WO2003099098A1

WO2003099098A1 - Dust removing cleaner

Info

Publication number: WO2003099098A1
Application number: PCT/JP2003/006549
Authority: WO
Inventors: Akira Katakura; Katsunori Todaka
Original assignee: Teraoka Seisakusho Co., Ltd.
Priority date: 2002-05-27
Filing date: 2003-05-26
Publication date: 2003-12-04
Also published as: CN1533256A; TWI222858B; JP3979635B2; JP2003339617A; HK1067026A1; CN1283205C; KR100570176B1; TW200401622A; KR20040021657A

Abstract

A dust removing cleaner which comprises an article having an pressure-sensitive adhesive tape wound around it, wherein the pressure-sensitive adhesive tape comprises a base material and, applied on one surface thereof, a pressure-sensitive adhesive composition formed through admixing spherical hollow thermoplastic resin particles having elasticity and an adhesive agent uniformly, and the tape is provided so as to have the pressure-sensitive adhesive composition layer on the outside thereof. The dust cleaner has a pressure sensitive adhesive tape being excellent in both tackiness and dust removing efficiency.

Description

Description Dust cleaner Technical field of the invention

The present invention provides a method of directly pressing a floor carpet or tatami mat, a wall surface or a ceiling surface, or the like, or rotating contact with an adhesive roll pressed against an electronic material such as a printed circuit board or a liquid crystal panel, thereby reducing dust and dust. The present invention relates to a dust cleaner that removes dust and the like by adhering to an adhesive layer. Background art

Conventionally, the use of a pressure-sensitive adhesive tape wound with the pressure-sensitive adhesive layer surface outside as a dust cleaner is disclosed in, for example, Japanese Patent Application Laid-Open No. 61-100224 and Utility Model No. 2 It is already known, as shown in the publication No. 5301113.

As described above, there are various types of conventionally known dust cleaners. However, the above-mentioned Japanese Patent Application Laid-Open No. 61-100224 and Utility Model No. 2531013 are disclosed. The dust cleaner described in the registered gazette has a function to adhere well to the uneven surface of the object to be cleaned and to adhere the dust, dust and dirt in the recess well because the adhesive layer has elasticity. However, the above-mentioned dust cleaner lacks the ability to instantaneously adhere dust, dirt, and debris, and the adhesive strength is immediately reduced. Had to be kept ready, and a large amount of tape had to be used.

Originally, dust cleaners are required to have the following functions. (1) It has the ability and sustainability of instantaneously adhering dust and dirt.

(2) It has a function to adjust to the unevenness of the object to be cleaned and to attach dirt, dust and dirt.

(3) If the object to be cleaned is flat like a tile or a wall, the adhesive tape is too tight to adhere to the object, and the adhesive tape is rotated when the dust cleaner is rotated back and forth. It must have releasability so that it cannot be unwound onto the object. Disclosure of the invention

The present invention that can solve the above-mentioned problems includes the following inventions.

(1) An adhesive tape in which an adhesive layer in which elastic thermoplastic resin hollow fine particles previously produced in an adhesive are dispersed is applied to one surface of a base material, with the adhesive layer as an outside. Dust cleaner consisting of wound adhesive tape.

(2) The hollow thermoplastic resin microparticles having elasticity are hollow microparticles formed by previously heating and foaming a synthetic resin micro-force capsule containing a heat-expandable material. 1) Dust cleaner described.

(3) The dust cleaner according to the above (1) or (2), wherein the adhesive tape roll has a release liner on an adhesive surface.

(4) The dust cleaner according to any one of (1) to (3), wherein the thermoplastic resin hollow fine particles are spherical hollow fine particles.

(5) serial to any one of the thermoplastic resin hollow particles are those having a specific gravity of 0. 0 1~0. L O gZ cm 3 (1) ~ (4) 麈 No dust cleaner.

(6) The dust cleaner according to any one of (1) to (5) above, wherein the average particle diameter of the hollow thermoplastic resin particles is in the range of 20 to 60 μπι.

(7) The method according to any one of the above (1) to (6), wherein the content of the hollow thermoplastic resin particles in the pressure-sensitive adhesive layer is in the range of 10 to 60% by volume based on the pressure-sensitive adhesive layer. Cleaner cleaner.

(8) The method according to any one of (1) to (7) above, wherein the content of the hollow fine particles of the thermoplastic resin in the pressure-sensitive adhesive layer is in the range of 0.5 to 5% by weight based on the pressure-sensitive adhesive layer. Dust cleaner. ■

(9) Any one of the above (1) to (8), in which the 90-degree peel adhesion after 30 minutes of roll pressing is 0.5 to 3 NZ20 mm according to the method specified in JISZ0237. Dust cleaner described.

(1 0) JISZ 0 2 3 7 to but pursuant to the method specified, stuck-bonding conditions of the tape to the stainless plate is 2 seconds crimp at 3 g / cm ^2, measured 9 0 degree peeling adhesive The dust cleaner according to any one of the above (1) to (9), wherein the force is 0.25 to 1.5 NZ20 mm.

(11) The dust cleaner according to any one of the above (1) to (10) for removing dust from a printed circuit board.

(12) An adhesive rubber roller and the dust cleaner according to any one of (1) to (10) are provided, and the adhesive rubber roller captures dust and dirt from an object to be removed. A dust remover, wherein the dust, dust, and the like captured by the adhesive rubber roller are transferred to the dust cleaner that rotates in contact with the adhesive rubber roller to remove dust. BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a cross-sectional view of an adhesive tape used for a dust cleaner according to the present invention. You.

FIGS. 2 and 3 schematically show an application example of a dust cleaner according to the present invention.

Embodiment of the Invention

As in the conventional case, the dust cleaner of the present invention can be used to (i) directly remove dust and dust attached to an adherend, and (ii) temporarily remove the dust and dust on the adherend. (To be described later), and then remove dust and dirt attached to the surface of the adhesive rubber port with a dust cleaner with reverse winding adhesive tape called cleaning port ( Transfer method).

The pressure-sensitive adhesive tape used in the dust cleaner of the present invention has, for example, a layer configuration shown in FIG. In the case of the pressure-sensitive adhesive tape of FIG. 1, the pressure-sensitive adhesive tape 1 has a pressure-sensitive adhesive layer 2 in which elastic thermoplastic resin hollow fine particles 5 already expanded and formed on one surface of a tape base material 3 are uniformly dispersed. On the opposite surface, a release agent layer 4 is provided. The opposite surface of the set Keru surface an adhesive layer of the tape base material Shi desirable that release treatment has been performed at stripper Rere ₀

As the tape base material, a base material used for ordinary adhesive tapes, such as craft paper, cloth, nonwoven fabric, and film is used. For dust reduction applications in a clean room such as a printed circuit board manufacturing process, a film type is preferably used for reasons that dust and dust are unlikely to be generated. Among the film-based materials, special synthetic paper (for example, trade name: made by Nuppo, Nippon Corporation) or laterally easy-to-cut olefin fin (for tape cut property) For example, trade name: Trefan, manufactured by Toray) is more preferably used.

The adhesive forming the adhesive layer includes a rubber-based adhesive and an acrylic-based adhesive. Adhesives, urethane-based adhesives, silicone-based adhesives, vinyl ether-based adhesives, and the like can be used. In rubbers, one elastomer component is selected from natural rubber or synthetic rubber such as SIS, and terpene resin or petroleum resin is used as a tackifying resin, in some cases a plasticizer, a filler, a vulcanizing agent, or an antiaging agent. Is used. In the acrylic system, various acrylate monomers such as butyl acrylate and 2-ethylhexyl acrylate are copolymerized with monomers such as acryl acid, and a metal is used as a crosslinking agent. Chelates (aluminum, titanium, zirconium, etc.), isocyanates (tolylene succinate adducts, hexamethylene diisocyanate adducts, etc.), epoxies, melamines ( Butylated melanin, methylated melanin, etc.) and aziridines are used and cured.

In general, rubber-based adhesives are used for removing dust and dirt adhering to household carpet mats, etc. due to their high adhesive strength. For applications where dust and dust are removed in a clean room, etc., an acrylic adhesive which has a small amount of migratory components and adverse substances to adherends is used. The adhesive strength of the adhesive layer of the dust cleaner of the present invention will be described later.

