FI20020445A - Process for making thin functional copper films of a uniform copper film and with the process produced product - Google Patents

Process for making thin functional copper films of a uniform copper film and with the process produced product

Info

Publication number
FI20020445A
FI20020445A FI20020445A FI20020445A FI20020445A FI 20020445 A FI20020445 A FI 20020445A FI 20020445 A FI20020445 A FI 20020445A FI 20020445 A FI20020445 A FI 20020445A FI 20020445 A FI20020445 A FI 20020445A
Authority
FI
Finland
Prior art keywords
produced product
making thin
thin functional
uniform
films
Prior art date
Application number
FI20020445A
Other languages
Finnish (fi)
Swedish (sv)
Other versions
FI20020445A0 (en
Inventor
Pekka Taskinen
Olli Hyvaerinen
Original Assignee
Outokumpu Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Outokumpu Oy filed Critical Outokumpu Oy
Priority to FI20020445A priority Critical patent/FI20020445A/en
Publication of FI20020445A0 publication Critical patent/FI20020445A0/en
Priority to TW092104378A priority patent/TW200304403A/en
Priority to AU2003208379A priority patent/AU2003208379A1/en
Priority to PCT/FI2003/000169 priority patent/WO2003077620A1/en
Publication of FI20020445A publication Critical patent/FI20020445A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/178—Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
FI20020445A 2002-03-08 2002-03-08 Process for making thin functional copper films of a uniform copper film and with the process produced product FI20020445A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FI20020445A FI20020445A (en) 2002-03-08 2002-03-08 Process for making thin functional copper films of a uniform copper film and with the process produced product
TW092104378A TW200304403A (en) 2002-03-08 2003-03-03 Method for manufacturing thin functional copper or copper alloy foils from copper or copper alloy foil strip and manufactured product
AU2003208379A AU2003208379A1 (en) 2002-03-08 2003-03-06 Method of manufacturing thin functional copper foils from a continuous copper foil and the manufactured product
PCT/FI2003/000169 WO2003077620A1 (en) 2002-03-08 2003-03-06 Method of manufacturing thin functional copper foils from a continuous copper foil and the manufactured product

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20020445A FI20020445A (en) 2002-03-08 2002-03-08 Process for making thin functional copper films of a uniform copper film and with the process produced product

Publications (2)

Publication Number Publication Date
FI20020445A0 FI20020445A0 (en) 2002-03-08
FI20020445A true FI20020445A (en) 2003-09-09

Family

ID=8563469

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20020445A FI20020445A (en) 2002-03-08 2002-03-08 Process for making thin functional copper films of a uniform copper film and with the process produced product

Country Status (4)

Country Link
AU (1) AU2003208379A1 (en)
FI (1) FI20020445A (en)
TW (1) TW200304403A (en)
WO (1) WO2003077620A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007027838B4 (en) 2007-06-13 2021-01-14 Leonhard Kurz Gmbh & Co. Kg Multi-layer film element
US10178778B2 (en) 2013-03-15 2019-01-08 Illinois Tool Works Inc. Transferable film including readable conductive image, and methods for providing transferable film
US9006082B2 (en) 2013-03-15 2015-04-14 Illinois Tool Works Inc. Film transferable logic circuit, and methods for providing film transferable logic circuit

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3978375A (en) * 1973-04-20 1976-08-31 Matsushita Electric Industrial Co., Ltd. Wiring unit
US4846922A (en) * 1986-09-29 1989-07-11 Monarch Marking Systems, Inc. Method of making deactivatable tags
US6630370B2 (en) * 1998-10-02 2003-10-07 Shinko Electric Industries Co., Ltd. Process for manufacturing IC card

Also Published As

Publication number Publication date
AU2003208379A1 (en) 2003-09-22
FI20020445A0 (en) 2002-03-08
TW200304403A (en) 2003-10-01
WO2003077620A1 (en) 2003-09-18

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Legal Events

Date Code Title Description
MA Patent expired