WO2004038052B1 - Friction-resistant alloy for use as a bearing - Google Patents

Friction-resistant alloy for use as a bearing

Info

Publication number
WO2004038052B1
WO2004038052B1 PCT/US2003/033430 US0333430W WO2004038052B1 WO 2004038052 B1 WO2004038052 B1 WO 2004038052B1 US 0333430 W US0333430 W US 0333430W WO 2004038052 B1 WO2004038052 B1 WO 2004038052B1
Authority
WO
WIPO (PCT)
Prior art keywords
friction
resistant alloy
bearing
alloy
new
Prior art date
Application number
PCT/US2003/033430
Other languages
French (fr)
Other versions
WO2004038052A1 (en
Inventor
John P Laughlin
David V Kyaw
Original Assignee
Fry Metals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fry Metals Inc filed Critical Fry Metals Inc
Priority to EP03777777A priority Critical patent/EP1554410A4/en
Priority to AU2003286574A priority patent/AU2003286574A1/en
Publication of WO2004038052A1 publication Critical patent/WO2004038052A1/en
Publication of WO2004038052B1 publication Critical patent/WO2004038052B1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C33/00—Parts of bearings; Special methods for making bearings or parts thereof
    • F16C33/02—Parts of sliding-contact bearings
    • F16C33/04—Brasses; Bushes; Linings
    • F16C33/06—Sliding surface mainly made of metal
    • F16C33/14—Special methods of manufacture; Running-in
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C2223/00—Surface treatments; Hardening; Coating
    • F16C2223/30—Coating surfaces
    • F16C2223/42—Coating surfaces by spraying the coating material, e.g. plasma spraying
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C2223/00—Surface treatments; Hardening; Coating
    • F16C2223/30—Coating surfaces
    • F16C2223/46—Coating surfaces by welding, e.g. by using a laser to build a layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Sliding-Contact Bearings (AREA)

Abstract

A friction-resistant alloy being a tin matrix containing copper, antimony, and between about 0.10% and about 2% by weight bismuth; and an industrial bearing component having this alloy on a wear surface.

Claims

28
AMENDED CLAIMS
[received by the International Bureau on 22 April 2004 (22.04.2004); new claim 69 added; original claims 1-68 unchanged (1 page)]
69. (New) A friction-resistant alloy for use as a bearing surface, the alloy consists of, by approximate weight % :
Sb 3 to 15%
Cu 0.5 to 10%
Bi 0.1 to 2%
Ni 0.1 to 0.5%
Sn remainder wherein the overall trace elemental composition is preferably maintained below about 0.75%, and the trace elemental composition of each of lead, cadmium, arsenic, silver and zinc is individually held below 0.35%.
PCT/US2003/033430 2002-10-22 2003-10-22 Friction-resistant alloy for use as a bearing WO2004038052A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP03777777A EP1554410A4 (en) 2002-10-22 2003-10-22 Friction-resistant alloy for use as a bearing
AU2003286574A AU2003286574A1 (en) 2002-10-22 2003-10-22 Friction-resistant alloy for use as a bearing

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/277,571 US20040076541A1 (en) 2002-10-22 2002-10-22 Friction-resistant alloy for use as a bearing
US10/277,571 2002-10-22

Publications (2)

Publication Number Publication Date
WO2004038052A1 WO2004038052A1 (en) 2004-05-06
WO2004038052B1 true WO2004038052B1 (en) 2004-06-24

Family

ID=32093323

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/033430 WO2004038052A1 (en) 2002-10-22 2003-10-22 Friction-resistant alloy for use as a bearing

Country Status (4)

Country Link
US (1) US20040076541A1 (en)
EP (1) EP1554410A4 (en)
AU (1) AU2003286574A1 (en)
WO (1) WO2004038052A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7499921B2 (en) * 2004-01-07 2009-03-03 International Business Machines Corporation Streaming mechanism for efficient searching of a tree relative to a location in the tree
JP4377788B2 (en) * 2004-09-27 2009-12-02 株式会社神戸製鋼所 Cu alloy for semiconductor wiring, manufacturing method of Cu alloy wiring, semiconductor device having Cu alloy wiring obtained by the manufacturing method, and sputtering target for forming Cu alloy wiring of semiconductor
US7227149B2 (en) * 2004-12-30 2007-06-05 General Electric Company Method and system for positron emission tomography image reconstruction
JP4275656B2 (en) 2005-09-02 2009-06-10 住友金属工業株式会社 Threaded joints for steel pipes
US20080037213A1 (en) * 2006-08-08 2008-02-14 Edgar Diego Haren Computer stand with cooling mechanism
AT505664B1 (en) * 2008-03-03 2009-03-15 Miba Gleitlager Gmbh SLIDE BEARING ALLOY OF WHITE METAL ON TIN BASIS
AT509112B1 (en) * 2009-12-10 2011-09-15 Miba Gleitlager Gmbh SLIDING LAYER
CN102248320B (en) * 2011-07-06 2013-06-05 东南大学 Stannum-based composite babbit metal and method for preparing welding wire

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US122901A (en) * 1872-01-23 Improvement in alloys to imitate silver
US71479A (en) * 1867-11-26 Improved alloys poe making plates aid sheets
US1078114A (en) * 1912-08-30 1913-11-11 Charles Willmott Solder for aluminium.
US1497011A (en) * 1923-01-13 1924-06-10 Gustav F Gerdts Method of treating metals
US1934875A (en) * 1931-06-04 1933-11-14 Nicodemo Felix Alloy, method of making the same, and article made therefrom
US3607253A (en) * 1969-12-24 1971-09-21 Ibm Tin base solder alloy
US4193530A (en) * 1978-05-16 1980-03-18 The Continental Group, Inc. Method of soldering tinplate can bodies with a sulfur resistant tin-alloy solder
GB8724311D0 (en) * 1987-10-16 1987-11-18 Imi Yorkshire Fittings Fittings
US4806309A (en) * 1988-01-05 1989-02-21 Willard Industries, Inc. Tin base lead-free solder composition containing bismuth, silver and antimony
JP2985292B2 (en) * 1990-11-30 1999-11-29 大豊工業株式会社 Copper bearing alloy
US5122207A (en) * 1991-07-22 1992-06-16 General Motors Corporation Hypo-eutectic aluminum-silicon-copper alloy having bismuth additions
US5122208A (en) * 1991-07-22 1992-06-16 General Motors Corporation Hypo-eutectic aluminum-silicon alloy having tin and bismuth additions
JP2679920B2 (en) * 1992-09-28 1997-11-19 大同メタル工業株式会社 Sliding bearing material with overlay with excellent anti-seizure property
US5330712A (en) * 1993-04-22 1994-07-19 Federalloy, Inc. Copper-bismuth alloys
US5328660A (en) * 1993-06-16 1994-07-12 International Business Machines Corporation Lead-free, high temperature, tin based multi-component solder
US5393489A (en) * 1993-06-16 1995-02-28 International Business Machines Corporation High temperature, lead-free, tin based solder composition
US5411703A (en) * 1993-06-16 1995-05-02 International Business Machines Corporation Lead-free, tin, antimony, bismtuh, copper solder alloy
US5435968A (en) * 1994-01-21 1995-07-25 Touchstone, Inc. A lead-free solder composition
DE4440477C1 (en) * 1994-11-12 1996-01-11 Elektro Thermit Gmbh Bearing alloy based on tin@
US5851482A (en) * 1996-03-22 1998-12-22 Korea Institute Of Machinery & Metals Tin-bismuth based lead-free solder for copper and copper alloys
JP3815865B2 (en) * 1997-09-02 2006-08-30 千住金属工業株式会社 Lead-free solder alloy
JP3292239B2 (en) * 1998-03-30 2002-06-17 輸出アンチモニー工業協同組合 Tin alloy for casting
GB9808981D0 (en) * 1998-04-27 1998-06-24 Itri Ltd Tin alloy wheel balancing weights
JP2000153388A (en) * 1998-09-14 2000-06-06 Murata Mfg Co Ltd Soldered article
US6197253B1 (en) * 1998-12-21 2001-03-06 Allen Broomfield Lead-free and cadmium-free white metal casting alloy
US6176947B1 (en) * 1998-12-31 2001-01-23 H-Technologies Group, Incorporated Lead-free solders
DE10145389C2 (en) * 2001-09-14 2003-07-24 Forschungsvereinigung Antriebs Plain bearing alloy based on Sn

Also Published As

Publication number Publication date
AU2003286574A1 (en) 2004-05-13
EP1554410A4 (en) 2006-08-09
WO2004038052A1 (en) 2004-05-06
US20040076541A1 (en) 2004-04-22
EP1554410A1 (en) 2005-07-20

Similar Documents

Publication Publication Date Title
EP0795693A3 (en) Copper-alloy and sliding bearing having improved seizure resistance
RU2003114304A (en) Lead Free Solder (OPTIONS)
TW200706662A (en) Cu-Ni-Si-Zn-Sn based alloy strip excellent in thermal peeling resistance of Tin plating, and Tin plated strip thereof
EP1468777A8 (en) Lead free solder
EP1705258A3 (en) Composition, methods and devices for high temperature lead-free solder
TW363334B (en) Lead-free, tin based solder composition
MY114565A (en) Lead-free solder alloys
CA2458723A1 (en) A lead-free copper alloy and its use
WO2004038052B1 (en) Friction-resistant alloy for use as a bearing
EP1614500A4 (en) Solder paste and printed board
DE60105987D1 (en) Gold alloys and master alloys for their manufacture
ATE431435T1 (en) CORROSION-RESISTANT COPPER ALLOY WITH MAGNESIUM AND USE THEREOF
WO2003026828A3 (en) Improved compositions, methods and devices for high temperature lead-free solder
MX2021009104A (en) Solder alloy.
TW200632115A (en) Alloy target for conductive film or its protection layer and manufacturing method thereof
WO2003064102A8 (en) Solder metal, soldering flux and solder paste
TW371276B (en) A lead-free tin-silver-based soldering alloy
HK1096628A1 (en) Pb-free solder alloy compositions comprising essentially tin (sn), silver (ag), copper (cu), and phosphorus (p)
JPH10330868A (en) Copper-base sintered alloy
EP1707302A3 (en) Pb-free solder alloy compositions comprising essentially tin (Sn), silver (Ag), copper (Cu), and phosphorus (P)
WO2011068357A3 (en) Brazing alloy
JPS5776142A (en) Abrasion-resistant copper-tin alloy
CN100566912C (en) No-lead soft soldering
WO2007045191A3 (en) Lead-free solder alloy
ATE353981T1 (en) COPPER ALLOY HAVING EXCELLENT CORROSION RESISTANCE AND DEZINCIZATION RESISTANCE AND A METHOD FOR PRODUCING THE SAME

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

B Later publication of amended claims

Effective date: 20040422

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2003777777

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 2003777777

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP

WWW Wipo information: withdrawn in national office

Ref document number: 2003777777

Country of ref document: EP