AU2003266280A1 - Method for joining surfaces, semiconductor with joined surfaces, bio-chip and bio-sensor - Google Patents

Method for joining surfaces, semiconductor with joined surfaces, bio-chip and bio-sensor

Info

Publication number
AU2003266280A1
AU2003266280A1 AU2003266280A AU2003266280A AU2003266280A1 AU 2003266280 A1 AU2003266280 A1 AU 2003266280A1 AU 2003266280 A AU2003266280 A AU 2003266280A AU 2003266280 A AU2003266280 A AU 2003266280A AU 2003266280 A1 AU2003266280 A1 AU 2003266280A1
Authority
AU
Australia
Prior art keywords
bio
chip
semiconductor
sensor
joined
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003266280A
Inventor
Holger Klapproth
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Micronas GmbH
Original Assignee
TDK Micronas GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Micronas GmbH filed Critical TDK Micronas GmbH
Publication of AU2003266280A1 publication Critical patent/AU2003266280A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/04—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving separate application of adhesive ingredients to the different surfaces to be joined
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having a potential-jump barrier or a surface barrier
    • H10K10/701—Organic molecular electronic devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/761—Biomolecules or bio-macromolecules, e.g. proteins, chlorophyl, lipids or enzymes

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Pressure Sensors (AREA)
  • Immobilizing And Processing Of Enzymes And Microorganisms (AREA)
  • Apparatus Associated With Microorganisms And Enzymes (AREA)
AU2003266280A 2002-08-14 2003-08-12 Method for joining surfaces, semiconductor with joined surfaces, bio-chip and bio-sensor Abandoned AU2003266280A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10237280A DE10237280A1 (en) 2002-08-14 2002-08-14 Process for connecting surfaces, semiconductors with bonded surfaces as well as bio-chip and bio-sensor
DE10237280.2 2002-08-14
PCT/EP2003/008955 WO2004017071A2 (en) 2002-08-14 2003-08-12 Method for joining surfaces, semiconductor with joined surfaces, bio-chip and bio-sensor

Publications (1)

Publication Number Publication Date
AU2003266280A1 true AU2003266280A1 (en) 2004-03-03

Family

ID=31501749

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003266280A Abandoned AU2003266280A1 (en) 2002-08-14 2003-08-12 Method for joining surfaces, semiconductor with joined surfaces, bio-chip and bio-sensor

Country Status (3)

Country Link
AU (1) AU2003266280A1 (en)
DE (1) DE10237280A1 (en)
WO (1) WO2004017071A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2887244A1 (en) * 2005-06-15 2006-12-22 Commissariat Energie Atomique COMPOUNDS FOR PLACING OBJECTS BY SELF-ASSEMBLY AND APPLICATIONS
US8846195B2 (en) 2005-07-22 2014-09-30 Canon Nanotechnologies, Inc. Ultra-thin polymeric adhesion layer
US8557351B2 (en) 2005-07-22 2013-10-15 Molecular Imprints, Inc. Method for adhering materials together
US8808808B2 (en) 2005-07-22 2014-08-19 Molecular Imprints, Inc. Method for imprint lithography utilizing an adhesion primer layer
GR1006447B (en) * 2006-09-15 2009-06-19 Εθνικο Κεντρο Ερευνας Φυσικων Επιστημων (Εκεφε) "Δημοκριτος" Bonding technique.

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5304582A (en) * 1988-04-28 1994-04-19 Matsushita Electric Industrial Co., Ltd. Process for producing polyacetylene or polyacene type long conjugated polymers
DE3832666A1 (en) * 1988-09-27 1990-04-05 Telefunken Electronic Gmbh HIGH FREQUENCY TRANSMITTERS, IN PARTICULAR FOR FUSE FACILITIES
US5427860A (en) * 1992-10-07 1995-06-27 Zeldin; Martel Methods and compositions for interfacially bonding mineral surfaces and the like
DE4234423C2 (en) * 1992-10-13 1996-10-10 Inst Mikrotechnik Mainz Gmbh Metal or semiconductor substrates coated with a resist and method for achieving stable resist-substrate adhesion
DE19752412A1 (en) * 1996-11-27 1998-05-28 Max Planck Gesellschaft Process for joining solid bodies e.g. for microelectronic components
DE19818962A1 (en) * 1998-04-28 1999-11-04 Degussa Method for connecting two solid bodies and the component produced in this way
DE60033648T2 (en) * 2000-07-27 2007-11-08 Micronas Holding Gmbh Surface-mounted polyfunctional polymer networks for sensor chips
DE50008123D1 (en) * 2000-07-27 2004-11-11 Micronas Holding Gmbh Sensor chips with polysiloxane multilayers
DE10137376A1 (en) * 2001-07-31 2003-02-27 Infineon Technologies Ag Use of poly-o-hydroxyamide polymers for adhesive bonding, especially for bonding chips and-or wafers, e.g. silicon wafers with titanium nitride-coated silicon chips

Also Published As

Publication number Publication date
WO2004017071A2 (en) 2004-02-26
DE10237280A1 (en) 2004-03-11
WO2004017071A3 (en) 2004-05-27

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase