WO2003046988A3 - Elektronische anordnung - Google Patents
Elektronische anordnung Download PDFInfo
- Publication number
- WO2003046988A3 WO2003046988A3 PCT/DE2002/003883 DE0203883W WO03046988A3 WO 2003046988 A3 WO2003046988 A3 WO 2003046988A3 DE 0203883 W DE0203883 W DE 0203883W WO 03046988 A3 WO03046988 A3 WO 03046988A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electronic assembly
- conductor layer
- strip conductor
- sandwich
- supports
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Battery Mounting, Suspending (AREA)
- Credit Cards Or The Like (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/495,233 US7138708B2 (en) | 1999-09-24 | 2002-10-15 | Electronic system for fixing power and signal semiconductor chips |
EP02779160A EP1449252A2 (de) | 2001-11-17 | 2002-10-15 | Elektronische anordnung |
JP2003548308A JP2005510877A (ja) | 2001-11-17 | 2002-10-15 | 電子装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10156626A DE10156626A1 (de) | 2001-11-17 | 2001-11-17 | Elektronische Anordnung |
DE10156626.3 | 2001-11-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2003046988A2 WO2003046988A2 (de) | 2003-06-05 |
WO2003046988A3 true WO2003046988A3 (de) | 2003-08-21 |
Family
ID=7706161
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2002/003883 WO2003046988A2 (de) | 1999-09-24 | 2002-10-15 | Elektronische anordnung |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1449252A2 (de) |
JP (1) | JP2005510877A (de) |
DE (1) | DE10156626A1 (de) |
WO (1) | WO2003046988A2 (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004031592A1 (de) * | 2004-06-30 | 2006-02-09 | Robert Bosch Gmbh | Elektronikmodulanordnung und entsprechendes Herstellungsverfahren |
US8018056B2 (en) | 2005-12-21 | 2011-09-13 | International Rectifier Corporation | Package for high power density devices |
JP5414644B2 (ja) | 2010-09-29 | 2014-02-12 | 三菱電機株式会社 | 半導体装置 |
DE102022207848A1 (de) | 2022-07-29 | 2023-11-16 | Vitesco Technologies Germany Gmbh | Kontaktierungselement für Leistungshalbleitermodule, Leistungshalbleitermodul und Inverter mit einem Kontaktierungselement |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4047197A (en) * | 1975-04-19 | 1977-09-06 | Semikron Gesellschaft Fur Gleichrichterbau Und Elektronik M.B.H. | Housing and lead structure for a series connected semiconductor rectifier arrangement |
DE3201296A1 (de) * | 1982-01-18 | 1983-07-28 | Institut elektrodinamiki Akademii Nauk Ukrainskoj SSR, Kiev | Transistoranordnung |
GB2146174A (en) * | 1983-09-06 | 1985-04-11 | Gen Electric | Hermetic power chip packages |
US5006921A (en) * | 1988-03-31 | 1991-04-09 | Kabushiki Kaisha Toshiba | Power semiconductor switching apparatus with heat sinks |
US6125039A (en) * | 1996-07-31 | 2000-09-26 | Taiyo Yuden Co., Ltd. | Hybrid module |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE59713027D1 (de) * | 1996-09-30 | 2010-03-25 | Infineon Technologies Ag | Mikroelektronisches bauteil in sandwich-bauweise |
WO2001024260A1 (en) * | 1999-09-24 | 2001-04-05 | Virginia Tech Intellectual Properties, Inc. | Low cost 3d flip-chip packaging technology for integrated power electronics modules |
-
2001
- 2001-11-17 DE DE10156626A patent/DE10156626A1/de not_active Withdrawn
-
2002
- 2002-10-15 EP EP02779160A patent/EP1449252A2/de not_active Withdrawn
- 2002-10-15 JP JP2003548308A patent/JP2005510877A/ja active Pending
- 2002-10-15 WO PCT/DE2002/003883 patent/WO2003046988A2/de active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4047197A (en) * | 1975-04-19 | 1977-09-06 | Semikron Gesellschaft Fur Gleichrichterbau Und Elektronik M.B.H. | Housing and lead structure for a series connected semiconductor rectifier arrangement |
US4047197B1 (de) * | 1975-04-19 | 1985-03-26 | ||
DE3201296A1 (de) * | 1982-01-18 | 1983-07-28 | Institut elektrodinamiki Akademii Nauk Ukrainskoj SSR, Kiev | Transistoranordnung |
GB2146174A (en) * | 1983-09-06 | 1985-04-11 | Gen Electric | Hermetic power chip packages |
US5006921A (en) * | 1988-03-31 | 1991-04-09 | Kabushiki Kaisha Toshiba | Power semiconductor switching apparatus with heat sinks |
US6125039A (en) * | 1996-07-31 | 2000-09-26 | Taiyo Yuden Co., Ltd. | Hybrid module |
Also Published As
Publication number | Publication date |
---|---|
JP2005510877A (ja) | 2005-04-21 |
EP1449252A2 (de) | 2004-08-25 |
DE10156626A1 (de) | 2003-06-05 |
WO2003046988A2 (de) | 2003-06-05 |
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