WO2003052762A1 - Apparatus and method for non-destructive data storage and retrieval - Google Patents
Apparatus and method for non-destructive data storage and retrieval Download PDFInfo
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- WO2003052762A1 WO2003052762A1 PCT/NO2002/000476 NO0200476W WO03052762A1 WO 2003052762 A1 WO2003052762 A1 WO 2003052762A1 NO 0200476 W NO0200476 W NO 0200476W WO 03052762 A1 WO03052762 A1 WO 03052762A1
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- Prior art keywords
- electrodes
- ferroelectric
- subcells
- twin
- memory cells
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- 238000013500 data storage Methods 0.000 title claims abstract description 12
- 230000001066 destructive effect Effects 0.000 title claims abstract description 12
- 238000000034 method Methods 0.000 title claims description 32
- 230000015654 memory Effects 0.000 claims abstract description 104
- 239000000463 material Substances 0.000 claims abstract description 57
- 230000004044 response Effects 0.000 claims abstract description 11
- 230000010287 polarization Effects 0.000 claims description 20
- 229920000642 polymer Polymers 0.000 claims description 16
- 230000033001 locomotion Effects 0.000 claims description 10
- 238000001514 detection method Methods 0.000 claims description 9
- 230000000694 effects Effects 0.000 claims description 9
- 230000005684 electric field Effects 0.000 claims description 9
- 230000009977 dual effect Effects 0.000 claims description 4
- 238000010292 electrical insulation Methods 0.000 claims description 2
- 238000012935 Averaging Methods 0.000 claims 1
- 230000001427 coherent effect Effects 0.000 claims 1
- 229920001971 elastomer Polymers 0.000 claims 1
- 239000000806 elastomer Substances 0.000 claims 1
- 210000004027 cell Anatomy 0.000 description 70
- 239000011159 matrix material Substances 0.000 description 26
- 230000005284 excitation Effects 0.000 description 9
- 230000008901 benefit Effects 0.000 description 7
- 230000004913 activation Effects 0.000 description 5
- 230000001419 dependent effect Effects 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- -1 poly(vinylidene difluoride- trifluoroethylene) Polymers 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000010339 dilation Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 2
- 241001082241 Lythrum hyssopifolia Species 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 229920002396 Polyurea Polymers 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
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- 238000010438 heat treatment Methods 0.000 description 1
- 125000005462 imide group Chemical group 0.000 description 1
- 230000036039 immunity Effects 0.000 description 1
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- 238000001459 lithography Methods 0.000 description 1
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- 230000021715 photosynthesis, light harvesting Effects 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
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Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/22—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
Definitions
- the present invention concerns a data storage apparatus with means for storing and retrieving data in respective write and read operations, wherein data are stored in a non-volatile manner as polarization states in ferroelectric or electret memory cells, wherein the memory cells are provided in a passive matrix-addressable array, wherein the memory cells can be individually addressed electrically for write and read operations, the addressing of the memory cell taking place via crossing electrodes of a respectively first and second electrode sets, wherein each electrode set comprises parallel stripe-like electrodes such that the electrodes of the first set substantially are oriented orthogonally to the electrodes of the second set; a method for performing a non-destructive readout in the apparatus according to claim 1; and a method for poling pairs of piezoelectric storage cells for write operations in the apparatus according to claim 1.
- Memory devices based on ferroelectric or electret polymer material have many advantages, like small cell footprint, stacking of memory layers, adaptability to reel-to-reel production/inkjet based production, low temperature processing, low cost, etc.
- data are read from the memory by so-called destructive readout, where reversal of polarization during the read operation makes it necessary to write back the information for further storage in the memory.
- a destructive read mode of this kind is undesirable for many applications; for instance, the number of fatigue cycles related to read is the doubled. The latter may represent a problem, since ferroelectric or electret based memories only can withstand a finite number of write cycles.
- having to switch the polymer film twice means that the power consumption is increased, as is the complexity of the required circuitry enabling such write back.
- EP-A2-0166 938 (Eiling & al.) which has a priority date of 1 June 1984, there is disclosed a write and read method in combination with the data storage device based on a ferroelectric polymer memory layer, with the aim of increasing storage density and reducing access time.
- data are stored in memory cells formed by a single domain in the polymer memory material of polymer.
- These domains are coded by being permanently polarized by an applied electric field and coded in accordance with the direction of the field, i.e. with a positive or negative polarization in the memory layer.
- this application discloses the use of pyroelectric or piezoelectric activation of the polarized domains.
- This activation is envisaged to take place over the suitably arranged electrode means in a matrix-addressable memory cell array in a ferroelectric memory material, preferably e.g. poly(vinylidene difluoride-trifluoroethylene) (PVDF-TrFE), such that activation of a memory cell would take place either pyroelectrically or piezoelectrically, respectively by means of an applied heating current pulse or by applied pressure or tension.
- PVDF-TrFE poly(vinylidene difluoride-trifluoroethylene)
- the first set of electrodes comprises a plurality of parallel trenches extending horizontally with an orthogonal orientation to the electrodes and vertically downwards from a top surface thereof for a distance less than the thickness of the electrodes and having a substantially rectangular profile, that at least a ferroelectric or electret memory material is provided in the trenches and covering the sidewalls thereof, that the second set of electrodes is provided as a dual set of electrodes, each comprising parallel twin electrodes provided in said trenches and parallel therewith and without mutual contact with the electrodes of said first set, that the ferroelectric material is provided in at least a portion of the volume of the trenches not occupied by the electrodes, said ferroelectric or electret material being a soft or elastic ferroelectric or electret material with piezoelectric properties and in addition providing electrical insulation between the electrodes of the second set and the electrodes of the first set, whereby the twin electrodes
- figs, l and lb show respectively a plan view and cross section thereof taken along line the A-A in fig. la of a portion of a memory cell array in a first preferred embodiment of the apparatus according to the present invention
- figs. 2a and 2b correspondingly a schematic variant of the embodiment in figs, la and lb
- fig. 3 schematically shows a plan view of a passive matrix arrangement according to the preferred embodiment in fig. 1
- figs. 4 a-d show the steps of a poling sequence in a write operation on a portion of the memory array in the apparatus according to the present invention
- 5a,c and 5b,d respectively plan views and cross sections taken along the lines A-A in figs. 5a and 5b, and schematically illustrating the principle for performing a readout in the apparatus according to the present invention and in accordance with an embodiment of a method according to the present invention
- figs. 6a and 6b respectively a plan view and a cross section thereof, taken along the line A-A of the former, of a portion of a second preferred embodiment of the apparatus according to the present invention, figs. 7a-d the poling of memory cells for a write operation in the embodiment of the apparatus as rendered in figs. 6a and 6b, figs. 7a and 7c being a plan view and figs. 7c and 7d respective corresponding matrix arrangements thereof, and
- figs. 8a,c and 8b,d respectively plan views and cross sections thereof taken along the lines A-A of fig. 8a and 8c, illustrating a method for data readout in the embodiment in figs. 6a and 6b according to the present invention, and based on a poling sequence as shown in figs. 7a-d.
- the general background of the present invention shall now be briefly mentioned, with a more comprehensive discussion of the various preferred embodiments of the apparatus and methods according to the invention to follow further below.
- the present invention permits information content in ferroelectric or electret memory cells to be read out non-destructively, by employing the piezoelectric effect in ferroelectric or electret materials to generate a physical driving force on individual memory cells, and to detect the polarization (logic-state)-dependent piezoelectric voltage response from those cells.
- Generic architectures are described, whereby piezoelectric driver and memory cells can be laid out densely in a passive matrix addressable array. These architectures involve polarization of ferroelectric or electret material in a lateral direction, i.e. parallel to the supporting substrate and combine micromechanical structures, resonant or non-resonant, that are compatible with layered stacking of multiple memory structures, to provide high volumetric data storage densities.
- FIG. la shows a plan view of portion of an array of memory cells according to one preferred embodiment of the present invention
- fig. lb shows a cross section thereof taken along the line A-A. The location of a single memory cell 1 is roughly indicated by a stitched outline.
- the material 2 in the trench 3 is preferably a ferroelectric polymer, which can be poled in an electric field of strength exceeding its coercive field, Once poled, the ferroelectric polymer retains its polarization, the direction and strength of which represents a logic value in a non-volatile memory cell arrangement formed by the matrix of intersecting, embedded electrodes as shown partly in fig. la.
- three piezoelectrically active subcells of a memory cell 1 can be defined, indicated by ⁇ nl , ⁇ n2 and ⁇ n in fig. lb.
- Subcells ⁇ n ⁇ and oc n2 correspond to the volume of ferroelectric polymer subjected to strong electric fields when a voltage is applied between the common electrode a n and electrodes b m and c ra , respectively.
- the cell ⁇ n corresponds to the elongated volume of ferroelectric polymer between electrodes b m and c m that is subjected to a strong electric field when a voltage is applied between the latter two. Poling endows the ferroelectric polymer with a piezoelectric response, which in the configuration shown in figs, la, lb causes the twin electrodes b m , c m , to move laterally in the trench 3 (i.e.
- Fig. 2a shows a plan view of a variant of the basic design in figs. la and lb, where the bottom of the trench 3 is filled with a support material 4 different from the ferroelectric material 2 inside the subcells ⁇ nl , n2 and ⁇ n .
- fig. 2b shows a cross section taken along the line A-A in fig. 2a.
- the memory cell 1 is as before indicated by the stitched outline.
- the mechanical response of the electrodes b m and c m can be optimized for given applications. It does not need to be ferroelectric or piezoelectric and can be chosen from a wide range of materials. Thus, it may be soft and elastic, providing small restraint on lateral motion of the electrodes b m and c m . In certain cases, its mechanical dissipation properties may be selected so as to influence the mechanical motion characteristics of the electrodes b m , c m . An example of this is adjustment of energy dissipation for achieving a desired mechanical Q value during resonant excitation of subcells ⁇ n ⁇ , n2 , ⁇ n .
- the bottom layer material 4 may or may not be bonded to the overlaying ferroelectric material 2 of the subcells ⁇ nl , ⁇ n2 , ⁇ n and/or the electrodes b m , c nv
- Fig. 3 shows schematically a cross-point passive matrix arrangement representing a preferred embodiment according to the present invention. Only the electrode layout is rendered. A memory cell 1 corresponding to the one shown in figs, lb and 2b is shown within a stitched outline.
- This addressing arrangement differs from the traditional passive matrix addressing schemes of prior art in that the "vertical" electrodes now are the parallel twin electrodes b m and c m (1 ⁇ m ⁇ M), where M is the number of memory cells 1 along each horizontal electrode a n (1 ⁇ n ⁇ N), where N is the number of memory cells 1 along each vertical electrode set b m , c m .
- the data-carrying subcells of a memory cell 1 are of the type ⁇ nl and ⁇ n2 , while the macroscopic subcells ⁇ n are used for reading out the stored data (cf. below).
- subcells ⁇ nl and n2 can each be poled such that the polarization points either from the sidewall of the trench 3 towards one of the twin electrodes b m or c m , or in the opposite direction.
- Figs. 4a-4d show the first steps in a poling sequence amounting to activation and write operations for a portion of the memory matrix comprising five memory cells 1, each of these occupying a corresponding location to the one indicated in either fig. la or fig. 2a, but not specifically shown here.
- the subcell ⁇ n is poled to prepare it to function as a driver cell during subsequent readout of data (cf. below). This is achieved as shown in fig. 4a by applying a voltage V p between electrodes b m and c m . This voltage is chosen to create an electric field in the ferroelectric that exceeds the coercive field, causing the ferroelectric to polarize in the direction shown by arrows in the figure.
- All crossing electrodes a n ,.... are shown to be maintained at V p /2, leading to little or no polarization response in all subcells ⁇ due to the strongly nonlinear hysteresis characteristics of the ferroelectric.
- This voltage may be chosen otherwise, or the electrodes a n ,... may be allowed to float, since the polarization states in the subcells ⁇ shall subsequently be set during the writing operation.
- Fig. 4b shows how subcells ⁇ nl and ⁇ n2 on electrode a n are poled for a write operation to encode a polarization state which in this case is taken to represent one bit of information, e.g. a logic "1".
- the voltages that are applied cause the polarization to be directed symmetrically from the twin electrodes b m , c m and outwards towards the sidewalls of the trench 3, while the voltages on all the other subcells ⁇ along the twin electrodes remains below V p /3, i.e. below the polarization switching threshold.
- Fig. 4c shows the encoding of a logic state "0" on electrode a n+ ⁇ .
- the polarization in cells ⁇ n ⁇ and ⁇ n2 for electrode a n+ ⁇ is reversed compared to the case for electrode a curat.
- the set of voltages applied to the electrodes in the matrix are in this case as shown locally in fig.
- Figs. 5a-5d show how data can be read out from the matrix.
- Figs. 5a and 5c show a plan view of the memory matrix at two different time instants, figs. 5b and 5d the respective cross sections thereof taken along the lines A-A.
- the approximate location of a memory cell 1 is as before indicated by the stitched outline.
- the twin electrodes b m and c m act as an exciter unit which causes the subcells ⁇ n ⁇ , ⁇ n2 for all electrodes along the length of the twin electrodes to be subjected to compression/dilation along the local poling direction in the ferroelectric material.
- a piezoelectric response is elicited from the subcells ⁇ nl , ⁇ n2 with a polarity that is dependent upon the poling direction.
- figs. 5a and 5b are shown the positions of the twin electrodes b m , c m at two instants representing extrema in a vibration cycle.
- the twin electrodes b m , c m are far apart, and all cells ⁇ n ⁇ and ⁇ n2 along the length of the twin electrodes b m , c m are compressed laterally.
- the twin electrodes b m , c m have moved to reduce the gap between them, stretching the cells ⁇ n ⁇ and ⁇ n2 on either side.
- voltages are generated between each electrode a n and a suitable reference
- the vibratory motion indicated in figs. 5 may be resonantly excited.
- the free vibration frequencies of structures as shown in figs. 5 with micrometer-sized cell widths shall be quite high, i.e. in the hundreds of kHz to hundreds of MHz region.
- readout can be performed with low voltage excitation on the twin electrodes b m , c m , minimizing pick-up and crosstalk in the readout signals.
- the vibrations shown shall persist for a time after the electrical excitation of the twin electrodes b m , c m has been turned off, permitting read-out free from disturbing excitation voltages.
- a single step or delta pulse may be applied, causing compression or dilation of the ⁇ n ⁇ and n2 cells.
- An analogy is piezoelectric spark generators. This provides a very fast means of readout, since the transit time of a compressional sound wave across the subcells ⁇ nl and ⁇ n2 is in the sub-nanosecond regime in typical memory structures.
- Figs. 6a and 6b illustrate respectively in plan view and in cross section taken along line A-A in fig. 6a a memory device structure which is quite similar in many respects to those shown in figs. 1 and 2, but where the twin electrodes t> m> c m are excited in a different way during readout of data.
- the volume or gap ⁇ n between the twin electrodes b m , c m is now filled with a material which in addition to being electrically insulating and non-piezoelectric adheres well to both of the twin electrodes, keeping them at a fixed distance from each other.
- Figs. 7a-7d show how subcells ⁇ n ⁇ and ⁇ n2 of a memory cell 1 can be poled with mutually opposite poling directions relative to the opposing twin electrode.
- the plan view of fig. 7a and the corresponding matrix arrangement in fig. 7b show the poling of subcell ⁇ nl in a memory cell 1 indicated by the stitched outline, while similarly figs. 7c and 7d show the poling of a subcell ⁇ n2 in the same arrangement.
- Figs. 8a-8d show readout of data from a memory cell 1 in the arrangement as shown in figs. 6 and 7.
- Figs. 8a and 8c show a portion of the apparatus according to the invention the memory in plan view
- figs. 8b and 8d show the respective cross sections thereof taken along the lines A-A of figs. 8a and 8c. Again the location of a memory cell 1 with subcells ⁇ n ..., ⁇ n is indicated by a stitched outline.
- subcells ⁇ n - ⁇ n+5 adjoining the electrodes a n -a n+5 have been poled such that when a voltage is applied between these electrodes and the twin electrodes b m , c ra , a net force is exerted upon the twin electrodes b m , c ra , pulling/pushing them to one side.
- Applying a sinusoidal voltage causes a right-left vibration of the twin electrodes b m , c m as a unit, as shown in figs. 8a and 8b at two points in time.
- the number and positions of driver units such as those on electrodes a n and a n+5 can be selected in each specific case, to achieve adequate overall excitation of the twin electrodes b m , c m without sacrificing too much memory capacity.
- the memory cells 1 on electrodes a n+2 , a n+3 and a n+ are encoded with data that yield a response +V, -V and 0 V, respectively, at that point in the excitation cycle.
- the voltages are generated piezoelectrically, and the discussion on different modes of excitation connection with fig. 5 above also applies here.
- a layer of insulating material may be applied to seal and protect the memory cells and ancillary circuitry.
- the material on top of the moving parts of the overall device must be selected and applied so as to avoid unduly damping or inhibiting the motion.
- an electrically conducting layer may be applied on top of the insulating layer, to provide electrical shielding against noise and pick-up.
- the present invention provides new opportunities for building densely arrayed piezoelectric microstructures that are essentially planar and compatible with multilayer stacking.
- the micromechanical motion takes place in a well-defined volume with precisely controlled materials and dimensions.
- a novel passive matrix architecture with dual electrodes provides a number of different ways of constructing memory cells, as well as writing data thereto, retrieving data therefrom and once more writing new data thereto. Extensions and variants of those exhibited here as the herein above-disclosed preferred embodiments would be obvious to persons skilled in the art, and shall be claimed as included in the present patent application.
- the present invention provides a passive matrix-addressable array of memory cells which in its overall aspects already is known from the prior art devices, wherein a layer of memory material, e.g. of ferroelectric polymer, is sandwiched between a first electrode layer with parallel strip-like electrodes and a second layer of parallel strip-like electrodes, but oriented orthogonally to the electrodes of the first set, whereby any memory cell in the array can be uniquely addressed for a write/read operation.
- a layer of memory material e.g. of ferroelectric polymer
- a very high storage density can be obtained in the prior art devices as the device thickness may be a fraction of a micrometer and the electrodes provided in a dense arrangement and with an obtainable memory cell pitch approaching the line width or minimum feature size that can be provided by the resolution presently offered by photolithographic and etching techniques used for patterning the electrodes.
- the memory layer is of course laid down as a global and continuous layer in the device and needs no patterning.
- the implication of a memory cell size and the memory cell pitch that may approach the minimum feature size as obtainable with present photomicrolithographic and etching techniques, offers the possibility of an area storage density of about 25 bit/ ⁇ m 2 or even more, with one bit per memory cell.
- the trench 3 must in order to accommodate the twin electrodes b, c provided therein and patterned with the conventional technologies, have a width at least twice that of a minimum feature size as provided by available design rules.
- the electrodes in the present invention all can be provided in a so-called dense arrangement, see for instance PCT/NO02/00414, and the distance between the parallel neighbour trenches which are oriented orthogonally to the electrodes a can in practice be made very small, as it is envisaged that also the trenches 3 can be provided in a dense arrangement.
- the area storage density in the apparatus according to the invention would be less than one half of that achievable with prior art memory devices with dense electrode arrangements, but one should then also bear in mind that the thickness of the memory matrix in present invention shall be equal to the thickness of the electrodes a.
- all functional parts of the apparatus of the present invention is contained within the electrode layer that constitutes the electrodes a, and this contrasts with prior art sandwich structures where the memory matrix consists of three consecutive stacked layers, as mentioned above. This offers the possibility of the apparatus according to the present invention providing an improved volumetric storage density, i.e.
- the number of memory cells or bits stored per volume unit would be comparable to that of the prior art technologies and could be further improved by resorting to multibit coding, if that is implemented in present invention.
- the apparatus according to the present invention i.e. the memory matrix
- the inventive memory matrices could be used to form a volumetric data storage apparatus similar to the volumetric devices known in the prior art, by stacking the inventive memory matrices on the top of each other, as the displacements or motions of the electrodes b, c take place laterally, i.e. in a horizontal direction, and the stress vectors in the memory material have the sane direction.
- Other candidate materials displaying both ferroelectric and piezoelectric properties have been contemplated by the applicant and include odd nylons, vinylidene-cyanide copolymers, polyurea, and polymers containing polynitride or imide groups.
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Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003553571A JP2005513772A (en) | 2001-12-14 | 2002-12-12 | Equipment and methods for nondestructive data storage and retrieval |
KR1020047009167A KR100554941B1 (en) | 2001-12-14 | 2002-12-12 | Apparatus and method for non-destructive data storage and retrieval |
CA002469910A CA2469910A1 (en) | 2001-12-14 | 2002-12-12 | Apparatus and method for non-destructive data storage and retrieval |
AU2002347685A AU2002347685A1 (en) | 2001-12-14 | 2002-12-12 | Apparatus and method for non-destructive data storage and retrieval |
EP02783863A EP1464055A1 (en) | 2001-12-14 | 2002-12-12 | Apparatus and method for non-destructive data storage and retrieval |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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NO20016100 | 2001-12-14 | ||
NO20016100A NO20016100D0 (en) | 2001-12-14 | 2001-12-14 | Piezo non-destructive readout |
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WO2003052762A1 true WO2003052762A1 (en) | 2003-06-26 |
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PCT/NO2002/000476 WO2003052762A1 (en) | 2001-12-14 | 2002-12-12 | Apparatus and method for non-destructive data storage and retrieval |
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EP (1) | EP1464055A1 (en) |
JP (1) | JP2005513772A (en) |
KR (1) | KR100554941B1 (en) |
CN (1) | CN1605104A (en) |
AU (1) | AU2002347685A1 (en) |
CA (1) | CA2469910A1 (en) |
NO (1) | NO20016100D0 (en) |
RU (1) | RU2271581C2 (en) |
WO (1) | WO2003052762A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006009462A1 (en) * | 2004-07-22 | 2006-01-26 | Thin Film Electronics Asa | An organic ferroelectric or electret device with via connections and a method for its manufacture |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103165173B (en) * | 2013-04-03 | 2016-06-08 | 南京大学 | The high density ferrum electricity date storage method that a kind of piezoelectric forces microscope probe realizes |
JP6393958B2 (en) * | 2013-05-15 | 2018-09-26 | 住友金属鉱山株式会社 | A device that can determine the polarity of a piezoelectric cylindrical crystal, or can determine the front and back depending on the polarization direction of a wafer as a crystal. |
CN104617133B (en) * | 2015-01-23 | 2018-02-06 | 上海华虹宏力半导体制造有限公司 | The domain structure and its manufacture method of groove-shaped super-junction device |
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Publication number | Priority date | Publication date | Assignee | Title |
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US6128214A (en) * | 1999-03-29 | 2000-10-03 | Hewlett-Packard | Molecular wire crossbar memory |
EP1045435A2 (en) * | 1999-04-13 | 2000-10-18 | Sharp Kabushiki Kaisha | Chemical vapor deposition of Pb5Ge3O11 thin film for ferroelectric applications |
-
2001
- 2001-12-14 NO NO20016100A patent/NO20016100D0/en unknown
-
2002
- 2002-12-12 JP JP2003553571A patent/JP2005513772A/en not_active Abandoned
- 2002-12-12 KR KR1020047009167A patent/KR100554941B1/en not_active IP Right Cessation
- 2002-12-12 CA CA002469910A patent/CA2469910A1/en not_active Abandoned
- 2002-12-12 AU AU2002347685A patent/AU2002347685A1/en not_active Abandoned
- 2002-12-12 EP EP02783863A patent/EP1464055A1/en not_active Withdrawn
- 2002-12-12 RU RU2004120775/09A patent/RU2271581C2/en not_active IP Right Cessation
- 2002-12-12 WO PCT/NO2002/000476 patent/WO2003052762A1/en active Application Filing
- 2002-12-12 CN CNA028249313A patent/CN1605104A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6128214A (en) * | 1999-03-29 | 2000-10-03 | Hewlett-Packard | Molecular wire crossbar memory |
EP1045435A2 (en) * | 1999-04-13 | 2000-10-18 | Sharp Kabushiki Kaisha | Chemical vapor deposition of Pb5Ge3O11 thin film for ferroelectric applications |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006009462A1 (en) * | 2004-07-22 | 2006-01-26 | Thin Film Electronics Asa | An organic ferroelectric or electret device with via connections and a method for its manufacture |
US7291859B2 (en) | 2004-07-22 | 2007-11-06 | Thin Film Electronics Asa | Organic electronic circuit and method for making the same |
Also Published As
Publication number | Publication date |
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KR100554941B1 (en) | 2006-03-03 |
RU2271581C2 (en) | 2006-03-10 |
CA2469910A1 (en) | 2003-06-26 |
JP2005513772A (en) | 2005-05-12 |
CN1605104A (en) | 2005-04-06 |
RU2004120775A (en) | 2005-10-27 |
EP1464055A1 (en) | 2004-10-06 |
AU2002347685A1 (en) | 2003-06-30 |
KR20040068234A (en) | 2004-07-30 |
NO20016100D0 (en) | 2001-12-14 |
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