200401356 玖、發明說明： 【發明所屬之技術領域】 本發明係關於一種表面防護片。特別係關於— t 、 禮表面防 護片，該防護片在生產一電子裝置時可用於保護其中已被200401356 (1) Description of the invention: [Technical field to which the invention belongs] The present invention relates to a surface protection sheet. In particular, it is related to-t, surface protective sheet, which can be used to protect an electronic device in which it has been
製造有元件及類似物之一電子裝置的表面；在鏡片研磨Z 間用於保護一已經完成研磨之鏡片的表面； _ <斤」於其他保 ?隻用途。另外，本發明還與該表面防護片所保強 — 口又—種物 品有關，例如一種電子裝置封裝。 【先前技術】 在生產半導體裝置及其他電子裝置之領域中，衆所週知 除更高精度、更高密度、及更高容量之發展外，微型化與 几件大小的縮減之發展正以顯著的速度前進。舉例而言， 一種用於半導體裝置生產之矽晶圓或其他半導體晶圓^背 面研磨到一預定的厚度，以在另一表面上製造了元件、1 形成了接線、電極、外部終端及類似物後，使其厚度減少 至約50至1〇〇微米（μπι)或更少。此研磨步騾通常稱為“背面研 磨。在背面研磨時，一稱為“背面研磨膠帶”之表面防護膠 Τ用來防止半導體晶圓具有元件及其他類似物之表面（以下 稱“製造了元件的表面”）受研磨期間所產生之碎屑等物弄髒 或弄壞。即，在背面研磨膠帶黏於製造了元件的表面後， 未受膠帶保護之半導體晶圓的背面（以下稱“未製造元件的 表面）由一背面研磨機進行研磨。當研磨工作完成後，半導 體晶圓通常切割成個別半導體晶片（大型積體電路（LSI)晶 片及類似物）。 84517 200401356 在半導體裝置的生產中，由於背面研磨的卓越生產力及 研磨精準度，它已廣泛採用作為一種研磨方式，並因此而 提出了各式的背面研磨膠帶。例如，日本未審查專利公開 案（Kokai)第2000-328023號中揭示了 —種用於晶圓表面之 黏接片’其包含各種類型的塑膠膜基板、及形成於基板上 之一黏接層，且其中該黏接層包括一種黏接混合物，其藉 由利用一能量射線將一混合物（由一黏接聚合物及一能量射 線-可聚合之化合物組成）硬化而獲得。日本未審查專利公開 案（Kokai)第2001 -200215號中揭示—種用於製造半導體晶 圓之黏接片’其包括提供於各種類型之塑膠膜基板之一表 面上的未受輻射實質硬化之一黏接層、及受輻射硬化且降 低黏性之一黏接層。此外，日本未審查專利公開案（K〇kai) 第200 1 -203255號中還揭示一種用於固定與保護半導體晶圓 之一黏接片。該黏接片包含各種類型之一塑膠膜基板層、 在该基板層之一表面上的一中間層，該中間層包含一種丙 烯酸聚合物，其彈性係數為30至1〇〇〇仟帕（kpa)，而其膠凝 比例為20。/。或更低，及形成於該中間層的該表面上之—種輻 射硬化的丙烯酸聚合物之一黏接層。 近來，吾人正對多維實施方法進行研究以提高有效容量 的密度。即人們正研究將半導體晶圓研磨成更薄之晶圓， 且層壓多個薄晶圓以獲得一整體構造。但半導體晶圓研磨 得愈薄，晶圓在研磨期間出現之缺陷或損壞亦愈高。習知 背面研磨膠帶無法克服缺陷或損壞問題。 另外，背面研磨膠帶可以有均勻厚度、適合柔軟性。但 84517 200401356 由於當一晶圓研磨得越薄時其強度減弱，所以柔軟的膠帶 增加產生缺陷或損壞之可能性。為克服此問題，日本未審 查專利公開案（尺仏叫第2000-1 29227號中揭示了一種用於 保〜半導0&33圓之黏接片，其包含一硬膜及—黏接層’其 中孩黏接層由一種能量射線硬化型黏接劑構成，且其中在 硬膜黏接層的反面壓有一層可收縮膜。日本未審查專利公 開案（Kokai)第2000-212524號中揭示了一種用於保護半導 體晶圓之黏接片，其包含一基板膜及一黏接層，其中該基 板膜由一多層膜構成，該多層膜至少包含一層彈性係數比 例在0.6 GPa或更高之薄膜層。 但是’上述公開案中所揭示之藉由採用相對硬質膜或多 層結構膜而取得之背面研磨膠帶在硬度方面仍不夠強硬。 另外’因晶圓的捲縮本質而產生之翹曲亦可能對晶圓產生 損壞。去除習知技術所引起之翹曲大體上是不可能的a 【發明内容] 本發明之目的旨在解決先前技術之問題。 本發明提供一種表面防護片，該防護片可作為—種背面 研磨膠帶及類似物使用，同時在物品受到研磨或其他製造 時該防護片不會導致產生缺陷或損壞。 此外’本發明提供一種表面防護片，其厚度均勻，且在 軟度上有所改進，即使要製造之物品很薄，該防護片也不 會導致其產生缺陷或損壞。 本發明還提供一種電子裝置封裝，該封裝在操作方面得 到改進，且不會對所製造之元件或裝置產生缺陷或損壞》 84517 200401356 藉由下列對本發明之詳細說明可清楚瞭解本發明。 本發明之一方面提出一種表面防護片’該表面防護片黏 合到一電子裝置之製造了元件的表面上，於此表面上已製 造有元件及類似物，其特徵在於該表面防護片包括一基板 及由該基板之一表面所支撐的一黏接層，該表面防護片在 製造该電子裝置之一未製造元件的表面時，具有足以將該 廷子1置固足、或輔助該電予裝置固定於一製造裝置上所 需要的磁力。 本發明之另一方面提出一種電子裝置封裝’該電子裝置 封裝包括一電子裝置及一表面防護片，前者具備一已經製 造有元件及類似物之一表面，後者則黏接於該電予裝置之 一製造了元件的表面上，該電子裝置封裝之特徵在於該表 面防護U含-基板及由該基板之—I面所支撐的一黏接 層，該表面防護片在製造該電子裝置之—未製造元件的表 面時’具有足以將該電子裝置固定、或辅助該電子裝置固 定於一製造裝置上所需要的磁力。 【實施方式】 本發明屬於-種保護一物品（要保護的物品）的表面之表 面防護片’其中該表面已經以任何方式製造。本發明之防 =藉由料所製造的表面或物品本身，用來保護物品表 =㈣或損壞’或在處理一未製造的表面時用來保護 物-免焚損壞。由表面防護片進行 於，有：在-表面已研磨過之後雖然不限 ^ 炱或在研磨的製程中之光 兄片（例如相機及眼鏡的鏡片）、半導體晶圓（例如碎晶圓 84517 200401356 、鎵晶圓、砷化鎵晶圓）、電子裝置等，於上述物品上已製 造了^牛，或已形成了接線、電極、外部终端及類似物。 總而言t，本發明纟防護片在要保護之物品是半成品時尤 其有用。 本發明之表面防護片，使用時可將其黏在有一表面已製 造了元件及類似物之一電子裝置的製造了元件的表面上。 有各種這樣的電子裝置。舉例而t，料晶圓層次晶片規 模封裝（CSP)，有密封樹脂類型、再接線類型、及接線板類 型CSP的電子組件。本發明之表面防護片可藉由黏到一製造 了元件的表面’當成這樣的電子裝置之防護材料使用。或 者，此表面防護片可較佳地用於防護一電予裝置之一表面 ’以便未製造元件之另一表面(未製造元件的表面)可接受製 造。未製造元件的表面之製造，雖然不限於，包括形成元 件（例如接線及外部連接終端），及研磨電子裝置的背面以製 造一更薄之裝置，即背面研磨工作。 一成型的表面防護片包括一基板及由該基板之一表面所支 撑的一黏接屬。 基板可為黏接膠帶領域廣為使用之類型。為實踐本發明 田從提供表面防護片合適之硬度以防止製成薄薄的電子裝 置免受損€、或防止該防護片在卷成—卷時發生的翹曲的 硯點來看，可有利地採用—熱塑樹脂材料來生產基板。合 :的熱塑樹脂’雖不限於，t聚氨脂樹脂、聚烯烴樹脂、 水酯樹脂、聚丙缔樹脂等。 基板厚度可根據表面防護片之應用等情況進行選擇。通常 84517 200401356 垓厚度約在12至1000 範圍中’最好是在約25至8〇〇 ，而約25至300 μχη更好。若該厚度少於12 μιη，則基板可能 會破損，使表面防護片失去效用。若該厚度大於〗〇〇〇 , 則防i隻片會太厚而不能防止防護片在卷成一卷時產生翹曲 。實際上在使用上述厚度之基板時，不需要提供傳統上所 需要用來防止翹曲的一塗層。 形成於基板之一表面上的黏接層用來將表面防護片暫時 地黏接到一電予裝置之一製造了元件的表面上。因此，它 可能有-可剥離特性。黏接層之“可剝離特性，，意指根據 曰本工業規格⑺”第z〇237號中所定義的黏接力大約〇 至10 N/25 mm的黏接力。 此具有可剝離特性之黏接層可採用各種黏接劑組成，且其 並不限於某種特定黏接劑。合適之黏接劑包括但不限於丙婦 酸鹽樹脂、聚氨酯樹脂、及聚丙烯氨基甲酸酯樹脂等。 任何上述黏接劑可藉由各種塗覆方法施敷在基板上，例 如印模塗法、讀法及刮塗法。使所塗之黏接劑變乾後形 成-預定厚度之黏接層。該黏接層之厚度可根據所採用黏 接劑、及所需要剥離力量程度等而改變，且根據需要約在2 至2 000 μπι的範圍中。 當黏接層之厚度根據需要有所增加時(例如當使用諸如熱 溶、紫外線（UV)可硬化、和其他黏接劑之非溶劑類型黏接 劑時；或當孩裝置之-製造了元件的表面有—損壞標記旬 該黏接層比在其他情況下更厚。損壞標記意指印在一半導 體晶片上的-樹脂材料’以表示在其上製造有晶片圖案之 S4517 -10- 200401356 半導體晶圓中的任何缺陷。 除了黏接層的厚度根據需求而增加 接層厚度通常在約2至40 μιη之範圍内 的上述情況以外 ’最好是約5至3 0 黏 μπι ，而 裝置 離。 約1 0至1 5 μπι更好。當其厚詹；丨、、h ,两予度小於2 μπι時，黏接在電子 上之表面防護片很可能自炊祕' b a…、地剠離或在輕微震擊下剥 若其厚度超過40 μπι，則其可剝離特性會降低。 當電子裝置之未製造元件的表面進行製造時，本發明之 表面防護片用來將該電子裝置固定於製造裝置上。因此， 該表面防護片可具有足以固定電予裝置、或辅助固定電子 裝置所必要之磁力。表面防護所需之磁力依據電子裝置的 士小、或依據製造裝置的結構而改變。當所需磁力表示為 —表面磁通量密度時’其通常约為3錢毫⑻特斯拉（丁 _ 或T) ’而約為5至1 5 mT更好。 表面防護片之磁力可在其生產之任何階段賦予表面防護 片通$有利之做法是在生產含有磁性材料（下文將解釋） :表面防護片之後’藉由一永久磁鐵或一電磁鐵對表面防 片進行磁化。若必要，可在將表面防護片黏接到電子裝 置或颌似物之則進行磁化過程。磁能量（表面磁通量密度） 可很容易地藉由可購得之測量裝置測得。 、告用万;电子裝置《製造裝置包括各種類型之傳統使用的製 j裝置其包括但不限於背面研磨機、膠帶壓合裝置、膠 ▼^離裝置、分割裝置等等。固定構件例如壓板、夹具、 基座取好由金屬板製成（如鐵板及鋼板），以放置待製造電子 裝置、及藉由磁力牢固地將電子裝置固定在製造裝置，參 84517 -11 - 200401356 見下又°羊細解釋。當採用抽吸器來固定電子裝置時，金屬 板最好可以有通風優良之多孔結構。 為使表面防s隻片具有預定程度之磁力，防護片之組成部 刀（例如基板、黏接層、在基板及黏接層之間所形成之磁力 廣在基板相對於黏接層之另—面上所形成之磁力層等）最 好具有足夠量之磁性材料，以顯示—預定程度的磁力。磁 性材料可能包含在-組成部分中，或包含在兩個或更多個 ’且成π刀巾’例如同時包含在基板及黏接層二者中。 圖1至圖4顯示結合了磁性材料的本發明之表 具體實施例之斷面圖。請表面防細顯示了 一基板10 及施加在㈣板的-表面上並膜化之黏接層2。展現磁力之 一磁性材料包含於黏接層2的内部。 本：明包括如圖所示的具體實施例採用之磁性材料不限 二 性材科。該材料的範例有鐵酸鹽類型隨化物) 材料、彩鈷類型材科、_刑物） 人.. 負型（钕、鐵、及硼）、及鋁鍥钍人 至類型材料。磁性材料單 5 結合使用。#科了早獨使用’或兩種或更多種材料 根據結合的方法签 1 並為爭m T以各種形式使用磁性材科。通常 其為表末形式。粉末可 吊 wf '' 針狀 '六面體狀等。磁粉 的大小可能大有不同。 兹杨 二田丄 吊大小在約1至55 μηι的範圍夕n ’而取好是在约之間1粉 圍^ 它混入到基板、黏接s ^ 又次大小，在將 P 層、或磁力層中時會產生不良影塑。 要此入之磁性材科的 0 有不同。通常磁性材料巧為其斤^的磁力等級而大 科為其所混入的基板、黏接層、及 84517 •12· 200401356 (或）磁力層的總質量之5G至98%，而最好是約8〇至95%。若 ,f材料的量少於質量的5 〇 %，則磁力不足以固定電子裝 直⑽右磁性材科的量大於質量的98%，則不能有效執行 膜覆製程。 ，圖i所不貫施例中，粉末狀磁性材料可以各種方式併入黏 接層中通吊，有利做法是先準備好塗覆用的黏接溶劑， 往溶劑中加入所需量的磁性材料，在塗覆前小心授掉溶劑 及混合溶劑。 圖2所不表面防護片j 〇包含一基板i及施敷在該基板的一 表面並膜化的—黏接層2。基板1中包含-磁性材料以顯示 磁力。表面防護片10之基板1及黏接層2的每-者可與…所 示防護片中所採用之對應物相同。粉末狀磁性材科可以各 種万式併人基板1中。通常，有利的做法是將所需量的磁性 材料捏入基板所用的散鄉樹φ 、& 、 的…、塑树5曰中，用砑光輥按壓該混合物 以對磁性材料進行定向，以及形成片狀。 圖3所示表面防護片1〇包含位於—基⑻及―黏接層2之 :的-磁力層3。該磁力層3包含—種磁性材料以顯二磁 :。圖4所示表面防護片1〇是圖3的-種變化，且顯示了形 ^在基板1及黏接層2之間的—磁力層3形成在基板！與黏接 層2相反之另一面上。該磁力声3 '、 磁力。表面防護片H)之基板^ ^㈣性材料以顯示 圖2所示防護片中所採用之對應物相;2。的每一者可與圖1及 ^於圖圖4所不炙表面防護片ι〇，粉末狀磁 以各種方式併入到基板1中。例如七 ^ 4 例如有利之做法是將所需量 84517 -13- 200401356 的磁性材料散布到一黏合劑樹脂中，接著將此懸浮液施加 万；膜化基板之一表面上，然後乾燥該生成物以製成—薄膜 。该等範例中所採用之黏合劑樹脂不限於一種特定黏合劑 树月曰且最好包括油墨用黏合劑樹脂，例如丙烯酸樹脂、 氨基甲酸酯樹脂及聚氯乙烯樹脂。 田磁力層的厚度可能依表面防護片之用途而改變。通常，其 厚度大 々在20至500 μπι之範圍中，最好是在約3〇至2〇〇卩出， t為50至〗50 μπι更好。若該厚度小於2〇 ，則磁力降得過 低而，’’、法口足％予I置，而若厚度超過pm，則所得之 表面防護片|厚度上會出現變化，$致對研磨I製成更薄 之半導體晶圓上的不便。 本發明I表面防護片有—基板及一黏接層作為基本組成 #刀，且根據需要而有—磁力層。若必要，該防護片可能 有傳統上當成—背面研磨膠帶、或—其他黏接膠帶使用的 ,附加層。一合適的附加層包括臨時保護一黏接層之一剝 離膜（脫離膜）。 本發明之·表面防護片可以各種形式提供。例如，它可為 具有-預足大小之扁平防護片、或一卷拉長的防護片。根 康本《X明，此防謾片具有一優點，即使該防護片捲成一卷 亦可防止它出現翹曲。 八本發明之表面防護片可以結合了電子裝置或其他組成部 之種層登的形式提供。例如，該防護片可在製造之前 或炎造中目’以將本發明之表面防護片黏貼到半成品鏡片 <待保護的表面上之方式用來製造鏡片。對於電子裝置製 84517 -14 - 200401356 商而$ ’提供s 、, ^ <片足万式為使該防護片黏貼到其中 已製造了元件的丰壤轉S ,上上 J千译日日囡（半成品）之製造了元件的表面 上。因為半成品的功能表面塗有表面防護片，所以產品在 操作或運輸時不會被弄髒或損壞。此外，接收產品之製造 两可在撕去該表面防護片後立即在下—製造步驟中使 產品。 因此’本發明係關於一種電予裝置封裝，其包含—電予 裝置(其有一表面已製造了元件及類似物)，及黏接到該電子 裝置之l le 了 7L件的表面之一表面防護片，其特徵在於 二該表面防護片為根據本發明之表面防護片，即該表面防 瘦片包含-基板、及由該基板之—表面所支播之—黏接層 ，該表面防護片在製造該電子裝置的_未製造元件的表面 時’具有足以固定該雷子裝署、1 电卞裝置或輔助固定該電子裝置於 一製造裝置所必要之磁力。 該電子裝置封裝可以各種形式提供。最好是以—半導體 晶圓之形式提供，例如一矽晶圓，其有由本發明之該表面 防1隻片所覆蓋的一製造了元件的表面、及形成於該製造了 兀件的表面之一相對侧上、待研磨及製造之一背面。舍採 用如本發明之半導體晶圓時，即使在背面研磨時將其二磨 得非常薄暨不會損壞該晶圓’或在製造了元件的表面也不 會被碎屑弄髒。 本發明還關於一種製造未受本發明之表面防護片遮蓋之 -物品表面的方法，而該物品之另—表面受防護片遮蓋。 一種較佳製造方法是用於半導體晶圓背面研磨之方法。 84517 -15- 200401356 、因此，本發明係關於一種用於背面研磨一半導體晶圓之 方法’其特徵在於一種研磨一半導體晶圓的一背面未製造 兀件的表Φ’以將該晶圓之厚度減至所需水準之方法，該 方法包含下列步.驟： 準備士有-製造了元件的表面之—電子裝置前體，將一 表面U (本發明疋表面防護片）藉由其黏接屠黏在電子 裝置前體上，並中智身而&省Λ .. 51表面防5又片包含一基板且該黏接層由 該基板之一表面所支撐，左兩 牙且社忒电子裝置雨'體的進一步製 造中當該前體固宏名„_、止姑$ + + 、 疋在I造裝置中時，該表面防護片有足 以固定該電予裝置前體、" 丑次輔助固疋孩電子裝置前體所必 要的磁力； 藉由该磁力或該磁力的辅助， 、止一 J祠坝在/又有衣面防謾片之未製 =1:露出之狀態下，將該電子裝置前體固定到製 2製=元件的表面受到保護的同3争，製造該電子裝置 則m <未製造元件的表面。 直 在此所採用之截播聲$ 《I I裝且為一種可購得之背面研 電子裝置前體藉由該表面 機。琢 ,、 万？又片乏磁力固足在背面研磨播 θ' 為將该則體確實地固定到壓板，最好_由一 孔金屬板將該前I#妾晉光田、 9 一多 〆則虹女置並固疋到一背面研磨機之— 夾具、基座等）。 整板（或 要放置於背面研磨機&厩、ι 甸研it機的壓板及電子裝置前體 金屬板並益·限制 ：；> ^丨Λ ^夕孔 生屬报龙…、限制。多孔金屬板最好可以具 以提高固定前體的空翁水让 疋乳孔， 4夹持效應。有利的生產方法是將金 84517 • 16 - 200401356 屬纖維或金屬微粒製成一 ^ | <形式，且對孩板進彳丁燒結。 一般採用強力磁销#划_，t ^ s 彳彳如鐵、姑、鎳及不銹鋼。此外 ，還可採用所謂的“冬嵐、” 屬母4或金屬網（線規）。 另外’本發明還關於一種生' 、 低工屋電子裝置4万法，其特徵 在於此生產JL右；1 π t , 、百711件及類似物的電子裝置之方法，包各下 列步驟： 13 準備-電予裝置，例如具有—製造了元件的表面之一半 導體晶圓’將—表面防護片(本發明之表面防護片)藉由1黏 接層黏到該電子裝置之一製造了元件的表面1中該表面 防…片基板且該黏接層由該基板之一表面支撐，且 ㈣電子裝置的未製造元件的表面之製造中，當該裝置固 疋在製以裝且中時，該表面防護片具有足以固定該電子 裝置、或輔助固定該電子裝置所必要的磁力； 一在沒有表面防護片之未製造元件的表面露出之狀態下， 藉由磁力或磁力之輔助將電子裝置固定到製造裝置；及 在保護製造了元件的表面的同時，製造該電子裝置前體 之未製造元件的表面。 本發明之生產電子裝置之方法可進一步包括一步驟’在 未製造元件的表面完成了製造後，將該電子裝置分割成個 別之電子裝置。 本發明之生產電子裝置之方法包括一種半導體晶圓背面 研磨方法，執行步驟如下： (Ό準備一半導體 藉由傳統的阻抗製程或膜化製程將電極、接線等形成在 84517 -17· 200401356 一半導體晶圓（此例採用矽晶圓）之表面上，該半導體晶圓由 單晶體切下並研磨。 (2) 黏接一表面防護片 在對所生產之矽晶圓檢查完畢後，將本發明之表面防護 片10藉由其黏接層10a黏到矽晶圓11之製造了元件的表面 11a上。黏接工作可藉由層壓機輕易完成。矽晶圓丨丨具有一 個表面1 1 b，孩表面要研磨到虛線丨1 c之深度水平。要研磨之 深度依電子裝置而不同。根據本發明，晶圓一般研磨到約 150至800 μηι之深度，從而可以輕易生產出厚度約為25 且有平滑背面之極薄晶圓。如圖6所示，在黏接完成後可獲 電子裝置封裝20’該電子裝置封裝包含一秒及覆 盍在元件製造表面的一表面防護片1〇。 (3) 背面研磨 如圖7所示，一電子裝置封裝2〇藉由一氣動卡盤（未顯示） 固定於一背面研磨機之壓板30上。該壓板3〇具有一多孔板 31以提高固定效果。電子裝置封裝2()之未加表面防護片之 待二磨表面暴露於研磨機35之下。碎晶圓&表面研磨到一 預定深度’而一製造了元件的表面由表面防護片保護。在 :面研磨完成後’自秒晶圓U撕掉表面防護片。然後沖洗石夕 曰口圓，並惊乾。 (4) 分割 糊分割成個別的晶片。分割程序最好藉由，例如， 將晶圓固定在一真空吸附臺i，並利用高速旋轉的金剛石 刀鋸切割碎晶圓、同時向晶圓上繞灌純水完成。 84517 -18· 200401356 刀J步驟後接著晶粒接著步驟 '樹脂密封步驟等。因為 該等步驟已為熟知此項技術者所知，所以在此不再瞀述。 實例 下列實例對本發明進行更進_步之閣明，但不意味對本 發明之範圍進行限制。下列實例僅供闡明之㈣，不意味 對隨附之申請專利範圍進行限制。 f例1 一種丙婦酸胺基曱酸酯樹脂（商品名稱[UT 1 〇〇]，由s〇ken Kagaku公司生產）及一種硬化劑（商品名稱[mc_〇丨]，由Asa幻 Glass公司生產）以重量比100:28進行混合。鐵氧類型磁粉 (商品名稱[GP-500]，由Toda K〇gy〇公司生產）以9〇%之體積 比率加入到所獲得之混合物中，然後所合成之混合物藉由 一移動的葉片類型之混合器均勻攪散。如此獲得一種具有 適合塗覆的黏度之磁性塗料。 準備38 μπι厚之聚對苯二甲酸乙二酯（pET)膜當成一基板 。在該基板的一表面上，由上述程序所得到之磁性塗料藉 由一刮刀塗覆器黏覆直到乾掉的膜厚度變成5〇 。將基板 上的膜放在一永久磁鐵附近以磁化該膜（表面磁通量密度約 =6 mT)，並放入一溫度在65 °C的烘爐中烘乾三分鐘。進而 獲得一種具有磁力層之PET基板。 為了在PET基板相對於磁力層之另一面形成一黏接層，採 用一刮刀塗覆器在相對側表面刷上一種黏接劑（商品名稱 [SK DYNE1501B]，由Soken Kagaku公司生產），使乾掉的膜 厚度變成3 μπι，並放入一溫度在65°C的烘爐烘乾三分鐘。 84517 -19- 200401356 進而獲得一目標表面防護片。 &在要捲成一卷的所獲得表面防護片之黏接層上黏接一層 剥離膜（商品名稱[G5Q]，由Toray公司生產），然後任其自然 。待48小時後將表面防護片#捲回來，可注意到未出現魅 曲0 然後，準備一表面（製造了元件的表面）具有鋁（A1)電極及 銅（Cu)接線之矽晶圓（直徑為2〇〇 mm，厚度為5〇〇 μιη)。藉由 —層壓機將按上述方法所獲得之表面防護片黏在製造了元 件的表面。 所獲得之表面防護的矽晶圓放置在一背面研磨機（商品名 稱[DFD-840]，由DISC0公司生產）之壓板上’使得該晶圓之 背面面向金剛石砂輪。在壓板表面上安裝一直徑為2〇〇 mm 、厚度為0.5 mm之多孔金屬板（SUS4471J1)，以藉由氣動卡 盤加強矽晶圓之吸附作用。將晶圓研磨到5〇 μιη厚度。晶圓 既未自金屬板表面升起，也未被損壞。將所研磨之矽晶圓 自背面研磨機上移除，並以肉眼觀察。發現所研磨之表面 平滑、整齊。 實例2 重複實例1除了在PET基板與磁力層相同之一面上形成一 黏接層以外之程序，採用一刮刀塗覆器將一黏接劑（商品名 稱SK DYNE1501B)塗在基板之磁力層表面，以獲得—厚度 為3 μιη之乾膜，並在65°C之烘爐中烘乾三分鐘。 在要捲成一卷的所獲得表面防護片之黏接層上黏接— 層剥離膜（商品名稱[G50]，由Toray公司生產），然後任其 84517 -20- 200401356 可注意到未出 自然。待4 8小時後將表面防護片鬆播回來 現麵曲。 所獲得之表面防護片藉由其 且在與實例1相同之條件下接受 屬板的表面升起，也未損壞。 研磨機上移除，並以肉眼觀察 、整齊。 黏接層黏在 同面石汗磨。 將所研磨之 —矽晶圓上， 阳圓既未從金 攻晶圓自背面 發現所研磨之表面 平滑 比較的實例1 除了省略提供該表面防護片—磁力層的步驟以外 實例1之程序作為比較。 ’重複 在要捲成一卷的所獲得表面防護片（沒有磁力層）之黏接 層上黏接一剝離膜（商品名稱[G50]，由Toray&司1 後任其自然。待48小時後’表面防護片鬆捲回來。可注意 到出現不易恢復的嚴重趣曲。 將所獲得之表面防護片藉由其黏接層黏在—矽晶圓上， 並在與實例1相同之條件下接受背面研磨。矽晶園自金屬板 表面升起，同時由於砂輪所造成之震擊—部分晶圓遭到破 壞。將所研磨切晶圓自背面研磨機上移除，丨以肉眼觀 祭。所研磨表面上出現許多不平滑部分。 貫例2至5及比毯例2黾3 除了製造了元件的矣而少职+ t * 开旳表面之形成及黏接層之形成依照下述 方式執行之外，重複實例1之程序。 製造了元件的表面之形成 採用矽曰曰圓，將鋁（A1)電極、鋼接線及壞標記製造於矽 84517 ，21 - 200401356 晶圓之一表面（製造了元件的表面）上。藉由從製造了元件的 表面印刷約為20 μπι咼度的一種樹脂材料，以該樹脂材料形 成壞標記。 黏接層之形成 為在PET基板之磁力層的相對位置形成一黏接層，以重量 比100:4混合一種黏接劑（商品名稱[/^_425],由1卯〇讣3丫似以 Kogyo公司生產）及一種硬化劑（商品名稱[Cr〇ss_丨mking agent N]，由Ipp0Sha Yushi Kogyo公司生產）。該混合物藉由一刮刀 以不同之厚度塗在PET基板之一表面上，從而得到在其乾後 分別為30 μιη(例3)、45 μπι(例4)或60 μηι(例5)的厚度，接著 將基板放入65°C之烘爐烘乾三分鐘。如此獲得目標表面防 護片。 為了作比較’除了在PET基板與磁力層之相對侧上形成— 黏接層外，還採用一刮刀塗覆器以乾掉後厚度1 μηι(比較的 例2)及25 μπι(比較的例3)將一種黏接劑（商品名稱[as_425] ’由Ipposha Yushi Kogyo公司生產）塗在pet基板之一表面上 ’然後將基板放入6 5 C之烘爐烘乾三分鐘。如此獲得目標 表面防護片。 評估 所獲得之表面防護片之測試涉及在研磨期間對晶圓造成 的損壞及根據例1所述方式對研磨表面進行肉眼檢查《此外 ，將完成研磨的矽晶圓黏在一施加於分割框架上的分割膠 帶上（商品名稱[G-19]，由Rintec公司生產），然後從晶圓上 撕下表面防護片以確認晶圓中有無任何損壞。評估結果匯 84517 -22· 200401356 總如下表。 實例編號 研磨中出現 裂缝 圖案位移 剝離時出現 破損 例3 無 無 無 例4 .4¾. ί Λ 無 無 例5 益 無 無 .比較的例2 有 有 無 比較的例3 有 有 無 本發明效果 如前所詳述’本發明提供了一種表面防護片，可作為背 面研磨膠帶及類似物使用，該表面防護片在一物品進行研 磨或其他處理時不會導致缺陷或損壞。 此外，本發明提供一種表面防護片，其厚度均勻，且在 軟度上有所改進’且即使待製造物品非常薄，該表面防護 片也不會導致物品出現缺陷或損壞。 此外，本發明提供一種電子裝置封裝，其在操作上有所 改進，且該電子裝置封裝對已製造的元件或裝置不會造成 缺陷或損壞。 熟知该項技蔽人士搞^ 7睹_β n π人士册了瞭解本發明之各種變型或改動均 不背離本發明之精神及範圍。 【圖式簡單說明】 圖1是一剖面圖 體實施例； 圖2是一剖面圖 其顯示本發明的表面防護片之一較佳具 其顯示本發明的表面防護片之另一較佳 84517 -23- 200401356 具體實施例； 圖3是一剖面圖，其顯示本發明的表面防護片之另一較佳 具體實施例； 圖4是一剖面圖，其顯示本發明的表面防護片之另一較佳 實施例； 圖5是一剖面圖，其顯示將本發明之表面防護片層壓在一 半導體晶圓上之方法； 圖6是一剖面圖，其顯示本發明的電予裝置封裝之另一較 佳具體實施例；及 圖7是一剖面圖，其顯示本發明之一種背面分割方法。 【圖式代表符號說明】 1 基板 2 黏接層 3 磁力層 10 表面防護片 10a 黏接層 11 矽晶圓 11a 製造了元件的表面 lib 表面 11c 虚線 20 電子裝置封裝 30 壓板 31 多孔金屬板 35 研磨機 84517 -24-The surface of an electronic device manufactured with components and the like; used to protect the surface of a finished lens between lens grinding Z; < catty " for other warranty purposes only. In addition, the present invention is also related to the type of articles secured by the surface protection sheet, such as an electronic device package. [Previous technology] In the field of producing semiconductor devices and other electronic devices, it is well known that in addition to the development of higher precision, higher density, and higher capacity, the development of miniaturization and reduction in the size of several pieces is making significant progress. Speed forward. For example, a silicon wafer or other semiconductor wafer used for semiconductor device production. The back surface is ground to a predetermined thickness to manufacture components on the other surface, 1 to form wiring, electrodes, external terminals, and the like. After that, its thickness is reduced to about 50 to 100 micrometers (μm) or less. This polishing step is commonly referred to as "back grinding." During back grinding, a surface protective tape called "back grinding tape" is used to prevent semiconductor wafers from having surfaces of components and the like (hereinafter referred to as "components manufactured" Surface ") is contaminated or damaged by debris or the like generated during polishing. That is, after the back surface abrasive tape is adhered to the surface of the device, the back surface of the semiconductor wafer not protected by the tape (hereinafter referred to as" The surface of the manufacturing element is ground by a back grinder. When grinding is completed, semiconductor wafers are usually diced into individual semiconductor wafers (large-scale integrated circuit (LSI) wafers and the like). 84517 200401356 In the production of semiconductor devices, due to the superior productivity and accuracy of back grinding, it has been widely used as a grinding method, and various back grinding tapes have therefore been proposed. For example, Japanese Unexamined Patent Publication (Kokai) No. 2000-328023 discloses an adhesive sheet for a wafer surface, which includes various types of plastic film substrates and an adhesive layer formed on the substrate. The adhesive layer includes an adhesive mixture obtained by hardening a mixture (composed of an adhesive polymer and an energy ray-polymerizable compound) with an energy ray. Japanese Unexamined Patent Publication (Kokai) No. 2001-200215 discloses an adhesive sheet for manufacturing a semiconductor wafer, which includes a non-radiated hardened material provided on one surface of various types of plastic film substrates. An adhesive layer, and an adhesive layer which is hardened by radiation and reduced in viscosity. In addition, Japanese Unexamined Patent Publication (Kokai) No. 200 1 -203255 discloses an adhesive sheet for fixing and protecting a semiconductor wafer. The adhesive sheet includes a plastic film substrate layer of various types, and an intermediate layer on one surface of the substrate layer. The intermediate layer includes an acrylic polymer and has an elastic coefficient of 30 to 1000 kPa (kpa). ), And its gelation ratio is 20. /. Or lower, and an adhesion layer formed on the surface of the intermediate layer, one of a radiation-hardened acrylic polymer. Recently, I am researching multidimensional implementation methods to increase the density of effective capacity. That is, people are studying grinding semiconductor wafers into thinner wafers, and laminating multiple thin wafers to obtain a monolithic structure. However, the thinner the semiconductor wafer is ground, the higher the defects or damage that occur during the grinding process. Conventional Abrasive tape on the back cannot overcome defects or damage. In addition, the back abrasive tape can have a uniform thickness and is suitable for flexibility. But 84517 200401356 As the strength of a wafer is reduced as it gets thinner, soft tape increases the possibility of defects or damage. In order to overcome this problem, Japanese Unexamined Patent Publication No. 2000-1 29227 discloses an adhesive sheet for protecting a semiconducting 0 & 33 circle, which includes a hard film and an adhesive layer. The adhesive layer is composed of an energy ray hardening adhesive, and a shrinkable film is pressed on the reverse side of the hard film adhesive layer. Japanese Unexamined Patent Publication (Kokai) No. 2000-212524 discloses An adhesive sheet for protecting a semiconductor wafer includes a substrate film and an adhesive layer, wherein the substrate film is composed of a multilayer film, and the multilayer film includes at least one layer having an elastic modulus ratio of 0.6 GPa or higher. Thin film layer. However, the back-grinding tape obtained by using a relatively hard film or a multilayer structure film disclosed in the above-mentioned publication is still not strong enough in hardness. In addition, the warping due to the nature of the wafer shrinkage is also It may cause damage to the wafer. It is generally impossible to remove the warpage caused by the conventional technology. [Summary] The purpose of the present invention is to solve the problems of the prior art. The present invention provides a surface protection sheet The protective sheet can be used as a kind of back-grinding tape and the like, and at the same time, the article will not cause defects or damage when the article is ground or otherwise manufactured. In addition, the present invention provides a surface protective sheet having a uniform thickness, And the softness is improved, even if the article to be manufactured is thin, the protective sheet will not cause defects or damage. The invention also provides an electronic device package, which is improved in operation and does not Defects or damage to manufactured components or devices "84517 200401356 The present invention can be clearly understood through the following detailed description of the present invention. One aspect of the present invention proposes a surface protection sheet 'the surface protection sheet is bonded to an electronic device manufacturing On the surface of the component, components and the like have been manufactured on the surface, characterized in that the surface protection sheet includes a substrate and an adhesive layer supported by one surface of the substrate, and the surface protection sheet is manufacturing the The surface of an unmanufactured component of an electronic device is sufficient to hold the court 1 in place, or to assist the electric device. The magnetic force required to be fixed on a manufacturing device. According to another aspect of the present invention, an electronic device package is provided. The electronic device package includes an electronic device and a surface protection sheet. The former is provided with one of components and the like that have been manufactured. The latter is adhered to the surface of one of the electrical devices where the component is manufactured. The electronic device package is characterized by the surface protection U-containing substrate and an adhesive layer supported by the -I side of the substrate. The surface protection sheet has a magnetic force sufficient to fix the electronic device or assist the electronic device to be fixed on a manufacturing device when manufacturing the surface of the electronic device—unmanufactured component. [Embodiment] The present invention belongs to- A surface protection sheet that protects the surface of an article (item to be protected), wherein the surface has been manufactured in any way. The protection of the present invention = the surface manufactured by the material or the article itself is used to protect the table of articles = ㈣ or 'Damaged' or used to protect an unmanufactured surface-from incineration. The surface protection sheet is carried out in the following ways: after the surface has been polished, although it is not limited ^ 炱 or in the grinding process of optical brothers (such as lenses of cameras and glasses), semiconductor wafers (such as broken wafers 84517 200401356 , Gallium wafer, gallium arsenide wafer), electronic devices, etc., have been manufactured on the above items, or wiring, electrodes, external terminals and the like have been formed. In summary, the thorium protective sheet of the present invention is particularly useful when the article to be protected is a semi-finished product. The surface protective sheet of the present invention can be adhered to a surface on which a component of one of electronic devices having a surface on which a component and the like have been manufactured is manufactured. There are various such electronic devices. As an example, the wafer-level wafer-scale package (CSP) has electronic components of sealing resin type, rewiring type, and wiring board type CSP. The surface protective sheet of the present invention can be used as a protective material for such an electronic device by being adhered to a surface on which a component is manufactured. Alternatively, the surface protection sheet can be preferably used to protect one surface of an electric device so that the other surface of the unmanufactured component (the surface of the unmanufactured component) can be manufactured. The manufacturing of the surface of unmanufactured components, although not limited to, includes forming components (such as wiring and external connection terminals), and grinding the back of an electronic device to make a thinner device, the back grinding work. A formed surface protection sheet includes a substrate and an adhesive metal supported by a surface of the substrate. The substrate can be a type widely used in the field of adhesive tape. In order to practice the present invention, it may be advantageous to provide a surface protection sheet with a suitable hardness to prevent thin electronic devices from being damaged, or to prevent the protection sheet from warping when rolled into a roll. The use of-thermoplastic resin materials to produce substrates. The thermoplastic resin is not limited to polyurethane resin, polyolefin resin, water ester resin, polypropylene resin, and the like. The thickness of the substrate can be selected according to the application of the surface protective sheet. Usually 84517 200401356 垓 The thickness is in the range of about 12 to 1000 ', preferably about 25 to 800, and more preferably about 25 to 300 μχη. If the thickness is less than 12 μm, the substrate may be damaged, and the surface protective sheet may become ineffective. If the thickness is greater than 〇〇〇〇, the anti-i sheet will be too thick to prevent the protective sheet from warping when rolled into a roll. In practice, when using a substrate of the above thickness, it is not necessary to provide a coating layer conventionally required to prevent warpage. An adhesive layer formed on one surface of the substrate is used to temporarily adhere the surface protective sheet to the surface of one of the electrical devices on which the component is manufactured. Therefore, it may have a peelable property. The "peelable property of the adhesive layer" means an adhesive force of approximately 0 to 10 N / 25 mm according to the adhesive force defined in Japanese Industrial Standard No. z〇237. The peelable adhesive layer may be composed of various adhesives, and it is not limited to a specific adhesive. Suitable adhesives include, but are not limited to, acrylic resin, polyurethane resin, and polypropylene urethane resin. Any of the above-mentioned adhesives can be applied to a substrate by various coating methods such as a die coating method, a reading method, and a doctor blade method. The applied adhesive is dried to form an adhesive layer of a predetermined thickness. The thickness of the adhesive layer can be changed according to the adhesive used, the required peeling strength, etc., and it is in the range of about 2 to 2 000 μm as needed. When the thickness of the adhesive layer is increased as required (for example, when using a non-solvent type adhesive such as heat-soluble, ultraviolet (UV) hardenable, and other adhesives); or when the device is manufactured- The surface has a-damage mark. The adhesive layer is thicker than in other cases. The damage mark means a -resin material 'printed on a semiconductor wafer to indicate the S4517 -10- 200401356 semiconductor wafer on which the wafer pattern is manufactured. Any defect in the circle. Except for the above case where the thickness of the adhesive layer is increased according to demand, the thickness of the adhesive layer is usually in the range of about 2 to 40 μm ′, preferably about 5 to 30 μm μm, and the device is off. 10 to 15 μπι is better. When its thickness is thick; 丨, h, and the two degrees are less than 2 μπι, the surface protection sheet adhered to the electron is likely to self-cook 'ba ... If the thickness of the peeling under shock exceeds 40 μm, its peelability will be reduced. When the surface of an unmanufactured component of an electronic device is manufactured, the surface protective sheet of the present invention is used to fix the electronic device to the manufacturing device. therefore The surface protection sheet may have a magnetic force sufficient to fix the electric device or assist the fixing of the electronic device. The magnetic force required for surface protection varies depending on the taxi of the electronic device or the structure of the manufacturing device. When the required magnetic force is expressed as —At the surface magnetic flux density, 'it is usually about 3 cents tesla (T_ or T)' and preferably about 5 to 15 mT. The magnetic force of the surface protection sheet can impart surface protection at any stage of its production It is advantageous to use the sheet pass after the production of magnetic materials (explained below): after the surface protection sheet, the surface protection sheet is magnetized by a permanent magnet or an electromagnet. If