WO2003028164A1 - Connection between a printed conductor and an electric contact surface and production method - Google Patents

Connection between a printed conductor and an electric contact surface and production method Download PDF

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Publication number
WO2003028164A1
WO2003028164A1 PCT/DE2002/003502 DE0203502W WO03028164A1 WO 2003028164 A1 WO2003028164 A1 WO 2003028164A1 DE 0203502 W DE0203502 W DE 0203502W WO 03028164 A1 WO03028164 A1 WO 03028164A1
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WO
WIPO (PCT)
Prior art keywords
conductor track
contact surface
wire
recess
connection
Prior art date
Application number
PCT/DE2002/003502
Other languages
German (de)
French (fr)
Inventor
Herbert Schwarzbauer
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO2003028164A1 publication Critical patent/WO2003028164A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05553—Shape in top view being rectangular
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H—ELECTRICITY
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/4826—Connecting between the body and an opposite side of the item with respect to the body
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/85399—Material
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
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    • H01L2924/01058—Cerium [Ce]
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Definitions

  • the invention relates to an electrical conductor track that is to be connected to at least one electrical contact surface, an electrical connection between an electrical conductor path and one or more electrical contact surfaces that are arranged on one side of a body, and a method for producing such a connection.
  • Power supply and discharge are usually located on one level in a printed circuit board or lead frame or on a ceramic substrate.
  • the top of the chip is usually contacted by bonding wires.
  • the object of the invention is to provide an electrical conductor track which can be connected to an electrical contact surface in a problem-free manner, in particular when large forces are required for this connection.
  • an electrical conductor track is to be connected, which is to be connected to at least one electrical contact surface, - which has at least one recess extending perpendicular to a plane of the conductor path, wherein - the recess is bridged by at least one electrical wire,
  • the contact surface is to be arranged on one side of the plane of the conductor track in the region of the recess and the wire to which the contact surface is located is assigned to move perpendicular to the plane of the conductor track in the region of its movable arc, to be brought into contact with the assigned contact area and to be connected to this contact area.
  • the wire which connects the conductor track to the contact area can advantageously always be moved back and forth or up and / or down without substantial effort, so that, for example, the problem of a vibration-free holding the conductor track does not occur when establishing a connection between the conductor track and a contact surface even if large forces have to be used to produce this connection.
  • the wire can advantageously be a bonding wire which is to be connected to the associated contact area in the region of its movable arc by bonding.
  • the bond wire is bonded to the conductor track.
  • a preferred embodiment of the conductor track according to the invention has a recess which borders on an edge side of the conductor track and is open on this edge side, so that the conductor track extends like prongs along opposite edge sides of the recess.
  • a further preferred embodiment of the conductor track according to the invention has a cutout in the form of an opening which is enclosed on all sides by the conductor track.
  • Both configurations can be combined with one another, so that a conductor track according to the invention encompasses at least one open-ended one, prong-like around the conductor track.
  • a conductor track according to the invention encompasses at least one open-ended one, prong-like around the conductor track.
  • the conductor track according to the invention can advantageously be connected to an electrical conductor track of another level by an electrically conductive step.
  • the invention also creates a new type of electrical connection between an electrical conductor track and one or more electrical contact surfaces which are arranged on one side of a body and has the features specified in claim 6.
  • the conductor track has at least one recess extending perpendicularly to a plane of the conductor track, the recess being bridged by at least one electrical wire,
  • the body is arranged on one side of the level of the conductor track so that the one side of the body, on which each contact surface to be connected to the conductor track is arranged, faces this plane and each of these contact surfaces lies in the region of the recess in the conductor track, and in which
  • a contact area connected to the conductor track can advantageously be a contact area of a body in the form of a semiconductor component, in particular a power semiconductor component, but it can also be a contact area of a body in the form of another electrical conductor track.
  • the invention also provides a method for producing a connection according to the invention by means of a conductor track according to the invention, which has the features of claim 16. A preferred embodiment of this method is specified in claim 17.
  • two connections are advantageously created per bonding process, which are very short and low-resistance.
  • the supply resistance can advantageously be reduced by an order of magnitude by means of the invention.
  • FIG. 1 shows a perspective illustration of a first exemplary embodiment of a conductor track according to the invention with a recess open on one side
  • FIG. 2 shows, in the same representation as in FIG. 1, a second exemplary embodiment of an interconnect according to the invention which has a recess which is enclosed on all sides
  • FIG. 3 shows a plan view of an exemplary embodiment of an electrical connection between an electrical conductor track and a plurality of electrical contact surfaces which are arranged on one side of a body
  • FIG. 4 shows the exemplary embodiment according to FIG. 3 in a perspective, partially sectioned illustration
  • Figure 5 is a plan view of a conventional electrical connection from previously common conductor tracks and one
  • Bodies with contact surfaces which are connected to conductor tracks
  • the electrical conductor track according to the invention designated 1 has at least one recess 11 which is perpendicular to a plane 10 of the conductor track 1, i.e. 1, 3 and 4 extends continuously through the entire conductor track 1 in the directions of the double arrow 100.
  • the recess 11 is bridged by a number of electrical wires 12, each of which is assigned a contact surface 2 (see FIGS. 2 and 4) with which the conductor track 1 is to be connected.
  • Each wire 12 is connected on opposite edge sides 111, 112 of the cutout 11 to an electrically conductive surface 110 of the conductor track 1 parallel to the plane 10 and in the area of the cutout 11 has a surface perpendicular to the plane 10 of the conductor track 1, i.e. in the directions of the double arrow 100 movable bow 120.
  • the number of wires 12 is determined by the number of assigned contact surfaces 2 and can be one, two, three or more. In Figures 1 to 3, the number is, for example, three.
  • the contact surface 2 is to be arranged on one side of the plane 10 of the conductor track 1 in the region of the recess 11, and the wire 12 of the conductor track 1, to which this contact surface 2 is assigned to move in the region of its movable arch 120 perpendicular to the plane 10 of the conductor track 1, to bring it into contact with the associated contact surface 2 and to connect it to this contact surface 2.
  • the wire 12 is preferably a bonding wire which is bonded to the surface 110 of the conductor track 1 and which is bonded to the associated contact area 2 in the region of its movable arch 120 by bonding.
  • the conductor track 1 has a cutout 11 which borders on an edge side 115 in the form of an edge surface of the conductor track 1 which extends perpendicular to the plane 10 and is open on this edge side 115, so that the conductor track 1 prongs - Like along the opposite edge sides 111 and 112 in the form of perpendicular to the plane 10 extending edge surfaces of the recess 11.
  • the exemplary embodiment of the conductor track 1 according to FIG. 2 is a conductor track 1 with a recess 11 in the form of an opening which is enclosed on all sides by the conductor track 1.
  • the conductor track 1 is connected by an electrically conductive step 41 to an electrical conductor track 4 of another plane 40, for example parallel to plane 10.
  • the other conductor track 4 has a smaller width w4 and the plane 40 in comparison to a width w1 of the conductor track 1 is arranged at a vertical distance D from the plane 10.
  • FIG. 3 shows a top view of an exemplary embodiment of an electrical connection denoted by 6 between an electrical conductor track 1 according to the invention and one or more electrical contact surfaces 2 which are arranged on one side 51 of a body 5.
  • the exemplary embodiment according to FIG. 1 is used as the conductor track 1 according to the invention, but it could equally well be the exemplary embodiment according to FIG. 2.
  • the conductor track 1 is arranged in such a way that the plane 10 and the surface 110 of the conductor track 1 are parallel to the drawing plane of this figure and thus the double arrow 100 is perpendicular to this drawing plane.
  • the body 5 is arranged in FIG. 3 below and thus on one side of the plane 10 of the conductor track 1 such that the side 51 of the body 5 defined by an upper surface of the body 5, on which each contact surface to be connected to the conductor track 1 2 is arranged, this level 10 and the conductor track 1 is facing and each of these contact surfaces 2 is in the region of the recess 11 of the conductor track 1.
  • the side 51 of the body 5 defines a plane which is arranged parallel to the plane .10 and at a distance d ⁇ D (see FIG. 4) perpendicular to the plane 10 from the conductor track 1.
  • each contact area 2 is in contact with the wire 12 of the conductor track 1 assigned to this contact area 2.
  • the area of the arc 120 of this wire 12 is preferably connected, the wire 12 preferably being a bonding wire which is connected to the associated contact area 2 by bonding.
  • the body 5 is preferably a, for example, chip-shaped semiconductor component, in particular a power semiconductor component, so that a contact area 2 connected to the conductor track 1 is a contact area of a semiconductor component, in particular a power semiconductor component.
  • a contact area 2 connected to the conductor track 1 can also be a contact area 2 of a body 5 in the form of another electrical conductor track different from the conductor track 1, this contact area 2 then being a contact area on the one defined by an electrically conductive surface of the other conductor track Page 51 of the body 5 is in the form of the other conductor track.
  • the body 5 is, for example, and at least in the case that the body 5 is a chip-shaped semiconductor component, with a side 52 facing away from one side 51 (see FIG. 4), preferably over the entire surface, on an electrically conductive surface 710 of another conductor track 71 applied, for example soldered.
  • This other conductor track 71 is preferably in the plane 40 of the other conductor track 4.
  • the other conductor track 71 has, for example in the area of the body 5, a section 711 of a relatively larger width w7, which is at least equal to a width w5 of the body 5, and a relatively narrower section 712 of a smaller width w71 adjoining this section, the narrower one Section 712 runs parallel to the other conductor track 4 at a lateral distance and its width w71 is approximately equal to the width w4 of the other conductor track 4, for example.
  • the contact surface 811 is connected in a conventional manner, for example by a wire 82, to a contact surface 3 on one side 51 of the body 5, which is not assigned to any of the wires 12 with an arc 120 and is also not connected to such a wire 12.
  • the wire 82 is a bonding wire that is bonded to both the contact area 811 and the contact area 3.
  • FIG. 4 shows a perspective and vertically sectioned illustration of the connection 6 according to FIG. 3, the section being taken along the section line II-II in FIG. 3 and the one on the right part of this section line is omitted.
  • the conductor track 1 in FIG. 4 can be the conductor track 1 according to FIGS. 1 and 3, as well as the conductor track 1 according to FIG. 2.
  • the body 5 and the conductor track 1 according to the invention are now arranged such that the body 5 is arranged on one side of the plane 10 below the conductor track 1 and the one side 51 of the body 5 on which each contact surface 2 to be connected to the conductor track 1 is arranged is this level 10 and the conductor track 1 faces and this contact surface 2 lies in the region of the recess 11 of the conductor track 1.
  • each wire 12 to which a contact surface 2 to be connected to the conductor track 1 is assigned, is arranged at a distance d1 from one side 51 of the body 5 and does not touch the contact surface 2 assigned to it.
  • This state is shown by way of example in FIG. 4 in the case of the wire 12 further from the hatched cut surface 400.
  • each wire 12 is moved in the region of its movable arc 120 perpendicular to the plane 10 of the conductor track 1, possibly by bending the wire 12, but preferably only by pivoting it vertically until this wire 12 comes into contact with the associated contact surface 2 is.
  • This state is shown by way of example in FIG. 4 in the case of the wire 12 lying closer to the hatched cutting surface 400.
  • this wire 12 is connected to this contact surface 2, preferably by bonding with a bonding tool. In this process, forces are only exerted on the wire 12, but essentially not on the conductor track 1.
  • connection between the contact surface 811 of the further conductor 81 and the contact surface 3 on one side 51 of the body 5 with the wire 82 can, depending on the geometrical spatial conditions before or after the relative arrangement of the conductor 1 and the body 5 to one another and connecting the Conductor 1 can be made with the contact surfaces 2 on one side 51 of the body 5.
  • the wire 82 is located partially under the conductor track 1. In this case, it appears expedient for the connection between the contact surface 811 of the further conductor track 81 and the contact surface 3 before the relative arrangement of the conductor track 1 and the body 5 to make each other. By contrast, if the wire 82 bridges the conductor track 1, it appears expedient to make the connection between the contact surface 811 of the further conductor track 81 and the contact surface 3 after the conductor 1 and the body 5 have been arranged relative to one another.
  • FIG. 5 shows a conventional electrical connection of conductor tracks with contact areas on one side of a body on the basis of FIG. 3 and in the same top view as in FIG. 3.
  • FIG. 5 differs from FIG. 3 essentially in that the conductor track 1 according to the invention is replaced by a conventional conductor track.
  • connection according to FIG. 5 has the same other conductor track 71 with sections 711 and 712 as in FIG. 3.
  • This conductor track 71 is arranged in the same plane 40 parallel to the drawing plane in FIG. 5 as in FIG. 3.
  • the body 5 is fastened on the section 711 of the other conductor track 71 in such a way that its one side 51, on which the contact surfaces 2 and the contact surface 3 are fastened, is turned upwards as in FIG.
  • the contact surface 811 is connected in a conventional manner by a wire 82 to the contact surface 3 on one side 51 of the body 5, and the wire 82 is a bonding wire that is bonded to both the contact surface 811 and the contact surface 3.
  • the conductor track 1 and the other conductor track 4, including the step 41 in FIG. 3 are replaced by a single conductor track 91, which is likewise arranged in the plane 40 and which is designed like the further conductor track 81 and corresponds to the other conductor track 4 of Figure 3 is arranged.
  • the conductor track 91 runs parallel to the section 712 of the other conductor track 71 with a lateral spacing, the conductor track 91 is arranged such that the other conductor track 71 is arranged between the conductor track 91 and the further conductor track 81, and the conductor track 91 ends at a distance the section 711 of the other conductor track 71 with a contact area 911.
  • the contact area 911 is connected by a wire 921 to one of the contact areas 2, which is assigned to a wire 12 with an arc 120 in FIG. 3.
  • This wire 921 is a bonding wire that is bonded both to the contact surface 911 and to the contact surface 2.
  • the contact area 911 is connected by another wire 922 to another contact area 2, which in FIG. 3 is associated with a wire 12 with an arc 120.
  • This other wire 921 is also a bonding wire that is bonded to both the contact surface 911 and the contact surface 2.
  • the third contact surface 2 which in FIG. 3 is assigned to a wire 12 with an arc 120, is missing in the connection according to FIG. 5 due to the lack of space for further wires for connecting contact surfaces.
  • FIGS. 3 and 4 illustrated and described above embodiment of the connection according to the invention per bond two connections, which are also very short and low-resistance. Since there is plenty of space on level 10, the number of bonds can be increased at the same time.
  • the lead resistance can be reduced by an order of magnitude.
  • the lead resistance can advantageously be reduced by an order of magnitude.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

The invention relates to a printed conductor (1), which is to be connected to at least one electric contact surface (2) and comprises at least one recess (11) that is bridged by at least one electric wire (12), to which the contact surface is allocated. Said wire is connected to the printed conductor on opposing sides (111, 112) of the recess and has an arc (120), which can be displaced perpendicularly to the plane (10) of the printed conductor, in the region of the recess. To produce the connection between the printed conductor and the contact surface, the wire is brought into contact with its allocated contact surface in the region of its displaceable arc and is connected to said surface. The invention also relates to a connection between the printed conductor and a body (5) and to a method for producing said connection. The connection is suitable for joining power semiconductor components.

Description

Beschreibung description
VERBINDUNG ZWISCHEN EINER LEITERBAHN UND EINER ELEKTRISCHEN KONTAKTFLÜ CHE UND HERSTELLUNGSVERFAHRENCONNECTION BETWEEN A PATH AND AN ELECTRICAL CONTACT SURFACE AND MANUFACTURING METHOD
Die Erfindung betrifft elektrische Leiterbahn, die mit zumindest einer elektrischen Kontaktfläche zu verbinden ist, eine elektrische Verbindung zwischen einer elektrischen Leiterbahn und einer oder mehreren elektrischen Kontaktflächen, die auf einer Seite eines Körpers angeordnet sind, und ein Verfahren zur Herstellung einer solchen Verbindung.The invention relates to an electrical conductor track that is to be connected to at least one electrical contact surface, an electrical connection between an electrical conductor path and one or more electrical contact surfaces that are arranged on one side of a body, and a method for producing such a connection.
Bei Leistungshalbleiterbauelementen müssen einem Leistungs- halbleiter in Form eines Chip sehr große Ströme zugeführt werden.In the case of power semiconductor components, very large currents have to be supplied to a power semiconductor in the form of a chip.
Üblicherweise befinden sich Stromzu- und -abführungen in einer Ebene in einer Leiterplatte bzw. Lead frame oder auf einem Keramiksubstrat.Power supply and discharge are usually located on one level in a printed circuit board or lead frame or on a ceramic substrate.
Während die Chipunterseite durch eine Lötung niederohmig mit der Leiterbahn verbunden ist, wird die Chipoberseite üblicherweise durch Bonddrähte kontaktiert.While the underside of the chip is connected to the conductor track with low resistance by soldering, the top of the chip is usually contacted by bonding wires.
Durch das Nebeneinanderliegen von Chip und Bondkontaktfläche bzw. -pad ergeben sich lange Bonddrähte mit entsprechend hohem Widerstand.The juxtaposition of the chip and the bond contact surface or pad results in long bond wires with a correspondingly high resistance.
Oft wird durch Platzmangel die Anzahl der Bonddrähte begrenzt .Often, the number of bond wires is limited due to a lack of space.
Durch das Einführen einer zweiten stromführenden Ebene bzw. Leiterbahn über dem Chip wird die Länge der Bonddrähte we- sentlich verkürzt, jedoch ist es äußerst schwierig, diese obenliegende zweite Leiterbahn bei den großen erforderlichen Bondkräften von einigen hundert Pond bzw. einigen Newton schwingungsfrei zu halten.By introducing a second current-carrying level or conductor track above the chip, the length of the bond wires is considerably shortened, but it is extremely difficult to require this second conductor track on the large ones To keep bond forces of a few hundred ponds or a few Newtons vibration-free.
Aufgabe der Erfindung ist es, eine elektrische Leiterbahn be- reitzustellen die problemlos mit einer elektrischen Kontaktfläche insbesondere auch dann verbunden werden kann, wenn zu dieser Verbindung große Kräfte erforderlich sind.The object of the invention is to provide an electrical conductor track which can be connected to an electrical contact surface in a problem-free manner, in particular when large forces are required for this connection.
