WO2003077620A1 - Method of manufacturing thin functional copper foils from a continuous copper foil and the manufactured product - Google Patents
Method of manufacturing thin functional copper foils from a continuous copper foil and the manufactured product Download PDFInfo
- Publication number
- WO2003077620A1 WO2003077620A1 PCT/FI2003/000169 FI0300169W WO03077620A1 WO 2003077620 A1 WO2003077620 A1 WO 2003077620A1 FI 0300169 W FI0300169 W FI 0300169W WO 03077620 A1 WO03077620 A1 WO 03077620A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- copper
- functional
- strip
- foils
- foil
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/178—Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- ing And Chemical Polishing (AREA)
- Details Of Aerials (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2003208379A AU2003208379A1 (en) | 2002-03-08 | 2003-03-06 | Method of manufacturing thin functional copper foils from a continuous copper foil and the manufactured product |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20020445 | 2002-03-08 | ||
FI20020445A FI20020445A (en) | 2002-03-08 | 2002-03-08 | Process for making thin functional copper films of a uniform copper film and with the process produced product |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2003077620A1 true WO2003077620A1 (en) | 2003-09-18 |
Family
ID=8563469
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FI2003/000169 WO2003077620A1 (en) | 2002-03-08 | 2003-03-06 | Method of manufacturing thin functional copper foils from a continuous copper foil and the manufactured product |
Country Status (4)
Country | Link |
---|---|
AU (1) | AU2003208379A1 (en) |
FI (1) | FI20020445A (en) |
TW (1) | TW200304403A (en) |
WO (1) | WO2003077620A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007027838A1 (en) * | 2007-06-13 | 2008-12-18 | Leonhard Kurz Gmbh & Co. Kg | Multilayer film element |
US9006082B2 (en) | 2013-03-15 | 2015-04-14 | Illinois Tool Works Inc. | Film transferable logic circuit, and methods for providing film transferable logic circuit |
US10178778B2 (en) | 2013-03-15 | 2019-01-08 | Illinois Tool Works Inc. | Transferable film including readable conductive image, and methods for providing transferable film |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3978375A (en) * | 1973-04-20 | 1976-08-31 | Matsushita Electric Industrial Co., Ltd. | Wiring unit |
US4846922A (en) * | 1986-09-29 | 1989-07-11 | Monarch Marking Systems, Inc. | Method of making deactivatable tags |
EP0992940A2 (en) * | 1998-10-02 | 2000-04-12 | Shinko Electric Industries Co. Ltd. | Process for manufacturing IC card |
-
2002
- 2002-03-08 FI FI20020445A patent/FI20020445A/en not_active IP Right Cessation
-
2003
- 2003-03-03 TW TW092104378A patent/TW200304403A/en unknown
- 2003-03-06 AU AU2003208379A patent/AU2003208379A1/en not_active Abandoned
- 2003-03-06 WO PCT/FI2003/000169 patent/WO2003077620A1/en not_active Application Discontinuation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3978375A (en) * | 1973-04-20 | 1976-08-31 | Matsushita Electric Industrial Co., Ltd. | Wiring unit |
US4846922A (en) * | 1986-09-29 | 1989-07-11 | Monarch Marking Systems, Inc. | Method of making deactivatable tags |
EP0992940A2 (en) * | 1998-10-02 | 2000-04-12 | Shinko Electric Industries Co. Ltd. | Process for manufacturing IC card |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007027838A1 (en) * | 2007-06-13 | 2008-12-18 | Leonhard Kurz Gmbh & Co. Kg | Multilayer film element |
US8350768B2 (en) | 2007-06-13 | 2013-01-08 | Leonhard Kurz Stiftung & Co. Kg | Multi-layer film element |
DE102007027838B4 (en) * | 2007-06-13 | 2021-01-14 | Leonhard Kurz Gmbh & Co. Kg | Multi-layer film element |
US9006082B2 (en) | 2013-03-15 | 2015-04-14 | Illinois Tool Works Inc. | Film transferable logic circuit, and methods for providing film transferable logic circuit |
US10178778B2 (en) | 2013-03-15 | 2019-01-08 | Illinois Tool Works Inc. | Transferable film including readable conductive image, and methods for providing transferable film |
Also Published As
Publication number | Publication date |
---|---|
FI20020445A0 (en) | 2002-03-08 |
TW200304403A (en) | 2003-10-01 |
AU2003208379A1 (en) | 2003-09-22 |
FI20020445A (en) | 2003-09-09 |
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