WO2004022662A1 - A method and a device for bonding two plate-shaped objects - Google Patents

A method and a device for bonding two plate-shaped objects Download PDF

Info

Publication number
WO2004022662A1
WO2004022662A1 PCT/IB2003/003423 IB0303423W WO2004022662A1 WO 2004022662 A1 WO2004022662 A1 WO 2004022662A1 IB 0303423 W IB0303423 W IB 0303423W WO 2004022662 A1 WO2004022662 A1 WO 2004022662A1
Authority
WO
WIPO (PCT)
Prior art keywords
objects
cure chamber
heating element
carrier
plate
Prior art date
Application number
PCT/IB2003/003423
Other languages
French (fr)
Inventor
Henricus G. R. Maas
Theodorus M. Michielsen
Richard J. M. Waelen
Original Assignee
Koninklijke Philips Electronics N.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics N.V. filed Critical Koninklijke Philips Electronics N.V.
Priority to DE60313980T priority Critical patent/DE60313980T2/en
Priority to EP03793937A priority patent/EP1537184B1/en
Priority to JP2004533704A priority patent/JP4949626B2/en
Priority to AU2003250435A priority patent/AU2003250435A1/en
Priority to US10/526,191 priority patent/US7271075B2/en
Publication of WO2004022662A1 publication Critical patent/WO2004022662A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/14—Glass
    • C09J2400/143—Glass in the substrate

Definitions

  • the invention relates to a method an a device for bonding two plate-shaped objects with an adhesive which is cured by ultraviolet light irradiation and by heating.
  • Such method can be used in the manufacture of a so-called SOA-semiconductor device (Silicon- On-Anything-semiconductor device) for bonding a disc-shaped semiconductor substrate to a disc-shaped insulating carrier, such as a glass carrier.
  • SOA-semiconductor device Silicon- On-Anything-semiconductor device
  • US-A-6051481 discloses a method for dispersing an adhesive between two plate-shaped objects, whereby the two objects are rotated while being pressed together, so that the adhesive between the two objects spreads homogeneously under the influence of the centrifugal force acting on the adhesive. After adhesive is applied between two objects, according to US-A-6051481 or in any other way, it may be required to cure the adhesive by ultraviolet light irradiation and/or by heating, depending on the type of adhesive.
  • the invention relates to a method whereby both treatments, light irradiation as well as heating, are applied.
  • both the irradiation lamp and the heating element must be present in the cure chamber, for irradiating and for heating the adhesive between the two objects.
  • the bonded objects may be warped or curled because during the curing treatment the temperature of the objects is different (higher) from the temperature of the bonded objects afterwards.
  • the object of the invention is to decrease the tendency of warping or curling of the bonded plate-shaped objects.
  • the two plate-shaped objects with the adhesive in between are transported into the cure chamber - comprising an ultraviolet lamp and a heating element - whereby a movable heat-shielding member is temporary present between the objects and the heating element during at least the first part of the irradiation treatment.
  • the adhesive will bond together the two plate-shaped objects to a certain degree before the temperature of the objects will substantially increase.
  • the movable heat-shielding member is positioned outside the cure chamber during a part of the cure treatment, so that the heat-shielding member can cool down.
  • the heat-shielding member is a portion of (or attached to) a carrier for transporting the said objects into the cure chamber. Thereby the objects and the heat-shielding member will enter into the cure chamber at the same time. Thereupon the carrier may remain in the cure chamber for at least 30 seconds, preferably for more than 60 seconds, and subsequently the carrier is removed out of the cure chamber while the said objects remain in the cure chamber for at least 60 seconds. Preferably, the said objects are moved in the direction of the heating element after the carrier has been removed out of the cure chamber, so that the objects can be heated quickly to the desired temperature.
  • the method for bonding two plate-shaped objects with an adhesive which is cured by ultraviolet light irradiation and by heating comprises the following steps: (a) moving two plate-shaped objects with an adhesive in between into a cure chamber comprising an ultraviolet irradiation lamp and a heating element, (b) keeping a heat-shielding member between the said objects and the heating element during at least 30 seconds while the said objects are exposed to ultraviolet irradiation, (c) removing the heat-shielding member for at least 60 seconds while the said objects are heated by the heating element, and (d) removing the said objects out of the cure chamber.
  • the invention also relates to a device for bonding two plate-shaped objects with an adhesive which is cured by ultraviolet light irradiation and by heating, comprising a cure chamber with an ultraviolet irradiation lamp and a heating element, and comprising a movable heat-shielding member which can be temporary present between the heating element and the said two plate shaped objects.
  • Fig. 1 is a top view showing a carrier
  • Fig. 2 is a side view of the carrier
  • Fig. 3 is a bottom view of the carrier
  • Fig. 4 is a top view of the carrier carrying two plate-shaped objects
  • Fig. 5 is a side view of the carrier according to Fig. 4;
