WO2003061004A3 - Method for coding and authenticating semiconductor circuits - Google Patents
Method for coding and authenticating semiconductor circuits Download PDFInfo
- Publication number
- WO2003061004A3 WO2003061004A3 PCT/DE2003/000080 DE0300080W WO03061004A3 WO 2003061004 A3 WO2003061004 A3 WO 2003061004A3 DE 0300080 W DE0300080 W DE 0300080W WO 03061004 A3 WO03061004 A3 WO 03061004A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- authenticating
- coding
- semiconductor circuits
- chip
- measurement
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
- G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
- G06K19/07372—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/57—Protection from inspection, reverse engineering or tampering
- H01L23/576—Protection from inspection, reverse engineering or tampering using active circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
- H01L2223/5444—Marks applied to semiconductor devices or parts containing identification or tracking information for electrical read out
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Computer Security & Cryptography (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Mathematical Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Crystallography & Structural Chemistry (AREA)
- Semiconductor Integrated Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
According to the invention, an electrical characteristic of a material layer (3) or layer-type material structure is measured at various points provided with connection contacts (5, 6). A mean value of the measurement, taken from a base set of IC chips, is subtracted from a respective value, and a digital word for identifying the chip in question is formed on the basis of the result thus obtained, for each IC chip. The measurement can be carried out by means of a cross-correlation, the measuring regions crossing over each other.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2002101645 DE10201645B4 (en) | 2002-01-17 | 2002-01-17 | Method for coding and authenticating semiconductor circuits |
DE10201645.3 | 2002-01-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2003061004A2 WO2003061004A2 (en) | 2003-07-24 |
WO2003061004A3 true WO2003061004A3 (en) | 2004-07-29 |
Family
ID=7712397
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2003/000080 WO2003061004A2 (en) | 2002-01-17 | 2003-01-13 | Method for coding and authenticating semiconductor circuits |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE10201645B4 (en) |
TW (1) | TW200302353A (en) |
WO (1) | WO2003061004A2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7023363B1 (en) * | 2005-02-17 | 2006-04-04 | Saiful Bahari Saidan | Position encoding using impedance comparison |
CN101772775B (en) | 2007-08-02 | 2013-07-10 | Nxp股份有限公司 | Tamper-resistant semiconductor device and methods of manufacturing thereof |
EP2665094A1 (en) | 2012-05-15 | 2013-11-20 | Nxp B.V. | Tamper resistant IC |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6460110A (en) * | 1987-08-31 | 1989-03-07 | Toshiba Corp | Code identifying circuit |
EP0404985A1 (en) * | 1989-06-29 | 1991-01-02 | Siemens Aktiengesellschaft | Identification circuit for integrated semiconductor circuits |
EP0893705A2 (en) * | 1997-07-04 | 1999-01-27 | Integrated Detector & Electronics AS | Method and system for reading data signal emitted by an active pixel in a sensor |
US5881155A (en) * | 1996-04-01 | 1999-03-09 | Schlumberger Industries | Security device for a semiconductor chip |
JP2000068833A (en) * | 1998-08-21 | 2000-03-03 | Meidensha Corp | Digital filter system |
US6047068A (en) * | 1995-09-19 | 2000-04-04 | Schlumberger Industries | Method for determining an encryption key associated with an integrated circuit |
US6161213A (en) * | 1999-02-17 | 2000-12-12 | Icid, Llc | System for providing an integrated circuit with a unique identification |
DE10025213A1 (en) * | 1999-06-24 | 2001-01-18 | Mitsubishi Electric Corp | Semiconductor device for protecting access e.g. to mobile telephone had circuit for encoding dispersion of polycrystalline substance in semiconductor element |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3736882C2 (en) * | 1987-10-30 | 1997-04-30 | Gao Ges Automation Org | Method for checking the authenticity of a data carrier with an integrated circuit |
US6459095B1 (en) * | 1999-03-29 | 2002-10-01 | Hewlett-Packard Company | Chemically synthesized and assembled electronics devices |
-
2002
- 2002-01-17 DE DE2002101645 patent/DE10201645B4/en not_active Expired - Fee Related
- 2002-12-20 TW TW91136809A patent/TW200302353A/en unknown
-
2003
- 2003-01-13 WO PCT/DE2003/000080 patent/WO2003061004A2/en not_active Application Discontinuation
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6460110A (en) * | 1987-08-31 | 1989-03-07 | Toshiba Corp | Code identifying circuit |
EP0404985A1 (en) * | 1989-06-29 | 1991-01-02 | Siemens Aktiengesellschaft | Identification circuit for integrated semiconductor circuits |
US6047068A (en) * | 1995-09-19 | 2000-04-04 | Schlumberger Industries | Method for determining an encryption key associated with an integrated circuit |
US5881155A (en) * | 1996-04-01 | 1999-03-09 | Schlumberger Industries | Security device for a semiconductor chip |
EP0893705A2 (en) * | 1997-07-04 | 1999-01-27 | Integrated Detector & Electronics AS | Method and system for reading data signal emitted by an active pixel in a sensor |
JP2000068833A (en) * | 1998-08-21 | 2000-03-03 | Meidensha Corp | Digital filter system |
US6161213A (en) * | 1999-02-17 | 2000-12-12 | Icid, Llc | System for providing an integrated circuit with a unique identification |
DE10025213A1 (en) * | 1999-06-24 | 2001-01-18 | Mitsubishi Electric Corp | Semiconductor device for protecting access e.g. to mobile telephone had circuit for encoding dispersion of polycrystalline substance in semiconductor element |
Non-Patent Citations (3)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 013, no. 270 (E - 776) 21 June 1989 (1989-06-21) * |
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 06 22 September 2000 (2000-09-22) * |
WIJARANAKULA W ET AL: "A FORMATION OF CRYSTAL DEFECTS IN CARBON-DOPED CZOCHRALSKI-GROWN SILICON AFTER A THREE-STEP INTERNAL GETTERING ANNEAL", JOURNAL OF THE ELECTROCHEMICAL SOCIETY, ELECTROCHEMICAL SOCIETY. MANCHESTER, NEW HAMPSHIRE, US, VOL. 138, NR. 7, PAGE(S) 2153-2159, ISSN: 0013-4651, XP000293484 * |
Also Published As
Publication number | Publication date |
---|---|
WO2003061004A2 (en) | 2003-07-24 |
DE10201645B4 (en) | 2007-04-26 |
DE10201645A1 (en) | 2003-08-07 |
TW200302353A (en) | 2003-08-01 |
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