As the thermoplastic resin hollow fine particles, thermoplastic resin hollow fine particles formed in advance and having elasticity are used. Such hollow particles of a thermoplastic resin are thermally expandable microphones containing vinylidene chloride-acrylonitrile copolymer / acrylonitrile polymer as a shell wall and containing volatile gas hydrocarbons. Hollow fine particles having elasticity, which are formed by heating and expanding a low-pressure capsule, are commercially available. Those capable of forming a large number of independent pores having a property inside the pressure-sensitive adhesive layer can be used. The thermoplastic resin hollow fine particles suitably used in the present invention have a particle size of about 1 ° to 100 μm. m, shell thickness about 0.05 to: 1.0 // m, specific gravity about 10 to: L 0 kg / m ³ force S preferred, more preferably particle size about 20 to 60 μιη, shell A spherical shape having a wall thickness of about 0.1 to 0.5 μm and a specific gravity of about 30 to 70 kg / m ³ is preferable. Examples of the hollow fine particles include, for example, Matsumoto Microsphere F80ED manufactured by Matsumoto Yushi-Seiyaku Co., Ltd. In the present invention, since the thermoplastic resin hollow fine particles formed in advance are used, the characteristics, particle size, particle size distribution, etc. of the hollow fine particles to be used can be selected and freely controlled in advance, and further, the presence of air bubbles. When an elastic pressure-sensitive adhesive layer is formed by simply mixing and applying the preselected hollow fine particles with the pressure-sensitive adhesive, the dispersion and uniform dispersion of the hollow fine particles in the pressure-sensitive adhesive layer can be controlled. There is.

The difference between the dust cleaner of the present invention and the dust cleaner disclosed in the above-mentioned Japanese Patent Application Laid-Open No. 61-100224 is that the dust cleaner described in the publication is foamable. After mixing the spherical heat-expandable microcapsules containing the substance with the pressure-sensitive adhesive, the heat-expandable microphone opening capsule is heated and foamed and expanded in the pressure-sensitive adhesive layer. The first liner is characterized in that it has a pressure-sensitive adhesive layer formed by uniformly mixing thermoplastic resin hollow fine particles that have been foam-formed in advance with a pressure-sensitive adhesive. The present inventors have found that the dust cleaner disclosed in Japanese Patent Application Laid-Open No. 61-100224 impairs the tackiness of the surface of the pressure-sensitive adhesive layer. The LINA is characterized in that a suitable elasticity and a supporting force are provided without impairing the tackiness of the surface of the pressure-sensitive adhesive layer.

The clear reason why the dust cleaner of the present invention is excellent in its ability to adhere dust, dust and dirt instantaneously and in its sustainability is that it is necessary to have further research in the future. When a foamable substance is heated and foamed in a state where the substance is mixed with an adhesive, if the foamable substance expands in the formed adhesive layer, the adhesive in the adhesive layer will expand and the adhesive In contrast to the inherent tackiness of the adhesive, the pressure-sensitive adhesive layer of the dust cleaner of the present invention has a tendency to cause foaming in the pressure-sensitive adhesive layer after the pressure-sensitive adhesive layer is applied and dried. It is presumed that the major factor is that there is no elongation of the adhesive.

The content of the hollow thermoplastic resin particles in the pressure-sensitive adhesive layer of the present invention is preferably 10 to 60% by volume, more preferably 30 to 50% by volume, based on the pressure-sensitive adhesive layer. Although it depends on the specific gravity of the hollow resin particles, it is generally preferably about 0.5 to 5% by weight, more preferably about 1.25 to 3.0% by weight. If this content is low, the elasticity (cushioning property) is insufficient, and the adhesion to the uneven adherend is lacking, and the operator is easily tired. Conversely, if the amount is too large, the pressure-sensitive adhesive layer becomes brittle and glue tends to remain on the adherend.

According to the method specified in JISZ 0 237, the adhesive strength of the pressure-sensitive adhesive layer is such that the 90 ° peel adhesive strength after 30 minutes of roll bonding is 0.5 to 3 N / 20 mm, more preferably 1 . 0~ 2. O NZ20mm, also a 2 seconds tape application, pressure bonding conditions at 3 g / cm ² to a stainless steel plate is 9 0 ° peel adhesion at low pressure conditions (adherend, measured immediately after compression It is preferable that the applied adhesive strength is 0.25 to 1.5 N / 20 mm, more preferably 0.5 to 1.5 ON / 20 mm. By using the thermoplastic resin hollow fine particles formed in advance of the present invention, the pressure-sensitive adhesive layer can have this adhesive force while maintaining appropriate elasticity.

