WO2004049400A3 - Methods for applying thermally conductive compounds utilizing piezo electric jet deposition - Google Patents

Methods for applying thermally conductive compounds utilizing piezo electric jet deposition Download PDF

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Publication number
WO2004049400A3
WO2004049400A3 PCT/US2003/037421 US0337421W WO2004049400A3 WO 2004049400 A3 WO2004049400 A3 WO 2004049400A3 US 0337421 W US0337421 W US 0337421W WO 2004049400 A3 WO2004049400 A3 WO 2004049400A3
Authority
WO
WIPO (PCT)
Prior art keywords
methods
piezo electric
thermally conductive
jet deposition
conductive compounds
Prior art date
Application number
PCT/US2003/037421
Other languages
French (fr)
Other versions
WO2004049400A2 (en
Inventor
Robert A Rauch
Original Assignee
Henkel Corp
Robert A Rauch
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Corp, Robert A Rauch filed Critical Henkel Corp
Priority to AU2003294472A priority Critical patent/AU2003294472A1/en
Publication of WO2004049400A2 publication Critical patent/WO2004049400A2/en
Publication of WO2004049400A3 publication Critical patent/WO2004049400A3/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)

Abstract

Methods are provided for precisely depositing layers of thermally-conductive material using ink jet deposition. A thermally-conductive material (28) having phase-change properties is heated until liquified (26) and then deposited in a desired pattern having a desired thickness on a substrate (30), particularly for heat-dissipating components such as heat sinks and the like, utilizing piezo electric ink jet printer heads (16).
PCT/US2003/037421 2002-11-21 2003-11-21 Methods for applying thermally conductive compounds utilizing piezo electric jet deposition WO2004049400A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003294472A AU2003294472A1 (en) 2002-11-21 2003-11-21 Methods for applying thermally conductive compounds utilizing piezo electric jet deposition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US42862602P 2002-11-21 2002-11-21
US60/428,626 2002-11-21

Publications (2)

Publication Number Publication Date
WO2004049400A2 WO2004049400A2 (en) 2004-06-10
WO2004049400A3 true WO2004049400A3 (en) 2004-07-15

Family

ID=32393436

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/037421 WO2004049400A2 (en) 2002-11-21 2003-11-21 Methods for applying thermally conductive compounds utilizing piezo electric jet deposition

Country Status (2)

Country Link
AU (1) AU2003294472A1 (en)
WO (1) WO2004049400A2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5510823A (en) * 1991-03-07 1996-04-23 Fuji Xerox Co., Ltd. Paste for resistive element film

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5510823A (en) * 1991-03-07 1996-04-23 Fuji Xerox Co., Ltd. Paste for resistive element film

Also Published As

Publication number Publication date
WO2004049400A2 (en) 2004-06-10
AU2003294472A1 (en) 2004-06-18
AU2003294472A8 (en) 2004-06-18

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