WO2003090276A2 - Method for the production of contact pads on a substrate and device for carrying out said method - Google Patents
Method for the production of contact pads on a substrate and device for carrying out said method Download PDFInfo
- Publication number
- WO2003090276A2 WO2003090276A2 PCT/FR2003/001261 FR0301261W WO03090276A2 WO 2003090276 A2 WO2003090276 A2 WO 2003090276A2 FR 0301261 W FR0301261 W FR 0301261W WO 03090276 A2 WO03090276 A2 WO 03090276A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- alloy
- pipe
- liquid metal
- matrix
- molding
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 238000000034 method Methods 0.000 title claims description 31
- 239000000758 substrate Substances 0.000 title description 5
- 238000000465 moulding Methods 0.000 claims abstract description 63
- 239000000956 alloy Substances 0.000 claims abstract description 60
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 35
- 229910052751 metal Inorganic materials 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims abstract description 8
- 238000007711 solidification Methods 0.000 claims abstract description 8
- 230000008023 solidification Effects 0.000 claims abstract description 8
- 229910001338 liquidmetal Inorganic materials 0.000 claims description 42
- 239000011159 matrix material Substances 0.000 claims description 33
- 229910002065 alloy metal Inorganic materials 0.000 claims description 25
- 239000007789 gas Substances 0.000 claims description 23
- 238000002347 injection Methods 0.000 claims description 20
- 239000007924 injection Substances 0.000 claims description 20
- 230000001172 regenerating effect Effects 0.000 claims description 15
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims description 14
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 12
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 11
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims description 6
- 238000009792 diffusion process Methods 0.000 claims description 6
- 235000019253 formic acid Nutrition 0.000 claims description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
- 238000011144 upstream manufacturing Methods 0.000 claims description 6
- 238000000926 separation method Methods 0.000 claims description 5
- 238000006073 displacement reaction Methods 0.000 claims description 4
- 238000002360 preparation method Methods 0.000 claims description 3
- 238000005213 imbibition Methods 0.000 claims 1
- 239000007788 liquid Substances 0.000 abstract description 7
- 230000008602 contraction Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 12
- 238000010992 reflux Methods 0.000 description 6
- 230000005484 gravity Effects 0.000 description 4
- 239000007787 solid Substances 0.000 description 3
- 239000003963 antioxidant agent Substances 0.000 description 2
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- 230000007547 defect Effects 0.000 description 2
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- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
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- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 230000036244 malformation Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 150000002829 nitrogen Chemical class 0.000 description 1
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- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/05571—Disposition the external layer being disposed in a recess of the surface
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05573—Single external layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
- H01L2224/1131—Manufacturing methods by local deposition of the material of the bump connector in liquid form
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01087—Francium [Fr]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder
Definitions
- the present invention relates to the technical field of producing electrical connection pads, of the ball type, on surfaces of electronic components.
- the present invention relates more particularly to a method for producing at least one electrical contact pad on a reception area of an electronic component, in which an alloy or a liquid metal is injected into at least one pipe, which comprises two portions, a routing portion and a molding portion separated by a narrowing, said pipe being positioned so that the molding portion opens out against the reception area.
- the present invention also relates to a device for producing at least one electrical contact pad on a reception area of an electronic component, said device comprising a pipe intended for the passage of alloy or liquid metal, said pipe itself comprising two portions, a conveying portion forming part of a first part forming a matrix, and a molding portion forming part of a second part forming a mold, said conveying and molding portions being separated by a narrowing.
- a major challenge in the manufacture and installation of networks of connection pads lies in minimizing the number of production operations and the duration of said operations, so as to be able to equip pads with a substrate, in a minimum cycle time, without sacrificing the metallurgical and geometric quality of the studs.
- a conductive liquid alloy is injected into a guide formed by two separable parts, a mold and an injection matrix, with a narrowing of the guide at the separation of the parts; - The parts of the guide are separated while the alloy is liquid;
- the mold is separated from the substrate of the component before the alloy solidifies.
- the present invention also relates to a method for regenerating an assembly of electrical contact pads produced on receiving pads of an electronic component, in which an alloy or a liquid metal is injected into at least one pipe, which comprises two portions, a routing portion and a molding portion separated by a narrowing, said pipe being positioned so that the molding portion opens out against the reception area.
- the present invention finally relates to a device for regenerating a set of contact pads produced on the receiving areas of an electronic component, said device comprising a pipe intended for the passage of alloy or liquid metal, said pipe itself comprising two portions, a conveying portion forming part of a first part forming a matrix, and a molding portion forming part of a second part forming a mold, said conveying and molding portions being separated by a narrowing.
- the object assigned to the invention therefore aims to propose a new method for producing at least one electrical contact pad on a reception area of an electronic component, or for regenerating a set of electrical contact pads produced on a reception area of an electronic component, making it possible to remedy the various drawbacks listed above and capable of making electrical contact pads or of regenerating a set of electrical contact pads faster, simpler and less costly .
- Another object of the invention aims to propose a new method for producing at least one electrical contact pad on a reception area of an electronic component, or for regenerating a set of electrical contact pads produced on a reception of an electronic component, whose reliability is improved.
- Another object of the invention is to propose a new method for producing at least one electrical contact pad on a reception area of an electronic component or for regenerating a set of contact pads electrical produced on a reception area of an electronic component, making it possible to obtain electrical contact pads with excellent shape reproducibility.
- Another object of the invention is to propose a device for producing at least one electrical contact pad on a reception area of an electronic component, or for regenerating a set of electrical contact pads produced on a reception area of an electronic component, whose design is simplified and the kinematics, as well as the robustness, are improved.
- Another object of the invention is to propose a new device for producing at least one electrical contact pad on a reception area of an electronic component, or for regenerating a set of electrical contact pads produced on a location reception of an electronic component, with good reproducibility and homogeneity.
- Another object of the invention is to propose a new device for producing at least one electrical contact pad on a reception area of an electronic component, or for regenerating a set of electrical contact pads produced on reception of an electronic component making it possible to obtain studs of improved quality.
- the objects assigned to the invention are achieved using a method for producing at least one electrical contact pad on a reception area of an electronic component, or for regenerating a set of electrical contact pads produced on reception areas of an electronic component, in which: - an alloy or a liquid metal is injected into at least one pipe, which comprises two portions, one portion conveying and a molding portion separated by a narrowing, said pipe being positioned so that the molding portion opens out against the reception area,
- the molding portion and the reception area are separated before complete solidification of the metal or of the alloy, while keeping the routing and molding portions integral,
- the conveying portion is part of a first part forming a matrix
- the molding portion is part of a second separate part forming a mold, said matrix and mold being juxtaposed to form the pipe.
- a device for producing at least one electrical contact pad on a reception area of an electronic component, or for regenerating a set of electrical contact pads produced on reception areas of an electronic component said device comprising a pipe intended for the passage of alloy or of molten metal, said pipe itself comprising two portions, a routing portion forming part of a first part forming matrix, and a molding portion forming part of a second part forming a mold, said conveying and molding portions being separated by a narrowing, characterized in that it comprises a means for fixing the matrix relative to the mold allowing said matrix and mold are mounted fixedly juxtaposed to form the pipe.
- FIG. 4 schematically illustrates, in a sectional view, a detail of the device according to the invention, in a configuration corresponding to the process step shown in FIG. 1.
- FIG. 5 schematically illustrates an embodiment of the pipe of the device according to the invention.
- FIGS. 1 to 3 illustrate different steps of the method for producing at least one electrical contact pad 1 on a reception area 2 of an electronic component 3, in accordance with the invention.
- the electronic component 3 is made of any material well known to those skilled in the art, and includes electrically conductive receiving pads 2 which generally consist of metal tracks, for example copper or gold.
- an alloy or a liquid metal 4 is injected into at least one pipe 5.
- alloys which can be used in the context of the process according to the invention, mention may be made, purely by way of nonlimiting illustration, of alloys combining two or more, of the following elements: Sn, Pb, Bi, In.
- Line 5 comprises two portions 5A, 5B, namely a routing portion 5A and a molding portion 5B, separated by a narrowing 5C.
- Figures 1 to 4 show process and device using four lines, purely by way of illustration. It is indeed necessary to count as many pipes 5 as pads 1 to be produced, that is to say in practice generally several tens or hundreds.
- the injection of the alloy or of the liquid metal 4, which constitutes the welding material can be carried out by imposing, by any known means, an injection pressure on said liquid welding material 4, so as to force the latter to pass in line 5 in the direction of the reception area 2, in an injection direction shown in FIG. 1 by the arrow I.
- the routing portion 5A is extended by the molding portion 5B, so as to form a continuous pipe 5 in which the alloy or liquid metal 4 will follow a substantially and generally unidirectional trajectory, in the direction of injection I.
- the routing portions 5A and molding 5B can be rectilinear and have a common axial symmetry along an axis XX ′. It is also possible, without departing from the scope of the invention, for the respective axes of symmetry of the routing portions 5A and of the molding 5B to be offset and not to coincide.
- the routing portions 5A and molding 5B are of substantially cylindrical shape, the portion routing 5A having a constant section smaller than the section, also constant, of the molding portion 5B.
- the shrinkage 5C in this case comes from the difference in section between the routing portion 5A and the molding portion 5B.
- the narrowing 5C is understood here and in what follows as a restriction of section of the pipe 5 when the latter is traversed in the direction opposite to the direction of injection I, that is to say from the molding portion towards the routing portion.
- routing portions 5A and molding 5B are both of frustoconical shape, each of said portions of cones connecting at their respective minimum section, so as to produce a neck forming a narrowing 5C.
- the routing portion 5A is of rectilinear cylindrical shape and opens out at the minimum section of a molding portion 5B of frustoconical shape.
- the molding portion 5B has a substantially hemispherical or cavity shape, with an opening communicating with a routing portion 5A of cylindrical or frustoconical shape.
- the step described above thus constitutes a step of injecting an alloy or liquid metal 4 onto a reception area 2. At the end of this step, the injection pressure ceases to be imposed on the alloy or liquid metal 4.
- the molding portion 5B and the reception area 2 are separated before complete solidification of the metal or of the alloy 4, while holding the portions together routing 5A and molding 5B.
- the state “before complete solidification” corresponds to a state located outside the “all solid” zone delimited by the Solidus curve in the liquid-solid diagram of l 'alloy considered.
- Line 5 can be machined in one piece from the mass of a single part.
- the pipe 5 is however produced by two separate parts 6, 7.
- the routing portion 5A is part of a first part forming a matrix 6, and the molding portion 5B is part of a second separate part forming a mold 7, said matrix 6 and mold 7 being juxtaposed to form the pipe 5, as shown in FIGS. 1, 2 and 4.
- the mold 7 thus pressed against the matrix 6 makes it possible to create a continuous pipe 5, in the same way as if line 5 had been machined in a single part.
- the juxtaposition of two separate parts, such as the mold 7 and the matrix 6, however necessarily creates a clearance at the contact interface 8 between these two parts. This game, even an infinitesimal one, creates an air gap which turns out to contribute in a beneficial way to the demolding phase represented in FIG. 2, since it contributes to separate the material forming the primary pad 1A from that remaining in the matrix. at the routing line 5A.
- the juxtaposition of two distinct parts 6, 7, so as to form a unitary unitary assembly is a particularly appreciated embodiment of the pipe 5.
- the alloy or the liquid metal 4 is moved in the opposite direction to the injection (or reflux direction, illustrated by the arrow R) within the conveying portion 5A, before separating the portion 5B molding and the reception area 2.
- This reflux step which occurs between the injection step shown in Figure 1 and the release step shown in Figure 2, allows to break, at the level of shrinkage 5C and in cooperation with it, the “column” of alloy or liquid metal 4 present in the pipe 5, thus making it possible to facilitate and optimize the demolding operation, by perfectly controlling the quantity of material deposited on the reception area 2 to form the primary pad 1A.
- the displacement of the alloy 4 in the direction of the reflux R is achieved by suction, by imposing on the alloy or liquid metal 4 a pressure opposite to the injection pressure, that is to say a vacuum.
- the suction is carried out by the displacement, in the direction R opposite to the direction of injection, of a shutter element 9 of the valve type, located upstream of the pipe 5 in consideration of the direction of injection. I, towards a position where said obturation element 9 closes the supply of the pipe 5 in alloy or liquid metal 4.
- the obturation element 9 thus has a double function: it closes the supply of the pipe 5 and thus puts an end to the injection step, and its displacement through the alloy or the liquid metal 4 creates a depression substantially displacing the alloy or the liquid metal 4 in the conveying portion 5A in the direction of reflux R.
- the alloy or liquid metal constituting the primary pad 1A free of any mechanical influence, except that of the receiving area 2 on which it rests, will take the form of a substantially spherical cap, as shown in Figure 3, this geometry minimizing the surface tensions.
- the alloy or liquid metal will then cool and solidify completely.
- the separation of the molding portion 5B and of the reception area 2 takes place in a sheet of inert or reducing gas G.
- the gas G is preferably spread from before the demolding step shown in the figure 2, so as to carry out the demolding operation in a gaseous environment inhibiting the oxidation of the pads.
- the gas G comprises nitrogen.
- the gas G may however include any other neutral or reducing gas fulfilling the function of inhibiting oxidation.
- the gas G comprises a component comprising a carboxyl group (COOH).
- COOH carboxyl group
- the presence in the gas G of such a component in fact makes it possible to confer on it properties of aid in the formation of the pad 1 from the primary pad 1A, making it possible to rapidly form the balls 1 with good repeatability of form.
- the component comprising a carboxyl group is formic acid (H-COOH).
- the gas G thus constitutes an active atmosphere having a double function, namely an antioxidant function and a function for forming the pads 1.
- the device for producing at least one electrical contact pad 1 on a reception area 2 of an electronic component 3 comprises a pipe 5 intended for the passage of alloy or liquid metal 4.
- said pipe 5 itself comprises two portions, a routing portion 5A forming part of a first part forming a die 6, and a molding portion 5B forming part of a second part forming a mold 7, preferably distinct from the first play.
- Said routing portions 5A and molding 5B are separated by a narrowing 5C.
- the latter comprises a means 10 for fixing the matrix 6 relative to the mold 7, allowing said matrix 6 or mold 7 to be mounted juxtaposed in a fixed manner to form the pipe 5.
- the matrix 6 and the mold 7 are thus mounted to form a unitary unitary sub-assembly.
- the matrix 6 includes a plate comprising at least one porous zone which forms the conveying portion 5A.
- the matrix 6 can thus be produced from a porous material, the porosity of which is inhibited by chemical attack, varnishing or any other process well known to those skilled in the art, except in areas which constitute the routing portion 5A.
- the mold 7 can be manufactured by any process known to those skilled in the art.
- the material of the mold 7 is chosen so as not to wet the alloy or liquid metal 4, and to minimize the surface tension of the alloy / mold.
- the material can in particular be chosen from: stainless steel with chemical deburring, graphite, teflon, treated silicon.
- the device according to the invention comprises, upstream of the matrix 6 and in consideration of the direction I of passage (or injection) of the alloy or of the liquid metal 4, a reservoir 11 intended to contain the alloy or the liquid metal 4, said reservoir 11 having a lower opening 11A opening into a tank 12 communicating itself with said matrix 6.
- the passage of the alloy or of the liquid metal 4 through the lower opening 11A is controlled by an element d mobile shutter 9 of the valve type, capable of moving parallel to the direction of passage of the alloy or of the liquid metal 4, in the direction of injection l or in the opposite direction of reflux R, between a high stop position (not shown) where it closes the lower opening 11A, and at least one intermediate position (shown in FIG. 4) where it authorizes the passage of the alloy or of the liquid metal 4 towards the tank 12, then towards the matrix 6 .
- the movable closure element 9 of the valve type comprises a rod 9A and a head 9B of section greater than that of the rod 9A.
- the latter slides vertically between the edges of the opening 11 A, with sufficient clearance relative to said edges to allow passage of alloy or liquid metal 4.
- the opening 11A widens downstream in consideration of the direction of injection I, to form a chamber in which the head 9B moves.
- the matrix 6 is mounted in communication with this chamber in a sealed manner by means of a seal 13 to form the tank 12.
- the head 9B moves in the alloy or liquid metal contained in the tank 12, and can print this direction of passage in the routing portion 6.
- Such a valve-type arrangement thus makes it possible to carry out the step of stopping the injection and aspiration mentioned previously in the description of the process.
- the device according to the invention comprises means (not shown) for dispensing a gas G at the level of the molding portion 5B.
- This gas dispensing means makes it possible to saturate the atmosphere with a gas G which is preferably inert or reducing, so as to have an antioxidant function.
- Said gas G also preferably comprises a component comprising a carboxyl group (COOH), so as to have forming properties, with good repeatability, of the beads 1.
- the component exhibiting a carboxyl group is formic acid ( H-COOH).
- the gas G comprises nitrogen.
- the gas dispensing means G (not shown) comprises a diffusion means (not shown) and a preparation means (not shown) located upstream of said diffusion means, said diffusion means allowing the component to be imbibed. having a carboxyl group with an inert or reducing primary gas.
- the dispensing means comprises, as means of preparation, a container containing liquid formic acid which will be brought into contact with nitrogen, so that this nitrogen is soaked with formic acid and thus has the qualities mentioned above.
- the pipe 5 is arranged so as to be positioned above the reception area 2.
- This technical characteristic is completely independent of the fact that the matrix and the mold are formed from a single piece or from two separate pieces.
- This specific arrangement makes it possible to obtain particularly good results, no doubt due to the fact that any impurities contained in the alloy or liquid metal 4, and whose density is generally lower than that of the alloy or liquid metal 4, go up. in the direction of reflux R under the effect of gravity and do not come to accumulate at the level of the pad surface 14 in contact with the reception area 2, which could disturb the correct wetting of the pad 1A and its good adhesion to the reception area 2.
- This arrangement also makes it possible to avoid the accumulation, under the effect of gravity, of impurities at the level of the molding portion 5B and / or of the routing portion 5A , which could block said portions 5A, 5B.
- the invention thus relates, entirely independently, to a method for producing at least one electrical contact pad 1 on a reception area 2 of an electronic component, or for regenerating a set of electrical contact pads 1 produced on receiving areas 2 of an electronic component 3, into which a liquid alloy or a liquid metal 4 is injected into at least one pipe 5, which comprises two separate portions, a routing portion 5A and a molding portion 5B by a narrowing 5C, said pipe 5 being positioned so that the molding portion 5B opens against the reception area 2, said method also comprising a step in which the molding portion 5B is separated of the reception area 2 before complete solidification of the metal or of the alloy 4, while holding the routing portions 5A and the molding 5B integral, said pipe 5 being arranged so as to be positioned above the range d welcome 2 relative to gravity.
- the invention also relates independently to a device for producing at least one electrical contact pad 1 on a receiving pad 2 of an electronic component 3, or for regenerating a set of electrical contact pads 1 formed on pads reception 2 of an electronic component 3, said device comprising a pipe 5 intended for the passage of alloy or of liquid metal 4, said pipe 5 itself comprising two portions, a routing portion 5A forming part of a first part forming a matrix 6, and a molding portion 5B forming part of a second part forming a mold 7, said routing portions 5A and molding 5B being separated by a narrowing 5C, said device comprising a means 10 for fixing the matrix 6 relative to the mold 7, allowing said matrix 6 and mold 7 to be mounted juxtaposed in a fixed manner to form the pipe 5, said pipe 5 being arranged so as to be be positioned above the reception area, relative to gravity.
- the method can also be used to regenerate a set of electrical contact pads 1 produced on receiving pads 2 of an electronic component 3.
- the term “regenerate” here designates an operation repair of studs in the broad sense, in particular possibly involving the addition of material to correct or complete the size of studs, and / or reforming of studs. To this end, the same steps should be carried out as those implemented in the production of new studs according to the method described above, to rehabilitate arrays of balls 1 having defects (geometric especially).
- the first regeneration step thus consists in pressing the pipe 5 against the reception area 2, so that it includes the existing contact pad 1 to be corrected.
- an alloy or a liquid metal 4 is injected into the pipe 5, the latter occupying, at the level of the molding portion 5B, the space remaining left free by the existing stud 1 to be corrected. This produces a corrective overmolding of the defective stud.
- the device and the method in accordance with the invention make it possible to produce or regenerate networks of electrical contact pads 1 of the BGA type quickly, since the number of steps is optimized (no mold separation step and of the matrix), as well as the cycle time, since it is not necessary to wait until the material has solidified in the molding portion 5B before proceeding with demolding.
- the invention finds its industrial application in the production of electrical contact pads.
Abstract
The invention relates to a method for producing at least one electric contact pad on a receiving pad (2) of an electronic component, wherein: a liquid alloy (4) is injected into at least one duct (5) which comprises a routing part (5A) and a molding part (5B) which are separated by a contraction, said duct (5) being disposed in such a way that the moulding part (5B) leads to the receiving pad (2); the moulding part (5B) and the receiving pad (2) are separated before full solidification of the metal or alloy (4) while the routing part (5A) and moulding part (5B) remain joined. The invention is characterized in that the routing part (5A) is part of a first part forming a die (6) and the moulding part (5B) is part of a second distinct part forming a mould (7), the die and mould being juxtaposed in order to form the duct (5). The invention is used to produce contact pads for electronic components.
Description
PROCEDE DE REALISATION DE PLOTS DE CONTACT PROCESS FOR PRODUCING CONTACT PLUGS
ELECTRIQUE SUR UN SUBSTRAT ET DISPOSITIFELECTRIC ON SUBSTRATE AND DEVICE
POUR LA MISE EN OEUVRE DE CE PROCEDEFOR THE IMPLEMENTATION OF THIS PROCESS
DOMAINE TECHNIQUETECHNICAL AREA
La présente invention se rapporte au domaine technique de la réalisation de plots de connexion électrique, du genre billes, sur des surfaces de composants électroniques.The present invention relates to the technical field of producing electrical connection pads, of the ball type, on surfaces of electronic components.
La présente invention concerne plus particulièrement un procédé pour réaliser au moins un plot de contact électrique sur une plage d'accueil d'un composant électronique, dans lequel on injecte un alliage ou un métal liquide dans au moins une conduite, laquelle comprend deux portions, une portion d'acheminement et une portion de moulage séparées par un rétrécissement, ladite conduite étant positionnée de façon à ce que la portion de moulage débouche contre la plage d'accueil.The present invention relates more particularly to a method for producing at least one electrical contact pad on a reception area of an electronic component, in which an alloy or a liquid metal is injected into at least one pipe, which comprises two portions, a routing portion and a molding portion separated by a narrowing, said pipe being positioned so that the molding portion opens out against the reception area.
La présente invention concerne également un dispositif pour réaliser au moins un plot de contact électrique sur une plage d'accueil d'un composant électronique, ledit dispositif comprenant une conduite destinée au passage d'alliage ou de métal liquide, ladite conduite comprenant elle-même deux portions, une portion d'acheminement faisant partie d'une première pièce formant matrice, et une portion de moulage faisant partie d'une deuxième pièce formant moule, lesdites portions d'acheminement et de moulage étant séparées par un rétrécissement.
TECHNIQUE ANTERIEUREThe present invention also relates to a device for producing at least one electrical contact pad on a reception area of an electronic component, said device comprising a pipe intended for the passage of alloy or liquid metal, said pipe itself comprising two portions, a conveying portion forming part of a first part forming a matrix, and a molding portion forming part of a second part forming a mold, said conveying and molding portions being separated by a narrowing. PRIOR ART
Il existe plusieurs techniques pour connecter un circuit intégré, ou plus généralement un composant électronique, sur un substrat ou support. On peut citer ainsi les liaisons filaires, les liaisons par ruban ou encore les liaisons par réseaux de microbilles (BGA : Bail Grid Array) qui assurent le contact entre le circuit et le support. Le concept d'interconnexion par réseaux de microbilles est particulièrement apprécié pour les performances élevées qu'il procure, avec des effets parasites faibles.There are several techniques for connecting an integrated circuit, or more generally an electronic component, to a substrate or support. One can thus cite the wire connections, the connections by ribbon or still the connections by networks of microbeads (BGA: Bail Grid Array) which ensure the contact between the circuit and the support. The concept of interconnection by microbead networks is particularly appreciated for the high performance it provides, with low parasitic effects.
Un enjeu majeur dans la fabrication et la pose de réseaux de plots de connexion réside dans la minimisation du nombre d'opérations de production et de la durée desdites opérations, de façon à pouvoir équiper de plots un substrat, en un temps de cycle minimum, sans sacrifier la qualité métallurgique et géométrique des plots.A major challenge in the manufacture and installation of networks of connection pads lies in minimizing the number of production operations and the duration of said operations, so as to be able to equip pads with a substrate, in a minimum cycle time, without sacrificing the metallurgical and geometric quality of the studs.
On connaît, par la demande de brevet français enregistrée sous le numéro FR-99 05544, un procédé pour réaliser des billes sur une plage d'accueil électriquement conductrice d'un composant électronique, dans lequel :We know, from the French patent application registered under the number FR-99 05544, a method for producing balls on an electrically conductive reception area of an electronic component, in which:
- on injecte un alliage liquide conducteur dans un guide formé de deux pièces séparables, un moule et une matrice d'injection, avec un rétrécissement du guide au niveau de la séparation des pièces ; - on sépare les pièces du guide pendant que l'alliage est liquide ;- A conductive liquid alloy is injected into a guide formed by two separable parts, a mold and an injection matrix, with a narrowing of the guide at the separation of the parts; - The parts of the guide are separated while the alloy is liquid;
- on sépare le moule du substrat du composant avant la solidification de l'alliage.- The mold is separated from the substrate of the component before the alloy solidifies.
On connaît également, par le même document cité plus haut, un dispositif permettant la mise en oeuvre du procédé mentionné précédemment.
Un tel procédé, s'il donne généralement satisfaction et tend à répondre à l'enjeu mentionné plus haut, implique cependant un grand nombre d'opérations nécessitant un pilotage complexe, et mettant en oeuvre de nombreuses pièces mobiles relativement les unes aux autres, multipliant ainsi les risques d'usure et de grippage, ou d'imprécision dans la réalisation des plots.Also known from the same document cited above, a device for implementing the method mentioned above. Such a method, if it generally gives satisfaction and tends to respond to the challenge mentioned above, however involves a large number of operations requiring complex control, and implementing numerous moving parts relatively to each other, multiplying thus the risks of wear and seizure, or imprecision in the production of the studs.
La présente invention concerne également un procédé pour régénérer un ensemble de plots de contact électrique réalisé sur des plages d'accueil d'un composant électronique, dans lequel on injecte un alliage ou un métal liquide dans au moins une conduite, laquelle comprend deux portions, une portion d'acheminement et une portion de moulage séparées par un rétrécissement, ladite conduite étant positionnée de façon à ce que la portion de moulage débouche contre la plage d'accueil.The present invention also relates to a method for regenerating an assembly of electrical contact pads produced on receiving pads of an electronic component, in which an alloy or a liquid metal is injected into at least one pipe, which comprises two portions, a routing portion and a molding portion separated by a narrowing, said pipe being positioned so that the molding portion opens out against the reception area.
La présente invention concerne enfin un dispositif pour régénérer un ensemble de plots de contact réalisé sur des plages d'accueil d'un composant électronique, ledit dispositif comprenant une conduite destinée au passage d'alliage ou de métal liquide, ladite conduite comprenant elle- même deux portions, une portion d'acheminement faisant partie d'une première pièce formant matrice, et une portion de moulage faisant partie d'une deuxième pièce formant moule, lesdites portions d'acheminement et de moulage étant séparées par un rétrécissement.The present invention finally relates to a device for regenerating a set of contact pads produced on the receiving areas of an electronic component, said device comprising a pipe intended for the passage of alloy or liquid metal, said pipe itself comprising two portions, a conveying portion forming part of a first part forming a matrix, and a molding portion forming part of a second part forming a mold, said conveying and molding portions being separated by a narrowing.
Il arrive, notamment avec des procédés de dépôt de billes de l'art antérieur, par exemple du type de ceux mettant en oeuvre un aspirateur ou un tamis déposant les billes sur les plages d'accueil du composant, ou encore du type de ceux impliquant une refusion de crème à braser déposée par sérigraphie sur la plage d'accueil du composant, que certaines billes, à l'issue du procédé, présentent des imperfections nuisant à leur fonctionnalité, comme par exemple, une malformation, une taille trop petite, voire une absence
complète. On connaît des dispositifs d'inspection permettant de repérer de tels défauts ou une absence de billes. A l'issue de cette inspection, il est généralement nécessaire de procéder à la correction des défauts identifiés de façon individuelle, en ajoutant des billes une par une là où elles manquent, et en supprimant les billes trop petites pour les remplacer une par une par de nouvelles billes présentant les caractéristiques requises. Une telle façon de procéder est longue et nécessite un nombre d'opérations considérable, ce qui en fait une technique onéreuse et délicate à mettre en oeuvre.It happens, in particular with prior art ball deposition methods, for example of the type of those using a vacuum cleaner or a sieve depositing the balls on the receiving areas of the component, or even of the type of those involving a remelting of solder cream deposited by screen printing on the reception area of the component, that certain beads, at the end of the process, have imperfections detrimental to their functionality, such as for example a malformation, a size too small, or even an absence complete. Inspection devices are known which make it possible to identify such defects or an absence of balls. After this inspection, it is generally necessary to correct the faults identified individually, by adding balls one by one where they are missing, and by removing the balls too small to replace them one by one by new balls with the required characteristics. Such a procedure is long and requires a considerable number of operations, which makes it an expensive and delicate technique to implement.
EXPOSE DE L'INVENTIONSTATEMENT OF THE INVENTION
L'objet assigné à l'invention vise en conséquence à proposer un nouveau procédé pour réaliser au moins un plot de contact électrique sur une plage d'accueil d'un composant électronique, ou pour régénérer un ensemble de plots de contact électrique réalisé sur une plage d'accueil d'un composant électronique, permettant de porter remède aux différents inconvénients énumérés précédemment et susceptible de permettre de réaliser des plots de contact électrique ou de régénérer un ensemble de plots de contact électrique de façon plus rapide, plus simple et moins coûteuse.The object assigned to the invention therefore aims to propose a new method for producing at least one electrical contact pad on a reception area of an electronic component, or for regenerating a set of electrical contact pads produced on a reception area of an electronic component, making it possible to remedy the various drawbacks listed above and capable of making electrical contact pads or of regenerating a set of electrical contact pads faster, simpler and less costly .
Un autre objet de l'invention vise à proposer un nouveau procédé pour réaliser au moins un plot de contact électrique sur une plage d'accueil d'un composant électronique, ou pour régénérer un ensemble de plots de contact électrique réalisé sur une plage d'accueil d'un composant électronique, dont la fiabilité est améliorée.Another object of the invention aims to propose a new method for producing at least one electrical contact pad on a reception area of an electronic component, or for regenerating a set of electrical contact pads produced on a reception of an electronic component, whose reliability is improved.
Un autre objet de l'invention vise à proposer un nouveau procédé pour réaliser au moins un plot de contact électrique sur une plage d'accueil d'un composant électronique ou pour régénérer un ensemble de plots de contact
électrique réalisé sur une plage d'accueil d'un composant électronique, permettant d'obtenir des plots de contact électrique avec une excellente reproductibilité de forme.Another object of the invention is to propose a new method for producing at least one electrical contact pad on a reception area of an electronic component or for regenerating a set of contact pads electrical produced on a reception area of an electronic component, making it possible to obtain electrical contact pads with excellent shape reproducibility.
Un autre objet de l'invention vise à proposer un dispositif pour réaliser au moins un plot de contact électrique sur une plage d'accueil d'un composant électronique, ou pour régénérer un ensemble de plots de contact électrique réalisé sur une plage d'accueil d'un composant électronique, dont la conception est simplifiée et la cinématique, ainsi que la robustesse, sont améliorées.Another object of the invention is to propose a device for producing at least one electrical contact pad on a reception area of an electronic component, or for regenerating a set of electrical contact pads produced on a reception area of an electronic component, whose design is simplified and the kinematics, as well as the robustness, are improved.
