AU2003294472A1 - Methods for applying thermally conductive compounds utilizing piezo electric jet deposition - Google Patents
Methods for applying thermally conductive compounds utilizing piezo electric jet depositionInfo
- Publication number
- AU2003294472A1 AU2003294472A1 AU2003294472A AU2003294472A AU2003294472A1 AU 2003294472 A1 AU2003294472 A1 AU 2003294472A1 AU 2003294472 A AU2003294472 A AU 2003294472A AU 2003294472 A AU2003294472 A AU 2003294472A AU 2003294472 A1 AU2003294472 A1 AU 2003294472A1
- Authority
- AU
- Australia
- Prior art keywords
- methods
- thermally conductive
- piezo electric
- conductive compounds
- jet deposition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 150000001875 compounds Chemical class 0.000 title 1
- 238000001540 jet deposition Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
- H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US42862602P | 2002-11-21 | 2002-11-21 | |
| US60/428,626 | 2002-11-21 | ||
| PCT/US2003/037421 WO2004049400A2 (en) | 2002-11-21 | 2003-11-21 | Methods for applying thermally conductive compounds utilizing piezo electric jet deposition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| AU2003294472A1 true AU2003294472A1 (en) | 2004-06-18 |
| AU2003294472A8 AU2003294472A8 (en) | 2004-06-18 |
Family
ID=32393436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2003294472A Abandoned AU2003294472A1 (en) | 2002-11-21 | 2003-11-21 | Methods for applying thermally conductive compounds utilizing piezo electric jet deposition |
Country Status (2)
| Country | Link |
|---|---|
| AU (1) | AU2003294472A1 (en) |
| WO (1) | WO2004049400A2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5510823A (en) * | 1991-03-07 | 1996-04-23 | Fuji Xerox Co., Ltd. | Paste for resistive element film |
-
2003
- 2003-11-21 AU AU2003294472A patent/AU2003294472A1/en not_active Abandoned
- 2003-11-21 WO PCT/US2003/037421 patent/WO2004049400A2/en not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| WO2004049400A2 (en) | 2004-06-10 |
| WO2004049400A3 (en) | 2004-07-15 |
| AU2003294472A8 (en) | 2004-06-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |