WO2003063241A8 - Method and apparatus for high heat flux heat transfer - Google Patents

Method and apparatus for high heat flux heat transfer

Info

Publication number
WO2003063241A8
WO2003063241A8 PCT/US2003/001894 US0301894W WO03063241A8 WO 2003063241 A8 WO2003063241 A8 WO 2003063241A8 US 0301894 W US0301894 W US 0301894W WO 03063241 A8 WO03063241 A8 WO 03063241A8
Authority
WO
WIPO (PCT)
Prior art keywords
heat
coolant
sprayed onto
transferred
absorbed
Prior art date
Application number
PCT/US2003/001894
Other languages
French (fr)
Other versions
WO2003063241A2 (en
WO2003063241A3 (en
Inventor
Daniel P Rini
H Randolph Anderson
Jayanta Sankar Kapat
Louis Chow
Original Assignee
Rini Technologies Inc
Daniel P Rini
H Randolph Anderson
Jayanta Sankar Kapat
Louis Chow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/115,510 external-priority patent/US6571569B1/en
Priority claimed from US10/342,669 external-priority patent/US20030155434A1/en
Application filed by Rini Technologies Inc, Daniel P Rini, H Randolph Anderson, Jayanta Sankar Kapat, Louis Chow filed Critical Rini Technologies Inc
Priority to AU2003216085A priority Critical patent/AU2003216085A1/en
Publication of WO2003063241A2 publication Critical patent/WO2003063241A2/en
Publication of WO2003063241A3 publication Critical patent/WO2003063241A3/en
Publication of WO2003063241A8 publication Critical patent/WO2003063241A8/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735—Jet impingement
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B1/00—Compression machines, plants or systems with non-reversible cycle
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B19/00—Machines, plants or systems, using evaporation of a refrigerant but without recovery of the vapour
    • F25B19/02—Machines, plants or systems, using evaporation of a refrigerant but without recovery of the vapour using fluid jet, e.g. of steam
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/02—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by influencing fluid boundary
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/0012—Apparatus for achieving spraying before discharge from the apparatus
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2339/00—Details of evaporators; Details of condensers
    • F25B2339/02—Details of evaporators
    • F25B2339/021—Evaporators in which refrigerant is sprayed on a surface to be cooled
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2341/00—Details of ejectors not being used as compression device; Details of flow restrictors or expansion valves
    • F25B2341/001—Ejectors not being used as compression device
    • F25B2341/0014—Ejectors with a high pressure hot primary flow from a compressor discharge
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B39/00—Evaporators; Condensers
    • F25B39/02—Evaporators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

The subject invention pertains to a method and apparatus for high heat flux heat transfer. The subject invention can be utilized to transfer heat from a heat source to a coolant such that the transferred heat can be effectively transported to another location. Examples of heat sources from which heat can be transferred from include, for example, fluids and surfaces. The coolant to which the heat is transferred can be sprayed onto a surface which is in thermal contact with the heat source, such that the coolant sprayed onto the surface in thermal contact with the heat absorbs heat from the surface and carries the absorbed heat away as the coolant leaves the surface. The surface can be, for example, the surface of an interface plate in thermal contact with the heat source or a surface integral with the heat source. The coolant sprayed onto the surface can initially be a liquid and remain a liquid after absorbing the heat, or can in part or in whole be converted to a gas or vapor after absorbing the heat. The coolant can be sprayed onto the surface, for example, as a stream of liquid after being atomized, or in other ways which allow the coolant to contact the surface and absorb heat. Once the heat is absorbed by the coolant, the coolant can be transported to another location so as to transport the absorbed heat as well.
PCT/US2003/001894 2002-01-22 2003-01-22 Method and apparatus for high heat flux heat transfer WO2003063241A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003216085A AU2003216085A1 (en) 2002-01-22 2003-01-22 Method and apparatus for high heat flux heat transfer

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
US35085702P 2002-01-22 2002-01-22
US35087102P 2002-01-22 2002-01-22
US35068702P 2002-01-22 2002-01-22
US60/350,687 2002-01-22
US60/350,871 2002-01-22
US60/350,857 2002-01-22
US10/115,510 2002-04-02
US10/115,510 US6571569B1 (en) 2001-04-26 2002-04-02 Method and apparatus for high heat flux heat transfer
US39824402P 2002-07-24 2002-07-24
US60/398,244 2002-07-24
US10/342,669 2003-01-14
US10/342,669 US20030155434A1 (en) 2002-02-01 2003-01-14 Spray nozzle apparatus and method of use

Publications (3)

Publication Number Publication Date
WO2003063241A2 WO2003063241A2 (en) 2003-07-31
WO2003063241A3 WO2003063241A3 (en) 2004-04-01
WO2003063241A8 true WO2003063241A8 (en) 2004-05-27

Family

ID=32046163

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/001894 WO2003063241A2 (en) 2002-01-22 2003-01-22 Method and apparatus for high heat flux heat transfer

Country Status (2)

Country Link
AU (1) AU2003216085A1 (en)
WO (1) WO2003063241A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102663192B (en) * 2012-04-12 2015-04-15 铁道第三勘察设计院集团有限公司 Method for automatically designing and optimizing railway vertical profile
US10638648B2 (en) 2016-04-28 2020-04-28 Ge Energy Power Conversion Technology Ltd. Cooling system with pressure regulation
US9894815B1 (en) 2016-08-08 2018-02-13 General Electric Company Heat removal assembly for use with a power converter

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1356114A (en) * 1970-09-03 1974-06-12 Lage J R Method of and apparatus for heat transfer
JPS62119947A (en) * 1985-11-19 1987-06-01 Fujitsu Ltd Cooling unit for integrated circuit element
US5353865A (en) * 1992-03-30 1994-10-11 General Electric Company Enhanced impingement cooled components
EP0642698B1 (en) * 1992-05-25 1996-09-18 FICHTEL & SACHS AG Fluid-cooled power transistor arrangement

Also Published As

Publication number Publication date
AU2003216085A1 (en) 2003-09-02
WO2003063241A2 (en) 2003-07-31
WO2003063241A3 (en) 2004-04-01

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