Un autre objet de l'invention vise à proposer un nouveau dispositif pour réaliser au moins un plot de contact électrique sur une plage d'accueil d'un composant électronique, ou pour régénérer un ensemble de plots de contact électrique réalisé sur une plage d'accueil d'un composant électronique, avec une bonne reproductibilité et homogénéité.Another object of the invention is to propose a new device for producing at least one electrical contact pad on a reception area of an electronic component, or for regenerating a set of electrical contact pads produced on a location reception of an electronic component, with good reproducibility and homogeneity.
Un autre objet de l'invention vise à proposer un nouveau dispositif pour réaliser au moins un plot de contact électrique sur une plage d'accueil d'un composant électronique, ou pour régénérer un ensemble de plots de contact électrique réalisé sur des plages d'accueil d'un composant électronique permettant d'obtenir des plots présentant une qualité améliorée.Another object of the invention is to propose a new device for producing at least one electrical contact pad on a reception area of an electronic component, or for regenerating a set of electrical contact pads produced on reception of an electronic component making it possible to obtain studs of improved quality.
Les objets assignés à l'invention sont atteints à l'aide d'un procédé pour réaliser au moins un plot de contact électrique sur une plage d'accueil d'un composant électronique, ou pour régénérer un ensemble de plots de contact électrique réalisé sur des plages d'accueil d'un composant électronique, dans lequel : - on injecte un alliage ou un métal liquide dans au moins une conduite, laquelle comprend deux portions, une portion
d'acheminement et une portion de moulage séparées par un rétrécissement, ladite conduite étant positionnée de façon à ce que la portion de moulage débouche contre la plage d'accueil,The objects assigned to the invention are achieved using a method for producing at least one electrical contact pad on a reception area of an electronic component, or for regenerating a set of electrical contact pads produced on reception areas of an electronic component, in which: - an alloy or a liquid metal is injected into at least one pipe, which comprises two portions, one portion conveying and a molding portion separated by a narrowing, said pipe being positioned so that the molding portion opens out against the reception area,
- on sépare la portion de moulage et la plage d'accueil avant solidification complète du métal ou de l'alliage, tout en maintenant solidaires les portions d'acheminement et de moulage,- the molding portion and the reception area are separated before complete solidification of the metal or of the alloy, while keeping the routing and molding portions integral,
caractérisé en ce que la portion d'acheminement fait partie d'une première pièce formant matrice, et la portion de moulage fait partie d'une deuxième pièce distincte formant moule, lesdits matrice et moule étant juxtaposés pour former la conduite.characterized in that the conveying portion is part of a first part forming a matrix, and the molding portion is part of a second separate part forming a mold, said matrix and mold being juxtaposed to form the pipe.
Les objets assignés à l'invention sont également atteints à l'aide d'un dispositif pour réaliser au moins un plot de contact électrique sur une plage d'accueil d'un composant électronique, ou pour régénérer un ensemble de plots de contact électrique réalisé sur des plages d'accueil d'un composant électronique, ledit dispositif comprenant une conduite destinée au passage d'alliage ou de métal liquide, ladite conduite comprenant elle-même deux portions, une portion d'acheminement faisant partie d'une première pièce formant matrice, et une portion de moulage faisant partie d'une deuxième pièce formant moule, lesdites portions d'acheminement et de moulage étant séparées par un rétrécissement, caractérisé en ce qu'il comprend un moyen de fixation de la matrice relativement au moule permettant que lesdits matrice et moule soient montés juxtaposés de façon fixe pour former la conduite.
DESCRIPTIF SOMMAIRE DES DESSINSThe objects assigned to the invention are also achieved using a device for producing at least one electrical contact pad on a reception area of an electronic component, or for regenerating a set of electrical contact pads produced on reception areas of an electronic component, said device comprising a pipe intended for the passage of alloy or of molten metal, said pipe itself comprising two portions, a routing portion forming part of a first part forming matrix, and a molding portion forming part of a second part forming a mold, said conveying and molding portions being separated by a narrowing, characterized in that it comprises a means for fixing the matrix relative to the mold allowing said matrix and mold are mounted fixedly juxtaposed to form the pipe. SUMMARY OF DRAWINGS
D'autres objets et avantages particuliers de l'invention apparaîtront plus en détails à la lecture de la description qui suit, et à l'aide des dessins annexés ci-après, à titre purement illustratif et non limitatif, dans lesquels :Other particular objects and advantages of the invention will appear in more detail on reading the description which follows, and with the aid of the appended drawings below, purely by way of non-limiting illustration, in which:
- Les figures 1 à 3 illustrent schématiquement différentes phases du procédé selon l'invention, ainsi que des parties du dispositif conforme à l'invention.- Figures 1 to 3 schematically illustrate different phases of the method according to the invention, as well as parts of the device according to the invention.
- La figure 4 illustre schématiquement, selon une vue en coupe, un détail du dispositif conforme à l'invention, dans une configuration correspondant à l'étape de procédé représentée à la figure 1.FIG. 4 schematically illustrates, in a sectional view, a detail of the device according to the invention, in a configuration corresponding to the process step shown in FIG. 1.
- La figure 5 illustre schématiquement un mode de réalisation de la conduite du dispositif selon l'invention.- Figure 5 schematically illustrates an embodiment of the pipe of the device according to the invention.
MEILLEURE MANIERE DE REALISER L'INVENTIONBEST WAY TO IMPLEMENT THE INVENTION
Les figures 1 à 3 illustrent différentes étapes du procédé pour réaliser au moins un plot de contact électrique 1 sur une plage d'accueil 2 d'un composant électronique 3, conforme à l'invention.FIGS. 1 to 3 illustrate different steps of the method for producing at least one electrical contact pad 1 on a reception area 2 of an electronic component 3, in accordance with the invention.
Le composant électronique 3 est fabriqué en tous matériaux bien connus de l'homme du métier, et comporte des plages d'accueil 2 électriquement conductrices qui consistent généralement en des pistes métalliques, par exemple en cuivre ou en or.The electronic component 3 is made of any material well known to those skilled in the art, and includes electrically conductive receiving pads 2 which generally consist of metal tracks, for example copper or gold.
Selon le procédé conforme à l'invention, on injecte un alliage ou un métal liquide 4 dans au moins une conduite 5.
Parmi les alliages utilisables dans le cadre du procédé selon l'invention, on peut citer, à titre purement illustratif et non limitatif, des alliages combinant deux ou plus, des éléments suivants : Sn, Pb, Bi, In.According to the process according to the invention, an alloy or a liquid metal 4 is injected into at least one pipe 5. Among the alloys which can be used in the context of the process according to the invention, mention may be made, purely by way of nonlimiting illustration, of alloys combining two or more, of the following elements: Sn, Pb, Bi, In.
La conduite 5 comprend deux portions 5A, 5B, à savoir une portion d'acheminement 5A et une portion de moulage 5B, séparées par un rétrécissement 5C.Line 5 comprises two portions 5A, 5B, namely a routing portion 5A and a molding portion 5B, separated by a narrowing 5C.
Les figures 1 à 4 représentent des procédé et dispositif mettant en oeuvre quatre conduites, à titre purement illustratif. Il faut en effet compter autant de conduites 5 que de plots 1 à réaliser, c'est à dire en pratique généralement plusieurs dizaines ou centaines.Figures 1 to 4 show process and device using four lines, purely by way of illustration. It is indeed necessary to count as many pipes 5 as pads 1 to be produced, that is to say in practice generally several tens or hundreds.
L'injection de l'alliage ou du métal liquide 4, qui constitue le matériau de soudure, peut être réalisé en imposant, par tout moyen connu, une pression d'injection audit matériau liquide de soudure 4, de façon à forcer celui-ci à passer dans la conduite 5 en direction de la plage d'accueil 2, selon une direction d'injection représentée à la figure 1 par la flèche I.The injection of the alloy or of the liquid metal 4, which constitutes the welding material, can be carried out by imposing, by any known means, an injection pressure on said liquid welding material 4, so as to force the latter to pass in line 5 in the direction of the reception area 2, in an injection direction shown in FIG. 1 by the arrow I.
La portion d'acheminement 5A est prolongée par la portion de moulage 5B, de façon à former une conduite 5 continue dans laquelle l'alliage ou métal liquide 4 va suivre une trajectoire sensiblement et globalement unidirectionnelle, dans le sens d'injection I.The routing portion 5A is extended by the molding portion 5B, so as to form a continuous pipe 5 in which the alloy or liquid metal 4 will follow a substantially and generally unidirectional trajectory, in the direction of injection I.
Telles que représentées aux figures, les portions d'acheminement 5A et de moulage 5B peuvent être rectilignes et présenter une symétrie axiale commune selon un axe X-X'. Il est également envisageable, sans sortir du cadre de l'invention, que les axes de symétrie respectifs des portions d'acheminement 5A et de moulage 5B soient décalés et ne coïncident pas. Selon la variante représentée aux figures, les portions d'acheminement 5A et de moulage 5B sont de forme sensiblement cylindrique, la portion
d'acheminement 5A présentant une section constante inférieure à la section, constante également, de la portion de moulage 5B. Le rétrécissement 5C provient dans ce cas de la différence de section entre la portion d'acheminement 5A et la portion de moulage 5B. Le rétrécissement 5C s'entend ici et dans ce qui suit comme une restriction de section de la conduite 5 lorsque celle-ci est parcourue dans le sens opposé au sens d'injection I, c'est à dire de la portion de moulage vers la portion d'acheminement.As shown in the figures, the routing portions 5A and molding 5B can be rectilinear and have a common axial symmetry along an axis XX ′. It is also possible, without departing from the scope of the invention, for the respective axes of symmetry of the routing portions 5A and of the molding 5B to be offset and not to coincide. According to the variant shown in the figures, the routing portions 5A and molding 5B are of substantially cylindrical shape, the portion routing 5A having a constant section smaller than the section, also constant, of the molding portion 5B. The shrinkage 5C in this case comes from the difference in section between the routing portion 5A and the molding portion 5B. The narrowing 5C is understood here and in what follows as a restriction of section of the pipe 5 when the latter is traversed in the direction opposite to the direction of injection I, that is to say from the molding portion towards the routing portion.
D'autres modes de réalisation de forme de la conduite sont envisageables sans sortir du cadre de l'invention. Il est ainsi possible que les portions d'acheminement 5A et de moulage 5B soient toutes deux de forme tronconique, chacune desdites portions de cônes se raccordant au niveau de leur section minimum respective, de façon à réaliser un col formant rétrécissement 5C. Il est également envisageable que la portion d'acheminement 5A soit de forme cylindrique rectiligne et débouche au niveau de la section minimum d'une portion de moulage 5B de forme tronconique. Il est également envisageable que la portion de moulage 5B présente une forme sensiblement hémisphérique ou de cavité, avec une ouverture communiquant avec une portion d'acheminement 5A de forme cylindrique ou tronconique. De tels modes de réalisation et de géométrie de la conduite 5 sont bien connus de l'homme du métier, notamment par le document FR-99 05544. Il est enfin envisageable, tel que cela est représenté à la figure 5, que le rétrécissement 5C soit réalisé par le décalage latéral relatif des portions d'acheminement 5A et de moulage 5B. De cette façon, les sections respectives des portions d'acheminement 5A et de moulage 5B peuvent être de dimensions quelconques, puisqu'il suffit de les faire se chevaucher partiellement pour obtenir le rétrécissement 5C. Selon ce mode de réalisation, une même portion d'acheminement 5A peut ainsi alimenter plusieurs portions de moulage 5B.
Selon l'invention, la conduite 5 est positionnée de façon à ce que la portion de moulage 5B débouche contre la plage d'accueil 2.Other embodiments of the shape of the pipe can be envisaged without departing from the scope of the invention. It is thus possible that the routing portions 5A and molding 5B are both of frustoconical shape, each of said portions of cones connecting at their respective minimum section, so as to produce a neck forming a narrowing 5C. It is also conceivable that the routing portion 5A is of rectilinear cylindrical shape and opens out at the minimum section of a molding portion 5B of frustoconical shape. It is also conceivable that the molding portion 5B has a substantially hemispherical or cavity shape, with an opening communicating with a routing portion 5A of cylindrical or frustoconical shape. Such embodiments and geometry of the pipe 5 are well known to those skilled in the art, in particular from document FR-99 05544. It is finally possible, as shown in FIG. 5, for the shrinkage 5C is achieved by the relative lateral offset of the routing portions 5A and molding 5B. In this way, the respective sections of the routing 5A and molding 5B portions can be of any size, since it suffices to make them partially overlap to obtain the narrowing 5C. According to this embodiment, the same routing portion 5A can thus supply several molding portions 5B. According to the invention, the pipe 5 is positioned so that the molding portion 5B opens against the reception area 2.
L'étape décrite ci-avant constitue ainsi une étape d'injection d'alliage ou de métal liquide 4 sur une plage d'accueil 2. A l'issue de cette étape, on cesse d'imposer une pression d'injection à l'alliage ou métal liquide 4.The step described above thus constitutes a step of injecting an alloy or liquid metal 4 onto a reception area 2. At the end of this step, the injection pressure ceases to be imposed on the alloy or liquid metal 4.
Dans une étape ultérieure de démoulage, et conformément à une caractéristique essentielle de l'invention, on sépare la portion de moulage 5B et la plage d'accueil 2 avant solidification complète du métal ou de l'alliage 4, tout en maintenant solidaires les portions d'acheminement 5A et de moulage 5B.In a subsequent demolding step, and in accordance with an essential characteristic of the invention, the molding portion 5B and the reception area 2 are separated before complete solidification of the metal or of the alloy 4, while holding the portions together routing 5A and molding 5B.
Le demandeur a en effet découvert qu'il était possible, de façon inattendue, de démouler en phase liquide sans pour autant, et contrairement à ce qu'enseigne l'art antérieur, procéder à une étape antérieure de séparation de la portion d'acheminement 5A et de la portion de moulage 5B. Cette étape de démoulage, représentée à la figure 2, permet ainsi, en une seule opération et non deux comme dans les procédés de l'art antérieur, d'obtenir des plots primaires 1A séparés du reste de matière 4 présent dans la portion d'acheminement 5A, et ce avant solidification complète du métal ou de l'alliage 4 formant ledit plot primaire 1A.The applicant has in fact discovered that it was possible, unexpectedly, to turn out in the liquid phase without, and contrary to what the prior art teaches, proceed to an earlier step of separation of the routing portion 5A and the molding portion 5B. This demolding step, shown in Figure 2, thus allows, in a single operation and not two as in the methods of the prior art, to obtain primary pads 1A separated from the rest of material 4 present in the portion of routing 5A, and this before complete solidification of the metal or of the alloy 4 forming said primary pad 1A.
Par « avant solidification complète », on entend que le matériau se trouve dans un état liquide ou du moins très malléable, ne pouvant être assimilé à l'état solide. Plus précisément, dans le cas d'un alliage, l'état « d'avant solidification complète » correspond à un état situé en dehors de la zone de « tout solide » délimitée par la courbe de Solidus dans le diagramme liquide- solide de l'alliage considéré.
La conduite 5 peut être usinée d'un seul tenant dans la masse d'une pièce unique. De façon préférentielle, la conduite 5 est cependant réalisée grâce à deux pièces distinctes 6, 7. Ainsi, la portion d'acheminement 5A fait partie d'une première pièce formant matrice 6, et la portion de moulage 5B fait partie d'une deuxième pièce distincte formant moule 7, lesdits matrice 6 et moule 7 étant juxtaposés pour former la conduite 5, tel que cela est représenté aux figures 1 , 2 et 4. Le moule 7 ainsi plaqué contre la matrice 6 permet de créer une conduite 5 continue, de la même façon que si la conduite 5 avait été usinée dans une pièce unique. La juxtaposition de deux pièces distinctes, comme le moule 7 et la matrice 6, crée cependant nécessairement un jeu au niveau de l'interface de contact 8 entre ces deux pièces. Ce jeu, même infinitésimal, crée une lame d'air qui s'avère contribuer de façon bénéfique à la phase de démoulage représentée à la figure 2, puisqu'elle contribue à séparer la matière formant le plot primaire 1A de celle restant dans la matrice au niveau de la conduite d'acheminement 5A. Ainsi, la juxtaposition de deux pièces distinctes 6, 7, de façon à former un ensemble unitaire monobloc, est un mode de réalisation particulièrement apprécié de la conduite 5.By "before complete solidification" is meant that the material is in a liquid state or at least very malleable, which cannot be assimilated to the solid state. More precisely, in the case of an alloy, the state “before complete solidification” corresponds to a state located outside the “all solid” zone delimited by the Solidus curve in the liquid-solid diagram of l 'alloy considered. Line 5 can be machined in one piece from the mass of a single part. Preferably, the pipe 5 is however produced by two separate parts 6, 7. Thus, the routing portion 5A is part of a first part forming a matrix 6, and the molding portion 5B is part of a second separate part forming a mold 7, said matrix 6 and mold 7 being juxtaposed to form the pipe 5, as shown in FIGS. 1, 2 and 4. The mold 7 thus pressed against the matrix 6 makes it possible to create a continuous pipe 5, in the same way as if line 5 had been machined in a single part. The juxtaposition of two separate parts, such as the mold 7 and the matrix 6, however necessarily creates a clearance at the contact interface 8 between these two parts. This game, even an infinitesimal one, creates an air gap which turns out to contribute in a beneficial way to the demolding phase represented in FIG. 2, since it contributes to separate the material forming the primary pad 1A from that remaining in the matrix. at the routing line 5A. Thus, the juxtaposition of two distinct parts 6, 7, so as to form a unitary unitary assembly, is a particularly appreciated embodiment of the pipe 5.
Avantageusement, on assure le déplacement de l'alliage ou du métal liquide 4 dans le sens opposé à l'injection (ou sens de reflux, illustré par la flèche R) au sein de la portion d'acheminement 5A, avant de séparer la portion de moulage 5B et la plage d'accueil 2. Cette étape de reflux, qui survient entre l'étape d'injection représentée à la figure 1 et l'étape de démoulage représentée à la figure 2, permet de casser, au niveau du rétrécissement 5C et en coopération avec celui-ci, la « colonne » d'alliage ou de métal liquide 4 présent dans la conduite 5, permettant ainsi de faciliter et d'optimiser l'opération de démoulage, en contrôlant parfaitement la quantité de matière déposée sur la plage d'accueil 2 pour former le plot primaire 1A.
De façon préférentielle, le déplacement de l'alliage 4 dans le sens du reflux R est réalisé par aspiration, en imposant à l'alliage ou métal liquide 4 une pression inverse à la pression d'injection, c'est à dire une dépression.Advantageously, the alloy or the liquid metal 4 is moved in the opposite direction to the injection (or reflux direction, illustrated by the arrow R) within the conveying portion 5A, before separating the portion 5B molding and the reception area 2. This reflux step, which occurs between the injection step shown in Figure 1 and the release step shown in Figure 2, allows to break, at the level of shrinkage 5C and in cooperation with it, the “column” of alloy or liquid metal 4 present in the pipe 5, thus making it possible to facilitate and optimize the demolding operation, by perfectly controlling the quantity of material deposited on the reception area 2 to form the primary pad 1A. Preferably, the displacement of the alloy 4 in the direction of the reflux R is achieved by suction, by imposing on the alloy or liquid metal 4 a pressure opposite to the injection pressure, that is to say a vacuum.
De façon préférentielle, l'aspiration est réalisée par le déplacement, dans le sens R opposé au sens d'injection, d'un élément d'obturation 9 du genre soupape, situé en amont de la conduite 5 en considération du sens d'injection I, vers une position où ledit élément d'obturation 9 ferme l'alimentation de la conduite 5 en alliage ou en métal liquide 4. L'élément d'obturation 9 a ainsi une double fonction : il ferme l'alimentation de la conduite 5 et met ainsi fin à l'étape d'injection, et son déplacement à travers l'alliage ou le métal liquide 4 crée une dépression déplaçant sensiblement l'alliage ou le métal liquide 4 dans la portion d'acheminement 5A dans le sens du reflux R.Preferably, the suction is carried out by the displacement, in the direction R opposite to the direction of injection, of a shutter element 9 of the valve type, located upstream of the pipe 5 in consideration of the direction of injection. I, towards a position where said obturation element 9 closes the supply of the pipe 5 in alloy or liquid metal 4. The obturation element 9 thus has a double function: it closes the supply of the pipe 5 and thus puts an end to the injection step, and its displacement through the alloy or the liquid metal 4 creates a depression substantially displacing the alloy or the liquid metal 4 in the conveying portion 5A in the direction of reflux R.
A l'issue de l'étape de démoulage, ou quasiment conjointement à cette étape de démoulage, l'alliage ou métal liquide constituant le plot primaire 1A, dégagé de toute influence mécanique, exceptée celle de la plage d'accueil 2 sur laquelle il repose, va prendre la forme d'une calotte sensiblement sphérique, telle que représentée à la figure 3, cette géométrie minimisant les tensions superficielles. Dans cette étape de formage du plot, l'alliage ou métal liquide va alors se refroidir et se solidifier complètement.At the end of the demolding step, or almost jointly with this demolding step, the alloy or liquid metal constituting the primary pad 1A, free of any mechanical influence, except that of the receiving area 2 on which it rests, will take the form of a substantially spherical cap, as shown in Figure 3, this geometry minimizing the surface tensions. In this step of forming the pad, the alloy or liquid metal will then cool and solidify completely.
De façon particulièrement avantageuse, la séparation de la portion de moulage 5B et de la plage d'accueil 2 se fait dans une nappe de gaz inerte ou réducteur G. Le gaz G est préférentiellement répandu dès avant l'étape de démoulage représentée à la figure 2, de façon à procéder à l'opération de démoulage dans un environnement gazeux inhibant l'oxydation des plots.
De façon préférentielle, le gaz G comprend de l'azote. Le gaz G peut cependant comprendre tout autre gaz neutre ou réducteur remplissant la fonction d'inhibition de l'oxydation.In a particularly advantageous manner, the separation of the molding portion 5B and of the reception area 2 takes place in a sheet of inert or reducing gas G. The gas G is preferably spread from before the demolding step shown in the figure 2, so as to carry out the demolding operation in a gaseous environment inhibiting the oxidation of the pads. Preferably, the gas G comprises nitrogen. The gas G may however include any other neutral or reducing gas fulfilling the function of inhibiting oxidation.
Avantageusement, le gaz G comprend un composant comportant un groupe carboxyle (COOH). La présence dans le gaz G d'un tel composant permet en effet de conférer à celui-ci des propriétés d'aide à la formation du plot 1 à partir du plot primaire 1A, permettant de former rapidement les billes 1 avec une bonne répétabilité de forme. De façon particulièrement préférentielle, le composant comportant un groupe carboxyle est l'acide formique (H-COOH). Le gaz G constitue ainsi une atmosphère active présentant une double fonction, à savoir une fonction antioxydation et une fonction de formage des plots 1.Advantageously, the gas G comprises a component comprising a carboxyl group (COOH). The presence in the gas G of such a component in fact makes it possible to confer on it properties of aid in the formation of the pad 1 from the primary pad 1A, making it possible to rapidly form the balls 1 with good repeatability of form. Particularly preferably, the component comprising a carboxyl group is formic acid (H-COOH). The gas G thus constitutes an active atmosphere having a double function, namely an antioxidant function and a function for forming the pads 1.
Le dispositif pour réaliser au moins un plot de contact électrique 1 sur une plage d'accueil 2 d'un composant électronique 3 conforme à l'invention comprend une conduite 5 destinée au passage d'alliage ou de métal liquide 4. Ainsi que cela a été décrit précédemment, ladite conduite 5 comprend elle-même deux portions, une portion d'acheminement 5A faisant partie d'une première pièce formant matrice 6, et une portion de moulage 5B faisant partie d'une deuxième pièce formant moule 7, préférentiellement distincte de la première pièce. Lesdites portions d'acheminement 5A et de moulage 5B sont séparées par un rétrécissement 5C.The device for producing at least one electrical contact pad 1 on a reception area 2 of an electronic component 3 according to the invention comprises a pipe 5 intended for the passage of alloy or liquid metal 4. As has described above, said pipe 5 itself comprises two portions, a routing portion 5A forming part of a first part forming a die 6, and a molding portion 5B forming part of a second part forming a mold 7, preferably distinct from the first play. Said routing portions 5A and molding 5B are separated by a narrowing 5C.
Selon une caractéristique essentielle du dispositif selon l'invention, ce dernier comprend un moyen de fixation 10 de la matrice 6 relativement au moule 7, permettant que lesdits matrice 6 ou moule 7 soient montés juxtaposés de façon fixe pour former la conduite 5. La matrice 6 et le moule 7 sont ainsi montés pour former un sous-ensemble unitaire monobloc.
Avantageusement, la matrice 6 inclut une plaque comprenant au moins une zone poreuse qui forme la portion d'acheminement 5A. La matrice 6 peut être ainsi réalisée dans un matériau poreux, dont la porosité est inhibée par attaque chimique, vernissage ou tout autre procédé bien connu de l'homme du métier, excepté en des zones qui constituent la portion d'acheminement 5A.According to an essential characteristic of the device according to the invention, the latter comprises a means 10 for fixing the matrix 6 relative to the mold 7, allowing said matrix 6 or mold 7 to be mounted juxtaposed in a fixed manner to form the pipe 5. The matrix 6 and the mold 7 are thus mounted to form a unitary unitary sub-assembly. Advantageously, the matrix 6 includes a plate comprising at least one porous zone which forms the conveying portion 5A. The matrix 6 can thus be produced from a porous material, the porosity of which is inhibited by chemical attack, varnishing or any other process well known to those skilled in the art, except in areas which constitute the routing portion 5A.
Le moule 7 peut être fabriqué par tout procédé connu de l'homme du métier. De façon préférentielle, le matériau du moule 7 est choisi de manière à ne pas mouiller l'alliage ou métal liquide 4, et à minimiser la tension superficielle alliage/moule. Le matériau peut être notamment choisi parmi : acier inoxydable avec ébavurage chimique, graphite, téflon, silicium traité.The mold 7 can be manufactured by any process known to those skilled in the art. Preferably, the material of the mold 7 is chosen so as not to wet the alloy or liquid metal 4, and to minimize the surface tension of the alloy / mold. The material can in particular be chosen from: stainless steel with chemical deburring, graphite, teflon, treated silicon.
Avantageusement, le dispositif selon l'invention comprend, en amont de la matrice 6 et en considération du sens I de passage (ou d'injection) de l'alliage ou du métal liquide 4, un réservoir 11 destiné à contenir l'alliage ou le métal liquide 4, ledit réservoir 11 présentant une ouverture inférieure 11A débouchant dans une cuve 12 communiquant elle-même avec ladite matrice 6. Le passage de l'alliage ou du métal liquide 4 par l'ouverture inférieure 11A est contrôlé par un élément d'obturation mobile 9 du genre soupape, susceptible de se déplacer parallèlement à la direction de passage de l'alliage ou du métal liquide 4, dans le sens d'injection l ou dans le sens opposé de reflux R, entre une position haute de butée (non représentée) où il obture l'ouverture inférieure 11A, et au moins une position intermédiaire (représentée à la figure 4) où il autorise le passage de l'alliage ou du métal liquide 4 vers la cuve 12, puis vers la matrice 6.Advantageously, the device according to the invention comprises, upstream of the matrix 6 and in consideration of the direction I of passage (or injection) of the alloy or of the liquid metal 4, a reservoir 11 intended to contain the alloy or the liquid metal 4, said reservoir 11 having a lower opening 11A opening into a tank 12 communicating itself with said matrix 6. The passage of the alloy or of the liquid metal 4 through the lower opening 11A is controlled by an element d mobile shutter 9 of the valve type, capable of moving parallel to the direction of passage of the alloy or of the liquid metal 4, in the direction of injection l or in the opposite direction of reflux R, between a high stop position (not shown) where it closes the lower opening 11A, and at least one intermediate position (shown in FIG. 4) where it authorizes the passage of the alloy or of the liquid metal 4 towards the tank 12, then towards the matrix 6 .
De façon préférentielle, l'élément d'obturation mobile 9 du genre soupape comprend une tige 9A et une tête 9B de section supérieure à celle de la tige 9A. Cette dernière coulisse verticalement entre les bords de l'ouverture 11 A, avec un jeu suffisant par rapport audits bords pour autoriser le passage
d'alliage ou de métal liquide 4. L'ouverture 11A s'élargit en aval en considération du sens d'injection I, pour former une chambre dans laquelle se meut la tête 9B. La matrice 6 est montée en communication avec cette chambre de façon étanche par l'intermédiaire d'un joint 13 pour former la cuve 12. Ainsi, la tête 9B se déplace dans l'alliage ou métal liquide contenu dans la cuve 12, et peut imprimer à cette matière un sens de passage dans la portion d'acheminement 6. Lorsque la tête 9B vient se plaquer contre le rebord périphérique de l'ouverture 11 A, l'alimentation en alliage ou métal liquide de la cuve 12 est stoppée, la matière subissant concomitamment une aspiration dans le sillage de la tête 9B.Preferably, the movable closure element 9 of the valve type comprises a rod 9A and a head 9B of section greater than that of the rod 9A. The latter slides vertically between the edges of the opening 11 A, with sufficient clearance relative to said edges to allow passage of alloy or liquid metal 4. The opening 11A widens downstream in consideration of the direction of injection I, to form a chamber in which the head 9B moves. The matrix 6 is mounted in communication with this chamber in a sealed manner by means of a seal 13 to form the tank 12. Thus, the head 9B moves in the alloy or liquid metal contained in the tank 12, and can print this direction of passage in the routing portion 6. When the head 9B is pressed against the peripheral rim of the opening 11 A, the supply of alloy or liquid metal to the tank 12 is stopped, the material concomitantly sucking in the wake of the head 9B.
Un tel agencement de type soupape permet ainsi de réaliser l'étape d'arrêt de l'injection et d'aspiration évoquée précédemment dans la description du procédé.Such a valve-type arrangement thus makes it possible to carry out the step of stopping the injection and aspiration mentioned previously in the description of the process.
Avantageusement, le dispositif selon l'invention comprend un moyen (non représenté) pour dispenser un gaz G au niveau de la portion de moulage 5B. Ce moyen de dispense de gaz permet de saturer l'atmosphère avec un gaz G qui est préférentiellement inerte ou réducteur, de façon à présenter une fonction antioxydation. Ledit gaz G comprend également préférentiellement un composant comportant un groupe carboxyle (COOH), de façon à présenter des propriétés de formage, avec une bonne répétabilité, des billes 1. De façon préférentielle, le composant présentant un groupe carboxyle est l'acide formique (H-COOH). De façon préférentielle, le gaz G comprend de l'azote.Advantageously, the device according to the invention comprises means (not shown) for dispensing a gas G at the level of the molding portion 5B. This gas dispensing means makes it possible to saturate the atmosphere with a gas G which is preferably inert or reducing, so as to have an antioxidant function. Said gas G also preferably comprises a component comprising a carboxyl group (COOH), so as to have forming properties, with good repeatability, of the beads 1. Preferably, the component exhibiting a carboxyl group is formic acid ( H-COOH). Preferably, the gas G comprises nitrogen.
Avantageusement, le moyen de dispense de gaz G (non représenté) comprend un moyen de diffusion (non représenté) et un moyen d'élaboration (non représenté) situé en amont dudit moyen de diffusion, ledit moyen de diffusion permettant l'imbibition du composant comportant un groupe carboxyle par un gaz primitif inerte ou réducteur. De façon préférentielle, le
moyen de dispense comprend, en tant que moyen d'élaboration, un récipient contenant de l'acide formique liquide que l'on va mettre en contact avec de l'azote, de façon à ce que cet azote s'imbibe d'acide formique et présente ainsi les qualités citées précédemment.Advantageously, the gas dispensing means G (not shown) comprises a diffusion means (not shown) and a preparation means (not shown) located upstream of said diffusion means, said diffusion means allowing the component to be imbibed. having a carboxyl group with an inert or reducing primary gas. Preferably, the dispensing means comprises, as means of preparation, a container containing liquid formic acid which will be brought into contact with nitrogen, so that this nitrogen is soaked with formic acid and thus has the qualities mentioned above.
Avantageusement, la conduite 5 est agencée de façon à être positionnée au dessus de la plage d'accueil 2. Cette caractéristique technique est totalement indépendante du fait que la matrice et le moule soient formés d'une pièce unique ou de deux pièces distinctes. Cette disposition spécifique permet d'obtenir des résultats particulièrement bons, sans doute du fait que les éventuelles impuretés contenues dans l'alliage ou métal liquide 4, et dont la densité est généralement plus faible que celle de l'alliage ou métal liquide 4, remontent dans le sens du reflux R sous l'effet de la gravité et ne viennent pas s'accumuler au niveau de la surface de plot 14 en contact avec la plage d'accueil 2, ce qui pourrait perturber le mouillage correct du plot 1A et sa bonne adhésion sur la plage d'accueil 2. Cet agencement permet également d'éviter l'accumulation, sous l'effet de la gravité, d'impuretés au niveau de la portion de moulage 5B et/ou de la portion d'acheminement 5A, ce qui pourrait boucher lesdites portions 5A, 5B.Advantageously, the pipe 5 is arranged so as to be positioned above the reception area 2. This technical characteristic is completely independent of the fact that the matrix and the mold are formed from a single piece or from two separate pieces. This specific arrangement makes it possible to obtain particularly good results, no doubt due to the fact that any impurities contained in the alloy or liquid metal 4, and whose density is generally lower than that of the alloy or liquid metal 4, go up. in the direction of reflux R under the effect of gravity and do not come to accumulate at the level of the pad surface 14 in contact with the reception area 2, which could disturb the correct wetting of the pad 1A and its good adhesion to the reception area 2. This arrangement also makes it possible to avoid the accumulation, under the effect of gravity, of impurities at the level of the molding portion 5B and / or of the routing portion 5A , which could block said portions 5A, 5B.
L'invention concerne ainsi, de façon totalement indépendante, un procédé pour réaliser au moins un plot 1 de contact électrique sur une plage d'accueil 2 d'un composant électronique, ou pour régénérer un ensemble de plots 1 de contact électrique réalisé sur des plages d'accueil 2 d'un composant électronique 3, dans lequel on injecte un alliage liquide ou un métal liquide 4 dans au moins une conduite 5, laquelle comprend deux portions, une portion d'acheminement 5A et une portion de moulage 5B, séparées par un rétrécissement 5C, ladite conduite 5 étant positionnée de façon à ce que la portion de moulage 5B débouche contre la plage d'accueil 2, ledit procédé comprenant également une étape où l'on sépare la portion de moulage 5B
de la plage d'accueil 2 avant solidification complète du métal ou de l'alliage 4, tout en maintenant solidaire les portions d'acheminement 5A et de moulage 5B, ladite conduite 5 étant agencée de façon à être positionnée au dessus de la plage d'accueil 2 relativement à la gravité.The invention thus relates, entirely independently, to a method for producing at least one electrical contact pad 1 on a reception area 2 of an electronic component, or for regenerating a set of electrical contact pads 1 produced on receiving areas 2 of an electronic component 3, into which a liquid alloy or a liquid metal 4 is injected into at least one pipe 5, which comprises two separate portions, a routing portion 5A and a molding portion 5B by a narrowing 5C, said pipe 5 being positioned so that the molding portion 5B opens against the reception area 2, said method also comprising a step in which the molding portion 5B is separated of the reception area 2 before complete solidification of the metal or of the alloy 4, while holding the routing portions 5A and the molding 5B integral, said pipe 5 being arranged so as to be positioned above the range d welcome 2 relative to gravity.
L'invention concerne également de façon indépendante un dispositif pour réaliser au moins un plot 1 de contact électrique sur une plage d'accueil 2 d'un composant électronique 3, ou pour régénérer un ensemble de plots 1 de contact électrique réalisé sur des plages d'accueil 2 d'un composant électronique 3, ledit dispositif comprenant une conduite 5 destinée au passage d'alliage ou de métal liquide 4, ladite conduite 5 comprenant elle- même deux portions, une portion d'acheminement 5A faisant partie d'une première pièce formant matrice 6, et une portion de moulage 5B formant partie d'une deuxième pièce formant moule 7, lesdites portions d'acheminement 5A et de moulage 5B étant séparées par un rétrécissement 5C, ledit dispositif comprenant un moyen de fixation 10 de la matrice 6 relativement au moule 7, permettant que lesdits matrice 6 et moule 7 soient montés juxtaposés de façon fixe pour former la conduite 5, ladite conduite 5 étant agencée de façon à être positionnée au dessus de la plage d'accueil, relativement à la gravité.The invention also relates independently to a device for producing at least one electrical contact pad 1 on a receiving pad 2 of an electronic component 3, or for regenerating a set of electrical contact pads 1 formed on pads reception 2 of an electronic component 3, said device comprising a pipe 5 intended for the passage of alloy or of liquid metal 4, said pipe 5 itself comprising two portions, a routing portion 5A forming part of a first part forming a matrix 6, and a molding portion 5B forming part of a second part forming a mold 7, said routing portions 5A and molding 5B being separated by a narrowing 5C, said device comprising a means 10 for fixing the matrix 6 relative to the mold 7, allowing said matrix 6 and mold 7 to be mounted juxtaposed in a fixed manner to form the pipe 5, said pipe 5 being arranged so as to be be positioned above the reception area, relative to gravity.
Le procédé, ainsi que le dispositif selon l'invention, peuvent être utilisés également pour régénérer un ensemble de plots de contact électrique 1 réalisé sur des plages d'accueil 2 d'un composant électronique 3. Le terme « régénérer » désigne ici une opération de réparation de plots au sens large, impliquant notamment éventuellement un ajout de matière pour corriger ou parachever la taille de plots, et/ou un reformage de plots. A cette fin, il convient de procéder aux mêmes étapes que celles mises en oeuvre dans la réalisation de nouveaux plots selon le procédé décrit précédemment, pour réhabiliter des réseaux de billes 1 présentant des défauts (géométriques
notamment). La première étape de régénération consiste ainsi à plaquer la conduite 5 contre la plage d'accueil 2, de façon à ce qu'elle englobe le plot de contact 1 existant à corriger. On injecte par la suite un alliage ou un métal liquide 4 dans la conduite 5, celui-ci occupant, au niveau de la portion de moulage 5B, l'espace restant laissé libre par le plot 1 existant à corriger. On réalise ainsi un surmoulage correctif du plot défectueux.The method, as well as the device according to the invention, can also be used to regenerate a set of electrical contact pads 1 produced on receiving pads 2 of an electronic component 3. The term “regenerate” here designates an operation repair of studs in the broad sense, in particular possibly involving the addition of material to correct or complete the size of studs, and / or reforming of studs. To this end, the same steps should be carried out as those implemented in the production of new studs according to the method described above, to rehabilitate arrays of balls 1 having defects (geometric especially). The first regeneration step thus consists in pressing the pipe 5 against the reception area 2, so that it includes the existing contact pad 1 to be corrected. Subsequently, an alloy or a liquid metal 4 is injected into the pipe 5, the latter occupying, at the level of the molding portion 5B, the space remaining left free by the existing stud 1 to be corrected. This produces a corrective overmolding of the defective stud.
Ainsi, le dispositif et le procédé conformes à l'invention permettent de réaliser ou de régénérer des réseaux de plots 1 de contact électrique du type BGA de façon rapide, puisque le nombre d'étapes est optimisé (pas d'étape de séparation du moule et de la matrice), de même que le temps de cycle, puisqu'il n'est pas nécessaire d'attendre que la matière se soit solidifiée dans la portion de moulage 5B pour procéder au démoulage.Thus, the device and the method in accordance with the invention make it possible to produce or regenerate networks of electrical contact pads 1 of the BGA type quickly, since the number of steps is optimized (no mold separation step and of the matrix), as well as the cycle time, since it is not necessary to wait until the material has solidified in the molding portion 5B before proceeding with demolding.
POSSIBILITE D'APPLICATION INDUSTRIELLEPOSSIBILITY OF INDUSTRIAL APPLICATION
L'invention trouve son application industrielle dans la réalisation de plots de contact électrique.
The invention finds its industrial application in the production of electrical contact pads.
Claims
REVENDICATIONS
- Procédé pour réaliser au moins un plot (1) de contact électrique sur une plage d'accueil (2) d'un composant électronique, ou pour régénérer un ensemble de plots (1) de contact électrique réalisé sur des plages d'accueil (2) d'un composant électronique (3), dans lequel :- Method for producing at least one electrical contact pad (1) on a receiving pad (2) of an electronic component, or for regenerating a set of electrical contact pads (1) made on receiving pads ( 2) an electronic component (3), in which:
- on injecte un alliage ou un métal liquide (4) dans au moins une conduite (5), laquelle comprend deux portions, une portion d'acheminement (5A) et une portion de moulage (5B) séparées par un rétrécissement (5C), ladite conduite (5) étant positionnée de façon à ce que la portion de moulage (5B) débouche contre la plage d'accueil (2),- an alloy or a liquid metal (4) is injected into at least one pipe (5), which comprises two portions, a conveying portion (5A) and a molding portion (5B) separated by a narrowing (5C), said pipe (5) being positioned so that the molding portion (5B) opens against the reception area (2),
- on sépare la portion de moulage (5B) et la plage d'accueil (2) avant solidification complète du métal ou de l'alliage (4), tout en maintenant solidaires les portions d'acheminement (5A) et de moulage (5B),- the molding portion (5B) and the reception area (2) are separated before complete solidification of the metal or alloy (4), while maintaining the conveying portions (5A) and molding portions (5B) together ),
caractérisé en ce que la portion d'acheminement (5A) fait partie d'une première pièce formant matrice (6), et la portion de moulage (5B) fait partie d'une deuxième pièce distincte formant moule (7), lesdits matrice et moule étant juxtaposés pour former la conduite (5).characterized in that the conveying portion (5A) is part of a first part forming a die (6), and the molding portion (5B) is part of a second separate part forming a mold (7), said die and mold being juxtaposed to form the pipe (5).
- Procédé selon la revendication 1 caractérisé en ce que l'on assure le déplacement de l'alliage ou du métal liquide (4) dans le sens opposé à l'injection au sein de la portion d'acheminement (5A), avant de séparer la portion de moulage (5B) et la plage d'accueil (2).- Method according to claim 1 characterized in that the movement of the alloy or liquid metal (4) is ensured in the direction opposite to the injection within the conveying portion (5A), before separating the molding portion (5B) and the reception area (2).
