WO2003035926A2 - Improved precursors for chemical vapour deposition - Google Patents

Improved precursors for chemical vapour deposition Download PDF

Info

Publication number
WO2003035926A2
WO2003035926A2 PCT/GB2002/004822 GB0204822W WO03035926A2 WO 2003035926 A2 WO2003035926 A2 WO 2003035926A2 GB 0204822 W GB0204822 W GB 0204822W WO 03035926 A2 WO03035926 A2 WO 03035926A2
Authority
WO
WIPO (PCT)
Prior art keywords
och
precursor
alkyl group
mmp
ligand
Prior art date
Application number
PCT/GB2002/004822
Other languages
French (fr)
Other versions
WO2003035926A3 (en
Inventor
Anthony Copeland Jones
Original Assignee
Epichem Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB0125724A external-priority patent/GB0125724D0/en
Priority claimed from GB0129080A external-priority patent/GB0129080D0/en
Application filed by Epichem Limited filed Critical Epichem Limited
Priority to JP2003538422A priority Critical patent/JP4472338B2/en
Priority to DE60215034T priority patent/DE60215034T2/en
Priority to EP02772548A priority patent/EP1438315B1/en
Priority to US10/493,667 priority patent/US7419698B2/en
Priority to DE02772548T priority patent/DE02772548T1/en
Priority to AU2002337310A priority patent/AU2002337310A1/en
Publication of WO2003035926A2 publication Critical patent/WO2003035926A2/en
Publication of WO2003035926A3 publication Critical patent/WO2003035926A3/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F5/00Compounds containing elements of Groups 3 or 13 of the Periodic System
    • C07F5/003Compounds containing elements of Groups 3 or 13 of the Periodic System without C-Metal linkages
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00Compounds containing elements of Groups 4 or 14 of the Periodic System
    • C07F7/003Compounds containing elements of Groups 4 or 14 of the Periodic System without C-Metal linkages

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Gas Separation By Absorption (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Formation Of Insulating Films (AREA)

Abstract

Ti, Zr Hf and La precursors for use in MOCVD techniques have a ligand of the general formula OCR1(R2)CH2X, wherein R1 is H or an alkyl group, R2 is an optionally substituted alkyl group and X is selected from OR and NR¿2?, wherein R is an alkyl group or a substituted alkyl group.

Description

Improved precursors for chemical vapour deposition
Description
This invention concerns precursors for chemical vapour deposition. This invention is particularly, but not exclusively concerned with precursors for the growth of zirconium oxide (ZrO2), hafnium oxide (HfO2), zirconium oxide/silicon oxide (ZSO) and hafnium oxide/silicon oxide (HSO) by chemical vapour deposition.
Thin films of ZrO2 and Hf02 and the related silicates ZSO and HSO have important technological applications. In particular, they have high permittivities and are relatively stable in contact with silicon, making them the prime candidates to replace Si02 as gate dielectric layers in next-generation MOSFET devices in integrated Si circuits. Metalorganic chemical vapour deposition (MOCVD) is an attractive technique for the deposition of these materials, offering the potential for large area growth, good composition control and film uniformity, and excellent conformal step coverage at device
dimensions less than 2μm, which is particularly important in microelectronics
applications.
An essential requirement for a successful MOCVD process is the availability of precursors with the appropriate physical properties for vapour phase transport and a suitable reactivity for deposition. There must be an adequate temperature window between evaporation and decomposition, and for most electronics applications oxide deposition is restricted to temperatures in the region of 500°C, to prevent degradation of the underlying silicon circuitry and metal interconnects.
There are a number of problems associated with existing Zr and Hf
CVD precursors. For instance, the halides ZrCI4 and HfCI4 are low volatility solids which need substrate temperatures of 800°C and above for oxide
deposition. Metal β-diketonates, such as [Zr(thd)4] (thd = 2,2,6,6- tetramethylheptane-3,5-dionate) also require high substrate temperatures (>
600°C) for oxide growth. These are incompatible with the requirements of the electronics industry. Metal alkoxides are more attractive CVD precursors as
they allow lower deposition temperatures. However, the majority of [Zr(OR)4]
and [Hf(OR)4] complexes are dimeric or polymeric with limited volatility, due to the pronounced tendency of the Zr(IV) and Hf(IV) to expand their coordination sphere to six, seven or eight. In order to inhibit oligomerisation, sterically demanding ligands such as ferf-butoxide have been employed, and
[Zr(OBu4)4] (D.C. Bradley, Chem. Rev. 1989, 89, 1317) and [Hf(OBu ] (S.
Pakswer & P Skoug, in " Thin dielectric oxide films made by oxygen assisted pyrolysis of alkoxides", The Electrochem. Soc, Los Angeles, CA, USA, 1970,
619 - 636) have been successfully used for the CVD of Zr02 and HfO2.
However, these mononuclear precursors contain unsaturated four-coordinate metal centres and the ferf-butoxide ligand undergoes a catalytic decomposition reaction in the presence of trace water. This makes them highly air and moisture sensitive and susceptible to pre-reaction in the CVD reactor. Their reactivity also leads to a greatly reduced shelf life, especially in solution-based liquid injection CVD applications. An object of this invention is to provide stable and volatile Ti, Zr and Hf precursors suitable for use in chemical vapour deposition techniques.
It has been surprisingly found that the donor functionalised alkoxy ligand 1-methoxy-2-methyl-2-propanolate [OCMe2CH2OMe, mmp] is effective in inhibiting oligomerisation in Zr and Hf alkoxide complexes, as well as increasing the ambient stability of the complexes.
Accordingly the present invention provides Ti, Zr, Hf and La precursors for use in MOCVD techniques having a ligand of the general formula OCR1(R2)CH2X, wherein R1 is H or an alkyl group, R2 is an optionally substituted alkyl group and X is selected from OR and NR2,wherein R is an alkyl group or a substituted alkyl group.
Precursors according to a first preferred embodiment of the invention have the following general formula:
M(L)x[OCR1(R2)CH2X]4
wherein M is a metal selected from Ti, Zr and Hf, L is a ligand, x is a number from 0 to 3 and R1, R2 and X are as defined above.
The preferred ligand L is an alkoxy group having from 1 to 4 carbon atoms, of which tertiary-butoxide (OBu1) group is most preferred, although other groups such as iso-propoxide (OPr1) can be employed.
The preferred ligand of the formula OCR1(R2)CH2X is 1-methoxy-2- methyl-2-propanolate (mmp) but other donor functionalised alkoxide ligands may also carry out the desirable function of inhibiting oligomerisation in Zr, Hf and Ti alkoxides for use in the invention. These include but are not limited to OCH(Me)CH2OMe, OCEt2CH2OMe, OCH(But)CH2OEt, OC(But)2CH2OEt,
OC(Pιj)2CH2OEt, OCH(But)CH2NEt2, OC(Pι )2CH2OC2H4OMe and
OC(But)(CH2OPri)2 .
The invention further provides a method of making Ti, Zr and Hf precursors for use in MOCVD techniques comprising reacting mmpH with the corresponding metal alkoxide or metal alkylamide in appropriate molar proportions.
The new alkoxide complexes Zr(OBut)2(mmp)2, Zr(mmp)4, Hf(OBut)2(mmp)2, and Hf(mmp)4 have been synthesised by the addition of mmpH to Zr(OBul)4 and Hf(OBu')4 in appropriate molar proportions. The complexes have high vapour pressures suitable for MOCVD, and are also much less reactive to air and moisture than Zr(OR)4 compounds, wherein R is an alkyl group, making them easier to handle and use in MOCVD. The reduced air-sensitivity of these new Zr and Hf complexes arises from the replacement of the highly moisture sensitive terf-butoxide groups in [Z^OBu^] and [H^OBu^] with the mmp ligand, which is much less susceptible to hydrolysis. The complexes are further stabilised to hydrolysis by an increase in the coordination number of the central Zr or Hf atom.
According to a second preferred embodiment the invention can be extended to other metals, which have large atomic radii and are highly positively charged, such as lanthanum, in which case preferred precursors have the following general formula
Figure imgf000005_0001
wherein R1 is H or an alkyl group, R2 is an optionally substituted alkyl group and X is selected from OR and NR2,wherein R is an alkyl group or a substituted alkyl group.
The preferred ligand for this preferred embodiment of the invention is 1-methoxy-2-methyl-2-propanolate [OCMe2CH2OMe], although other donor functionalised alkoxide ligands may be used. These may include but are not limited to OCH(Me)CH2OMe, OCEt2CH2OMe, OCH(But)CH2OEt, OC(But)2CH2OEt, OC(PrJ)2CH2θEt> OCH(But)CH2NEt2, OC(Pri)2CH2θC2H4OMe and OC(ButχCH2OPri)2 .
The invention also provides a preferred method of making precursors according to the second preferred embodiment comprising reacting mmpH with La{N(SiMe3)2}3 in appropriate molar proportions.
Precursors according to the invention may be used in depositing single or mixed oxide layers or films by conventional MOCVD, in which the precursor is contained in a metalorganic bubbler, or by liquid injection MOCVD, in which the precursor is dissolved in an appropriate inert organic solvent and then evaporated into the vapour phase using a heated evaporator. The precursors may also be suitable for use in the deposition of zirconium oxide, hafnium oxide and titanium oxide films by other chemical vapour deposition techniques, such as atomic layer deposition (ALD).
The precursors can be used for the MOCVD of Zr02, HfO2, and Ti02, La2O3, and in combination with other precursors for the MOCVD of complex oxides containing zirconium oxide, hafnium oxide, and lanthanum oxide such as ZSO and HSO and La-silicate.
The precursors can also be used in combination for the MOCVD of complex oxides. Examples include the MOCVD of bismuth-titanate from the combinations Bi(mmp)3 / Ti(OPri)2(mmp)2 or Bi(mmp)3 / Ti(mmp)4.
The invention will now be further described with reference to the accompanying drawings, in which:
Figure 1 shows an envisaged structure for M(OBut)2(mmp)2 (M = Zr or Hf);
Figure 2 shows the molecular structure of Hf(mmp)4. Zr(mmp)4 has a similar structure; and
Figure 3 shows laser Raman spectra Zrθ2 and Hfθ2 films grown by liquid injection MOCVD using Zr(OBut)2(mmp)2 or Hf(OBut)2(mmp)2.
The invention will now be further described by means of the following Examples.
Example 1
Preparation of Zr(OBul)2(mmp)2
2.8 ml (2.69 g, 7.0 mmol) Z^OBu^ was dissolved in hexane (ca. 40 ml). mmpH (1.6 ml, 1.44 g, 13.9 mmol) was added dropwise, the mixture was heated to reflux and stirring continued for a further 2 hours. The solution was cooled to room temperature and the volatiles removed by evaporation under reduced pressure. The product was recrystallised from hexane to give a white crystalline solid.
M.pt.: 96 - 101 °C (uncorrected) Microanalysis: Calc. C: 48.71 , H: 9.10. Found: C: 46.32, H: 8.77%
1H NMR: (400MHz, dβ-tol) 1.19 (s, 12H,
Figure imgf000008_0001
1.37 (s, 18H,
OC(Ctk ), 3.23 (s, 4H, O CHskCHgOCHs), 3.40 (s, 6H,
O CHskCHsOCHsJ.
13C NMR: 34.1 (OCfCH^CHzOCHs), 38.5 (OC(CH3)3), 65.4
(OC(CH3)2CH2OCH2), 78.6 (OC(CH3)2CH2OCH3 and OC(CH3)3), 90.5
Figure imgf000008_0002
IR: (υ cm"1, Nujol, NaCI) 3588(w), 3442(w), 2725(m), 2360(w), 1356(s),
1277(m), 1227(m), 1206(s), 1177(s), 1115(s), 1080(s), 1012(s), 974(s),
936(s), 801 (s), 782(s), 595(s).
An envisaged structure for Zr(OBut)2(mmp)2 is shown in Figure 1 of the drawings.
Example 2
Preparation of Zr(mmp)4
2.0 g (5.2 mmol) Zr(OPri)4»PriOH was dissolved in hexane (ca. 40 ml).
mmpH (2.6 ml, 2.35 g, 22.5 mmol) was added dropwise, the mixture heated to reflux and stirring was continued for 2 hours. The mixture cooled to room temperature and the volatiles was removed by evaporation under reduced pressure to give the product as a white viscous oil. (Yield: 2.4 g, 94%).
Zr(mmp)4 can also be synthesised from the corresponding zirconium alkylamide complexes, Zr(NR2)4. For instance, by the dropwise addition of mmpH (6.9g, 65.8 mmol) to a stirred solution of [Zr(NEt2)4j ( 5.0g, 13.2 mmol) in hexane (50 cm3). The mixture was boiled under reflux for 2 hr. and then allowed to cool to room temperature. Volatiles were removed in vacuo to give the product (yield 6.25 g, 94%).
Microanalysis: Calc. C: 47.67, H: 8.82 Found: C:47.80, H: 8.79%.
1H NMR: (400 MHz, d8-tol): 1.21 (s, OC(CH3)2CH2OCH3), 3.16 (s,
OC(CH3)2CH2OCH3), 3.27 (s, OC(CH3)2CH20 Ctk)
13C NMR: (100 MHz, d8-tol): 32.1 (OC(CH2)2C 2OC 3), 64.8
(OC(CH3)2C 2OCH2), 76.0 (OC(CH3)2CH2OCH3), 88.5 (OC(CH3)2CH OCH3).
IR: (υ crrϊ1, Nujol, NaCI) 3589(w), 3448(w,br), 2724(m), 2346(w), 1377(s),
1322(m), 1279(m), 1239(m), 1176(s), 1134(m), 1114(s), 1081(m), 1018(s),
996(m), 982(s), 958(m), 937(m), 917(m), 845(m), 804(m), 784(m), 594(s).
Example 3
Preparation of Hf(OBut)2(mmp)2
3.5 ml (4.0 g, 8.5 mmol) HfiOBu*^ was dissolved in hexane (ca. 40 ml) to give a yellow solution. MmpH (2.0 ml, 1.79 g, 19.0 mmol) was added dropwise, the mixture heated to reflux and stirring continued for 2 hours. The solution was allowed to cool and the volatiles removed by boiling under reduced pressure. The crude product was recrystallised from hexane to give a white crystalline solid. (Yield: 4.4 g, 97%).
M. Pt: 100 - 104 ° C (uncorrected)
Microanalysis: Calc. C: 40.71 , H: 7.61. Found. C: 38.93, H: 7.30%
1H NMR: (400 MHz, d8-tol): δ = 1.18 (s, 12H, OC(CH2)2C 2OC 3), 1.38 (s,
18H, OC(CH2)3), 3.21 (s, 12H, OC(CH3)2CH2OCH3)> 3.42 (s, 12H, OC(CH3)2CH2θCH2) 13C NMR: (100 MHz d8-tol): δ = 34.4 (OC(Cr^)2CH2OCH3), 38.6 OC&Hs ),
65.7, (OC(CH3)2CH2OCH ), 78.0, 79.1 (OC(CH3)2CH2OCH3 and OC(CH3)3), 90.9 (OC(CH3)2CH2OCH3),
IR: (υ cm"1, Nujol, NaCI): 3441 (w), 2726(m), 2256(w), 1272(s), 1177(s),
1074(s), 1016(s), 976(s), 802(s), 782(s), 593(s).
An envisaged structure for Hf(OBut)2(mmp)2 is shown in Figure 1 of the drawings.
Example 4
Preparation of Hf(mmp)4
4.0 ml (5.56 g, 11.9 mmol) [Hf(NEt2)4] was dissolved in hexane (60 ml). Hmmp (7.0 ml, 6.3 g, 60 mmol) was added dropwise and the mixture refluxed for 90 mins. Volatiles were removed in vacuo to give the product as a yellow viscous oil.
(Yield: 6.88 g, 97.5 %).
Microanalysis: Calc. C: 40.63, H: 7.52. Found. C39.85, H 7.32% 1H NMR: 1.30 (s, 24H, O CHskCHzOCHs), 3.28 (s, 8H, OC(CH3)2CH2θCH- 3), 3.36 (s, 12H, OC(CH3)2CH2OCH^)
13C NMR: 34.74 (OC(CH3)2CH2OCH3), 65.16 (OC(CH3)2CH2OCH3), 79.83 (OC(CH3)2CH2OCH3), 90.25 (OC(CH3)2CH2OCH3)
IR: (Nujol/NaCI): 3585(w), 3450(w,br), 2722(m), 1366(s), 1356(vs), 1268(s), 1242(s), 1214(vs), 1177(vs), 1115(vs), 1079(vs), 1045(vs), 1026(vs), 996(vs), 975(vs), 936(vs), 912(m), 802(s), 779(s), 594(vs).
An envisaged structure for Hf(mmp)4 is shown in Figure 2 of the accompanying drawings. Example 5
Preparation of Zr(OPri)2(mmp)2
1.06 g (2.75 mmol) Zr(OPri)4»PriOH was dissolved in hexane (ca 40
ml). 1-methoxy-2-methyl-2-propanol [mmpH] (0.65 ml, 0.57 g, 5.5 mmol) was added dropwise, the mixture was heated to reflux and stirring continued for a further 2 hours. The solution was cooled to room temperature and the volatiles removed by evaporation under reduced pressure. The product was isolated as a white viscous oil.
Microanalysis: Calc. C: 46.23, H: 8.73. Found: C: 44.17, H: 8.47 1H NMR (400MHz, d8-tol): 1.26 (s, OC(CJ&)2CH2OCH3), 1.32 (d, OCH(CH3)2), 3.26 (2, OC(CH3)2CH2θCH3), 3.36 (s, OC(CH3)2CH2OCH3), 4.46 (m,
OCH(CH3)2).
13C NMR (100MHz, d8-tol): 32.1
Figure imgf000011_0001
34.2 (OCH(CH2)2), 64.9
Figure imgf000011_0002
76.1 , 76.4 (OCH(CH3)2 and OC(CH3)2CH2OCH3), 88.6 (OC(CH3)2CH2OCH3).
IR: (υ cm"1, Nujol, NaCI) 3589(w), 3423(w), 2724(w), 2282(w), 1239(w),
1175(m), 1115(m), 1019(m), 959(m).
Example 6
Preparation of Ti(OPri)2(mmp)2 MmpH (2.81 g, 27mmol) was added dropwise to 0.0135moles) to a stirred solution of Ti(OPri)4 (3.84g, 13.5mmol) in hexane (20 ml). The mixture was boiled under reflux for 11/2 hours and was then allowed to cool. The solvent was then removed in vacuo to give Ti(OPri)2(mmp)2 as a colourless oil. Microanalysis for TiC16H36θ4 : (calculated) C% 51.61 , H% 9.75;
(experimental) C% 51.20, H% 9.92.
1H NMR (C6D5CD3 at 30°C) δ 1.1 (26H, d, (CH3)2CH; CH3OCH2(CH3)2C ); δ
3.2 ( 10H, two singlets, CH3OC fe(CH3)2C ); δ 4.5 ( 2H, m, (CH3)2CH ).
3C{1H> NMR (C6D5CD3, 30°C): 32 (OC(CH3)2CH2OCH3), 33.4 (OC (C\-\2)2),
64.4 (OC(CH3)2CH2OCH5), 81.7 (OC(CH3)2CH2OCH3 86.5 (OCH(CH3)2), 88
Figure imgf000012_0001
IR (Nujol, cm"1) 2972s, 2928s, 2869s, 2625w, 1463m, 1376m, 1360s, 1331m,
1277m, 1126s, 1001s, 850s, 778m., 629s.
Example 7
Preparation of Ti(mmp)4 MmpH (4.41 g, 42 mmol) was added dropwise to a stirred solution of Ti(NEt2) (2.85g; 3ml; 8.47mmole) in hexane (20 ml) resulting in pale brown solution. The mixture was boiled under reflux for 11/2 hours, allowed to cool, and then volatiles were removed in vacuo to give Ti (mmp)4 as a pale brown oil. Microanalysis for TiCaoHφ j : (calculated) C% 52.17, H% 9.63; (experimental) C% 51.95, H% 9.97.
1H NMR (C6D5CD3 at 30°C) δ 1.3 (24H, s, CH3OCH2(CH3)2C ); δ 3.2 ( 20H,
two singlets, CH3OCH2.(CH3)2C). VT 1H NMR showed sharp distinct peaks
from -50 to +50 °C - no broadening was apparent.
13C{1H> NMR (C6D5CD3, 30°C): 31.9 (OCCCH^ChbOCHs), 64.5
(OC(CH3)2CH2OCH3), 81.7 (OC(CH3)2CH2OCH3), 87 (OC(CH3)2CH2OCH3). IR (Nujol, cm"1) 2975s, 2931s, 2876s, 2829m, 2625w, 1461m, 1360s, 1331m, 1277m, 12406m, 1116s, 1004s, 850m., 796s, 775s, 625s. Example 8
Preparation of La(mmp)3 [La{N(SiMe3)2}3] (2.89 g, 4.6 mmol) was dissolved in toluene (50 ml) and mmpH (2.2 ml, 1.96 g, 18.7 mmol) added dropwise under stirring. Stirring was continued at room temperature for a further 21 hours and the volatiles removed in vacuo to give the product as a brown viscous oil (Yield = 1.8 g , 87% with respect to La)
Microanalysis for LaC15H33θ6(calculated) C % 40.18, H % 7.43; (experimental) C % 40.01 , H % 7.38
Example 9
Zirconium oxide and hafnium oxide deposition from Zr(OBut)2(mmp)2, Zr(mmp)4, Hf(OBut)2(mmp)2 and Hf(mmp)4
All four complexes were found to be excellent precursors for the deposition of ZrO2 and Hf0 thin films by MOCVD. The Zr02 and HfO2 films were deposited by liquid injection MOCVD using the same general conditions shown in Table 1 below.
Table 1 Growth conditions used for the growth of Zr02 or Hf02 thin films by liquid injection MOCVD using Zr(OBut)2(mmp)2, Zr(mmp)4, Hf(OBut)2(mmp)4 or Hf(mmp)4
Figure imgf000014_0001
The identity of the films was confirmed as Zr02 or Hf02 by laser Raman spectroscopy (see Figure 3). Raman spectra of Zrθ2 and Hfθ2 films grown from Zr(OBut)2(mmp)2 or Hf(OBut)2(mmp)2 are shown in Fig. 3. Comparison
with bulk crystalline data showed that these films were predominantly in the α-
or monoclinic phase.

Claims

1. Ti, Zr, Hf and La precursors for use in MOCVD techniques having a ligand of the general formula OCR1(R2)CH2X, wherein R1 is H or an alkyl group, R2 is an optionally substituted alkyl group and X is selected from OR and NR2, wherein R is an alkyl group or a substituted alkyl group.
2. A precursor for use in MOCVD techniques having the following general formula:
M(L)x[OCR1(R2)CH2X]4.x
wherein M is a metal selected from Ti, Zr and Hf, L is a ligand, x is a number from 0 to 3 and R1, R2 and X are as defined above.
3. A precursor as claimed in claim 2, wherein the ligand L is an alkoxy group having from 1 to 4 carbon atoms.
4. A precursor as claimed in claim 3, wherein the ligand L is selected from tertiary-butoxide (OBu*) and iso-propoxide (OPH).
5. A precursor as claimed in any one of claims 1 to 4, wherein the ligand of the formula OCR1(R2)CH2X is 1-methoxy-2-methyl-2-propanolate (mmp).
6. A precursor as claimed in any one of claims 1 to 4, wherein the ligand of the formula OCR1(R2)CH2X is selected from OCH(Me)CH2OMe, OCEt2CH2OMe, OCH(But)CH2OEt, OC(But)2CH2OEt, OC(Pri)2CH2OEt, OCH(But)CH2NEt2, OC(Pri)2CH2OC2H4OMe and OC(But)(CH2OPri)2 .
7. Zr(OBut)2(mmp)2.
8. Zr(mmp) .
Figure imgf000016_0001
10. Hf(mmp)4
11. A method of making Ti, Zr and Hf precursors for use in MOCVD techniques comprising reacting HOCR1(R2)CH2X with the corresponding metal alkoxide or metal alkylamide in appropriate molar proportions.
12. A precursor for use in MOCVD techniques having the following general formula
La[OCR1(R2)CH2X]3 wherein R1 is H or an alkyl group, R2 is an optionally substituted alkyl group and X is selected from OR and NR2,wherein R is an alkyl group or a substituted alkyl group.
13. A precursor as claimed in claim 12, wherein the ligand is 1-methoxy-2- methyl-2-propanolate [OCMe2CH2OMe].
14. A precursor as claimed in claim13, wherein the ligand is selected from OCH(Me)CH2OMe, OCEt2CH2OMe, OCH(But)CH2OEt, OC(But)2CH2OEt, OC(Pri)2CH2OEt, OCH(But)CH2NEt2) OC(Pri)2CH2OC2H4OMe and OC(But)(CH2OPιJ)2 .
15. La[mmpJ3.
16. A method of making precursors as claimed in claim 12 comprising reacting HOCR1(R2)CH2X with La{N(SiMe3)2}3 in appropriate molar proportions.
17. A method of depositing single or mixed oxide layers or films by conventional MOCVD, in which the precursor is contained in a metalorganic bubbler, or by liquid injection MOCVD, in which the precursor is dissolved in an appropriate inert organic solvent and then evaporated into the vapour phase using a heated evaporator, wherein at least one of the precursors is as defined in any one of claims 1 to 10 and 12 to 15.
PCT/GB2002/004822 2001-10-26 2002-10-25 Improved precursors for chemical vapour deposition WO2003035926A2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2003538422A JP4472338B2 (en) 2001-10-26 2002-10-25 An improved precursor for chemical vapor deposition.
DE60215034T DE60215034T2 (en) 2001-10-26 2002-10-25 PROVISIONAL COMPOUNDS FOR CHEMICAL STEAM PHASE SEPARATION
EP02772548A EP1438315B1 (en) 2001-10-26 2002-10-25 Improved precursors for chemical vapour deposition
US10/493,667 US7419698B2 (en) 2001-10-26 2002-10-25 Precursors for chemical vapor deposition
DE02772548T DE02772548T1 (en) 2001-10-26 2002-10-25 PRECURSOR CONNECTIONS FOR CHEMICAL VAPOR PHASE DEPOSITION
AU2002337310A AU2002337310A1 (en) 2001-10-26 2002-10-25 Improved precursors for chemical vapour deposition

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
GB0125724A GB0125724D0 (en) 2001-10-26 2001-10-26 Improved precursors for metalorganic chemical vapour deposition
GB0125724.5 2001-10-26
GB0129080A GB0129080D0 (en) 2001-12-04 2001-12-04 Improved precursors for chemical vapour deposition
GB0129080.8 2001-12-04

Publications (2)

Publication Number Publication Date
WO2003035926A2 true WO2003035926A2 (en) 2003-05-01
WO2003035926A3 WO2003035926A3 (en) 2003-06-12

Family

ID=26246699

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2002/004822 WO2003035926A2 (en) 2001-10-26 2002-10-25 Improved precursors for chemical vapour deposition

Country Status (8)

Country Link
US (1) US7419698B2 (en)
EP (1) EP1438315B1 (en)
JP (1) JP4472338B2 (en)
CN (1) CN100379745C (en)
AT (1) ATE340800T1 (en)
AU (1) AU2002337310A1 (en)
DE (2) DE02772548T1 (en)
WO (1) WO2003035926A2 (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2391555A (en) * 2002-08-09 2004-02-11 Epichem Ltd Vapour phase deposition of silicate and oxide films
GB2399568A (en) * 2003-03-17 2004-09-22 Epichem Ltd Aminoalkoxide- or alkoxyalkoxide-containing rare earth metal precursors for use in MOCVD techniques
WO2005027189A2 (en) * 2003-09-16 2005-03-24 Tokyo Electron Limited Formation of a metal-containing film by sequential gas exposure in a batch type processing system
JP2005244170A (en) * 2004-02-28 2005-09-08 Samsung Electronics Co Ltd Amorphous dielectric film and manufacturing method therefor
EP1698614A1 (en) * 2003-12-25 2006-09-06 Asahi Denka Co., Ltd. Metal compound, material for forming thin film and method for preparing thin film
US7790628B2 (en) 2007-08-16 2010-09-07 Tokyo Electron Limited Method of forming high dielectric constant films using a plurality of oxidation sources
US7816278B2 (en) 2008-03-28 2010-10-19 Tokyo Electron Limited In-situ hybrid deposition of high dielectric constant films using atomic layer deposition and chemical vapor deposition
EP2261389A2 (en) 2006-06-02 2010-12-15 L'Air Liquide Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude Method of forming high-k dielectric films based on novel zirconium, and hafnium precursors and their use for semiconductor manufacturing
US7964515B2 (en) 2007-12-21 2011-06-21 Tokyo Electron Limited Method of forming high-dielectric constant films for semiconductor devices
US8613975B2 (en) 2008-05-23 2013-12-24 Sigma-Aldrich Co. Llc Methods of producing high-K dielectric films using cerium-based precursors
US9499571B2 (en) 2014-12-23 2016-11-22 L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude Germanium- and zirconium-containing compositions for vapor deposition of zirconium-containing films
US9663547B2 (en) 2014-12-23 2017-05-30 L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude Silicon- and Zirconium-containing compositions for vapor deposition of Zirconium-containing films
US10106568B2 (en) 2016-10-28 2018-10-23 L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude Hafnium-containing film forming compositions for vapor deposition of hafnium-containing films

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6316797B1 (en) * 1999-02-19 2001-11-13 Advanced Technology Materials, Inc. Scalable lead zirconium titanate(PZT) thin film material and deposition method, and ferroelectric memory device structures comprising such thin film material
KR100634532B1 (en) 2005-01-19 2006-10-13 삼성전자주식회사 A Ti precursor, a method for preparing the same, a method for preparing by using the Ti precursor and the Ti-containing thin layer
KR100657792B1 (en) * 2005-01-24 2006-12-14 삼성전자주식회사 Method of manufacturing a thin layer using atomic layer deposition, and method of manufacturing a capacitor and a gate structure using the same
GB2432363B (en) * 2005-11-16 2010-06-23 Epichem Ltd Hafnocene and zirconocene precursors, and use thereof in atomic layer deposition
SG171683A1 (en) 2006-05-12 2011-06-29 Advanced Tech Materials Low temperature deposition of phase change memory materials
CN101495672B (en) 2006-11-02 2011-12-07 高级技术材料公司 Antimony and germanium complexes useful for CVD/ALD of metal thin films
JP5008379B2 (en) * 2006-11-08 2012-08-22 株式会社Adeka Zinc compound, raw material for forming thin film containing zinc compound, and method for producing thin film
KR100852234B1 (en) * 2006-11-17 2008-08-13 삼성전자주식회사 Method of forming a metal oxide layer, method of manufacturing a gate structure, and method of manufacturing a capacitor using the same
US20120107491A1 (en) * 2007-01-16 2012-05-03 Alliance For Sustainable Energy, Llc High Permittivity Transparent Films
WO2008128141A2 (en) * 2007-04-12 2008-10-23 Advanced Technology Materials, Inc. Zirconium, hafnuim, titanium, and silicon precursors for ald/cvd
TWI382987B (en) * 2007-07-24 2013-01-21 Sigma Aldrich Co Organometallic precursors for use in chemical phase deposition processes
TWI425110B (en) * 2007-07-24 2014-02-01 Sigma Aldrich Co Methods of forming thin metal-containing films by chemical phase deposition
EP2201149B1 (en) 2007-09-14 2013-03-13 Sigma-Aldrich Co. Methods of preparing titanium containing thin films by atomic layer deposition using monocyclopentadienyl titanium-based precursors
US20090087561A1 (en) * 2007-09-28 2009-04-02 Advanced Technology Materials, Inc. Metal and metalloid silylamides, ketimates, tetraalkylguanidinates and dianionic guanidinates useful for cvd/ald of thin films
KR101458953B1 (en) 2007-10-11 2014-11-07 삼성전자주식회사 Method of forming phase change material layer using Ge(Ⅱ) source, and method of fabricating phase change memory device
US8834968B2 (en) 2007-10-11 2014-09-16 Samsung Electronics Co., Ltd. Method of forming phase change material layer using Ge(II) source, and method of fabricating phase change memory device
SG178736A1 (en) * 2007-10-31 2012-03-29 Advanced Tech Materials Amorphous ge/te deposition process
US20090215225A1 (en) 2008-02-24 2009-08-27 Advanced Technology Materials, Inc. Tellurium compounds useful for deposition of tellurium containing materials
TW200949939A (en) * 2008-05-23 2009-12-01 Sigma Aldrich Co High-k dielectric films and methods of producing using titanium-based β -diketonate precursors
TW200951241A (en) * 2008-05-30 2009-12-16 Sigma Aldrich Co Methods of forming ruthenium-containing films by atomic layer deposition
US8330136B2 (en) 2008-12-05 2012-12-11 Advanced Technology Materials, Inc. High concentration nitrogen-containing germanium telluride based memory devices and processes of making
KR101017897B1 (en) 2009-03-13 2011-03-04 한국화학연구원 Siliconiv complexes alkoxyalkoxide and preparation method thereof
US20100270508A1 (en) * 2009-04-24 2010-10-28 Advanced Technology Materials, Inc. Zirconium precursors useful in atomic layer deposition of zirconium-containing films
KR101538982B1 (en) 2009-08-07 2015-07-23 시그마-알드리치 컴퍼니., 엘엘씨 High molecular weight alkyl-allyl cobalttricarbonyl complexes and use thereof for preparing dielectric thin films
US8952188B2 (en) * 2009-10-23 2015-02-10 Air Products And Chemicals, Inc. Group 4 metal precursors for metal-containing films
US20110124182A1 (en) * 2009-11-20 2011-05-26 Advanced Techology Materials, Inc. System for the delivery of germanium-based precursor
KR101706809B1 (en) 2010-03-26 2017-02-15 엔테그리스, 아이엔씨. Germanium antimony telluride materials and devices incorporating same
WO2011146913A2 (en) 2010-05-21 2011-11-24 Advanced Technology Materials, Inc. Germanium antimony telluride materials and devices incorporating same
EP2609102B1 (en) 2010-08-27 2014-12-31 Sigma-Aldrich Co. LLC Molybdenum (iv) amide precursors and use thereof in atomic layer deposition
US8927748B2 (en) 2011-08-12 2015-01-06 Sigma-Aldrich Co. Llc Alkyl-substituted allyl carbonyl metal complexes and use thereof for preparing dielectric thin films
US9175023B2 (en) 2012-01-26 2015-11-03 Sigma-Aldrich Co. Llc Molybdenum allyl complexes and use thereof in thin film deposition
WO2014070682A1 (en) 2012-10-30 2014-05-08 Advaned Technology Materials, Inc. Double self-aligned phase change memory device structure
TWI753794B (en) 2016-03-23 2022-01-21 法商液態空氣喬治斯克勞帝方法研究開發股份有限公司 Si-containing film forming compositions and methods of making and using the same
KR20200118831A (en) 2018-02-12 2020-10-16 메르크 파텐트 게엠베하 Vapor deposition method of ruthenium using oxygen-free co-reactant

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0614867A2 (en) * 1993-03-11 1994-09-14 Hoechst Aktiengesellschaft Volatile metal alcoholates of bifunctional beta-ether alcohols, process for their preparation and their use

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3367759A (en) * 1965-09-30 1968-02-06 Chevron Res Alkali metal derivatives of alkanols in gasoline fuels
US4758682A (en) * 1983-03-17 1988-07-19 California Institute Of Technology Homogeneous coordination compounds as oxidation catalysts
US5344948A (en) * 1992-02-25 1994-09-06 Iowa State University Research Foundation, Inc. Single-source molecular organic chemical vapor deposition agents and use
FR2693727B1 (en) * 1992-07-20 1994-08-19 Ceramiques Tech Soc D Organo-mineral polycondensate and process for obtaining it.
GB9300934D0 (en) * 1993-01-19 1993-03-10 Bp Chem Int Ltd Metallocene complexes
GB9315771D0 (en) * 1993-07-30 1993-09-15 Epichem Ltd Method of depositing thin metal films
NL9302030A (en) * 1993-11-24 1995-06-16 Ass Octel Volatile yttrium organic compounds and process for the preparation of yttrium-containing layered materials from these compounds.
US5591483A (en) * 1994-08-31 1997-01-07 Wayne State University Process for the preparation of metal nitride coatings from single source precursors
MY112590A (en) * 1994-09-02 2001-07-31 Sec Dep For Defence Acting Through His Defence Evaluation And Research Agency United Kingdom Semi-conductor devices and their production
GB9421335D0 (en) * 1994-10-22 1994-12-07 Epichem Ltd Chemical vapour deposition
US5527752A (en) * 1995-03-29 1996-06-18 Union Carbide Chemicals & Plastics Technology Corporation Catalysts for the production of polyolefins
US5508458A (en) * 1995-05-26 1996-04-16 Hoechst Celanese Corporation Chiral catalysts and processes for preparing the same
US5908947A (en) * 1996-02-09 1999-06-01 Micron Technology, Inc. Difunctional amino precursors for the deposition of films comprising metals
US6313035B1 (en) * 1996-05-31 2001-11-06 Micron Technology, Inc. Chemical vapor deposition using organometallic precursors
US5698022A (en) * 1996-08-14 1997-12-16 Advanced Technology Materials, Inc. Lanthanide/phosphorus precursor compositions for MOCVD of lanthanide/phosphorus oxide films
GB9709639D0 (en) * 1997-05-14 1997-07-02 Inorgtech Ltd Chemical vapour deposition precursors
US6277436B1 (en) * 1997-11-26 2001-08-21 Advanced Technology Materials, Inc. Liquid delivery MOCVD process for deposition of high frequency dielectric materials
JP3680542B2 (en) * 1998-02-09 2005-08-10 三菱マテリアル株式会社 Organotitanium compounds suitable for MOCVD
US6159855A (en) * 1998-04-28 2000-12-12 Micron Technology, Inc. Organometallic compound mixtures in chemical vapor deposition
GB9814048D0 (en) * 1998-06-30 1998-08-26 Inorgtech Ltd Novel precursors for the growth of heterometal oxide films by MOCVD
JP2000044240A (en) * 1998-07-30 2000-02-15 Asahi Denka Kogyo Kk Bismuth titanate ferroelectric film
GB9917189D0 (en) * 1999-07-23 1999-09-22 Inorgtech Ltd Metalorganic chemical vapour deposition precursor
US6376691B1 (en) * 1999-09-01 2002-04-23 Symetrix Corporation Metal organic precursors for transparent metal oxide thin films and method of making same
US6623656B2 (en) * 1999-10-07 2003-09-23 Advanced Technology Materials, Inc. Source reagent composition for CVD formation of Zr/Hf doped gate dielectric and high dielectric constant metal oxide thin films and method of using same
JP2001181288A (en) * 1999-12-24 2001-07-03 Asahi Denka Kogyo Kk Metal alkoxide compound for chemical vapor deposition and compound metal oxide thin film using the same
JP2001234343A (en) * 2000-02-17 2001-08-31 Asahi Denka Kogyo Kk Metallic compound solution and method for producing thin film using the same
JP4868639B2 (en) 2000-06-12 2012-02-01 株式会社Adeka Raw material for chemical vapor deposition and method for producing thin film using the same
EP1184365A3 (en) * 2000-08-26 2003-08-06 Samsung Electronics Co., Ltd. Novel group IV metal precursors and chemical vapor deposition method using thereof
US6642567B1 (en) * 2000-08-31 2003-11-04 Micron Technology, Inc. Devices containing zirconium-platinum-containing materials and methods for preparing such materials and devices
US6416814B1 (en) * 2000-12-07 2002-07-09 First Solar, Llc Volatile organometallic complexes of lowered reactivity suitable for use in chemical vapor deposition of metal oxide films
US6552209B1 (en) * 2002-06-24 2003-04-22 Air Products And Chemicals, Inc. Preparation of metal imino/amino complexes for metal oxide and metal nitride thin films

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0614867A2 (en) * 1993-03-11 1994-09-14 Hoechst Aktiengesellschaft Volatile metal alcoholates of bifunctional beta-ether alcohols, process for their preparation and their use

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
CHEMICAL ABSTRACTS, vol. 80, no. 23, 10 June 1974 (1974-06-10) Columbus, Ohio, US; abstract no. 132732, BHARARA, P. C. ET AL: "Reactions of titanium alkoxides with (methylamino) alcohols" XP002236947 & ZEITSCHRIFT FUER ANORGANISCHE UND ALLGEMEINE CHEMIE (1974), 403(3), 337-4 , 1974, *
DATABASE CA [Online] CHEMICAL ABSTRACTS SERVICE, COLUMBUS, OHIO, US; ONOSAWA, KAZUHISA ET AL: "Source material for CVD and deposition of thin film using the source material" retrieved from STN Database accession no. 136:239948 CA XP002236948 & JP 2002 069641 A (ASAHI DENKA KOGYO K. K., JAPAN) 8 March 2002 (2002-03-08) *
See also references of EP1438315A2 *

Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2391555A (en) * 2002-08-09 2004-02-11 Epichem Ltd Vapour phase deposition of silicate and oxide films
GB2399568A (en) * 2003-03-17 2004-09-22 Epichem Ltd Aminoalkoxide- or alkoxyalkoxide-containing rare earth metal precursors for use in MOCVD techniques
US7927661B2 (en) 2003-03-17 2011-04-19 Sigma-Aldrich Co. Methods of depositing a metal oxide layer or film using a rare earth metal precursor
GB2399568B (en) * 2003-03-17 2007-03-21 Epichem Ltd Precursors for deposition of metal oxide layers or films
JP2007505993A (en) * 2003-09-16 2007-03-15 東京エレクトロン株式会社 Formation of metal-containing films by sequential gas exposure in batch type processing systems
WO2005027189A2 (en) * 2003-09-16 2005-03-24 Tokyo Electron Limited Formation of a metal-containing film by sequential gas exposure in a batch type processing system
WO2005027189A3 (en) * 2003-09-16 2006-01-05 Tokyo Electron Ltd Formation of a metal-containing film by sequential gas exposure in a batch type processing system
EP1698614A4 (en) * 2003-12-25 2006-12-06 Adeka Corp Metal compound, material for forming thin film and method for preparing thin film
EP1698614A1 (en) * 2003-12-25 2006-09-06 Asahi Denka Co., Ltd. Metal compound, material for forming thin film and method for preparing thin film
KR101138130B1 (en) * 2003-12-25 2012-04-23 가부시키가이샤 아데카 Metal compound, material for forming thin film and method for preparing thin film
JP2005244170A (en) * 2004-02-28 2005-09-08 Samsung Electronics Co Ltd Amorphous dielectric film and manufacturing method therefor
US8399056B2 (en) 2006-06-02 2013-03-19 L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude Method of forming high-k dielectric films based on novel titanium, zirconium, and hafnium precursors and their use for semiconductor manufacturing
US9583335B2 (en) 2006-06-02 2017-02-28 L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude Method of forming dielectric films, new precursors and their use in semiconductor manufacturing
US10217629B2 (en) 2006-06-02 2019-02-26 L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude Method of forming dielectric films, new precursors and their use in semiconductor manufacturing
US9911590B2 (en) 2006-06-02 2018-03-06 L'Air Liquide Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude Methods of forming dielectric films, new precursors and their use in semiconductor manufacturing
EP2540861A1 (en) 2006-06-02 2013-01-02 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Method of forming high-k dielectric films based on novel zirconium, and hafnium precursors and their use for semiconductor manufacturing
EP2261389A2 (en) 2006-06-02 2010-12-15 L'Air Liquide Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude Method of forming high-k dielectric films based on novel zirconium, and hafnium precursors and their use for semiconductor manufacturing
US8470402B2 (en) 2006-06-02 2013-06-25 L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude Method of depositing a metal-containing dielectric film
US8668957B2 (en) 2006-06-02 2014-03-11 L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude Method of forming dielectric films, new precursors and their use in semiconductor manufacturing
US7790628B2 (en) 2007-08-16 2010-09-07 Tokyo Electron Limited Method of forming high dielectric constant films using a plurality of oxidation sources
US7964515B2 (en) 2007-12-21 2011-06-21 Tokyo Electron Limited Method of forming high-dielectric constant films for semiconductor devices
US7816278B2 (en) 2008-03-28 2010-10-19 Tokyo Electron Limited In-situ hybrid deposition of high dielectric constant films using atomic layer deposition and chemical vapor deposition
US8613975B2 (en) 2008-05-23 2013-12-24 Sigma-Aldrich Co. Llc Methods of producing high-K dielectric films using cerium-based precursors
US9499571B2 (en) 2014-12-23 2016-11-22 L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude Germanium- and zirconium-containing compositions for vapor deposition of zirconium-containing films
US9663547B2 (en) 2014-12-23 2017-05-30 L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude Silicon- and Zirconium-containing compositions for vapor deposition of Zirconium-containing films
US9868753B2 (en) 2014-12-23 2018-01-16 L'Air Liquide, Société Anonyme our l'Etude et l'Exploitation des Procédés Georges Claude Germanium- and zirconium-containing composition for vapor deposition of zirconium-containing films
US10106568B2 (en) 2016-10-28 2018-10-23 L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude Hafnium-containing film forming compositions for vapor deposition of hafnium-containing films

Also Published As

Publication number Publication date
EP1438315B1 (en) 2006-09-27
JP4472338B2 (en) 2010-06-02
JP2005506387A (en) 2005-03-03
DE60215034T2 (en) 2007-04-05
CN1571790A (en) 2005-01-26
AU2002337310A1 (en) 2003-05-06
DE60215034D1 (en) 2006-11-09
US7419698B2 (en) 2008-09-02
CN100379745C (en) 2008-04-09
EP1438315A2 (en) 2004-07-21
ATE340800T1 (en) 2006-10-15
DE02772548T1 (en) 2004-11-11
US20050008781A1 (en) 2005-01-13
WO2003035926A3 (en) 2003-06-12

Similar Documents

Publication Publication Date Title
US7419698B2 (en) Precursors for chemical vapor deposition
US9583335B2 (en) Method of forming dielectric films, new precursors and their use in semiconductor manufacturing
EP1849789B1 (en) Metal complexes of polydentate beta-ketoiminates
US8952188B2 (en) Group 4 metal precursors for metal-containing films
US20130337659A1 (en) Novel group iv-b organometallic compound, and method for preparing same
EP1669361B1 (en) Precursors for silica or metal silicate films
KR101284664B1 (en) Organometallic compounds with silylamine ligand, and method for deposition of a thin-film of metal oxide or silicon-containing metal oxide therefrom
US20130011579A1 (en) Metal-Enolate Precursors For Depositing Metal-Containing Films
CA2223677A1 (en) Metal complex source reagents for chemical vapor deposition
KR101288919B1 (en) Novel metal complexes for metal-containing film deposition
US6736993B1 (en) Silicon reagents and low temperature CVD method of forming silicon-containing gate dielectric materials using same
US20080286464A1 (en) Group 2 Metal Precursors For Depositing Multi-Component Metal Oxide Films
US20110206863A1 (en) Organometallic compounds having sterically hindered amides
US6689427B2 (en) Group IV metal precursors and a method of chemical vapor deposition using the same
US8691710B2 (en) Group IV metal complexes for metal-containing film deposition
US7033560B2 (en) Single source mixtures of metal siloxides
US6124427A (en) Organometallic single source precursors for inorganic films coatings and powders
KR101151462B1 (en) Methods for deposition of group 4 metal containing films
KR20030095125A (en) The organometallic compounds for a thin film deposition with metals by using CVD or ALD and the method thereof
GB2422832A (en) Precursors for chemical vapour deposition comprising metal & ligand with co-ordinating N & O, separated by 2 or 3 carbons, & sterically hindering substituent
KR100367346B1 (en) Novel Group IV Metal Precursor and Chemical Vapor Deposition Method Using Thereof
US8247617B2 (en) Group 2 metal precursors for depositing multi-component metal oxide films
KR20040068027A (en) Organometallic precursor for ferroelectric ram and manufacturing method thereof
GB2398568A (en) N, N-dialkylaminooxy-Ti/Zr/Hf compounds for use in Chemical Vapour Deposition

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VC VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LU MC NL PT SE SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
WWE Wipo information: entry into national phase

Ref document number: 2002772548

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 20028204379

Country of ref document: CN

WWE Wipo information: entry into national phase

Ref document number: 2003538422

Country of ref document: JP

WWP Wipo information: published in national office

Ref document number: 2002772548

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 10493667

Country of ref document: US

WWG Wipo information: grant in national office

Ref document number: 2002772548

Country of ref document: EP