necessary, the surface protection sheet may be bonded. When it comes to electronic devices or jaw-like objects, the magnetization process is performed. Magnetic energy (surface magnetic flux density) can be easily measured by commercially available measuring devices. Electronic devices "manufacturing devices include various types of traditional The j-making device used includes, but is not limited to, a back-grinding machine, an adhesive tape pressing device, a glue separating device, a dividing device, etc. Fixing members such as a pressing plate, a clamp, and a base Take the metal plate (such as iron plate and steel plate) to place the electronic device to be manufactured, and securely fix the electronic device to the manufacturing device by magnetic force. See 84517 -11-200401356 below for a detailed explanation. When using an aspirator to fix an electronic device, the metal plate should preferably have a porous structure with excellent ventilation. In order to prevent the surface of the sheet from having a predetermined degree of magnetic force, the component parts of the protective sheet (such as substrates, adhesive layers, The magnetic force formed between the substrate and the adhesive layer is wide. The magnetic layer formed on the other side of the substrate relative to the adhesive layer, etc.) preferably has a sufficient amount of magnetic material to display a predetermined degree of magnetic force. Magnetic The material may be contained in the -component, or contained in two or more 'and π knife towels', for example, contained in both the substrate and the adhesive layer. 1 to 4 show sectional views of a specific embodiment of the watch of the present invention incorporating a magnetic material. The surface of the substrate is shown in detail to prevent a substrate 10 and an adhesive layer 2 applied on the surface of the fascia and filmed. A magnetic material exhibiting magnetic force is contained inside the adhesive layer 2. Ben: This includes the magnetic materials used in the specific embodiments shown in the figure. Examples of this material are ferrite type accompany material), colored cobalt type material family, _ criminal property) people: negative type (neodymium, iron, and boron), and aluminum halide to type materials. Magnetic material sheet 5 is used in combination. # 科 了 早 独 用 ’or two or more materials are signed according to the combined method and the magnetic material section is used in various forms for the competition. It is usually at the end of the table. The powder can hang wf '' acicular 'hexahedral and so on. The size of the magnetic particles may vary widely.杨 杨二田 丄 The size is in the range of about 1 to 55 μηι, and it is better to be between about 1 powder ^ It is mixed into the substrate, bonding s ^ and the size, in the P layer, or the magnetic layer Will produce bad shadows. The 0 of the magnetic materials department is different. Usually the magnetic material is the magnetic force level of Dajin, and Dake is 5G to 98% of the total mass of the substrate, adhesive layer, and 84517 • 12 · 200401356 (or) magnetic layer, and it is preferably about 80 to 95%. If the amount of the f material is less than 50% of the mass, the magnetic force is insufficient to fix the electronic device, and if the amount of the right magnetic material is greater than 98% of the mass, the film coating process cannot be effectively performed. In the inconsistent embodiment shown in FIG. I, the powdery magnetic material can be incorporated into the adhesive layer in various ways, and it is advantageous to prepare an adhesive solvent for coating and add the required amount of magnetic material to the solvent , Carefully teach the solvent and mixed solvents before coating. The surface protection sheet j in FIG. 2 includes a substrate i and an adhesive layer 2 applied to a surface of the substrate and formed into a film. The substrate 1 contains a magnetic material to display magnetic force. Each of the substrate 1 and the adhesive layer 2 of the surface protective sheet 10 may be the same as the counterparts used in the protective sheet shown. Various types of powdered magnetic materials can be incorporated into the substrate 1. Generally, it is advantageous to knead the required amount of magnetic material into the scattered trees φ, &, ..., and plastic tree used in the substrate, and press the mixture with a calender roller to orient the magnetic material, and Form flakes. The surface protection sheet 10 shown in FIG. 3 includes a magnetic layer 3 located on the base layer and the adhesive layer 2. The magnetic layer 3 includes a magnetic material to display two magnetic fields. The surface protection sheet 10 shown in FIG. 4 is a variation of that in FIG. 3 and shows that the shape between the substrate 1 and the adhesive layer 2-the magnetic force layer 3 is formed on the substrate! Opposite to the adhesive layer 2. The magnetic force sounds 3 ', magnetic force. The substrate of the surface protection sheet H) is made of a non-conductive material to show the corresponding phase used in the protection sheet shown in FIG. 2; 2. Each of them can be incorporated into the substrate 1 in various ways with the surface protection sheet ι0 shown in FIG. 1 and FIG. For example, 7 ^ 4 For example, it is advantageous to disperse the required amount of magnetic material of 84517 -13- 200401356 into an adhesive resin, and then apply this suspension to 10,000; film one surface of the substrate, and then dry the product Made of-thin film. The binder resin used in these examples is not limited to a specific binder, and preferably includes binder resins for inks, such as acrylic resins, urethane resins, and polyvinyl chloride resins. The thickness of the magnetic field layer may vary depending on the use of the surface protective sheet. Generally, its thickness is in the range of 20 to 500 μm, preferably about 30 to 200 μm, and t is preferably 50 to 50 μm. If the thickness is less than 20, the magnetic force will be too low, and "%" will be set to I, and if the thickness exceeds pm, the thickness of the obtained surface protection sheet will change. The inconvenience of making thinner semiconductor wafers. The surface protective sheet of the present invention has a base plate and an adhesive layer as basic components, and a knife layer as required. If necessary, the protective sheet may have an additional layer traditionally used as—backside abrasive tape, or—other adhesive tape. A suitable additional layer