WO2003092062A3 - Surface protection sheet and electronic device package - Google Patents

Surface protection sheet and electronic device package Download PDF

Info

Publication number
WO2003092062A3
WO2003092062A3 PCT/US2003/008511 US0308511W WO03092062A3 WO 2003092062 A3 WO2003092062 A3 WO 2003092062A3 US 0308511 W US0308511 W US 0308511W WO 03092062 A3 WO03092062 A3 WO 03092062A3
Authority
WO
WIPO (PCT)
Prior art keywords
electronic device
protection sheet
surface protection
device package
substrate
Prior art date
Application number
PCT/US2003/008511
Other languages
French (fr)
Other versions
WO2003092062A2 (en
Inventor
Makoto Sakakibara
Original Assignee
3M Innovative Properties Co
Makoto Sakakibara
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co, Makoto Sakakibara filed Critical 3M Innovative Properties Co
Priority to AU2003214239A priority Critical patent/AU2003214239A1/en
Publication of WO2003092062A2 publication Critical patent/WO2003092062A2/en
Publication of WO2003092062A3 publication Critical patent/WO2003092062A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Abstract

To provide a surface protection sheet useful as a back grinding tape, which does not cause defects or damages when an electronic device is subjected to grinding.A surface protection sheet used by being adhered to an element-fabricated surface of an electronic device, in which the surface protection sheet comprises a substrate and an adhesive layer supported by one surface of the substrate, and has a magnetic force sufficient to fix or necessary to assist in fixation of the electronic device when the electronic device is fixed to a fabrication apparatus for further fabrication of an element-unfabricated surface of the electronic device.
PCT/US2003/008511 2002-04-24 2003-03-20 Surface protection sheet and electronic device package WO2003092062A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003214239A AU2003214239A1 (en) 2002-04-24 2003-03-20 Surface protection sheet and electronic device package

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002122561A JP2003318142A (en) 2002-04-24 2002-04-24 Surface protection sheet and electronic component package
JP2002-122561 2002-04-24

Publications (2)

Publication Number Publication Date
WO2003092062A2 WO2003092062A2 (en) 2003-11-06
WO2003092062A3 true WO2003092062A3 (en) 2004-03-18

Family

ID=29267452

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/008511 WO2003092062A2 (en) 2002-04-24 2003-03-20 Surface protection sheet and electronic device package

Country Status (4)

Country Link
JP (1) JP2003318142A (en)
AU (1) AU2003214239A1 (en)
TW (1) TW200401356A (en)
WO (1) WO2003092062A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101820528B1 (en) * 2016-01-13 2018-01-19 송혜경 Masking Tape having Magnetpart

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3612955A (en) * 1969-01-21 1971-10-12 Bell Telephone Labor Inc Circuit board containing magnetic means for positioning devices
JPH05114643A (en) * 1991-10-21 1993-05-07 Sony Corp Holding method for wafer sheet of semiconductor wafer
JPH0778360A (en) * 1993-09-10 1995-03-20 Tosoh Corp Polishing jig and polishing method for stamper
US5479694A (en) * 1993-04-13 1996-01-02 Micron Technology, Inc. Method for mounting integrated circuits onto printed circuit boards and testing
US5966591A (en) * 1997-08-07 1999-10-12 Read-Rite Corporation Method and tool for handling micro-mechanical structures
US6302775B1 (en) * 2000-03-22 2001-10-16 Motorola, Inc. Apparatus and method for cold cross-sectioning of soft materials
JP2002348554A (en) * 2001-05-24 2002-12-04 Lintec Corp Sheet for fixing work and method for machining work
WO2003054943A1 (en) * 2001-12-21 2003-07-03 Disco Corporation Support substrate for thin-sheet work

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3612955A (en) * 1969-01-21 1971-10-12 Bell Telephone Labor Inc Circuit board containing magnetic means for positioning devices
JPH05114643A (en) * 1991-10-21 1993-05-07 Sony Corp Holding method for wafer sheet of semiconductor wafer
US5479694A (en) * 1993-04-13 1996-01-02 Micron Technology, Inc. Method for mounting integrated circuits onto printed circuit boards and testing
JPH0778360A (en) * 1993-09-10 1995-03-20 Tosoh Corp Polishing jig and polishing method for stamper
US5966591A (en) * 1997-08-07 1999-10-12 Read-Rite Corporation Method and tool for handling micro-mechanical structures
US6302775B1 (en) * 2000-03-22 2001-10-16 Motorola, Inc. Apparatus and method for cold cross-sectioning of soft materials
JP2002348554A (en) * 2001-05-24 2002-12-04 Lintec Corp Sheet for fixing work and method for machining work
WO2003054943A1 (en) * 2001-12-21 2003-07-03 Disco Corporation Support substrate for thin-sheet work

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 017, no. 476 (E - 1424) 30 August 1993 (1993-08-30) *
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 06 31 July 1995 (1995-07-31) *
PATENT ABSTRACTS OF JAPAN vol. 2003, no. 04 2 April 2003 (2003-04-02) *

Also Published As

Publication number Publication date
AU2003214239A1 (en) 2003-11-10
WO2003092062A2 (en) 2003-11-06
JP2003318142A (en) 2003-11-07
TW200401356A (en) 2004-01-16

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