The thickness of the pressure-sensitive adhesive layer is preferably larger than the average particle diameter of the hollow thermoplastic resin particles used, and the number of the hollow fine particles of the thermoplastic resin larger than the thickness of the pressure-sensitive adhesive layer is preferably small. If a large amount of thermoplastic resin hollow fine particles larger than the thickness of the pressure-sensitive adhesive layer are contained, streaky uncoated portions are likely to be generated in the pressure-sensitive adhesive layer. For example, if the average particle size of the hollow thermoplastic resin particles is 40 μm, Desirable thickness of the pressure-sensitive adhesive layer is 40 / m or more, more preferably 60 μm or more, and further preferably 70 μm or more. Also, it is desirable that the hollow fine particles of the thermoplastic resin used should be removed beforehand by a sieve or the like, in particular, hollow fine particles of a thermoplastic resin having a particle diameter larger than the thickness of the pressure-sensitive adhesive layer.

To form the pressure-sensitive adhesive layer, the pressure-sensitive adhesive and cross-linking agent, etc., and thermoplastic resin hollow fine particles are usually mixed, and if necessary, a diluting solvent such as toluene is used, and the mixture is stirred and mixed with an appropriate homogenizer and applied to the substrate. It is desirable to have a release liner on the outermost pressure-sensitive adhesive layer of the roll of pressure-sensitive adhesive tape, but the release agent used for this release liner is the side opposite to the pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape. It is desirable to use a substrate provided with a release layer.

There are mainly silicone-based and non-silicon-based release agents. Silicone-based polyadducts of methylvinylpolysiloxane and methylhydridoenepolysiloxane with a catalyst such as platinum are generally known. The typical release agent silicones are Shin-Etsu Chemical Co., Ltd., Toray Industries Co., Ltd., and Toshiba Silicone Co., Ltd., with a range of light to heavy peeling agents. As an example, add 10 g of Shin-Etsu Chemical's KS847T to 0.1 g of a platinum-based catalyst (PL 50), dilute with 120 g of toluene, and dilute with 2.4 g of toluene. For example, a release agent solution is applied by a wire par having a wire diameter of 0.2 mm at a wet application amount of 10 g / m ² and dried at 100 ° C. for 2 minutes to form the release agent solution. In addition, non-silicone-based products generally show heavier release than silicon-based release agents, and long-chain alkyl-based, fluorine-based, alkyd-based, and acrylic-based products are known. A typical example is a long-chain alkyl type (such as Nichipan Gazette). For example, Diluted Yushi the (Piroiru 1 0 1 0) lg in Toruen 1 0 0 g, a solution prepared by dissolve, Uwe' preparative 1 0 g / m ² was applied in the wire par, dried for 2 minutes at 1 0 0 ° C And the like.

The dust cleaner of the present invention is obtained by winding the adhesive tape produced as described above on a suitable core material.

As described above, the dust cleaner of the present invention is used not only to directly remove dust and dirt adhering to an adherend, but also to capture dust and dust with an adhesive mouth. Therefore, a method can be used in which a dust cleaner is brought into contact with the adhesive rubber roll and rotated to remove dust and dirt attached to the adhesive roll.

Fig. 2 and Fig. 3 show the usage of such a dust cleaner. In FIG. 2, a core member 11 is provided with a wound body 12 of a dust cleaner, and the core member 11 is rotatably connected to a handle 13.

In FIG. 3, for example, in order to remove dust and dirt attached to the surface of the printed circuit board before exposure, before laminating, etc., the printed circuit board 21 is attached to an adhesive rubber roll 22, 22. The adhesive rubber rolls 22, 22 ′ capture dust and dirt adhering to the surface of the printed circuit board 21 by passing through the gap, and then the adhesive rubber rolls 22, 22, The dust cleaner 23, 23 ′ of the present invention is rotated by contact, and the dust and dust adhered to the surface of the adhesive rubber roll 22, 22 ′ are transferred to the dust cleaner 23, 23 ′. You. When the dust cleaners 23, 23 'are soiled, their parts are cut off, and the adhesive layer of the fresh (clean) dust cleaners 23, 23, 23 underneath appears.

Although the adhesive rubber mouth itself used for this purpose is known, various rubbers can be used for the adhesive rubber roll, but urethane rubber, fluorine rubber, polyisobutylene, butadiene rubber, Silicone rubber, Styrene butadiene rubber, Ethylene propylene rubber, Petinole Rubber, acrylic rubber, nitrile rubber, and the like can be used, and typically, silicone rubber, butyl rubber, and urethane rubber are used. The diameter of the hole is not limited, but a diameter of about 30 to 15 Omm is used for dust removal of printed circuit boards. Example

Hereinafter, specific examples of the present invention will be described with reference to examples, but the present invention is not limited to these examples and the like.

Example 1

Acrylic pressure-sensitive adhesive with a non-volatile content of 40% [trade name “SK Dine A-134” manufactured by Soken Chemical Co., Ltd.] Name “Microsphere F80 ED” manufactured by Matsumoto Yushi Seiyaku Co., Ltd .; average particle size 40 μm, particle size distribution 20-60 μm; specific gravity 27 kg / m ³ ; shell wall thickness Approximately 0.2 μπι) 0.85 g of toluene-wet product (5 g) was stirred and mixed in “Homoday Spar” manufactured by Tokushu Kika Kogyo Co., Ltd. Hardener (trade name “Aluminate A” manufactured by Kawaken Fine Chemical Co., Ltd.) 0.05 g was added, and the mixture was stirred and mixed in the “Homodisper”, and the mixture was further stirred and mixed. Then, the adhesive composition A was prepared by using a sieve to remove large particles such that the adhesive layer became streaked.

One side of a polyester film substrate having a thickness of 38 μm and a width of 2 Ocm was subjected to a release treatment with a silicone release agent, and the other side was coated with the pressure-sensitive adhesive composition A using a roll coater. Apply so that the thickness of the adhesive layer after drying is about 70 μππι. After drying, wind it up on a 38 mm inner diameter paper core so that the adhesive layer is on the outside, and use it for dust cleaner. An adhesive tape was made.

Comparative Example 1 Acrylic adhesive with a non-volatile content of 40% [trade name "SK Dyne A-1340" manufactured by Soken Chemical Co., Ltd.] 100 g and a thermally expandable microphone mouth capsule (trade name " Microcross F 80, manufactured by Matsumoto Yushi Pharmaceutical Co., Ltd.) 0.85 g of toluene-wet product (5 g) was stirred and mixed in Tokushu Kika Kogyo Co., Ltd. “Homoday Spar”. To 25 g of toluene, 0.05 g of an aluminum chelate-based curing agent (trade name “Aluminate A” manufactured by Kawaken Fine Chemicals Co., Ltd.) was added, and the mixture was stirred and mixed in the above “Homodisperse”. These were combined and further stirred and mixed to prepare an adhesive composition B.

One side of a 38 μm thick, 2 Ocm wide polyestenolefinolene substrate is subjected to a release treatment with a silicone release agent, and the other surface is coated with the above adhesive using a roll coater. The composition B was applied so that the thickness of the pressure-sensitive adhesive layer after expansion was about 70 // m, dried to remove the solvent, and then dried in an oven ("PH-200" After heating at 150 ° C to thermally expand the heat-expandable microcapsules in the adhesive layer, it is wound around a paper core with an inner diameter of 38 mm so that the adhesive layer is on the outside. Then, an adhesive tape for dust cleaner was prepared.

For the adhesive tapes obtained in Examples and Comparative Examples, tests of each item (adhesive layer thickness, adhesive force after 30 minutes of pressure bonding, adhesive force immediately after pressure bonding, dust adhesion performance, dust adhesion sustainability, post-rolling test , Dust elimination cleaner) and obtained the results shown in Table 1.

〔Test method〕

Adhesive layer thickness:

The thickness of the pressure-sensitive adhesive tape of the samples of Examples and Comparative Examples was measured according to the method specified in JISZ 0237, and the thickness of the polyester film (38 μπι) as the base material was subtracted. Calculated.

Adhesive force : The samples of Examples and Comparative Examples were measured for 90-degree peel adhesion of the pressure-sensitive adhesive tape to a stainless steel plate in accordance with the method specified in JISZ 0237. However, the adhesive strength after 30 minutes of pressure bonding is applied to a stainless steel plate, and measured after 30 minutes of pressure bonding with a pressure roller. Immediately after low pressure bonding, the adhesive force is measured immediately after pressure bonding at 3 g Z cm ² for 2 seconds. The measurement was performed, and the test was performed in place of instantaneous tackiness (tackiness).

Dust adhesion performance:

The samples of Examples and Comparative Examples were attached to an adherend in which metal powder was uniformly attached on a polyester film, peeled off, and the adhesion of metal powder (average particle size 5 / xm) attached to the surface of the adhesive The garbage adherence persistence performance was compared visually:

The sample to which the above-mentioned metal powder was adhered was peeled off the adhesive tape to a stainless steel plate at 90 degrees by a method specified in JIS I0237 to measure the adhesive force. However, the measurement was performed by the above-described test method based on the adhesive force immediately after pressure bonding.

Back roll test:

The samples of Examples and Comparative Examples were adhered onto the flooring as an adherend, and it was tested whether or not the tape was rewound on the vinylite as the adherent when the dust cleaner was rotated back and forth. .

Dust cleaner operation:

The samples of Examples and Comparative Examples were adhered to a flooring as an adherend, and the degree of dust removal and conformability to the adherend were tested when the dust cleaner was rotated back and forth. table 1

As shown in the above experiment, the dust cleaner according to the present invention is several times as rich as the conventional one, and has a high ability to instantly adhere dust, dust, and dirt, and has excellent sustainability. This eliminates the need to use a large amount of tape. In addition, even if the object to be cleaned is a smooth surface, there is no problem that the adhesive tape is unwound, and even if the surface of the object has irregularities, it has good adaptability and can be easily cleaned. can do. Industrial applicability

The dust cleaner of the present invention is used as a dust cleaner that is used by directly pressing it against a floor carpet, a tatami mat, a wall surface or a ceiling surface, and an adhesive that is pressed against an electronic material such as a print substrate or a liquid crystal plate. It is industrially useful as a dust cleaner that is brought into rotary contact with a roll to remove dust, dirt, and dirt from the adhesive layer.

Claims

The scope of the claims

1. An adhesive tape in which an adhesive layer preliminarily prepared in an adhesive and having elastic thermoplastic hollow particles dispersed therein is applied to one surface of a substrate, and the adhesive layer is set to the outside. Dust cleaner consisting of a roll of adhesive tape wound around.

2. The hollow thermoplastic resin microparticles having elasticity are hollow microparticles formed by previously heating and foaming a synthetic resin microphone opening capsule containing a heat-expandable substance. Dust cleaner.

3. The dust cleaner according to claim 1, wherein the adhesive tape roll has a release liner on an adhesive surface.

4. The dust cleaner according to any one of claims 1 to 3, wherein the thermoplastic resin hollow fine particles are spherical hollow fine particles.

5. The thermoplastic resin hollow particles 0. 0 1~0. L O g Z cm 3 of those having a specific gravity according to claim 1 dust cleaners scratch.

6. The dust cleaner according to any one of claims 1 to 5, wherein the average particle diameter of the hollow thermoplastic resin particles is in the range of 20 to 60 // πι.

7. The dust cleaner according to any one of claims 1 to 6, wherein the content of the hollow fine particles of the thermoplastic resin in the pressure-sensitive adhesive layer is in the range of 10 to 60% by volume based on the pressure-sensitive adhesive layer.

8. The dust cleaner according to any one of claims 1 to 7, wherein the content of the hollow fine particles of the thermoplastic resin in the pressure-sensitive adhesive layer is in a range of 0.5 to 5% by weight based on the pressure-sensitive adhesive layer.

9. The method according to JISZ 0 2 37, wherein the 90-degree peel adhesion after 30 minutes of roll bonding is 0.5 to 3 N / 20 mm. 9. The dust cleaner according to any one of to 8.

10. In accordance with the method specified in JISZ 0 2 37, affixing the tape to the stainless steel plate.The crimping condition was 3 g Z cm ² for 2 seconds. The dust cleaner according to any one of claims 1 to 9, which has a thickness of 0.25 to 1.5 N / 20 mm.

1 1. The dust cleaner according to any one of claims 1 to 10, for dust removal of a printed circuit board.

1 2. Equipped with an adhesive rubber roller and a dust remover according to any one of claims 1 to 10, wherein the adhesive rubber roller captures dust and dirt from an object to be dust-removed, A dust removal device that transfers dust and dirt caught by a conductive rubber roller to the dust cleaner that rotates in contact with the adhesive rubber roller to remove the dust.