  • Fig. 6 is a side view of the carrier in a different position; Fig. 7 shows a cure chamber with the carrier inside; and Fig. 8 shows the cure chamber with the carrier outside.
  • Figs. 1-3 show a carrier comprising a arm 1 bearing at its end a support table 2 having a substantially round and flat upper surface. Underneath the support table 2 a heat- shielding member 3 is attached to it.
  • the heat-shielding member 3 is a disc-shaped member made of heat insulating material.
  • Arrow 4 indicates the direction of movement of the carrier
  • Figs. 4 and 5 show the carrier 1,2 according to figs. 1-3, whereby the carrier is carrying two plate shaped objects 5.
  • the two plate-shaped objects are both disc-shaped and are provided with a layer of adhesive in between.
  • the layer adhesive has to be cured by ultraviolet light irradiation as well as by heating.
  • the carrier 1,2 can move in the direction indicated by arrow 4 to transport the two objects 5 into a cure chamber and afterwards out of the cure chamber 11 (figs. 7 and 8).
  • Fig. 5 Within the cure chamber there are three support bars 6 having a vertical portion 7 and a horizontal portion 8 (see Fig. 5).
  • the support bars 6 can move in vertical direction as indicated by arrows 9.
  • the horizontal portions 8 of the support bars 6 can lift the objects 5 from the support table 2, so that the carrier can move (arrow 4) leaving the two objects 5 in the cure chamber 11.
  • the objects are carried by the support bars 6 as shown in Fig. 6.
  • Figs. 7 and 8 show the cure chamber 11 containing an ultraviolet irradiation lamp 12 in its upper part and a heating element 13 in its lower part.
  • the cure chamber 11 is provided with an opening 14 through which the carrier 1,2 - together with the heat-shielding member 3 attached to it - can be moved into and out of the cure chamber 11.
  • FIG. 7 shows the carrier 1,2 after it is entered into the cure chamber 11.
  • the carrier 1,2 carries two plate shaped objects 5 as already shown in Fig. 5.
  • the two objects 5 are irradiated by the ultraviolet lamp 12 to cure the layer of adhesive between the objects.
  • the carrier 1,2 is provided with the heat-shielding member 3 in such way that the heat-shielding member is located between the two objects 5 and the heating element 13 in the lower part of the cure chamber 11. So, as long as the carrier 1,2 is inside the cure chamber 11, the two objects 5 shall not be heated by the heating element 13, at least the heating will be reduced.
  • the two objects 5 are lifted from the carrier 1,2 by the three support bars 6 (as shown in Fig. 6), so that the carrier 1,2 - together with the heat-shielding member 3 - can be moved out of the cure chamber 11. Subsequently the three support bars 6 are moved downward to bring the two objects 5 closer to the heating element 13, whereby the objects 5 may rest on the heating element 13. Thereby the support bars 6 may move into recesses (not shown) in the heating element 13. After the cure treatment is completed the three support bars 6 move upwardly, so that the carrier 1,2 can move back into the cure chamber 11. Then the support bars 6 replace the objects 5 on the carrier 1,2 and the objects 5 can be transported by the carrier 1,2 out of the cure chamber 11.
  • the described embodiment of the device for bonding two plate shaped objects is merely an example, a great many other embodiments are possible.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Manufacturing Optical Record Carriers (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Replacement Of Web Rolls (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

A method for bonding two plate-shaped objects (5) with an adhesive which is cured by ultraviolet light irradiation and by heating. The two plate-shaped objects (5) with the adhesive in between are transported into a cure chamber (11) comprising an ultraviolet lamp (12) and a heating element (13). A movable heat-shielding member (3) is temporary present between the objects (5) and the heating element (13) during at least the first part of the irradiation treatment. Preferably, the heat-shielding member (3) is positioned outside the cure chamber (11) during a part of the cure treatment.

Description

A method and a device for bonding two plate-shaped objects
The invention relates to a method an a device for bonding two plate-shaped objects with an adhesive which is cured by ultraviolet light irradiation and by heating. Such method can be used in the manufacture of a so-called SOA-semiconductor device (Silicon- On-Anything-semiconductor device) for bonding a disc-shaped semiconductor substrate to a disc-shaped insulating carrier, such as a glass carrier.
US-A-6051481 discloses a method for dispersing an adhesive between two plate-shaped objects, whereby the two objects are rotated while being pressed together, so that the adhesive between the two objects spreads homogeneously under the influence of the centrifugal force acting on the adhesive. After adhesive is applied between two objects, according to US-A-6051481 or in any other way, it may be required to cure the adhesive by ultraviolet light irradiation and/or by heating, depending on the type of adhesive. The invention relates to a method whereby both treatments, light irradiation as well as heating, are applied.
It is advantageous to make use of only one cure chamber in which the curing treatment of the adhesive takes place. Thereby both the irradiation lamp and the heating element must be present in the cure chamber, for irradiating and for heating the adhesive between the two objects. In case the two plate-shaped objects have a different coefficient of expansion, the bonded objects may be warped or curled because during the curing treatment the temperature of the objects is different (higher) from the temperature of the bonded objects afterwards.
The object of the invention is to decrease the tendency of warping or curling of the bonded plate-shaped objects.
In order to accomplish that objective, the two plate-shaped objects with the adhesive in between are transported into the cure chamber - comprising an ultraviolet lamp and a heating element - whereby a movable heat-shielding member is temporary present between the objects and the heating element during at least the first part of the irradiation treatment. Thereby the adhesive will bond together the two plate-shaped objects to a certain degree before the temperature of the objects will substantially increase. Because the temperature in the cure chamber will be higher the temperature outside the cure chamber, preferably, the movable heat-shielding member is positioned outside the cure chamber during a part of the cure treatment, so that the heat-shielding member can cool down.
In one preferred embodiment, the heat-shielding member is a portion of (or attached to) a carrier for transporting the said objects into the cure chamber. Thereby the objects and the heat-shielding member will enter into the cure chamber at the same time. Thereupon the carrier may remain in the cure chamber for at least 30 seconds, preferably for more than 60 seconds, and subsequently the carrier is removed out of the cure chamber while the said objects remain in the cure chamber for at least 60 seconds. Preferably, the said objects are moved in the direction of the heating element after the carrier has been removed out of the cure chamber, so that the objects can be heated quickly to the desired temperature.
Preferably, the method for bonding two plate-shaped objects with an adhesive which is cured by ultraviolet light irradiation and by heating comprises the following steps: (a) moving two plate-shaped objects with an adhesive in between into a cure chamber comprising an ultraviolet irradiation lamp and a heating element, (b) keeping a heat-shielding member between the said objects and the heating element during at least 30 seconds while the said objects are exposed to ultraviolet irradiation, (c) removing the heat-shielding member for at least 60 seconds while the said objects are heated by the heating element, and (d) removing the said objects out of the cure chamber.
The invention also relates to a device for bonding two plate-shaped objects with an adhesive which is cured by ultraviolet light irradiation and by heating, comprising a cure chamber with an ultraviolet irradiation lamp and a heating element, and comprising a movable heat-shielding member which can be temporary present between the heating element and the said two plate shaped objects.
The invention will be explained in more detail hereinafter by means of a description of an embodiment, in which reference is made to a drawing, in which: Fig. 1 is a top view showing a carrier; Fig. 2 is a side view of the carrier; Fig. 3 is a bottom view of the carrier;
Fig. 4 is a top view of the carrier carrying two plate-shaped objects; Fig. 5 is a side view of the carrier according to Fig. 4;
Fig. 6 is a side view of the carrier in a different position; Fig. 7 shows a cure chamber with the carrier inside; and Fig. 8 shows the cure chamber with the carrier outside.
The figs, are merely schematic representations of the embodiment, in which less relevant parts are not shown.
Figs. 1-3 show a carrier comprising a arm 1 bearing at its end a support table 2 having a substantially round and flat upper surface. Underneath the support table 2 a heat- shielding member 3 is attached to it. The heat-shielding member 3 is a disc-shaped member made of heat insulating material. Arrow 4 indicates the direction of movement of the carrier
1,2.
Figs. 4 and 5 show the carrier 1,2 according to figs. 1-3, whereby the carrier is carrying two plate shaped objects 5. The two plate-shaped objects are both disc-shaped and are provided with a layer of adhesive in between. The layer adhesive has to be cured by ultraviolet light irradiation as well as by heating. The carrier 1,2 can move in the direction indicated by arrow 4 to transport the two objects 5 into a cure chamber and afterwards out of the cure chamber 11 (figs. 7 and 8).
Within the cure chamber there are three support bars 6 having a vertical portion 7 and a horizontal portion 8 (see Fig. 5). The support bars 6 can move in vertical direction as indicated by arrows 9. Thereby the horizontal portions 8 of the support bars 6 can lift the objects 5 from the support table 2, so that the carrier can move (arrow 4) leaving the two objects 5 in the cure chamber 11. Thereby the objects are carried by the support bars 6 as shown in Fig. 6. Figs. 7 and 8 show the cure chamber 11 containing an ultraviolet irradiation lamp 12 in its upper part and a heating element 13 in its lower part. The cure chamber 11 is provided with an opening 14 through which the carrier 1,2 - together with the heat-shielding member 3 attached to it - can be moved into and out of the cure chamber 11. Arrow 4 indicates the direction of movement. Fig. 7 shows the carrier 1,2 after it is entered into the cure chamber 11. The carrier 1,2 carries two plate shaped objects 5 as already shown in Fig. 5. After entering the cure chamber 11 the two objects 5 are irradiated by the ultraviolet lamp 12 to cure the layer of adhesive between the objects. To prevent the two objects 5 from heating during the first part of the cure treatment, the carrier 1,2 is provided with the heat-shielding member 3 in such way that the heat-shielding member is located between the two objects 5 and the heating element 13 in the lower part of the cure chamber 11. So, as long as the carrier 1,2 is inside the cure chamber 11, the two objects 5 shall not be heated by the heating element 13, at least the heating will be reduced.
After the first part of the cure treatment has taken place, the two objects 5 are lifted from the carrier 1,2 by the three support bars 6 (as shown in Fig. 6), so that the carrier 1,2 - together with the heat-shielding member 3 - can be moved out of the cure chamber 11. Subsequently the three support bars 6 are moved downward to bring the two objects 5 closer to the heating element 13, whereby the objects 5 may rest on the heating element 13. Thereby the support bars 6 may move into recesses (not shown) in the heating element 13. After the cure treatment is completed the three support bars 6 move upwardly, so that the carrier 1,2 can move back into the cure chamber 11. Then the support bars 6 replace the objects 5 on the carrier 1,2 and the objects 5 can be transported by the carrier 1,2 out of the cure chamber 11. The described embodiment of the device for bonding two plate shaped objects is merely an example, a great many other embodiments are possible.

Claims

CLAIMS:
1. A method for bonding two plate-shaped objects with an adhesive which is cured by ultraviolet light irradiation and by heating, whereby the two plate-shaped objects with the adhesive in between are transported into a cure chamber comprising an ultraviolet lamp and a heating element, whereby a movable heat-shielding member is temporary present between the objects and the heating element during at least the first part of the irradiation treatment.
2. A method as claimed in claim 1, characterized in that the movable heat- shielding member is positioned outside the cure chamber during a part of the cure treatment.
3. A method as claimed in claim 1 or 2, characterized in that the heat-shielding member is a portion of a carrier for transporting the said objects into the cure chamber.
4. A method as claimed in claim 3, characterized in that, during the cure treatment, the carrier remains in the cure chamber for at least 30 seconds, preferably for more than 60 seconds, and that subsequently the carrier is removed out of the cure chamber while the said objects remain in the cure chamber for at least 60 seconds.
5. A method as claimed in claim 4, characterized in that the said objects are moved in the direction of the heating element after the carrier has been removed out of the cure chamber.
6. A method as claimed in any of the preceding claims, characterized by the following steps: (a) moving two plate-shaped objects with an adhesive in between into a cure chamber comprising an ultraviolet irradiation lamp and a heating element;
(b) keeping a heat-shielding member between the said objects and the heating element during at least 30 seconds while the said objects are exposed to ultraviolet irradiation; (c) removing the heat-shielding member for at least 60 seconds while the said objects are heated by the heating element;
(d) removing the said objects out of the cure chamber.
7. A device for bonding two plate-shaped objects with an adhesive which is cured by ultraviolet light irradiation and by heating, comprising a cure chamber with an ultraviolet irradiation lamp and a heating element, and comprising a movable heat-shielding member which can be temporary present between the heating element and the said two plate shaped objects.
8. A device as claimed in claim 7, characterized in that the heat-shielding member is a portion of a carrier for transporting the said objects into the cure chamber.
9. A device as claimed in claim 8,' characterized by means for taking the said two plate-shaped objects from the carrier and moving said two plate-shaped objects towards the heating element.
PCT/IB2003/003423 2002-09-04 2003-08-04 A method and a device for bonding two plate-shaped objects WO2004022662A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE60313980T DE60313980T2 (en) 2002-09-04 2003-08-04 METHOD AND DEVICE FOR CONNECTING TWO PLATE-SHAPED OBJECTS
EP03793937A EP1537184B1 (en) 2002-09-04 2003-08-04 A method and a device for bonding two plate-shaped objects
JP2004533704A JP4949626B2 (en) 2002-09-04 2003-08-04 Method and apparatus for bonding two plate-shaped objects
AU2003250435A AU2003250435A1 (en) 2002-09-04 2003-08-04 A method and a device for bonding two plate-shaped objects
US10/526,191 US7271075B2 (en) 2002-09-04 2003-08-04 Method and a device for bonding two plate-shaped objects

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP02078629.9 2002-09-04
EP02078629 2002-09-04

Publications (1)

Publication Number Publication Date
WO2004022662A1 true WO2004022662A1 (en) 2004-03-18

Family

ID=31970387

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2003/003423 WO2004022662A1 (en) 2002-09-04 2003-08-04 A method and a device for bonding two plate-shaped objects

Country Status (9)

Country Link
US (2) US7271075B2 (en)
EP (1) EP1537184B1 (en)
JP (1) JP4949626B2 (en)
KR (1) KR101016979B1 (en)
AT (1) ATE362965T1 (en)
AU (1) AU2003250435A1 (en)
DE (1) DE60313980T2 (en)
TW (1) TWI289154B (en)
WO (1) WO2004022662A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100467021B1 (en) * 2002-08-20 2005-01-24 삼성전자주식회사 Contact structure of semiconductro device and method for fabricating the same
JP2011040476A (en) * 2009-08-07 2011-02-24 Lintec Corp Device and method for applying energy
KR102512276B1 (en) * 2016-03-07 2023-03-22 삼성디스플레이 주식회사 Bonding apparatus and bonding method using the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19538468A1 (en) * 1995-10-16 1997-04-17 Siemens Ag Bonding ceramic and metallic materials to composite, useful at high temperature

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54105774A (en) * 1978-02-08 1979-08-20 Hitachi Ltd Method of forming pattern on thin film hybrid integrated circuit
US5705232A (en) * 1994-09-20 1998-01-06 Texas Instruments Incorporated In-situ coat, bake and cure of dielectric material processing system for semiconductor manufacturing
JP2000501551A (en) * 1995-12-06 2000-02-08 シーメンス アクチエンゲゼルシヤフト Conductive reaction resin mixture
EP0970157B1 (en) 1997-11-26 2004-06-23 Koninklijke Philips Electronics N.V. Method and device for bonding two plate-shaped objects
JP2000167569A (en) * 1998-12-07 2000-06-20 Mesco Inc Method and equipment for treating copper-containing acidic waste water
IT1313118B1 (en) * 1999-08-25 2002-06-17 Morton Int Inc VACUUM APPLICATION EQUIPMENT EQUIPPED WITH CONVEYING MEANS PROCEDURE FOR APPLYING A DRY FILM RESIST TO A PANEL
JP2002167569A (en) * 2000-11-29 2002-06-11 Hitachi Chem Co Ltd Adhesive composition, adhesive composition for connecting circuit, connected unit and semiconductor device
JP3627011B2 (en) * 2001-02-13 2005-03-09 インターナショナル・ビジネス・マシーンズ・コーポレーション Joining method
JP5079949B2 (en) * 2001-04-06 2012-11-21 東京エレクトロン株式会社 Processing apparatus and processing method
US7279069B2 (en) * 2002-07-18 2007-10-09 Origin Electric Company Limited Adhesive curing method, curing apparatus, and optical disc lamination apparatus using the curing apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19538468A1 (en) * 1995-10-16 1997-04-17 Siemens Ag Bonding ceramic and metallic materials to composite, useful at high temperature

Also Published As

Publication number Publication date
AU2003250435A1 (en) 2004-03-29
JP4949626B2 (en) 2012-06-13
EP1537184B1 (en) 2007-05-23
JP2005538205A (en) 2005-12-15
KR101016979B1 (en) 2011-02-28
US20080011427A1 (en) 2008-01-17
KR20050057122A (en) 2005-06-16
TW200415223A (en) 2004-08-16
US20050245047A1 (en) 2005-11-03
TWI289154B (en) 2007-11-01
DE60313980T2 (en) 2008-01-17
US7845378B2 (en) 2010-12-07
DE60313980D1 (en) 2007-07-05
EP1537184A1 (en) 2005-06-08
ATE362965T1 (en) 2007-06-15
US7271075B2 (en) 2007-09-18

Similar Documents

Publication Publication Date Title
TWI802682B (en) Wafer Processing Method
JP4694878B2 (en) Semiconductor manufacturing apparatus and semiconductor device manufacturing method
JP3761444B2 (en) Manufacturing method of semiconductor device
JP4137310B2 (en) Method and apparatus for peeling articles fixed to double-sided pressure-sensitive adhesive sheet
EP0109547A2 (en) Method of applying a coating to heat sensitive materials
JP2001007179A (en) Method and device for peeling article fixed to double face adhesive sheet
US20080011738A1 (en) Apparatus and method for manufacturing a semiconductor device with a sapphire substrate
KR102220348B1 (en) Wafer debonding apparatus
US7845378B2 (en) Device for bonding two plate-shaped objects
US6605814B1 (en) Apparatus for curing resist
KR20190039000A (en) Tape expansion apparatus and tape expansion method
JP4999130B2 (en) Method and apparatus for heat treating plastic discs, especially molded wafers
JP2002172626A (en) Peeling method and peeling device for lens sheet
KR101987197B1 (en) A flexible display device manufacturing method
JPH10199904A (en) Hardening lead frame in carrier by optical heat source
JP2004186482A (en) Method and apparatus for pasting heat adhesive film
JP3381563B2 (en) Method for manufacturing semiconductor device
TWI786302B (en) Heating apparatus and heating method
NL2030086B1 (en) Method and device for bonding of substrates with electromagnetic irradiation
JP2000243817A (en) Wafer stage, its manufacture, and wafer holding method
US20070094982A1 (en) Heat treatment for a panel and apparatus for carrying out the heat treatment method
US11164762B2 (en) Ultraviolet irradiation apparatus and method of manufacturing a semiconductor package using the same
JP2006013345A (en) Method and equipment for peeling semiconductor wafer, and semiconductor wafer adsorption stage
JPS6151418B2 (en)
JP2020129609A (en) Substrate processing apparatus

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2003793937

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 10526191

Country of ref document: US

WWE Wipo information: entry into national phase

Ref document number: 1020057003659

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 2004533704

Country of ref document: JP

WWP Wipo information: published in national office

Ref document number: 2003793937

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 1020057003659

Country of ref document: KR

WWG Wipo information: grant in national office

Ref document number: 2003793937

Country of ref document: EP