WO2004003968A2 - Method and system for arc suppression in a plasma processing system - Google Patents
Method and system for arc suppression in a plasma processing system Download PDFInfo
- Publication number
- WO2004003968A2 WO2004003968A2 PCT/US2003/016243 US0316243W WO2004003968A2 WO 2004003968 A2 WO2004003968 A2 WO 2004003968A2 US 0316243 W US0316243 W US 0316243W WO 2004003968 A2 WO2004003968 A2 WO 2004003968A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- signal
- recited
- plasma processing
- processing system
- plasma
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32174—Circuits specially adapted for controlling the RF discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32697—Electrostatic control
- H01J37/32706—Polarising the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/02—Details
- H01J2237/0203—Protection arrangements
- H01J2237/0206—Extinguishing, preventing or controlling unwanted discharges
Definitions
- FIG. 7B shows a top view of a substrate holder incorporating an arc suppression system according to another embodiment of the present invention
- FIG. 7C shows a top view of a substrate holder incorporating an arc suppression system according to another embodiment of the present invention
- FIG. 7D shows a top view of a substrate holder incorporating an arc suppression system according to another embodiment of the present invention
- FIG. 8 A shows an exploded view of an antenna electrode and antenna lead according to an embodiment of the present invention
- FIG. 8B shows an exploded view of an antenna electrode and antenna lead according to another embodiment of the present invention.
- FIG. 10 shows an exemplary signal utilized by the arc suppression system to determine a state of the processing plasma and control the plasma processing system to avoid an arcing event according to an embodiment of the present invention
- temperature control of the substrate can be useful at temperatures in excess of the steady-state temperature achieved due to a balance of the heat flux delivered to the substrate 25 from the plasma and the heat flux removed from substrate 25 by conduction to the substrate holder 20.
- heating elements such as resistive heating elements, or thermo-electric heaters/coolers can be included.
- the at least one antenna electrode 52 can be elliptical. In an alternate embodiment, as shown in FIG. 7C, the at least one antenna electrode 52 can be "kidney-shaped.” In an alternate embodiment, the at least one electrode 52 can be rectangular. Alternate embodiments, such as shown in FIG. 7D, can vary the arrangement of the antenna electrodes 52 to place them in various locations. However, it should be appreciated that any arrangement of antennas and any number of antennas can be used according to the present invention.
- the at least one antenna electrode 52 and the conductive element(s) of the at least one antenna lead 54 can be fabricated from copper or a like conducting material.
- the at least one antenna lead 54 is shielded using an outer conductive shield and insulated from the clamp electrode 132 and RF biasable electrode 126.
- the consumable electrode 570 is coplanar with the upper surface of the focus ring 560, and in FIG. 8D the consumable electrode 570 is not coplanar with the upper surface of the focus ring 560.
- the focus ring 560 is designed for repeatable replacement on the RF biasable electrode 126 and, therefore, consumable electrode 570 can be consistently coupled to antenna electrode 52.
- the focus ring 128 or 560 can, for example, comprise at least one of silicon, silicon carbide, alumina, or quartz.
- consumable electrode 570 can, for example, comprise doped silicon or an embedded, conductive material such as tungsten.
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/512,862 US7199327B2 (en) | 2002-06-28 | 2003-06-27 | Method and system for arc suppression in a plasma processing system |
AU2003280398A AU2003280398A1 (en) | 2002-06-28 | 2003-06-27 | Method and system for arc suppression in a plasma processing system |
JP2004517580A JP2006507662A (en) | 2002-06-28 | 2003-06-27 | Arc suppression method and system in plasma processing system |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US39195002P | 2002-06-28 | 2002-06-28 | |
US60/391,950 | 2002-06-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2004003968A2 true WO2004003968A2 (en) | 2004-01-08 |
WO2004003968A3 WO2004003968A3 (en) | 2004-09-10 |
Family
ID=30000781
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2003/016243 WO2004003968A2 (en) | 2002-06-28 | 2003-06-27 | Method and system for arc suppression in a plasma processing system |
Country Status (5)
Country | Link |
---|---|
US (1) | US7199327B2 (en) |
JP (1) | JP2006507662A (en) |
CN (1) | CN100360704C (en) |
AU (1) | AU2003280398A1 (en) |
WO (1) | WO2004003968A2 (en) |
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JP2006196453A (en) * | 2004-12-24 | 2006-07-27 | Huettinger Elektronik Gmbh & Co Kg | Plasma excitation device and plasma coating system |
WO2006116445A2 (en) | 2005-04-22 | 2006-11-02 | Advanced Energy Industries, Inc. | Arc detection and handling in radio frequency power applications |
WO2008034092A2 (en) * | 2006-09-15 | 2008-03-20 | Schneider Automation Inc. | System and method for detecting non-cathode arcing in a plasma generation apparatus |
WO2008049463A1 (en) * | 2006-10-27 | 2008-05-02 | Oerlikon Trading Ag, Trübbach | Method and apparatus for manufacturing cleaned substrates or clean substrates which are further processed |
JP2009505441A (en) * | 2005-08-22 | 2009-02-05 | アプライド マテリアルズ インコーポレイテッド | Non-intrusive plasma monitoring system for detecting and preventing arcs in blanket CVD films |
JP2009510699A (en) * | 2005-09-30 | 2009-03-12 | ケーエルエー・テンコール コーポレイション | Method and apparatus for measuring electrical parameters of plasma processing |
US7981257B2 (en) | 2002-04-12 | 2011-07-19 | Schneider Electric USA, Inc. | Current-based method and apparatus for detecting and classifying arcs |
US7988833B2 (en) | 2002-04-12 | 2011-08-02 | Schneider Electric USA, Inc. | System and method for detecting non-cathode arcing in a plasma generation apparatus |
JP2011527506A (en) * | 2008-07-07 | 2011-10-27 | ラム リサーチ コーポレーション | Passive capacitively coupled electrostatic (CCE) probe configuration for detecting in-situ arc discharge events in a plasma processing chamber |
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2003
- 2003-06-27 US US10/512,862 patent/US7199327B2/en not_active Expired - Lifetime
- 2003-06-27 JP JP2004517580A patent/JP2006507662A/en active Pending
- 2003-06-27 AU AU2003280398A patent/AU2003280398A1/en not_active Abandoned
- 2003-06-27 CN CNB038152754A patent/CN100360704C/en not_active Expired - Fee Related
- 2003-06-27 WO PCT/US2003/016243 patent/WO2004003968A2/en active Search and Examination
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US5192894A (en) * | 1991-08-20 | 1993-03-09 | Leybold Aktiengesellschaft | Device for the suppression of arcs |
US5611899A (en) * | 1994-11-19 | 1997-03-18 | Leybold Aktiengesellschaft | Device for suppressing flashovers in cathode sputtering installations |
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Cited By (23)
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---|---|---|---|---|
US7988833B2 (en) | 2002-04-12 | 2011-08-02 | Schneider Electric USA, Inc. | System and method for detecting non-cathode arcing in a plasma generation apparatus |
US7981257B2 (en) | 2002-04-12 | 2011-07-19 | Schneider Electric USA, Inc. | Current-based method and apparatus for detecting and classifying arcs |
JP2006196453A (en) * | 2004-12-24 | 2006-07-27 | Huettinger Elektronik Gmbh & Co Kg | Plasma excitation device and plasma coating system |
EP1872295A4 (en) * | 2005-04-22 | 2010-03-10 | Advanced Energy Ind Inc | Arc detection and handling in radio frequency power applications |
WO2006116445A2 (en) | 2005-04-22 | 2006-11-02 | Advanced Energy Industries, Inc. | Arc detection and handling in radio frequency power applications |
EP1872295A2 (en) * | 2005-04-22 | 2008-01-02 | Advanced Energy Industries, Inc. | Arc detection and handling in radio frequency power applications |
JP2009505441A (en) * | 2005-08-22 | 2009-02-05 | アプライド マテリアルズ インコーポレイテッド | Non-intrusive plasma monitoring system for detecting and preventing arcs in blanket CVD films |
JP2009510699A (en) * | 2005-09-30 | 2009-03-12 | ケーエルエー・テンコール コーポレイション | Method and apparatus for measuring electrical parameters of plasma processing |
WO2008034092A3 (en) * | 2006-09-15 | 2008-05-08 | Schneider Automation | System and method for detecting non-cathode arcing in a plasma generation apparatus |
WO2008034092A2 (en) * | 2006-09-15 | 2008-03-20 | Schneider Automation Inc. | System and method for detecting non-cathode arcing in a plasma generation apparatus |
WO2008049463A1 (en) * | 2006-10-27 | 2008-05-02 | Oerlikon Trading Ag, Trübbach | Method and apparatus for manufacturing cleaned substrates or clean substrates which are further processed |
EP2158977A1 (en) * | 2006-10-27 | 2010-03-03 | Oerlikon Trading AG, Trübbach | Method and apparatus for manufacturing cleaned substrates or clean substrates which are further processed |
US10418230B2 (en) | 2006-10-27 | 2019-09-17 | Oerlikon Trading Ag, Truebbach | Method and apparatus for manufacturing cleaned substrates or clean substrates which are further processed |
US8941037B2 (en) * | 2006-12-25 | 2015-01-27 | Tokyo Electron Limited | Substrate processing apparatus, focus ring heating method, and substrate processing method |
US10622194B2 (en) | 2007-04-27 | 2020-04-14 | Applied Materials, Inc. | Bulk sintered solid solution ceramic which exhibits fracture toughness and halogen plasma resistance |
US9051219B2 (en) | 2007-04-27 | 2015-06-09 | Applied Materials, Inc. | Semiconductor processing apparatus comprising a solid solution ceramic formed from yttrium oxide, zirconium oxide, and aluminum oxide |
US10242888B2 (en) | 2007-04-27 | 2019-03-26 | Applied Materials, Inc. | Semiconductor processing apparatus with a ceramic-comprising surface which exhibits fracture toughness and halogen plasma resistance |
US10840112B2 (en) | 2007-04-27 | 2020-11-17 | Applied Materials, Inc. | Coated article and semiconductor chamber apparatus formed from yttrium oxide and zirconium oxide |
US10840113B2 (en) | 2007-04-27 | 2020-11-17 | Applied Materials, Inc. | Method of forming a coated article and semiconductor chamber apparatus from yttrium oxide and zirconium oxide |
US10847386B2 (en) | 2007-04-27 | 2020-11-24 | Applied Materials, Inc. | Method of forming a bulk article and semiconductor chamber apparatus from yttrium oxide and zirconium oxide |
US11373882B2 (en) | 2007-04-27 | 2022-06-28 | Applied Materials, Inc. | Coated article and semiconductor chamber apparatus formed from yttrium oxide and zirconium oxide |
JP2011527506A (en) * | 2008-07-07 | 2011-10-27 | ラム リサーチ コーポレーション | Passive capacitively coupled electrostatic (CCE) probe configuration for detecting in-situ arc discharge events in a plasma processing chamber |
US8502689B2 (en) | 2010-09-23 | 2013-08-06 | Applied Materials, Inc. | System and method for voltage-based plasma excursion detection |
Also Published As
Publication number | Publication date |
---|---|
WO2004003968A3 (en) | 2004-09-10 |
JP2006507662A (en) | 2006-03-02 |
AU2003280398A1 (en) | 2004-01-19 |
CN100360704C (en) | 2008-01-09 |
US20060081564A1 (en) | 2006-04-20 |
CN1665955A (en) | 2005-09-07 |
US7199327B2 (en) | 2007-04-03 |
AU2003280398A8 (en) | 2004-01-19 |
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