AU2003216085A1 - Method and apparatus for high heat flux heat transfer - Google Patents

Method and apparatus for high heat flux heat transfer

Info

Publication number
AU2003216085A1
AU2003216085A1 AU2003216085A AU2003216085A AU2003216085A1 AU 2003216085 A1 AU2003216085 A1 AU 2003216085A1 AU 2003216085 A AU2003216085 A AU 2003216085A AU 2003216085 A AU2003216085 A AU 2003216085A AU 2003216085 A1 AU2003216085 A1 AU 2003216085A1
Authority
AU
Australia
Prior art keywords
heat transfer
high heat
heat flux
flux
transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003216085A
Inventor
H. Randolph Anderson
Louis Chow
Jayanta Sankar Kapat
Daniel P. Rini
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RINI TECHNOLOGIES Inc
Original Assignee
RINI TECHNOLOGIES Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/115,510 external-priority patent/US6571569B1/en
Priority claimed from US10/342,669 external-priority patent/US20030155434A1/en
Application filed by RINI TECHNOLOGIES Inc filed Critical RINI TECHNOLOGIES Inc
Publication of AU2003216085A1 publication Critical patent/AU2003216085A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735—Jet impingement
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B1/00—Compression machines, plants or systems with non-reversible cycle
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B19/00—Machines, plants or systems, using evaporation of a refrigerant but without recovery of the vapour
    • F25B19/02—Machines, plants or systems, using evaporation of a refrigerant but without recovery of the vapour using fluid jet, e.g. of steam
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/02—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by influencing fluid boundary
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/0012—Apparatus for achieving spraying before discharge from the apparatus
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2339/00—Details of evaporators; Details of condensers
    • F25B2339/02—Details of evaporators
    • F25B2339/021—Evaporators in which refrigerant is sprayed on a surface to be cooled
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2341/00—Details of ejectors not being used as compression device; Details of flow restrictors or expansion valves
    • F25B2341/001—Ejectors not being used as compression device
    • F25B2341/0014—Ejectors with a high pressure hot primary flow from a compressor discharge
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B39/00—Evaporators; Condensers
    • F25B39/02—Evaporators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
AU2003216085A 2002-01-22 2003-01-22 Method and apparatus for high heat flux heat transfer Abandoned AU2003216085A1 (en)

Applications Claiming Priority (13)

Application Number Priority Date Filing Date Title
US35085702P 2002-01-22 2002-01-22
US35087102P 2002-01-22 2002-01-22
US35068702P 2002-01-22 2002-01-22
US60/350,871 2002-01-22
US60/350,857 2002-01-22
US60/350,687 2002-01-22
US10/115,510 US6571569B1 (en) 2001-04-26 2002-04-02 Method and apparatus for high heat flux heat transfer
US10/115,510 2002-04-02
US39824402P 2002-07-24 2002-07-24
US60/398,244 2002-07-24
US10/342,669 2003-01-14
US10/342,669 US20030155434A1 (en) 2002-02-01 2003-01-14 Spray nozzle apparatus and method of use
PCT/US2003/001894 WO2003063241A2 (en) 2002-01-22 2003-01-22 Method and apparatus for high heat flux heat transfer

Publications (1)

Publication Number Publication Date
AU2003216085A1 true AU2003216085A1 (en) 2003-09-02

Family

ID=32046163

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003216085A Abandoned AU2003216085A1 (en) 2002-01-22 2003-01-22 Method and apparatus for high heat flux heat transfer

Country Status (2)

Country Link
AU (1) AU2003216085A1 (en)
WO (1) WO2003063241A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102663192B (en) * 2012-04-12 2015-04-15 铁道第三勘察设计院集团有限公司 Method for automatically designing and optimizing railway vertical profile
US10638648B2 (en) 2016-04-28 2020-04-28 Ge Energy Power Conversion Technology Ltd. Cooling system with pressure regulation
US9894815B1 (en) 2016-08-08 2018-02-13 General Electric Company Heat removal assembly for use with a power converter

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1356114A (en) * 1970-09-03 1974-06-12 Lage J R Method of and apparatus for heat transfer
JPS62119947A (en) * 1985-11-19 1987-06-01 Fujitsu Ltd Cooling unit for integrated circuit element
US5353865A (en) * 1992-03-30 1994-10-11 General Electric Company Enhanced impingement cooled components
WO1993024983A1 (en) * 1992-05-25 1993-12-09 Mannesmann Ag Electric machine with semiconductor valves

Also Published As

Publication number Publication date
WO2003063241A8 (en) 2004-05-27
WO2003063241A2 (en) 2003-07-31
WO2003063241A3 (en) 2004-04-01

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase