WO2004017071A3 - Method for joining surfaces, semiconductor with joined surfaces, bio-chip and bio-sensor - Google Patents

Method for joining surfaces, semiconductor with joined surfaces, bio-chip and bio-sensor Download PDF

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Publication number
WO2004017071A3
WO2004017071A3 PCT/EP2003/008955 EP0308955W WO2004017071A3 WO 2004017071 A3 WO2004017071 A3 WO 2004017071A3 EP 0308955 W EP0308955 W EP 0308955W WO 2004017071 A3 WO2004017071 A3 WO 2004017071A3
Authority
WO
WIPO (PCT)
Prior art keywords
bio
semiconductor
chip
sensor
joined
Prior art date
Application number
PCT/EP2003/008955
Other languages
German (de)
French (fr)
Other versions
WO2004017071A2 (en
Inventor
Holger Klapproth
Original Assignee
Micronas Holding Gmbh
Holger Klapproth
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micronas Holding Gmbh, Holger Klapproth filed Critical Micronas Holding Gmbh
Priority to AU2003266280A priority Critical patent/AU2003266280A1/en
Publication of WO2004017071A2 publication Critical patent/WO2004017071A2/en
Publication of WO2004017071A3 publication Critical patent/WO2004017071A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/04—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving separate application of adhesive ingredients to the different surfaces to be joined
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having a potential-jump barrier or a surface barrier
    • H10K10/701—Organic molecular electronic devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/761—Biomolecules or bio-macromolecules, e.g. proteins, chlorophyl, lipids or enzymes

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Pressure Sensors (AREA)
  • Apparatus Associated With Microorganisms And Enzymes (AREA)
  • Immobilizing And Processing Of Enzymes And Microorganisms (AREA)

Abstract

The invention relates to a method for bonding surfaces, and to a semiconductor with surfaces bound thereby, and to bio-chips and bio-sensors comprising this semiconductor.
PCT/EP2003/008955 2002-08-14 2003-08-12 Method for joining surfaces, semiconductor with joined surfaces, bio-chip and bio-sensor WO2004017071A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003266280A AU2003266280A1 (en) 2002-08-14 2003-08-12 Method for joining surfaces, semiconductor with joined surfaces, bio-chip and bio-sensor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10237280.2 2002-08-14
DE10237280A DE10237280A1 (en) 2002-08-14 2002-08-14 Process for connecting surfaces, semiconductors with bonded surfaces as well as bio-chip and bio-sensor

Publications (2)

Publication Number Publication Date
WO2004017071A2 WO2004017071A2 (en) 2004-02-26
WO2004017071A3 true WO2004017071A3 (en) 2004-05-27

Family

ID=31501749

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2003/008955 WO2004017071A2 (en) 2002-08-14 2003-08-12 Method for joining surfaces, semiconductor with joined surfaces, bio-chip and bio-sensor

Country Status (3)

Country Link
AU (1) AU2003266280A1 (en)
DE (1) DE10237280A1 (en)
WO (1) WO2004017071A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2887244A1 (en) 2005-06-15 2006-12-22 Commissariat Energie Atomique COMPOUNDS FOR PLACING OBJECTS BY SELF-ASSEMBLY AND APPLICATIONS
US8557351B2 (en) * 2005-07-22 2013-10-15 Molecular Imprints, Inc. Method for adhering materials together
US8846195B2 (en) 2005-07-22 2014-09-30 Canon Nanotechnologies, Inc. Ultra-thin polymeric adhesion layer
US8808808B2 (en) 2005-07-22 2014-08-19 Molecular Imprints, Inc. Method for imprint lithography utilizing an adhesion primer layer
GR1006447B (en) * 2006-09-15 2009-06-19 Εθνικο Κεντρο Ερευνας Φυσικων Επιστημων (Εκεφε) "Δημοκριτος" Bonding technique.

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5693172A (en) * 1992-10-07 1997-12-02 Zeldin; Martel Methods and compositions for interfacially bonding mineral surfaces and the like
US6190778B1 (en) * 1998-04-28 2001-02-20 Degussa-Huls Aktiengesellschaft Process for joining two solid bodies and the resultant structural element

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5304582A (en) * 1988-04-28 1994-04-19 Matsushita Electric Industrial Co., Ltd. Process for producing polyacetylene or polyacene type long conjugated polymers
DE3832666A1 (en) * 1988-09-27 1990-04-05 Telefunken Electronic Gmbh HIGH FREQUENCY TRANSMITTERS, IN PARTICULAR FOR FUSE FACILITIES
DE4234423C2 (en) * 1992-10-13 1996-10-10 Inst Mikrotechnik Mainz Gmbh Metal or semiconductor substrates coated with a resist and method for achieving stable resist-substrate adhesion
DE19752412A1 (en) * 1996-11-27 1998-05-28 Max Planck Gesellschaft Process for joining solid bodies e.g. for microelectronic components
EP1176422B1 (en) * 2000-07-27 2004-10-06 Micronas Holding GmbH Sensor-chips with polysiloxane multilayers
DE60033648T2 (en) * 2000-07-27 2007-11-08 Micronas Holding Gmbh Surface-mounted polyfunctional polymer networks for sensor chips
DE10137376A1 (en) * 2001-07-31 2003-02-27 Infineon Technologies Ag Use of poly-o-hydroxyamide polymers for adhesive bonding, especially for bonding chips and-or wafers, e.g. silicon wafers with titanium nitride-coated silicon chips

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5693172A (en) * 1992-10-07 1997-12-02 Zeldin; Martel Methods and compositions for interfacially bonding mineral surfaces and the like
US6190778B1 (en) * 1998-04-28 2001-02-20 Degussa-Huls Aktiengesellschaft Process for joining two solid bodies and the resultant structural element

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
STEINKIRCHNER J ET AL: "SILICON WAFER BONDING VIA DESIGNED MONOLAYERS", ADVANCED MATERIALS, VCH VERLAGSGESELLSCHAFT, WEINHEIM, DE, vol. 7, no. 7, 1 July 1995 (1995-07-01), pages 662 - 665, XP000520485, ISSN: 0935-9648 *

Also Published As

Publication number Publication date
WO2004017071A2 (en) 2004-02-26
AU2003266280A1 (en) 2004-03-03
DE10237280A1 (en) 2004-03-11

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