WO2003031317A3 - Mikromechanischer sensor mit selbsttestfunktion und optimierungsverfahren - Google Patents

Mikromechanischer sensor mit selbsttestfunktion und optimierungsverfahren Download PDF

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Publication number
WO2003031317A3
WO2003031317A3 PCT/DE2002/003252 DE0203252W WO03031317A3 WO 2003031317 A3 WO2003031317 A3 WO 2003031317A3 DE 0203252 W DE0203252 W DE 0203252W WO 03031317 A3 WO03031317 A3 WO 03031317A3
Authority
WO
WIPO (PCT)
Prior art keywords
self
optimization method
micromechanical sensor
test function
seismic mass
Prior art date
Application number
PCT/DE2002/003252
Other languages
English (en)
French (fr)
Other versions
WO2003031317A2 (de
Inventor
Ralf Schellin
Michael Fehrenbach
Michael Klink
Original Assignee
Bosch Gmbh Robert
Ralf Schellin
Michael Fehrenbach
Michael Klink
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert, Ralf Schellin, Michael Fehrenbach, Michael Klink filed Critical Bosch Gmbh Robert
Priority to JP2003534309A priority Critical patent/JP2005504976A/ja
Priority to US10/491,676 priority patent/US20050039530A1/en
Priority to EP02774294A priority patent/EP1438255A2/de
Publication of WO2003031317A2 publication Critical patent/WO2003031317A2/de
Publication of WO2003031317A3 publication Critical patent/WO2003031317A3/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B81C99/0055—Manufacturing logistics
    • B81C99/006—Design; Simulation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P21/00—Testing or calibrating of apparatus or devices covered by the preceding groups
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0808—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate
    • G01P2015/0811—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass
    • G01P2015/0814—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass for translational movement of the mass, e.g. shuttle type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49007—Indicating transducer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Pressure Sensors (AREA)

Abstract

Die vorliegende Erfindung schafft einen mikromechanischen Sensor mit einem Substrat (1) mit einer darauf befindlichen Strukturschicht (3); einer unter einer Federkraft relativ zur Strukturschicht (3) beweglichen seismischen Masse (5); wenigstens einer Messkondensatorelektrodenanordnung (15, 16, 17) zum Erfassen einer Verlagerung der seismischen Masse (5) in einer Messrichtung; und wenigstens einer Antriebskondensatorelektrodenanordnung (18, 19) zum Auslenken der seismischen Masse (5) in eine Selbsttestrichtung; wobei die Messrichtung senkrecht zur Selbsttestrichtung ausgerichtet ist, sowie ein entsprechendes Optimierungsverfahren.
PCT/DE2002/003252 2001-10-04 2002-09-04 Mikromechanischer sensor mit selbsttestfunktion und optimierungsverfahren WO2003031317A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2003534309A JP2005504976A (ja) 2001-10-04 2002-09-04 セルフテスト機能及び最適化方法を備えたマイクロマシニング型のセンサ
US10/491,676 US20050039530A1 (en) 2001-10-04 2002-09-04 Micromechanical sensor having a self-test function and optimization method
EP02774294A EP1438255A2 (de) 2001-10-04 2002-09-04 Mikromechanischer sensor mit selbsttestfunktion und optimierungsverfahren

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10148858A DE10148858A1 (de) 2001-10-04 2001-10-04 Mikromechanischer Sensor mit Selbsttestfunktion und Optimierungsverfahren
DE10148858.0 2001-10-04

Publications (2)

Publication Number Publication Date
WO2003031317A2 WO2003031317A2 (de) 2003-04-17
WO2003031317A3 true WO2003031317A3 (de) 2003-10-09

Family

ID=7701304

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2002/003252 WO2003031317A2 (de) 2001-10-04 2002-09-04 Mikromechanischer sensor mit selbsttestfunktion und optimierungsverfahren

Country Status (5)

Country Link
US (1) US20050039530A1 (de)
EP (1) EP1438255A2 (de)
JP (1) JP2005504976A (de)
DE (1) DE10148858A1 (de)
WO (1) WO2003031317A2 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100513345B1 (ko) * 2003-12-20 2005-09-07 삼성전기주식회사 정전용량형 ｚ축 가속도계
KR100513346B1 (ko) * 2003-12-20 2005-09-07 삼성전기주식회사 보정전극을 갖는 정전용량형 가속도계
JP4367165B2 (ja) * 2004-02-13 2009-11-18 株式会社デンソー 半導体力学量センサの検査方法
CN1314969C (zh) * 2004-04-29 2007-05-09 中国科学院上海微系统与信息技术研究所 一种单硅片体微机械工艺实现的带静电自检测的加速度计
DE102004030380B4 (de) * 2004-06-23 2010-07-29 Eads Deutschland Gmbh Mikromechanischer Drucksensor und Verfahren zum Selbsttest eines solchen
FI118930B (fi) * 2005-09-16 2008-05-15 Vti Technologies Oy Menetelmä kiihtyvyyden mikromekaaniseen mittaamiseen ja mikromekaaninen kiihtyvyysanturi
DE102007057136A1 (de) 2007-11-28 2009-06-04 Robert Bosch Gmbh Schaltung für einen mikromechanischen Körperschallsensor und Verfahren zum Betrieb eines mikromechanischen Körperschallsensors
JP5037690B2 (ja) 2008-08-18 2012-10-03 株式会社日立製作所 微小電気機械システム
DE102009028173A1 (de) * 2009-07-31 2011-02-10 Robert Bosch Gmbh Sensorvorrichtung und Herstellungsverfahren für eine Sensorvorrichtung
DE102009046807B4 (de) 2009-11-18 2023-01-05 Robert Bosch Gmbh Verfahren zur Empfindlichkeitsbestimmung eines Beschleunigungs- oder Magnetfeldsensors
US8373522B2 (en) * 2010-02-03 2013-02-12 Harris Corporation High accuracy MEMS-based varactors
GB201322918D0 (en) * 2013-12-23 2014-02-12 Atlantic Inertial Systems Ltd Accelerometers
DE102015000158A1 (de) 2015-01-05 2016-07-07 Northrop Grumman Litef Gmbh Beschleunigungssensor mit reduziertem Bias und Herstellungsverfahren eines Beschleunigungssensors
DE102015001128B4 (de) * 2015-01-29 2021-09-30 Northrop Grumman Litef Gmbh Beschleunigungssensor mit Federkraftkompensation
ITUA20162172A1 (it) 2016-03-31 2017-10-01 St Microelectronics Srl Sensore accelerometrico realizzato in tecnologia mems avente elevata accuratezza e ridotta sensibilita' nei confronti della temperatura e dell'invecchiamento
CN108020687B (zh) * 2018-02-06 2024-03-19 深迪半导体(绍兴)有限公司 一种mems加速度计
CN110739178B (zh) * 2019-09-16 2022-07-29 北京空间机电研究所 一种双弹簧单质量块加速度开关
IT201900017546A1 (it) 2019-09-30 2021-03-30 St Microelectronics Srl Dispositivo a pulsante mems resistente all'acqua, dispositivo di ingresso comprendente il dispositivo a pulsante mems e apparecchio elettronico

Citations (4)

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Publication number Priority date Publication date Assignee Title
US5345824A (en) * 1990-08-17 1994-09-13 Analog Devices, Inc. Monolithic accelerometer
US6199874B1 (en) * 1993-05-26 2001-03-13 Cornell Research Foundation Inc. Microelectromechanical accelerometer for automotive applications
US6201284B1 (en) * 1997-08-08 2001-03-13 Mitsubishi Denki Kabushiki Kaisha Multi-axis acceleration sensor and manufacturing method thereof
DE10046958A1 (de) * 1999-09-27 2001-03-29 Denso Corp Kapazitive Vorrichtung zum Erfassen einer physikalischen Grösse

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4432837B4 (de) * 1994-09-15 2004-05-13 Robert Bosch Gmbh Beschleunigungssensor und Meßverfahren

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5345824A (en) * 1990-08-17 1994-09-13 Analog Devices, Inc. Monolithic accelerometer
US6199874B1 (en) * 1993-05-26 2001-03-13 Cornell Research Foundation Inc. Microelectromechanical accelerometer for automotive applications
US6201284B1 (en) * 1997-08-08 2001-03-13 Mitsubishi Denki Kabushiki Kaisha Multi-axis acceleration sensor and manufacturing method thereof
DE10046958A1 (de) * 1999-09-27 2001-03-29 Denso Corp Kapazitive Vorrichtung zum Erfassen einer physikalischen Grösse

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DEWEY A ET AL: "BEHAVIORAL MODELING OF MICROELECTROMECHANICAL SYSTEMS (MEMS) WITH STATISTICAL PERFORMANCE-VARIABILITY REDUCTION AND SENSITIVITY ANALYSIS", IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II: ANALOG AND DIGITAL SIGNAL PROCESSING, IEEE INC. NEW YORK, US, vol. 47, no. 2, February 2000 (2000-02-01), pages 105 - 113, XP000945557, ISSN: 1057-7130 *

Also Published As

Publication number Publication date
DE10148858A1 (de) 2003-04-10
EP1438255A2 (de) 2004-07-21
JP2005504976A (ja) 2005-02-17
WO2003031317A2 (de) 2003-04-17
US20050039530A1 (en) 2005-02-24

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