includes a release film (release film) that temporarily protects an adhesive layer. The surface protection sheet of the present invention can be provided in various forms. For example, it could be a flat protective sheet with a pre-foot size, or a roll of elongated protective sheet. According to the "Xing Ming", this anti-scratch sheet has an advantage, even if the protective sheet is rolled into a roll, it can prevent it from warping. The surface protection sheet of the present invention may be provided in the form of a seed layer in combination with an electronic device or other components. For example, the protective sheet can be used to manufacture a lens by adhering the surface protective sheet of the present invention to a semi-finished lens < surface to be protected, before or during manufacture. For electronic device manufacturing 84517 -14-200401356, quot; provide s ,, ^ < film foot type to make the protective sheet adhere to the rich soil transfer S in which the component has been manufactured, on the J thousand translation sundial ( Semi-finished product) on the surface of the component. Because the functional surface of the semi-finished product is coated with a surface protection sheet, the product will not be soiled or damaged during handling or transportation. In addition, the manufacture of the receiving product can be performed in the next-manufacturing step immediately after the surface protection sheet is removed. Therefore, the present invention relates to a package for an electric device, which includes an electric device (which has components and the like already manufactured on one surface), and one of the surfaces bonded to the surface of the electronic device. The sheet is characterized in that the surface protective sheet is a surface protective sheet according to the present invention, that is, the surface anti-thin sheet includes a substrate and an adhesive layer propagated from a surface of the substrate. The surface protective sheet is The surface of the unmanufactured component of the electronic device is manufactured with a magnetic force sufficient to fix the lightning device, an electric device, or an auxiliary device to fix the electronic device to a manufacturing device. The electronic device package may be provided in various forms. Preferably, it is provided in the form of a semiconductor wafer, such as a silicon wafer, which has a component-manufactured surface covered by the surface-protecting sheet of the present invention, and is formed on the surface of the manufactured member. On the opposite side, a back surface to be ground and manufactured. When a semiconductor wafer such as the present invention is used, even if the second wafer is ground very thin during back grinding, it will not damage the wafer 'or the surface on which the component is manufactured will not be soiled by debris. The invention also relates to a method for manufacturing the surface of an article which is not covered by the surface protective sheet of the present invention, and the other surface of the article is covered by the protective sheet. A preferred manufacturing method is a method for polishing the back of a semiconductor wafer. 84517 -15- 200401356. Therefore, the present invention relates to a method for back-grinding a semiconductor wafer 'characterized by a method of grinding a surface of a semiconductor wafer with unmanufactured components Φ' to A method for reducing the thickness to a required level. The method includes the following steps. Preparing the surface of the component—the precursor of an electronic device—a surface U (the surface protection sheet of the present invention) is adhered thereto. It is glued on the electronic device precursor, and it is in the state of sage & province Λ .. 51 surface anti-fouling and a sheet includes a substrate and the adhesive layer is supported by one surface of the substrate, the left two teeth and the social electronics In the further manufacture of the device rain body, when the precursor solid name __, Zhigu $ + +, 疋 in the I device, the surface protection sheet is sufficient to fix the electric device precursor, " Ugly The magnetic force necessary to assist in fixing the precursor of the electronic device; With the help of the magnetic force or the magnetic force, the Zhiyi Jciba is in the state with / without the lining of the anti-scratch sheet = 1: in the exposed state The electronic device precursor is fixed to the same surface as the surface of the component. The surface of the electronic device is m < the surface of the unmanufactured component. The cut-off sound used here is "II" and is a commercially available backside electronic device precursor through the surface machine. Wan? Another piece of film lacks magnetic force and is fixed on the back to grind and broadcast θ 'In order to secure the ruler to the pressure plate, it is best to _ the former I # 妾 晋光田 by a hole metal plate, 9 Hongyu And fixed to a back grinding machine-fixture, base, etc. The entire plate (or to be placed in the back grinding machine & 厩, ι 研 研 机 it press plate and electronic device precursor metal plate benefits and restrictions: ≫ ^ 丨 Λ ^ Porcelain is a dragon ..., restriction. Porous metal plates are best to have the effect of fixing the precursor's empty water to make the pores pinch, 4 clamping effect. An advantageous production method is to deposit gold 84517 • 16-200401356 It is made of fiber or metal particles, and it is sintered. It is generally made of strong magnetic pins # 划, t ^ s, such as iron, iron, nickel, and stainless steel. In addition, you can also use the so-called "Dong Lan," a mother 4 or a metal mesh (wire gauge). Ming also refers to a 40,000 method for producing electronic devices in low-work house, which is characterized by the method of producing JL right; 1 π t, one hundred 711 electronic devices and the like, including the following steps: 13 Preparation-Electrical For example, a semiconductor wafer having-one of the surfaces on which the element is manufactured-will-a surface protection sheet (the surface protection sheet of the present invention) is adhered to the surface 1 of one of the electronic devices on which the element is manufactured by an adhesive layer. The surface protection sheet substrate and the adhesive layer are supported by one surface of the substrate, and in the manufacture of the surface of an unmanufactured component of an electronic device, the surface protection sheet is fixed when the device is fixed in a built-in state. Have sufficient magnetic force necessary to fix the electronic device, or assist in fixing the electronic device;-in a state where the surface of the unmanufactured component without a surface protection sheet is exposed, the electronic device is fixed to the manufacturing device with the help of magnetic force or magnetic force; And while protecting the surface of the manufactured component, the surface of the unmanufactured component of the electronic device precursor is manufactured. The method for producing an electronic device of the present invention may further include a step of 'separating the electronic device into individual electronic devices after the surface of the unmanufactured component is manufactured. The method for producing an electronic device of the present invention includes a method for polishing a semiconductor wafer backside, and the execution steps are as follows: (Ό Prepare a semiconductor to form electrodes, wirings, etc. on the 84517-17 · 200401356 semiconductor by a conventional impedance process or a filming process. On the surface of the wafer (a silicon wafer is used in this example), the semiconductor wafer is cut and polished from a single crystal. (2) A surface protection sheet is bonded. After the produced silicon wafer is inspected, The surface protective sheet 10 is adhered to the surface 11a of the silicon wafer 11 on which the component is manufactured through its adhesive layer 10a. The adhesion work can be easily completed by a laminator. The silicon wafer has a surface 1 1 b, The surface needs to be polished to a depth level of 1 c. The depth to be polished depends on the electronic device. According to the present invention, the wafer is generally ground to a depth of about 150 to 800 μηι, so that the thickness can be easily produced to about 25 and Ultra-thin wafer with a smooth back surface. As shown in FIG. 6, after the bonding is completed, an electronic device package 20 'can be obtained. The electronic device package includes one second and a surface protection covering the component manufacturing surface. 10. (3) Back grinding As shown in FIG. 7, an electronic device package 20 is fixed on a platen 30 of a back grinding machine by a pneumatic chuck (not shown). The platen 30 has a perforated plate 31 to improve the fixing effect. The surface of the electronic device package 2 () without the surface protection sheet to be polished is exposed under the grinder 35. The broken wafer & surface is ground to a predetermined depth, and a surface of the component is manufactured. Protected by the surface protection sheet. After the surface grinding is completed, the surface protection sheet is torn off from the second wafer U. Then Shi Xiyue rinses the mouth round and dries. (4) The division paste is divided into individual wafers. The division process is the most For example, the wafer is fixed on a vacuum suction table i, and the wafer is cut by a high-speed rotating diamond blade saw, and the wafer is filled with pure water at the same time. 84517 -18 · 200401356 The knife J step is followed by The crystal grains are followed by a step 'resin sealing step, etc. Because these steps are already known to those skilled in the art, they will not be described here again. Examples The following examples further improve the present invention. Limit the scope of the invention The following examples are for illustrative purposes only, and are not meant to limit the scope of the accompanying patent application. FExample 1 A propylammonium aminoacetate resin (trade name [UT 1 〇〇], by Soken Kagaku Company Production) and a hardener (trade name [mc_〇 丨], produced by Asa Magic Glass Company) at a weight ratio of 100: 28. Ferrite magnetic powder (trade name [GP-500], produced by Toda K〇gy (Manufactured by the company) was added to the obtained mixture in a volume ratio of 90%, and the synthesized mixture was uniformly dispersed by a moving blade type mixer. Thus, a magnetic coating having a viscosity suitable for coating was obtained. . A 38 μm thick polyethylene terephthalate (pET) film was prepared as a substrate. On one surface of the substrate, the magnetic coating obtained by the above procedure was adhered by a doctor blade applicator until the thickness of the dried film became 50. The film on the substrate is placed near a permanent magnet to magnetize the film (surface magnetic flux density is about 6 mT), and dried in an oven at 65 ° C for three minutes. Further, a PET substrate having a magnetic layer was obtained. In order to form an adhesive layer on the other side of the PET substrate opposite to the magnetic layer, a blade coater was used to apply an adhesive (trade name [SK DYNE1501B], manufactured by Soken Kagaku company) on the opposite side surface to dry it out. The film thickness became 3 μm and dried in an oven at 65 ° C for three minutes. 84517 -19- 200401356 Further, a target surface protection sheet was obtained. & Attach a release film (trade name [G5Q], manufactured by Toray) to the adhesive layer of the obtained surface protection sheet to be rolled into a roll, and leave it as it is. After 48 hours, roll the surface protection sheet # back, and notice that no charm 0 appears. Then, prepare a silicon wafer (diameter with a (A1) electrode and copper (Cu)) surface (diameter) (200 mm, thickness is 500 μm). The surface protective sheet obtained as described above was adhered to the surface of the manufactured component by a laminator. The obtained surface-protected silicon wafer was placed on a platen of a back grinding machine (trade name [DFD-840], manufactured by DISC0 Corporation) so that the back of the wafer faced a diamond wheel. A porous metal plate (SUS4471J1) with a diameter of 200 mm and a thickness of 0.5 mm was installed on the surface of the platen to enhance the adsorption of the silicon wafer by a pneumatic chuck. The wafer was ground to a thickness of 50 μm. The wafer was neither lifted nor damaged from the surface of the metal plate. Remove the polished silicon wafer from the back grinder and observe it with the naked eye. The ground surface was found to be smooth and tidy. Example 2 The procedure of Example 1 was repeated except that an adhesive layer was formed on the same surface of the PET substrate and the magnetic layer. A doctor blade applicator was used to apply an adhesive (trade name SK DYNE1501B) to the surface of the magnetic layer of the substrate. Obtain a dry film with a thickness of 3 μm and dry in an oven at 65 ° C for three minutes. Adhere to the adhesive layer of the obtained surface protection sheet to be rolled into a roll-a release film (trade name [G50], manufactured by Toray Corporation), and then leave it to 84517 -20- 200401356. Notice that nothing happens. After 48 hours, loosen the surface protection sheet back to show the song. The obtained surface protection sheet was not damaged even though the surface of the metal plate was raised under the same conditions as in Example 1. Remove from the grinder and observe with the naked eye, neatly. Adhesive layer sticks to the stone rubbing on the same surface. On the polished silicon wafer, Yang Yuan has not found the smooth surface of the polished surface from the back of the golden tap wafer. Example 1 is compared with the procedure of Example 1 except that the step of providing the surface protection sheet-magnetic layer is omitted. . 'Repeatedly attach a release film (trade name [G50]) to the adhesive layer of the obtained surface protection sheet (without magnetic layer) to be rolled into a roll, leave it to Toray & Division 1 and let it go. After 48 hours, the surface The protective sheet is loosely rolled back. It can be noticed that there is a serious interesting song that is difficult to recover. The obtained surface protective sheet is adhered to a silicon wafer by its adhesive layer, and subjected to back grinding under the same conditions as in Example 1. .Silicon garden rises from the surface of the metal plate, and at the same time, due to the shock caused by the grinding wheel-part of the wafer is damaged. Remove the cut wafer from the back grinder and observe it with the naked eye. The polished surface There are many uneven parts on the surface. Examples 2 to 5 and 2 to 3 than blanket example 2 黾 3 except for the element manufacturing and t + + * The formation of the opening surface and the formation of the adhesive layer are performed in the following manner, The procedure of Example 1 was repeated. The surface of the manufactured device was formed using silicon wafers, and aluminum (A1) electrodes, steel wires, and bad marks were fabricated on one surface of the silicon 84517, 21-200401356 wafer (the surface on which the device was manufactured). ) On. By making from A resin material having a thickness of about 20 μπι 咼 is printed on the surface of the piece, and bad marks are formed with the resin material. The adhesive layer is formed by forming an adhesive layer at a relative position of the magnetic layer of the PET substrate, with a weight ratio of 100: 4. Mixing an adhesive (trade name [/ ^ _ 425], manufactured by Kogyo Company 1 卯 〇 讣 3 丫) and a hardener (trade name [Cr〇ss_ 丨 mking agent N], manufactured by Ipp0 Sha Yushi Kogyo Company (Production). The mixture was coated on one surface of a PET substrate with a different thickness by a doctor blade, thereby obtaining 30 μm (Example 3), 45 μm (Example 4), or 60 μηι (Example 5) after drying. The substrate is then dried in an oven at 65 ° C for three minutes. The target surface protective sheet is thus obtained. For comparison, in addition to the formation of an adhesive layer on the opposite side of the PET substrate and the magnetic layer, an adhesive layer is also used. A doctor blade applicator applied an adhesive (trade name [as_425] 'manufactured by Ipposha Yushi Kogyo Co., Ltd.) on a pet substrate with a thickness of 1 μηι (Comparative Example 2) and 25 μπι (Comparative Example 3) after drying. On one surface 'then put the substrate into a 6 5 C oven Dry for three minutes. The target surface protection sheet is thus obtained. Evaluation of the obtained surface protection sheet The test involves damage to the wafer during polishing and a visual inspection of the polished surface according to the method described in Example 1 In addition, the polished The silicon wafer was adhered to a dicing tape (trade name [G-19], manufactured by Rintec) applied to a dicing frame, and then the surface protective sheet was removed from the wafer to confirm whether there was any damage in the wafer. Evaluation The results are summarized in the table below. Example No. The crack pattern shifts and breaks during polishing. Example 3 No No No Example 4. 4¾. Ί Λ No No Example 5 Benefit No No. Comparative Example 2 With or without Comparative Example 3 With or without The effect of the present invention is as before DETAILED DESCRIPTION The present invention provides a surface protection sheet that can be used as a back-grinding tape and the like. The surface protection sheet does not cause defects or damage when an article is ground or otherwise processed. In addition, the present invention provides a surface protection sheet having a uniform thickness and improved softness' and the surface protection sheet does not cause defects or damage to the article even if the article to be manufactured is very thin. In addition, the present invention provides an electronic device package that is improved in operation and that the electronic device package does not cause defects or damage to manufactured components or devices. Those skilled in the art will understand that various variations or modifications of the present invention will not depart from the spirit and scope of the present invention. [Brief description of the drawings] FIG. 1 is a sectional view of an embodiment; FIG. 2 is a sectional view showing one of the surface protection sheets of the present invention, and another one of the surface protection sheets of the present invention. 23- 200401356 specific embodiment; Figure 3 is a sectional view showing another preferred embodiment of the surface protection sheet of the present invention; Figure 4 is a sectional view showing another comparison of the surface protection sheet of the present invention 5 is a cross-sectional view showing a method for laminating a surface protective sheet of the present invention on a semiconductor wafer; FIG. 6 is a cross-sectional view showing another embodiment of the electro-mechanical device package of the present invention. A preferred embodiment; and FIG. 7 is a cross-sectional view showing a back surface division method of the present invention. [Illustration of representative symbols of the figure] 1 substrate 2 adhesive layer 3 magnetic layer 10 surface protective sheet 10a adhesive layer 11 silicon wafer 11a the surface of the component is manufactured surface 11c dotted line 20 electronic device package 30 pressure plate 31 porous metal plate 35 Grinder 84517 -24-