604B2 (en) | 2005-07-27 | 2010-07-20 | Leica Geosystems Ag | Method for high-precision fixing of a miniaturized component on a support plate |
DE102017201679A1 (de) | 2017-02-02 | 2018-08-02 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Fügen von Bauteilen auf eine Trägerstruktur unter Einsatz von elektromagnetischer Strahlung |
WO2018141568A1 (de) | 2017-02-02 | 2018-08-09 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. | Verfahren zum fügen von bauteilen auf eine trägerstruktur unter einsatz von elektromagnetischer strahlung |
Also Published As
Publication number | Publication date |
---|---|
CA2507663C (en) | 2011-09-13 |
EP1567300B1 (de) | 2006-06-14 |
DE50303879D1 (de) | 2006-07-27 |
JP2006507946A (ja) | 2006-03-09 |
US20060124614A1 (en) | 2006-06-15 |
EP1424156A1 (de) | 2004-06-02 |
AU2003288207B2 (en) | 2008-06-12 |
CA2507663A1 (en) | 2004-06-17 |
CN1717292A (zh) | 2006-01-04 |
EP1567300A1 (de) | 2005-08-31 |
US7504604B2 (en) | 2009-03-17 |
AU2003288207A1 (en) | 2004-06-23 |
ATE329717T1 (de) | 2006-07-15 |
CN100430172C (zh) | 2008-11-05 |
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