CN1650414A - Method for the production of contact pads on a substrate and device for carrying out said method - Google Patents

Method for the production of contact pads on a substrate and device for carrying out said method Download PDF

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Publication number
CN1650414A
CN1650414A CNA038098008A CN03809800A CN1650414A CN 1650414 A CN1650414 A CN 1650414A CN A038098008 A CNA038098008 A CN A038098008A CN 03809800 A CN03809800 A CN 03809800A CN 1650414 A CN1650414 A CN 1650414A
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Prior art keywords
passage
metal
supporting region
molding part
equipment
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CNA038098008A
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Chinese (zh)
Inventor
埃里克·弗朗索瓦·派拉特
费代里克·吉恩·瓦龙
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Microtech应用技术公司
Applied Utech
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Applied Utech
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Publication of CN1650414A publication Critical patent/CN1650414A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05571—Disposition the external layer being disposed in a recess of the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05573—Single external layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1131—Manufacturing methods by local deposition of the material of the bump connector in liquid form
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    • H01—ELECTRIC ELEMENTS
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
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    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01033—Arsenic [As]
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    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder

Abstract

The invention relates to a method for producing at least one electric contact pad on a receiving pad (2) of an electronic component, wherein: a liquid alloy (4) is injected into at least one duct (5) which comprises a routing part (5A) and a molding part (5B) which are separated by a contraction, said duct (5) being disposed in such a way that the moulding part (5B) leads to the receiving pad (2); the moulding part (5B) and the receiving pad (2) are separated before full solidification of the metal or alloy (4) while the routing part (5A) and moulding part (5B) remain joined. The invention is characterized in that the routing part (5A) is part of a first part forming a die (6) and the moulding part (5B) is part of a second distinct part forming a mould (7), the die and mould being juxtaposed in order to form the duct (5). The invention is used to produce contact pads for electronic components.

Description

Be used on substrate, making technology that electrically contacts pad and the equipment of carrying out this technology
Technical field
The present invention relates on the surface of electronic component, make the technical field that is electrically connected pad (pad) (for example ball).
More specifically, the present invention relates to be used for supporting region (receiving zone) at electronic component goes up and makes at least one and electrically contact the technology of pad, in this technology, inject liquid alloy or metal at least one passage, described passage comprises two parts: the feeding part (feed portion) and the molding part (molding portion) that are separated by reducing (narrowing), described passage is set to make molding part in the supporting region upper shed.
The invention still further relates to and be used on the supporting region of electronic component making at least one and electrically contact the equipment of pad, described equipment comprises the passage that is used to transmit liquid alloy or metal, described passage self comprises two parts: feeding part, and it is the part of the first of formation matched moulds (die); And molding part, it is the part of the second portion of formation mold (mold), described feeding part is separated by reducing with molding part.
Background technology
Several technology that are used for integrated circuit (perhaps more generally, electronic component) is connected to substrate or bearing are arranged.For example have that lead connects, flat cable connects and utilize micro-sphere array (BGA or ball grid array) that the contact between circuit and the bearing is provided and being connected of carrying out.There is special benefit in the thought of utilizing ball grid array to interconnect: it provides high-performance, and does not almost have ghost effect.
Connecting the manufacturing of contact pad array and a main difficult problem of layout is exactly quantity and the duration thereof that how to minimize manufacturing operation, target is that the substrate of band contact pad was provided in the short as far as possible time, and does not sacrifice the metallurgy (metallurgical) and the geometry quality of this contact pad.
Number of registration is that the french patent application of FR-99 05544 discloses a kind of technology that is used for making ball on the conduction supporting region of electronic component, may further comprise the steps in this technology:
Inject the conduction liquid alloy in guide portion (guide), described guide portion is made up of two separable parts: mold and injection-molded matched moulds (injection-molding die), and this guide portion is shunk in separation place of described two parts;
When alloy is liquid state, separate two parts of described guide portion;
Before alloy solidifies, mold is separated with the substrate of element.
The document also discloses that a kind of equipment that is used to carry out above-mentioned technology.
Technology although it is so is gratifying generally, and often can satisfy above-mentioned challenge, but it needs a large amount of operations, it is essential that this makes that again complicated control system becomes, and need many movable toward each other parts, this makes wearing and tearing and the possibility of clinging increases, perhaps make make contact pad deterioration in accuracy.
The invention still further relates to a kind of a plurality of technologies that electrically contact pad of on the supporting region of electronic component, producing of being used to recover, in described technology, in at least one passage, inject liquid alloy or liquid metal, described passage comprises two parts: feeding part that is separated by reducing and molding part, described passage are provided so that molding part is in the upper shed of carrying pad.
At last, the present invention relates to a kind of equipment that is used to recover a plurality of contact pads of on the supporting region of electronic component, producing, described equipment comprises the passage that is used to transmit liquid alloy or metal, described passage self comprises two parts: feeding part, and it is the part of the first of formation matched moulds; And molding part, it is the part of the second portion of formation mold, described feeding part is separated by a reducing with molding part.
Sometimes, particularly for the ball depositing technics of prior art, for example use suction pipe (sucker) or screen (screen) to come or for example relate to silk screen printing (screenprinted) to the reflux technology of (reflow) of the solder cream on the element supporting region in the technology of deposit ball on the carrying pad of element, after technology finishes, some balls have the flaw that reduces its availability, for example deformity or too little perhaps even fully lacks.The known checkout facility that is useful on this defective of identification or lacks ball.After checking, be necessary usually by adding ball in the place that does not have ball one by one and remove too small ball and new ball that one by one use has expected characteristics is replaced these too small balls, thereby individually correct any defective that identifies.This is a processing mode consuming time, and essential a large amount of operation, thus the costliness of achieving and difficulty.
Summary of the invention
Therefore, an object of the present invention is to provide a kind of new technology, it is used for making at least one and electrically contacts pad on the supporting region of electronic component, what perhaps be used to recover to produce on the supporting region of electronic component a plurality ofly electrically contacts pad, described new technology provides a solution at the above multiple shortcoming of enumerating, and can make more quickly to electrically contact pad or recover a plurality of pads that electrically contact simplelyr and more economical.
Another object of the present invention provides a kind of new technology, it is used for making at least one and electrically contacts pad on the supporting region of electronic component, what perhaps be used to recover to produce on the supporting region of electronic component a plurality ofly electrically contacts pad, and the reliability of described new technology is improved.
Another object of the present invention provides a kind of new technology, it is used for making at least one and electrically contacts pad on the supporting region of electronic component, what perhaps be used to recover to produce on the supporting region of electronic component a plurality ofly electrically contacts pad, and described new technology can be made with the shape reproducibility of excellence and electrically contact pad.
Another object of the present invention provides a kind of equipment, it is used for making at least one and electrically contacts pad on the supporting region of electronic component, what perhaps be used to recover to produce on the supporting region of electronic component a plurality ofly electrically contacts pad, and described equipment has project organization and the improved motility and the robustness of simplification.
Another object of the present invention provides a kind of new equipment, it is used for making at least one with good reproducibility and uniformity ground on the supporting region of electronic component and electrically contacts pad, is used to perhaps to have that good reproducibility and uniformity ground recovers to produce on the supporting region of electronic component a plurality ofly electrically contacts pad.
Another object of the present invention provides a kind of new equipment, it is used for making at least one and electrically contacts pad on the supporting region of electronic component, what perhaps be used to recover to produce on the supporting region of electronic component a plurality ofly electrically contacts pad, and described new equipment can be made has the contact pad that improves quality.
Purpose of the present invention realizes by a kind of technology, this technology be used for make on the supporting region of electronic component at least one electrically contact pad or be used to recover produce on the supporting region at electronic component a plurality ofly electrically contact pad, in described technology, may further comprise the steps:
Inject liquid alloy or metal at least one passage, described passage comprises two parts: by feeding part and molding part that reducing separates, described passage is provided so that molding part in the supporting region upper shed,
Before the metal or alloy full solidification, described molding part is separated with supporting region, make feeding part and molding part keep engaging simultaneously,
This technology is characterised in that feeding part is a part that forms the first of matched moulds, and molding part is a part that forms the independently second portion of mold, and described matched moulds and mold are juxtaposed to form described passage.
Purpose of the present invention also realizes by a kind of equipment, this equipment be used for make on the supporting region of electronic component at least one electrically contact pad or be used to recover on the supporting region on the electronic component, produce a plurality ofly electrically contact pad, described equipment comprises the passage that is used for delivering liquid alloy or metal, described passage self comprises two parts: feeding part, and it is the part of the first of formation matched moulds; And molding part, it is the part of the second portion of formation mold, described feeding part is separated by reducing with molding part, described equipment is characterised in that, it comprises a device, this device is used for matched moulds is fixed with respect to mold, and making can be with described matched moulds and mold by fixing mode and put to form described passage.
Description of drawings
Read following explanation, and, will know other specific purposes of the present invention and advantage with reference to the appended accompanying drawing in the end of writing (only being used for nonrestrictive illustrating), wherein:
Fig. 1 to 3 schematically shows the different phase according to technology of the present invention, and according to some part of equipment of the present invention;
Fig. 4 shows structure and the corresponding details according to equipment of the present invention of processing step shown in Figure 1 with cross-sectional view with illustrating property; And
Fig. 5 schematically shows the embodiment according to the passage of equipment of the present invention.
Embodiment
Fig. 1 to 3 illustrates according to the different step in the technology of the present invention, and described technology is used for making at least one and electrically contacts pad 1 on the supporting region 2 of electronic component 3.
Electronic component 3 is made by any material known in those skilled in the art, and comprises conduction supporting region 2, and for example, this conduction supporting region 2 is made up of the metal line (track) of copper or gold usually.
In technology according to the present invention, inject liquid alloy or metal 4 at least one passage 5.
In technology according to the present invention in the available alloy, can be only by nonrestrictive explanation, enumerate two or more the alloy that has made up among element S n, Pb, Bi and the In.
Passage 5 comprises two part 5A and 5B, i.e. feeding part 5A and molding part 5B, and these two is separated by reducing 5C.
Fig. 1 to 4 shows a kind of technology and equipment that has only used 4 passages for purpose of explanation.In fact, the contact pad 1 as many passage 5 that will have Yu will make, this means has tens or a hundreds of passage in fact usually.
Can flow to supporting region 2 to force it by passage 5 by utilizing any known devices to apply injection pressure to the liquid alloy of forming solder material or metal 4, the injection direction that represents by arrow I in Fig. 1 injects described liquid solder material 4.
To form continuous passage 5, liquid alloy or metal 4 flow in the substantial one-way passage in injection direction I upper edge through described passage 5 feeding part 5A generally by molding part 5B continuity.
As shown in the figure, feeding part 5A and molding part 5B can be straight and have axial symmetry about axle X-X '.The another kind of possibility that does not break away from the scope of the invention is: feeding part 5A and molding part 5B symmetry axis separately depart from each other and do not overlap.In the variation shown in the figure, feeding part 5A and molding part 5B are substantially cylindrical, and feeding part 5A has constant cross section, its cross section less than molding part 5B (this cross section equally also is constant).Like this, because reducing 5C has appearred in the difference of the cross section between feeding part 5A and the molding part 5B.At this and hereinafter, described reducing 5C is meant when along the direction (that is, from molding part to feeding part) opposite with injection direction I restriction to the cross section of passage 5 during by passage 5.
Under the prerequisite that does not depart from the scope of the present invention, can conceive other embodiment of passage.Thereby the shape that can make feeding part 5A and molding part 5B and makes the tapering join mutually at its minimum cross-section end place all in the form of a truncated cone, thereby produces the neck that forms reducing 5C.Another kind may be, feeding part 5A is a column shape, and it enters the minimum cross-section end of Frusto-conical molding part 5B.Another kind may be, molding part 5B is basic hemisphere or recessed arch, and it has the opening that communicates with cylindrical or Frusto-conical feeding part 5A.These embodiment and the geometry of passage 5 are known in those skilled in the art, particularly according to document FR-99 05544.As shown in Figure 5, also have and a kind ofly may be: produce reducing 5C by making feeding part 5A and molding part 5B opposite side in-migration.Like this, because feeding part 5A and molding part 5B only need part to overlap to produce reducing 5C, so their cross sections separately can have virtually any size.In this embodiment, a feeding part 5A just can supply a plurality of molding part 5B.
According to the present invention, passage 5 is arranged so that molding part 5B is in supporting region 2 upper sheds.
Thereby above-mentioned steps has constituted the step of injecting liquid alloy or metal 4 on supporting region 2.At the end of this step, stop the injection pressure on liquid alloy or the metal 4.
In the demoulding (demolding) step subsequently, according to essential characteristic of the present invention, molding part 5B is separated with supporting region 2, and make feeding part 5A and molding part 5B keep engaging.
Its reason is that the applicant has been found that unexpectedly, can need not at first carry out feeding part 5A and molding part 5B separation steps in the liquid phase demoulding---in this unlike the prior art.This demoulding step makes shown in figure 2, can be in an operation but not obtain the initial contact pad 1A that separates with the surplus material 4 that retains in the feeding part 5A in two operations in the existing technology, and this took place before metal or alloy 4 full solidification that form described initial contact pad 1A.
The statement here " before the full solidification " meaning is, described material is in liquid state or is in minimum highly-malleable and can not be taken as solid-state state.More precisely, for the situation of alloy, the state of " before the full solidification " corresponding to: be arranged in the state outside " solid-state fully " zone that the solidus by the liquid-solid phasor of consideration alloy limits.
Can from start to finish come processing channel 5 by whole block material.Yet, preferably, construct passage 5 by two separated portions 6,7.Thereby feeding part 5A is a part that forms the first of matched moulds 6, and molding part 5B is the part of second portion that forms the separation of mold 7, and shown in Fig. 1,2 and 4, described matched moulds 6 and mold 7 are juxtaposed to form passage 5.Thereby, by with are the modes that process by single piece of material as passage 5, mold 7 is pressed matched moulds 6 to produce continuous passage 5.Yet, two separating parts (as mold 7 and matched moulds 6) and put inevitable contact interface 8 places and produce the gap in these two parts.Even this gap is minimum, also will produce air film, in fact this air film is useful for ejection phase shown in Figure 2, because it helps to separate in the material in material that will form initial contact pad 1A and the mold that remains in the feeding-passage 5A.And to put two separating parts 6 and 7 be passage 5 useful especially embodiment to form an integral body therefore.
Advantageously, with molding part 5B with before supporting region 2 separates, liquid alloy or metal 4 are moved along the direction (backflow direction, by arrow R represent) opposite with injection direction by feeding part 5A.This reflow step occurs between implantation step shown in Figure 1 and the demoulding step shown in Figure 2, make and to cooperate to interrupt the liquid alloy of existence in the passage 5 or " post (column) " of metal 4 at reducing 5C place mutually with this reducing, make thus and can accurately control, thereby be convenient to and optimize stripping operation to form initial contact pad 1A to the quantity of material of deposit on the carrying pad 2.
Preferably, by suction, by applying along the pressure (that is, partial vacuum) of the direction opposite, alloy 4 is moved along backflow direction R with injection direction to liquid alloy or metal 4.
Preferably, the poppet type barrier element (poppet valve close-off element) 9 of the upstream (along injection direction I) by will being positioned at passage 5 along the rightabout R of injection direction is shifted to and is made described barrier element 9 blocking-up produce suction to the position of passage 5 supply liquid alloys or metal 4.Therefore, barrier element 9 has two kinds of functions: its blocking-up also finishes implantation step thus to the supply of passage 5, and it is by the mobile generation partial vacuum of liquid alloy or metal 4, and this partial vacuum causes that liquid alloy or metal 4 obviously move by feeding part 5A along backflow direction R.
At the end of demoulding step, perhaps almost in this demoulding step, the liquid alloy or the metal that form initial contact pad 1A will find that it no longer is subjected to any other mechanism except the mechanism that is subjected to stopping the supporting region 2 on it.Thus, as shown in Figure 3, it will adopt the shape of almost spherical cap (cap), and this geometry has minimized surface tension.Form in the step of contact pad at this, liquid alloy or metal will cool off and full solidification.
Particularly advantageous is to separate molding part 5B and supporting region 2 in the cover layer (blanket) of inertia or reducing gas G.Preferably, before beginning, demoulding step shown in Figure 2 applies this gas G, so that can in the gaseous environment that stops the contact pad oxidation, carry out stripping operation.
Preferably, gas G comprises nitrogen.Yet gas G also can comprise any other inertia or the reducing gas of realizing stoping oxidative function.
Advantageously, gas G comprises the composition that contains carboxyl (COOH), because in gas G, exist this composition to bring following attribute: help to form contact pad 1, and make it possible to form ball 1 fast with good shape reproducibility by initial contact pad 1A for it.It is most preferred that the described composition that contains carboxyl is formic acid (H-COOH).Thereby gas G forms the reactive atmosphere with two kinds of functions (that is, anti-oxidation function and contact pad shaping function 1).
Be used on the carrying pad 2 of electronic component 3 making at least one equipment that electrically contacts pad 1 and comprise the passage 5 that is used for delivering liquid alloy or metal 4 according to of the present invention.As previously mentioned, described passage 5 self comprises two parts: the feeding part 5A that belongs to first or matched moulds part 6, and the molding part 5B that belongs to second portion or mould portion 7, this second portion or mould portion 7 preferably separate with first.By reducing 5C described feeding part 5A is separated with molding part 5B.
A substantive characteristics according to equipment of the present invention is, it comprises one with respect to the fixing device 10 of matched moulds 6 of mold 7, and making can be with described matched moulds 6 or mold 7 by fixed form and put to form passage 5.Assemble matched moulds 6 and mold 7 thus to form single entire combination part.
Advantageously, matched moulds 6 comprises the plate that contains at least one porous zone, and it forms feeding part 5A.Thus, except the zone that forms feeding part 5A, matched moulds 6 can be made by the porous material that its porosity is subjected to etching, japanning (lacquering) or any other technology inhibition that those skilled in the art were familiar with.
Mold 7 can be made by any technology known to those skilled in the art.Preferably, the material of selecting mold 7 not be so that can soak into liquid alloy or metal 4, and minimizes the surface tension between alloy and the mold.Particularly, this material can be selected from stainless steel, stone mill, PTFE and the processing silicon (treated silicon) of chemical deburring.
Advantageously, (when flowing during (or injection) direction I along liquid alloy or metal 4) comprises and designed to be used the storage pond 11 that holds liquid alloy or metal 4 equipment according to the present invention in the upstream of matched moulds 6, described storage pond 11 has the under shed 11A that feeds storage tank 12, and this storage tank 12 is connected with described matched moulds 6 again.Liquid alloy or metal 4 are controlled by poppet type activity barrier element 9 by the motion of under shed 11A, this barrier element 9 can move between last contact position (not shown) and at least one centre position (shown in Figure 4) along injection direction I or along opposite backflow direction R with paralleling with the flow direction of liquid alloy or metal 4, contact position place on described, barrier element 9 is closed under shed 11A, and at place, described centre position, barrier element 9 allows flow through storage tank 12 and then flowing on the matched moulds 6 of liquid alloys or metal 4.
Preferably, poppet type activity barrier element comprises shank (stem) 9A and the cross section head 9B greater than the cross section of shank 9A.Described shank vertically slides between the edge of opening 11A, has enough gaps with described edge and passes through to allow liquid alloy or metal 4.(by injection direction I) widens opening 11A in the downstream, to form the movable therein chamber portion (chamber) of head 9B.Matched moulds 6 is not revealed (sealing 13) with this chamber portion and is connected, to form storage tank 12.Thus, movable in liquid alloy that head 9B holds in storage tank 12 or the metal, and can be to the direction of this material indication inflow feeding part 6.When head 9B is kept lean against opening 11A circumferential lip (lip) when going up, stop to storage tank 12 supply liquid alloy or metals, this material follows head 9B simultaneously closely and is aspirated.
Thus, reference is above to the explanation of this technology, and this poppet type layout makes to carry out injects the step that stops and aspirating.
Advantageously, equipment according to the present invention comprises a kind of device (not shown) that is used for dispensing gas G around molding part 5B.This gas dispenser apparatus is used to utilize the gas G that is preferably inertia or reproducibility to fill atmosphere, to realize anti-oxidation function.Preferably, described gas G also comprises the composition that contains carboxyl (COOH), thereby has the characteristic that forms ball 1 with good reproducibility.Carboxylic composition is preferably formic acid (H-COOH).Gas G preferably comprises nitrogen.
Advantageously, gas G dispenser apparatus (not shown) comprises diffusion (diffusion) device (not shown) and the generation device (not shown) that is positioned at described disperser upstream, and described disperser makes carboxylic composition to be sucked by initial inertia or reducibility gas.Preferably, dispenser apparatus comprises the container that contains liquid formic acid as generation device, and this container will be set to contact with nitrogen, thereby has aforesaid character so that nitrogen sucks formic acid.
Advantageously, passage 5 is designed to be positioned at the top of supporting region 2.This technical characterictic and mold and matched moulds be integrally form or by two discrete parts form irrelevant fully.This specific arrangements is brought special good result, this beyond doubt because that exist in liquid alloy or the metal 4 and usually than the little any impurity of liquid alloy or metal 4 density at the effect lower edge backflow direction R of gravity to come-up, and can not accumulate on the contact pad surface 14 that contacts with supporting region 2, at 14 places, this contact pad surface, impurity can disturb the appropriate infiltration of contact pad 1A and to the good adhesion of supporting region 2.This layout prevents that also impurity from accumulating among molding part 5B and/or the feeding part 5A under the effect of gravity, impurity can stop up described part 5A, 5B in molding part 5B and/or feeding part 5A.
Therefore, the present invention relates to a kind of technology fully independently, it is used for making at least one and electrically contacts pad 1 on the supporting region 2 of electronic component, what perhaps be used to recover to produce on the supporting region 2 of electronic component 3 a plurality ofly electrically contacts pad 1, in this technology, inject liquid alloy or liquid metal 4 at least one passage 5, described passage 5 comprises two parts: by the feeding part 5A and the molding part 5B of reducing 5C separation, described passage 5 is provided so that molding part 5B is in supporting region 2 upper sheds, described technology also comprises a step, wherein before metal or alloy 4 full solidification, molding part 5B is separated with supporting region 2, make feeding part 5A and molding part 5B keep engaging simultaneously, described passage 5 is designed to be positioned at respect to gravity the top of supporting region 2.
The present invention also relates to a kind of equipment independently, it is used for making at least one and electrically contacts pad 1 on the supporting region 2 of electronic component 3, what perhaps be used to recover to produce on the supporting region on the electronic component 32 a plurality ofly electrically contacts pad 1, described equipment comprises the passage 5 that is used for delivering liquid alloy or metal 4, described passage 5 self comprises two parts: feeding part 5A, and it is the part of the first of formation matched moulds 6; And molding part 5B, it is the part of the second portion of formation mold 7, described feeding part 5A is separated by reducing 5C with molding part 5B, described equipment comprises and being used for matched moulds 6 with respect to mold 7 stationary devices 10, make can with fixed form and put described matched moulds 6 and mold 7 forming passage 5, and described passage 5 is designed to be positioned at respect to gravity the top of supporting region.
A plurality ofly electrically contact pad 1 according to what technology of the present invention and equipment can also be used to recover to produce on the supporting region 2 of electronic component 3.Here, contact pad reparation operation broadly represented in term " recovery ", especially,, relate to and add material correcting or to finish the size of contact pad if suitably, and/or to the shaping of contact pad.For this reason, carry out and the identical step of step performed according to the new contact pad of above-mentioned technology manufacturing the time, so that reparation has the ball grid array 1 of defective (especially on the geometry).Therefore, first recovering step is that passage 5 is pressed on the supporting region 2 to be located on the existing contact pad 1 that needs to correct.Subsequently liquid alloy or metal 4 are injected in the passage 5, and be full of in the molding part 5B not by existing band defective contact pad 1 occupy have living space.Thereby with the corrective of defective contact pad molded again (overmolding).
Therefore, since optimization step number (existence) with mold and matched moulds separation steps, and optimization cycle (because need not wait for before the demoulding that material solidify in molding part 5B), so according to equipment of the present invention and technology make can make or recover the BGA type apace electrically contact pad 1 array.
Industrial applicability
The present invention has commercial Application in electrically contacting the pad manufacturing.

Claims (17)

1, a kind of technology, it is used for supporting region (2) at electronic component go up to make at least one and electrically contacts pad (1), perhaps is used for recovering to go up produce a plurality of at the supporting region (2) of electronic component (3) and electrically contacts pad (1), and described technology may further comprise the steps:
Liquid alloy or metal (4) are injected at least one passage (5), this passage 5 comprises two parts: by the feeding part (5A) and the molding part (5B) of reducing (5C) separation, described passage (5) is provided so that described molding part (5B) is in described supporting region (2) upper shed
Before described metal or alloy (4) full solidification, described molding part (5B) is separated with described supporting region (2), makes described feeding part (5A) and molding part (5B) keep engaging simultaneously,
Described technology is characterised in that, described feeding part (5A) is a part that forms the first of matched moulds (6), and described molding part (5B) is the part of second portion that forms the separation of mold (7), and described matched moulds and mold are juxtaposed to form passage (5).
2, technology according to claim 1 is characterized in that: with described molding part (5B) with before described supporting region (2) separates, described liquid alloy or metal (4) are moved along the direction opposite with injection direction by described feeding part (5A).
3, technology according to claim 2 is characterized in that: described alloy (4) is aspirated and is moved.
4, technology according to claim 3, it is characterized in that: described suction is the poppet type barrier element (9) by the upstream that is positioned at described passage (5) by injection direction (I), shifts to described barrier element (9) prevention along the direction (R) opposite with injection direction (I) and produces to described passage (5) supply liquid alloy or the residing position of metal (4).
5, according to any one the described technology in the claim 1 to 4, it is characterized in that: described molding part (5B) is separated in the cover layer that occurs in inertia or reducing gas with described supporting region (2).
6, technology according to claim 5 is characterized in that: described gas comprises nitrogen.
7, technology according to claim 6 is characterized in that: described gas comprises carboxylic composition.
8, technology according to claim 7 is characterized in that: described carboxylic composition is a formic acid.
9, a kind of equipment, it is used for going up manufacturing at the supporting region of electronic component (3) (2), and at least one electrically contacts pad (1), perhaps being used for recovering supporting region (2) on electronic component (3) goes up produce a plurality of and electrically contacts pad (1), described equipment comprises the passage (5) that is used for delivering liquid alloy or metal (4), described passage (5) self comprises two parts: feeding part (5A), and it is the part of the first of formation matched moulds (6); And molding part (5B), it is the part of the second portion of formation mold (7), described feeding part (5A) is separated by reducing (5C) with molding part (5B), described equipment is characterised in that, it comprises and being used for matched moulds (6) with respect to mold (7) stationary device (10), make can by fixed form and put described matched moulds (6) and mold (7) to form described passage (5).
10, equipment according to claim 9 is characterized in that: described matched moulds (6) comprises the plate with at least one porous zone, and it forms feeding part (5A).
11, according to claim 9 or 10 described equipment, it is characterized in that: it is positioned at the storage pond (11) of the upstream of described matched moulds (6) when comprising along the flow direction of liquid alloy or metal (I), this storage pond (11) designed to be used and holds liquid alloy or metal (4), described storage pond (11) has following the opening (11A) of feeding storage tank (12), described storage tank (12) is connected with described matched moulds (6), liquid alloy or metal (4) are controlled by poppet type activity barrier element (9) through moving of described under shed, this barrier element (9) can move between last position and at least one centre position with paralleling with the flow direction of liquid alloy or metal, position on described, described barrier element (9) is closed described under shed (11A), and at place, described centre position, described barrier element (9) allows flow through described storage tank (12) and then flowing on the described matched moulds (6) of liquid alloy or metal (4).
12, according to claim 9 or 10 described equipment, it is characterized in that: it comprises the device that is used for dispensing gas around described molding part.
13, equipment according to claim 12 is characterized in that: described gas is inertia or reproducibility, and comprises carboxylic composition.
14, equipment according to claim 13 is characterized in that: described carboxylic composition is a formic acid.
15, according to claim 13 or 14 described equipment, it is characterized in that: described gas comprises nitrogen.
16, according to any one the described equipment in the claim 13 to 15, it is characterized in that: described gas dispenser apparatus comprises disperser and is positioned at the generation device of described disperser upstream that described disperser makes described carboxylic composition to be sucked by initial inertia or reducing gas.
17, according to any one the described equipment in the claim 9 to 16, it is characterized in that: described passage (5) is designed to be positioned at the top of supporting region (2).
CNA038098008A 2002-04-19 2003-04-18 Method for the production of contact pads on a substrate and device for carrying out said method Pending CN1650414A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR02/04976 2002-04-19
FR0204976A FR2838913A1 (en) 2002-04-19 2002-04-19 Production or regeneration of electrical contact pads on a substrate involves injecting molten metal through the routing part and molding part of a conduit onto a receiving pad

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Publication Number Publication Date
CN1650414A true CN1650414A (en) 2005-08-03

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EP (1) EP1500131A2 (en)
KR (1) KR20050006172A (en)
CN (1) CN1650414A (en)
AU (1) AU2003246848A1 (en)
FR (1) FR2838913A1 (en)
WO (1) WO2003090276A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103962677A (en) * 2014-05-15 2014-08-06 苏州云远网络技术有限公司 Circuit board one-time welding device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11274204A (en) * 1998-03-26 1999-10-08 Toshiba Corp Formation of solder bump
US6189772B1 (en) * 1998-08-31 2001-02-20 Micron Technology, Inc. Method of forming a solder ball
FR2792861B1 (en) * 1999-04-30 2001-07-06 Eric Pilat PROCESS FOR PRODUCING WELDING PLOTS ON A SUBSTRATE AND GUIDE FOR IMPLEMENTING THE PROCESS

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103962677A (en) * 2014-05-15 2014-08-06 苏州云远网络技术有限公司 Circuit board one-time welding device
CN103962677B (en) * 2014-05-15 2016-01-13 苏州云远网络技术有限公司 A kind of circuit board welder

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Publication number Publication date
WO2003090276A3 (en) 2004-04-01
EP1500131A2 (en) 2005-01-26
KR20050006172A (en) 2005-01-15
WO2003090276A2 (en) 2003-10-30
AU2003246848A1 (en) 2003-11-03
FR2838913A1 (en) 2003-10-24
AU2003246848A8 (en) 2003-11-03

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