- Procédé selon la revendication 2 caractérisé en ce que le déplacement de l'alliage (4) est réalisé par aspiration.
- Procédé selon la revendication 3 caractérisé en ce que l'aspiration est réalisée par le déplacement dans le sens (R) opposé au sens d'injection (I) d'un élément d'obturation (9) du genre soupape, situé en amont de la conduite (5) en considération du sens d'injection (I), vers une position où ledit élément d'obturation (9) ferme l'alimentation de la conduite (5) en alliage ou en métal liquide (4).- Method according to claim 2 characterized in that the displacement of the alloy (4) is carried out by suction. - Method according to claim 3 characterized in that the suction is carried out by the movement in the direction (R) opposite to the direction of injection (I) of a closing element (9) of the valve type, located upstream of the pipe (5) in consideration of the injection direction (I), towards a position where said closing element (9) closes the supply to the pipe (5) of alloy or liquid metal (4).
- Procédé selon l'une des revendications 1 à 4 caractérisé en ce que la séparation de la portion de moulage (5B) et de la plage d'accueil (2) se fait dans une nappe de gaz (G) inerte ou réducteur.- Method according to one of claims 1 to 4 characterized in that the separation of the molding portion (5B) and the receiving area (2) is done in a sheet of inert or reducing gas (G).
- Procédé selon la revendication 5 caractérisé en ce que le gaz (G) comprend de l'azote.- Method according to claim 5 characterized in that the gas (G) comprises nitrogen.
- Procédé selon la revendication 6 caractérisé en ce que le gaz (G) comprend un composant comportant un groupe carboxyle.- Method according to claim 6 characterized in that the gas (G) comprises a component comprising a carboxyl group.
- Procédé selon la revendication 7 caractérisé en ce que le composant comportant un groupe carboxyle est l'acide formique.- Process according to claim 7 characterized in that the component comprising a carboxyl group is formic acid.
- Dispositif pour réaliser au moins un plot (1) de contact électrique sur une plage d'accueil (2) d'un composant électronique (3), ou pour régénérer un ensemble de plots (1) de contact électrique réalisé sur des plages d'accueil - Device for producing at least one electrical contact pad (1) on a receiving pad (2) of an electronic component (3), or for regenerating a set of electrical contact pads (1) made on pads of 'welcome
(2) d'un composant électronique (2) an electronic component
(3), ledit dispositif comprenant une conduite (5) destinée au passage d'alliage ou de métal liquide (3), said device comprising a pipe (5) intended for the passage of alloy or liquid metal
(4), ladite conduite (4), said conduct
(5) comprenant elle-même deux portions, une portion d'acheminement (5A) faisant partie d'une première pièce formant matrice (6), et une portion de moulage (5B) faisant partie d'une deuxième pièce formant moule (7), lesdites portions d'acheminement (5A) et de moulage (5B) étant séparées par un rétrécissement (5C), caractérisé en ce qu'il comprend un moyen de fixation (10) de la matrice
(6) relativement au moule (7) permettant que lesdits matrice (5) itself comprising two portions, a conveying portion (5A) forming part of a first die part (6), and a molding portion (5B) forming part of a second mold part (7) ), said conveying (5A) and molding (5B) portions being separated by a narrowing (5C), characterized in that it comprises a means of fixing (10) of the matrix (6) relative to the mold (7) allowing said matrix
(6) et moule(6) and mold
(7) soient montés juxtaposés de façon fixe pour former la conduite (5).(7) are mounted juxtaposed in a fixed manner to form the pipe (5).
-Dispositif selon la revendication 9 caractérisé en ce que la matrice (6) inclue une plaque comprenant au moins une zone poreuse qui forme la portion d'acheminement (5A).-Device according to claim 9 characterized in that the matrix (6) includes a plate comprising at least one porous zone which forms the conveying portion (5A).
- Dispositif selon la revendication 9 ou 10 caractérisé en ce qu'il comprend en amont de la matrice (6) et en considération du sens de passage de l'alliage ou du métal liquide (I), un réservoir (11) destiné à contenir l'alliage ou le métal liquide (4), ledit réservoir (11) présentant une ouverture inférieure (11 A) débouchant dans une cuve (12) communiquant avec ladite matrice (6), le passage de l'alliage ou du métal liquide (4) par l'ouverture inférieure étant contrôlé par un élément d'obturation mobile (9) du genre soupape susceptible de se déplacer parallèlement à la direction de passage de l'alliage ou du métal liquide, entre une position haute où il obture l'ouverture inférieure (11A) et au moins une position intermédiaire où il autorise le passage de l'alliage ou du métal liquide (4) vers la cuve (12) puis vers la matrice (6).- Device according to claim 9 or 10 characterized in that it comprises upstream of the matrix (6) and taking into consideration the direction of passage of the alloy or liquid metal (I), a reservoir (11) intended to contain the alloy or liquid metal (4), said reservoir (11) having a lower opening (11 A) opening into a tank (12) communicating with said matrix (6), the passage of the alloy or liquid metal ( 4) by the lower opening being controlled by a movable closing element (9) of the valve type capable of moving parallel to the direction of passage of the alloy or liquid metal, between a high position where it closes the lower opening (11A) and at least one intermediate position where it allows the passage of the alloy or liquid metal (4) towards the tank (12) then towards the matrix (6).
- Dispositif selon la revendication 9 ou 10 caractérisé en ce qu'il comprend un moyen pour dispenser un gaz (G) au niveau de la portion de moulage.- Device according to claim 9 or 10 characterized in that it comprises means for dispensing a gas (G) at the level of the molding portion.
- Dispositif selon la revendication 12 caractérisé en ce que le gaz (G) est inerte ou réducteur et comprend un composant comportant un groupe carboxyle.- Device according to claim 12 characterized in that the gas (G) is inert or reducing and comprises a component comprising a carboxyl group.
- Dispositif selon la revendication 13 caractérisé en ce que le composant présentant un groupe carboxyle est l'acide formique.
- Dispositif selon la revendication 13 ou 14 caractérisé en ce que le gaz- Device according to claim 13 characterized in that the component having a carboxyl group is formic acid. - Device according to claim 13 or 14 characterized in that the gas
(G) comprend de l'azote.(G) includes nitrogen.
- Dispositif selon l'une des revendications 13 à 15 caractérisé en ce que le moyen de dispense de gaz (G) comprend un moyen de diffusion et un moyen d'élaboration situé en amont dudit moyen de diffusion, ledit moyen de diffusion permettant l'imbibition du composant comportant un groupe carboxyle par un gaz primitif inerte ou réducteur.- Device according to one of claims 13 to 15 characterized in that the gas dispensing means (G) comprises a diffusion means and a preparation means located upstream of said diffusion means, said diffusion means allowing the imbibition of the component comprising a carboxyl group with a primitive inert or reducing gas.
- Dispositif selon l'une des revendications 9 à 16 caractérisé en ce que la conduite (5) est agencée de façon à être positionnée au dessus de la plage d'accueil (2).
- Device according to one of claims 9 to 16 characterized in that the pipe (5) is arranged so as to be positioned above the reception area (2).
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2004-7016840A KR20050006172A (en) | 2002-04-19 | 2003-04-18 | Method for the production of contact pads on a substrate and device for carrying out said method |
| EP03746848A EP1500131A2 (en) | 2002-04-19 | 2003-04-18 | Method for the production of contact pads on a substrate and device for carrying out said method |
| AU2003246848A AU2003246848A1 (en) | 2002-04-19 | 2003-04-18 | Method for the production of contact pads on a substrate and device for carrying out said method |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR02/04976 | 2002-04-19 | ||
| FR0204976A FR2838913A1 (en) | 2002-04-19 | 2002-04-19 | Production or regeneration of electrical contact pads on a substrate involves injecting molten metal through the routing part and molding part of a conduit onto a receiving pad |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2003090276A2 true WO2003090276A2 (en) | 2003-10-30 |
| WO2003090276A3 WO2003090276A3 (en) | 2004-04-01 |
Family
ID=28686225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/FR2003/001261 WO2003090276A2 (en) | 2002-04-19 | 2003-04-18 | Method for the production of contact pads on a substrate and device for carrying out said method |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP1500131A2 (en) |
| KR (1) | KR20050006172A (en) |
| CN (1) | CN1650414A (en) |
| AU (1) | AU2003246848A1 (en) |
| FR (1) | FR2838913A1 (en) |
| WO (1) | WO2003090276A2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103962677B (en) * | 2014-05-15 | 2016-01-13 | 苏州云远网络技术有限公司 | A kind of circuit board welder |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11274204A (en) * | 1998-03-26 | 1999-10-08 | Toshiba Corp | Formation of solder bump |
| FR2792861A1 (en) * | 1999-04-30 | 2000-11-03 | Eric Pilat | METHOD FOR PRODUCING WELDING PLOTS ON A SUBSTRATE AND GUIDE FOR IMPLEMENTING THE METHOD |
| US20010008250A1 (en) * | 1998-08-31 | 2001-07-19 | Hembree David R. | Method of forming a solder ball |
-
2002
- 2002-04-19 FR FR0204976A patent/FR2838913A1/en active Pending
-
2003
- 2003-04-18 KR KR10-2004-7016840A patent/KR20050006172A/en not_active Application Discontinuation
- 2003-04-18 AU AU2003246848A patent/AU2003246848A1/en not_active Abandoned
- 2003-04-18 EP EP03746848A patent/EP1500131A2/en not_active Withdrawn
- 2003-04-18 CN CNA038098008A patent/CN1650414A/en active Pending
- 2003-04-18 WO PCT/FR2003/001261 patent/WO2003090276A2/en not_active Application Discontinuation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11274204A (en) * | 1998-03-26 | 1999-10-08 | Toshiba Corp | Formation of solder bump |
| US20010008250A1 (en) * | 1998-08-31 | 2001-07-19 | Hembree David R. | Method of forming a solder ball |
| FR2792861A1 (en) * | 1999-04-30 | 2000-11-03 | Eric Pilat | METHOD FOR PRODUCING WELDING PLOTS ON A SUBSTRATE AND GUIDE FOR IMPLEMENTING THE METHOD |
Non-Patent Citations (1)
| Title |
|---|
| PATENT ABSTRACTS OF JAPAN vol. 2000, no. 01, 31 janvier 2000 (2000-01-31) -& JP 11 274204 A (TOSHIBA CORP), 8 octobre 1999 (1999-10-08) * |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2003090276A3 (en) | 2004-04-01 |
| EP1500131A2 (en) | 2005-01-26 |
| KR20050006172A (en) | 2005-01-15 |
| AU2003246848A1 (en) | 2003-11-03 |
| FR2838913A1 (en) | 2003-10-24 |
| CN1650414A (en) | 2005-08-03 |
| AU2003246848A8 (en) | 2003-11-03 |
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