Diese Aufgabe wird durch eine elektrische Leiterbahn gelöst, welche die im Anspruch 1 angegebenen Merkmale aufweist.This object is achieved by an electrical conductor track which has the features specified in claim 1.
Gemäß dieser Lösung ist eine elektrische Leiterbahn, die mit zumindest einer elektrischen Kontaktfläche zu verbinden ist, geschaffen, - die wenigsten eine senkrecht zu einer Ebene der Leiterbahn durchgehend sich erstreckende Aussparung aufweist, wobei - die Aussparung von zumindest einem elektrischen Draht überbrückt ist,According to this solution, an electrical conductor track is to be connected, which is to be connected to at least one electrical contact surface, - which has at least one recess extending perpendicular to a plane of the conductor path, wherein - the recess is bridged by at least one electrical wire,
- dem die Kontaktfläche zugeordnet ist, - der auf einander gegenüberliegenden Seiten (111, 112) der Aussparung mit der Leiterbahn verbunden ist und- To which the contact surface is assigned, - which is connected to the conductor track on opposite sides (111, 112) of the recess and
- der im Bereich der Aussparung einen senkrecht zur Ebene der Leiterbahn beweglichen Bogen aufweist, wobei - zur Herstellung der Verbindung zwischen der Leiterbahn und der Kontaktfläche die Kontaktfläche auf einer Seite der Ebene der Leiterbahn im Bereich der Aussparung anzuordnen ist und der Draht, dem die Kontaktfläche zugeordnet ist, im Bereich seines beweglichen Bogens senkrecht zur Ebene der Leiterbahn zu bewegen, mit der zugeordneten Kontaktfläche in Kontakt zu bringen und mit dieser Kontaktfläche zu verbinden ist.- Which in the area of the recess has an arc that is movable perpendicular to the plane of the conductor track, wherein - to establish the connection between the conductor track and the contact surface, the contact surface is to be arranged on one side of the plane of the conductor track in the region of the recess and the wire to which the contact surface is located is assigned to move perpendicular to the plane of the conductor track in the region of its movable arc, to be brought into contact with the assigned contact area and to be connected to this contact area.
Bei der erfindungsgemäßen Leiterbahn lässt sich vorteilhafterweise der die Verbindung der Leiterbahn mit der Kontaktflä- ehe herstellende Draht stets leicht ohne wesentlichen Kraftaufwand hin- und her- oder auf- und/oder abbewegen, so dass beispielsweise das Problem eines schwingungsfreien Haltens der Leiterbahn bei der Herstellung einer Verbindung zwischen der Leiterbahn und einer Kontaktfläche auch dann nicht auftritt, wenn zur Herstellung dieser Verbindung große Kräfte aufgewendet werden müssen. Dies gilt insbesondere auch für sehr dicke Drähte, wie sie für die hohen Ströme bei Leistungshalbleitern erforderlich sind.In the case of the conductor track according to the invention, the wire which connects the conductor track to the contact area can advantageously always be moved back and forth or up and / or down without substantial effort, so that, for example, the problem of a vibration-free holding the conductor track does not occur when establishing a connection between the conductor track and a contact surface even if large forces have to be used to produce this connection. This applies in particular to very thick wires, as are required for the high currents in power semiconductors.
Insbesondere kann bei der erfindungsgemäßen Leiterbahn vorteilhafterweise der Draht ein Bonddraht sein, der im Bereich seines beweglichen Bogens durch Bonden mit der zugeordneten Kontaktfläche zu verbinden ist.In particular, in the conductor track according to the invention, the wire can advantageously be a bonding wire which is to be connected to the associated contact area in the region of its movable arc by bonding.
Eine leichte Beweglichkeit des Bonddrahtes ist bei der erfindungsgemäßen Leiterbahn auch gegeben, wenn der Bonddraht an die Leiterbahn gebondet ist. Dies bedeutet vorteilhafterweise, dass der Bonddraht sowohl an die Leiterplatte als auch an die mit dieser Leiterplatte zu verbindende Kontaktfläche gebondet werden kann und dass somit zur Herstellung dieser Verbindung nur eine Verbindungstechnik erforderlich ist und nicht voneinander verschiedene Verbindungstechniken angewendet werden müssen. Dies gilt insbesondere auch für dicke Bonddrähte,' wie sie für die hohen Ströme bei Leistungshalbleitern erforderlich sind.With the conductor track according to the invention, there is also easy mobility of the bond wire if the bond wire is bonded to the conductor track. This advantageously means that the bonding wire can be bonded both to the printed circuit board and to the contact surface to be connected to this printed circuit board, and that therefore only one connection technique is required to produce this connection and different connection techniques do not have to be used. This also applies in particular to thick bond wires, as are required for the high currents in power semiconductors.
Eine bevorzugte Ausgestaltung der erfindungsgemäßen Leiterbahn weist eine Aussparung auf, die an eine Randseite der Leiterbahn grenzt und an dieser Randseite offen ist, so dass sich die Leiterbahn gabelzinkenartig entlang einander gegenüberliegenden Randseiten der Aussparung erstreckt.A preferred embodiment of the conductor track according to the invention has a recess which borders on an edge side of the conductor track and is open on this edge side, so that the conductor track extends like prongs along opposite edge sides of the recess.
Eine weiter bevorzugte Ausgestaltung der erfindungsgemäßen Leiterbahn weist eine Aussparung in Form einer Öffnung auf, die von der Leiterbahn allseitig umschlossen ist.A further preferred embodiment of the conductor track according to the invention has a cutout in the form of an opening which is enclosed on all sides by the conductor track.
Beide Ausgestaltungen können miteinander kombiniert sein, so dass eine erfindungsgemäße Leiterbahn sowohl zumindest eine einseitig offene, gabelzinkenartig von der Leiterbahn umgebe- ne Aussparung als auch eine allseitig umschlossene Aussparung aufweisen kann, deren jede von zumindest einem Draht überbrückt ist, der im Bereich dieser Aussparung einen leicht beweglichen Bogen aufweist.Both configurations can be combined with one another, so that a conductor track according to the invention encompasses at least one open-ended one, prong-like around the conductor track. can have a recess as well as a recess enclosed on all sides, each of which is bridged by at least one wire which has an easily movable arc in the region of this recess.
Die erfindungsgemäße Leiterbahn kann vorteilhafterweise durch eine elektrisch leitende Stufe mit einer elektrischen Leiterbahn einer anderen Ebene verbunden sein.The conductor track according to the invention can advantageously be connected to an electrical conductor track of another level by an electrically conductive step.
Durch die Erfindung ist auch eine neuartige elektrische Verbindung zwischen einer elektrischen Leiterbahn und einer oder mehreren elektrischen Kontaktflächen, die auf einer Seite eines Körpers angeordnet sind, geschaffen, welche die im Anspruch 6 angegebenen Merkmale aufweist.The invention also creates a new type of electrical connection between an electrical conductor track and one or more electrical contact surfaces which are arranged on one side of a body and has the features specified in claim 6.
Demnach weist bei dieser neuartigen VerbindungAccordingly, this new type of connection
- die Leiterbahn wenigsten eine senkrecht zu einer Ebene der Leiterbahn durchgehend sich erstreckende Aussparung auf, wobei - die Aussparung von zumindest einem elektrischen Draht überbrückt ist,the conductor track has at least one recess extending perpendicularly to a plane of the conductor track, the recess being bridged by at least one electrical wire,
- dem eine Kontaktfläche auf der einen Seite des Körpers zugeordnet ist,- which is assigned a contact surface on one side of the body,
- der auf einander gegenüberliegenden Seiten (111, 112) der Aussparung mit der Leiterbahn verbunden ist und- The on opposite sides (111, 112) of the recess is connected to the conductor track and
- der im Bereich der Aussparung einen senkrecht zur Ebene der Leiterbahn einen Bogen () aufweist, wobei- Which has an arc () in the area of the recess perpendicular to the plane of the conductor track, wherein
- der Körper auf einer Seite der Ebene der Leiterbahn so angeordnet ist, dass die eine Seite des Körpers, auf der jede mit der Leiterbahn zu verbindende Kontaktfläche angeordnet ist, dieser Ebene zugekehrt ist und jede dieser Kontaktflächen im Bereich der Aussparung der Leiterbahn liegt, und wobei- The body is arranged on one side of the level of the conductor track so that the one side of the body, on which each contact surface to be connected to the conductor track is arranged, faces this plane and each of these contact surfaces lies in the region of the recess in the conductor track, and in which
- jede Kontaktfläche auf der einen Seite des Körpers mit dem dieser Kontaktfläche zugeordneten Draht der Leiterbahn im Bereich des Bogens dieses Drahtes verbunden ist. Bei der erfindungsgemäßen Verbindung kann vorteilhafterweise eine mit der Leiterbahn verbundene Kontaktfläche eine Kontaktfläche eines Körpers in Form eines Halbleiterbauelements, insbesondere eines Leistungshalbleiterbauelement sein, sie kann aber auch eine Kontaktfläche eines Körpers in Form einer anderen elektrischen Leiterbahn sein.- Each contact area on one side of the body is connected to the wire of the conductor track assigned to this contact area in the region of the arc of this wire. In the connection according to the invention, a contact area connected to the conductor track can advantageously be a contact area of a body in the form of a semiconductor component, in particular a power semiconductor component, but it can also be a contact area of a body in the form of another electrical conductor track.
Weitere bevorzugte und vorteilhafte Ausgestaltungen der erfindungsgemäßen Verbindung gehen aus den Ansprüchen 11 bis 16 hervor.Further preferred and advantageous refinements of the connection according to the invention emerge from claims 11 to 16.
Durch die Erfindung ist auch ein Verfahren zur Herstellung einer erfindungsgemäßen Verbindung mittels einer erfindungsgemäßen Leiterbahn bereitgestellt, das die Merkmale des An- Spruchs 16 aufweist. Eine bevorzugte Ausführungsform dieses Verfahrens ist im Anspruch 17 angegeben.The invention also provides a method for producing a connection according to the invention by means of a conductor track according to the invention, which has the features of claim 16. A preferred embodiment of this method is specified in claim 17.
Bei dem erfindungsgemäßen Verfahren entstehen pro Bondvorgang vorteilhafterweise zwei Verbindungen, die sehr kurz und nie- derohmig sind.In the method according to the invention, two connections are advantageously created per bonding process, which are very short and low-resistance.
Durch die Erfindung kann der Zuleitüngswiderstand vorteilhafterweise um eine Größenordnung gesenkt werden.The supply resistance can advantageously be reduced by an order of magnitude by means of the invention.
Die Erfindung wird in der nachfolgenden Beschreibung anhand der Zeichnungen beispielhaft näher erläutert. Es zeigen:The invention is explained in more detail in the following description with reference to the drawings. Show it:
Figur 1 in perspektivischer Darstellung ein erstes Ausführungsbeispiel einer erfindungsgemäßen Leiterbahn mit einer einseitig offenen Aussparung,1 shows a perspective illustration of a first exemplary embodiment of a conductor track according to the invention with a recess open on one side,
Figur 2 in der gleichen Darstellung wie in Figur 1 ein zweites Ausführungsbeispiel einer erfindungsgemäßen Leiterbahn, die eine allseitig umschlossene Aussparung aufweist, Figur 3 eine Draufsicht auf ein Ausführungsbeispiel einer e- lektrischen Verbindung zwischen einer elektrischen Leiterbahn und mehreren elektrischen Kontaktflächen, die auf einer Seite eines Körpers angeordnet sind,FIG. 2 shows, in the same representation as in FIG. 1, a second exemplary embodiment of an interconnect according to the invention which has a recess which is enclosed on all sides, FIG. 3 shows a plan view of an exemplary embodiment of an electrical connection between an electrical conductor track and a plurality of electrical contact surfaces which are arranged on one side of a body,
Figur 4 das Ausführungsbeispiel nach Figur 3 in perspektivischer, teilweise geschnittener Darstellung,FIG. 4 shows the exemplary embodiment according to FIG. 3 in a perspective, partially sectioned illustration,
Figur 5 eine Draufsicht auf eine herkömmliche elektrische Verbindung aus bisher üblichen Leiterbahnen und einemFigure 5 is a plan view of a conventional electrical connection from previously common conductor tracks and one
Körper mit Kontaktflächen, die mit Leiterbahnen verbunden sind, undBodies with contact surfaces which are connected to conductor tracks, and
Die Zeichnungen sind schematisch und nicht maßstäblich.The drawings are schematic and not to scale.
Gemäß den Figuren 1 bis 4 weist die mit 1 bezeichnete erfindungsgemäße elektrische Leiterbahn wenigsten eine Aussparung 11 auf, die sich senkrecht zu einer Ebene 10 der Leiterbahn 1, d.h. in den Richtungen des Doppelpfeiles 100 in den Figu- ren 1, 3 und 4 durchgehend durch die ganze Leiterbahn 1 erstreckt.According to FIGS. 1 to 4, the electrical conductor track according to the invention, designated 1, has at least one recess 11 which is perpendicular to a plane 10 of the conductor track 1, i.e. 1, 3 and 4 extends continuously through the entire conductor track 1 in the directions of the double arrow 100.
Die Aussparung 11 ist von einer Anzahl elektrischer Drähte 12 überbrückt, deren jedem je eine Kontaktfläche 2 (siehe Figu- ren 2 und 4), mit der die Leiterbahn 1 zu verbinden ist, zugeordnet ist. Jeder Draht 12 ist auf einander gegenüberliegenden Randseiten 111, 112 der Aussparung 11 mit einer zur Ebene 10 parallelen elektrisch leitenden Oberfläche 110 der Leiterbahn 1 verbunden und weist im Bereich der Aussparung 11 einen senkrecht zur Ebene 10 der Leiterbahn 1, d.h. in den Richtungen des Doppelpfeiles 100 beweglichen Bogen 120 auf.The recess 11 is bridged by a number of electrical wires 12, each of which is assigned a contact surface 2 (see FIGS. 2 and 4) with which the conductor track 1 is to be connected. Each wire 12 is connected on opposite edge sides 111, 112 of the cutout 11 to an electrically conductive surface 110 of the conductor track 1 parallel to the plane 10 and in the area of the cutout 11 has a surface perpendicular to the plane 10 of the conductor track 1, i.e. in the directions of the double arrow 100 movable bow 120.
Die Anzahl der Drähte 12 ist von der Anzahl der zugeordneten Kontaktflächen 2 bestimmt und kann eins, zwei, drei und mehr betragen. In den Figuren 1 bis 3 ist die Anzahl beispielsweise gleich drei. Zur Herstellung der Verbindung zwischen der Leiterbahn 1 und einer Kontaktfläche 2 ist die Kontaktfläche 2 auf einer Seite der Ebene 10 der Leiterbahn 1 im Bereich der Aussparung 11 anzuordnen, und der Draht 12 der Leiterbahn 1, dem diese Kon- taktfläche 2 zugeordnet ist, ist im Bereich seines beweglichen Bogens 120 senkrecht zur Ebene 10 der Leiterbahn 1 zu bewegen, mit der zugeordneten Kontaktfläche 2 in Kontakt zu bringen und mit dieser Kontaktfläche 2 zu verbinden.The number of wires 12 is determined by the number of assigned contact surfaces 2 and can be one, two, three or more. In Figures 1 to 3, the number is, for example, three. To establish the connection between the conductor track 1 and a contact surface 2, the contact surface 2 is to be arranged on one side of the plane 10 of the conductor track 1 in the region of the recess 11, and the wire 12 of the conductor track 1, to which this contact surface 2 is assigned to move in the region of its movable arch 120 perpendicular to the plane 10 of the conductor track 1, to bring it into contact with the associated contact surface 2 and to connect it to this contact surface 2.
Vorzugsweise ist der Draht 12 ein Bonddraht, der an die Oberfläche 110 der Leiterbahn 1 gebondet ist und der im Bereich seines beweglichen Bogens 120 durch Bonden mit der zugeordneten Kontaktfläche 2 verbunden wird.The wire 12 is preferably a bonding wire which is bonded to the surface 110 of the conductor track 1 and which is bonded to the associated contact area 2 in the region of its movable arch 120 by bonding.
Beim Ausführungsbeispiel der Leiterbahn nach Figur 1 weist die Leiterbahn 1 eine Aussparung 11 auf, die an eine Randseite 115 in Form einer sich senkrecht zur Ebene 10 erstreckenden Randfläche der Leiterbahn 1 grenzt und an dieser Randseite 115 offen ist, so dass sich die Leiterbahn 1 gabelzinken- artig entlang den einander gegenüberliegenden Randseiten 111 und 112 in Form von sich senkrecht zur Ebene 10 erstreckenden Randflächen der Aussparung 11 erstreckt.In the exemplary embodiment of the conductor track according to FIG. 1, the conductor track 1 has a cutout 11 which borders on an edge side 115 in the form of an edge surface of the conductor track 1 which extends perpendicular to the plane 10 and is open on this edge side 115, so that the conductor track 1 prongs - Like along the opposite edge sides 111 and 112 in the form of perpendicular to the plane 10 extending edge surfaces of the recess 11.
Das Ausführungsbeispiel der Leiterbahn 1 nach Figur 2 ist eine Leiterbahn 1 mit einer Aussparung 11 in Form einer Öffnung, die von der Leiterbahn 1 allseitig umschlossen ist. Dies bedeutet im Vergleich zum Ausführungsbeispiel nach Figur 1, dass die Randseite 115 der Leiterbahn 1 durchgehend geschlossen und nicht wie in Figur 1 durch die Aussparung 11 unterbrochen ist und eine Lücke aufweist.The exemplary embodiment of the conductor track 1 according to FIG. 2 is a conductor track 1 with a recess 11 in the form of an opening which is enclosed on all sides by the conductor track 1. In comparison to the exemplary embodiment according to FIG. 1, this means that the edge side 115 of the conductor track 1 is continuously closed and is not interrupted by the recess 11 as in FIG. 1 and has a gap.
Sowohl beim Ausführungsbeispiel nach Figur 1 als auch nach Figur 2 ist die Leiterbahn 1 durch eine elektrisch leitende Stufe 41 mit einer elektrischen Leiterbahn 4 einer anderen, beispielsweise zur Ebene 10 parallelen Ebene 40 verbunden.Both in the exemplary embodiment according to FIG. 1 and according to FIG. 2, the conductor track 1 is connected by an electrically conductive step 41 to an electrical conductor track 4 of another plane 40, for example parallel to plane 10.
Die andere Leiterbahn 4 weist im Vergleich zu einer Breite wl der Leiterbahn 1 eine kleinere Breite w4 auf und die Ebene 40 ist in einem senkrechten Abstand D von der Ebene 10 angeordnet.The other conductor track 4 has a smaller width w4 and the plane 40 in comparison to a width w1 of the conductor track 1 is arranged at a vertical distance D from the plane 10.
In der Figur 3 ist in Draufsicht ein Ausführungsbeispiel einer mit 6 bezeichneten elektrischen Verbindung zwischen einer erfindungsgemäßen elektrischen Leiterbahn 1 und einer oder mehreren elektrischen Kontaktflächen 2, die auf einer Seite 51 eines Körpers 5 angeordnet sind, dargestellt.FIG. 3 shows a top view of an exemplary embodiment of an electrical connection denoted by 6 between an electrical conductor track 1 according to the invention and one or more electrical contact surfaces 2 which are arranged on one side 51 of a body 5.
Beispielsweise ist als erfindungsgemäße Leiterbahn 1 das Ausführungsbeispiel nach Figur 1 verwendet, sie könnte aber ebenso gut das Ausführungsbeispiel nach Figur 2 sein.For example, the exemplary embodiment according to FIG. 1 is used as the conductor track 1 according to the invention, but it could equally well be the exemplary embodiment according to FIG. 2.
In der Figur 3 ist die Leiterbahn 1 so angeordnet, dass die Ebene 10 und die Oberfläche 110 der Leiterbahn 1 parallel zur Zeichenebene dieser Figur und somit der Doppelpfeil 100 senkrecht zu dieser Zeichenebene sind.In FIG. 3, the conductor track 1 is arranged in such a way that the plane 10 and the surface 110 of the conductor track 1 are parallel to the drawing plane of this figure and thus the double arrow 100 is perpendicular to this drawing plane.
Der Körper 5 ist in der Figur 3 unterhalb und damit auf einer Seite der Ebene 10 der Leiterbahn 1 so angeordnet, dass die durch eine obere Oberfläche des Körpers 5 definierte eine Seite 51 des Körpers 5, auf der jede mit der Leiterbahn 1 zu verbindende Kontaktfläche 2 angeordnet ist, dieser Ebene 10 und der Leiterbahn 1 zugekehrt ist und jede dieser Kontakt- flächen 2 im Bereich der Aussparung 11 der Leiterbahn 1 liegt. Beispielsweise definiert die Seite 51 des Körpers 5 eine Ebene, die zur Ebene .10 parallel und in einem zur Ebene 10 senkrechten Abstand d < D (siehe Figur 4) von der Leiterbahn 1 angeordnet ist.The body 5 is arranged in FIG. 3 below and thus on one side of the plane 10 of the conductor track 1 such that the side 51 of the body 5 defined by an upper surface of the body 5, on which each contact surface to be connected to the conductor track 1 2 is arranged, this level 10 and the conductor track 1 is facing and each of these contact surfaces 2 is in the region of the recess 11 of the conductor track 1. For example, the side 51 of the body 5 defines a plane which is arranged parallel to the plane .10 and at a distance d <D (see FIG. 4) perpendicular to the plane 10 from the conductor track 1.
Von drei auf der Seite 51 angeordneten Kontaktflächen 2 ist jede Kontaktfläche 2 mit dem dieser Kontaktfläche 2 zugeordneten Draht 12 der Leiterbahn 1 im. Bereich des Bogens 120 dieses Drahtes 12 vorzugsweise verbunden wobei der Draht 12 vorzugsweise ein Bonddraht ist, der durch Bonden mit der zugeordneten Kontaktfläche 2 verbunden ist. Der Körper 5 ist vorzugsweise ein beispielsweise chipförmiges Halbleiterbauelement, insbesondere ein Leistungshalbleiterbauelement, so dass eine mit der Leiterbahn 1 verbundene Kontaktfläche 2 eine Kontaktfläche eines Halbleiterbauelements, insbesondere eines Leistungshalbleiterbauelements ist.Of three contact areas 2 arranged on the side 51, each contact area 2 is in contact with the wire 12 of the conductor track 1 assigned to this contact area 2. The area of the arc 120 of this wire 12 is preferably connected, the wire 12 preferably being a bonding wire which is connected to the associated contact area 2 by bonding. The body 5 is preferably a, for example, chip-shaped semiconductor component, in particular a power semiconductor component, so that a contact area 2 connected to the conductor track 1 is a contact area of a semiconductor component, in particular a power semiconductor component.
Eine mit der Leiterbahn 1 verbundene Kontaktfläche 2 kann auch eine Kontaktfläche 2 eines Körpers 5 in Form einer von der Leiterbahn 1 verschiedenen anderen elektrischen Leiter- bahn sein, wobei dann diese Kontaktfläche 2 eine Kontaktfläche auf der durch eine elektrisch leitende Oberfläche der anderen Leiterbahn definierten einen Seite 51 des Körpers 5 in Form der anderen Leiterbahn ist.A contact area 2 connected to the conductor track 1 can also be a contact area 2 of a body 5 in the form of another electrical conductor track different from the conductor track 1, this contact area 2 then being a contact area on the one defined by an electrically conductive surface of the other conductor track Page 51 of the body 5 is in the form of the other conductor track.
Der Körper 5 ist beispielsweise und zumindest in dem Fall, dass der Körper 5 ein chipförmiges Halbleiterbauelement ist, mit einer von der einen Seite 51 abgekehrten Seite 52 (siehe Figur 4) flächig, vorzugsweise ganzflächig, auf einer elektrisch leitenden Oberfläche 710 einer anderen Leiterbahn 71 aufgebracht, beispielsweise aufgelötet. Diese andere Leiterbahn 71 liegt vorzugsweise in der Ebene 40 der anderen Leiterbahn 4.The body 5 is, for example, and at least in the case that the body 5 is a chip-shaped semiconductor component, with a side 52 facing away from one side 51 (see FIG. 4), preferably over the entire surface, on an electrically conductive surface 710 of another conductor track 71 applied, for example soldered. This other conductor track 71 is preferably in the plane 40 of the other conductor track 4.
Die andere Leiterbahn 71 weist beispielsweise im Bereich des Körpers 5 einen Abschnitt 711 einer relativ größeren Breite w7, die mindestens gleich einer Breite w5 des Körpers 5 ist, und einen an diese Abschnitt angrenzenden relativ schmaleren Abschnitt 712 einer kleineren Breite w71 auf, wobei der schmalere Abschnitt 712 mit seitlichem Abstand parallel zur anderen Leiterbahn 4 verläuft und seine Breite w71 beispielsweise etwa gleich der Breite w4 der anderen Leiterbahn 4 ist.The other conductor track 71 has, for example in the area of the body 5, a section 711 of a relatively larger width w7, which is at least equal to a width w5 of the body 5, and a relatively narrower section 712 of a smaller width w71 adjoining this section, the narrower one Section 712 runs parallel to the other conductor track 4 at a lateral distance and its width w71 is approximately equal to the width w4 of the other conductor track 4, for example.
Überdies ist in der Ebene 40 der anderen Leiterbahn 4 eine weitere Leiterbahn 81 vorhanden, die mit seitlichem Abstand parallel zum schmaleren Abschnitt 712 der anderen Leiterbahn 71 verläuft, die beispielsweise so angeordnet ist, dass die andere Leiterbahn 71 zwischen der anderen Leiterbahn 4 und der weiteren Leiterbahn 81 angeordnet ist, die beispielsweise eine Breite w81 von etwa der Breite w4 und/oder w71 aufweist, und die mit Abstand vor dem Abschnitt 711 relativ größeren Breite w7 der anderen Leiterbahn 71 mit einer Kontaktfläche 811 endet.In addition, in the plane 40 of the other conductor track 4 there is another conductor track 81 which runs at a lateral distance parallel to the narrower section 712 of the other conductor track 71, which is arranged, for example, in such a way that the other conductor track 71 between the other conductor track 4 and the further conductor track 81 is arranged, which for example has a width w81 of approximately the width w4 and / or w71, and which ends at a distance in front of the section 711 of relatively larger width w7 of the other conductor track 71 with a contact area 811.
Die Kontaktfläche 811 ist beispielsweise auf herkömmliche Weise durch einen Draht 82 mit einer Kontaktfläche 3 auf der einen Seite 51 des Körpers 5 verbunden, die keinem der Drähte 12 mit Bogen 120 zugeordnet ist und auch nicht mit einem solchen Draht 12 verbunden ist. Beispielsweise ist der Draht 82 ein Bonddraht, der sowohl an die Kontaktfläche 811 als auch die Kontaktfläche 3 gebondet ist.The contact surface 811 is connected in a conventional manner, for example by a wire 82, to a contact surface 3 on one side 51 of the body 5, which is not assigned to any of the wires 12 with an arc 120 and is also not connected to such a wire 12. For example, the wire 82 is a bonding wire that is bonded to both the contact area 811 and the contact area 3.
Ein beispielhaftes Verfahren zur Herstellung einer Verbindung 6 nach Figur 3 sei beispielsweise anhand der Figur 4 erläutert, die eine perspektivische und vertikal geschnittene Darstellung der Verbindung 6 nach Figur 3 zeigt, wobei der Schnitt längs der Schnittlinie II-II in Figur 3 geführt und der rechts von dieser Schnittlinie liegende Teil fortgelassen ist.An example of a method for producing a connection 6 according to FIG. 3 is explained, for example, with reference to FIG. 4, which shows a perspective and vertically sectioned illustration of the connection 6 according to FIG. 3, the section being taken along the section line II-II in FIG. 3 and the one on the right part of this section line is omitted.
Die Leiterbahn 1 in Figur 4 kann die Leiterbahn 1 nach Figur 1 und 3, ebenso gut auch die Leiterbahnl nach Figur 2 sein.The conductor track 1 in FIG. 4 can be the conductor track 1 according to FIGS. 1 and 3, as well as the conductor track 1 according to FIG. 2.
Es sei beispielsweise angenommen, dass der Körper 5 bereits auf dem relativ breiteren Abschnitt 711 der anderen Leiterbahn 71 befestigt ist und die weitere Leiterbahn 81 mit der Anschlussfläche 811 in der richtigen Lage fest neben der an- deren Leiterbahn 71 angeordnet ist.It is assumed, for example, that the body 5 is already fastened on the relatively wider section 711 of the other conductor track 71 and the further conductor track 81 with the connection area 811 is arranged in the correct position next to the other conductor track 71.
Nun werden der Körpers 5 und die erfindungsgemäße Leiterbahn 1 so angeordnet, dass der Körper 5 auf einer Seite der Ebene 10 unterhalb der Leiterbahn 1 angeordnet ist und die eine Seite 51 des Körpers 5, auf der jede mit der Leiterbahn 1 zu verbindende Kontaktfläche 2 angeordnet ist, dieser Ebene 10 und der Leiterbahn 1 zugekehrt ist und diese Kontaktfläche 2 im Bereich der Aussparung 11 der Leiterbahn 1 liegt.The body 5 and the conductor track 1 according to the invention are now arranged such that the body 5 is arranged on one side of the plane 10 below the conductor track 1 and the one side 51 of the body 5 on which each contact surface 2 to be connected to the conductor track 1 is arranged is this level 10 and the conductor track 1 faces and this contact surface 2 lies in the region of the recess 11 of the conductor track 1.
Es sei weiter angenommen, dass der bewegliche Bogen 120 jedes Drahtes 12, dem eine mit der Leiterbahn 1 zu verbindende Kontaktfläche 2 zugeordnet ist, in einem Abstand dl von der einen Seite 51 des Körpers 5 angeordnet ist und die ihm zugeordnete Kontaktfläche 2 nicht berührt. In der Figur 4 ist dieser Zustand bei dem von der schraffierten Schnittfläche 400 ferneren Draht 12 beispielhaft gezeigt.It is further assumed that the movable arc 120 of each wire 12, to which a contact surface 2 to be connected to the conductor track 1 is assigned, is arranged at a distance d1 from one side 51 of the body 5 and does not touch the contact surface 2 assigned to it. This state is shown by way of example in FIG. 4 in the case of the wire 12 further from the hatched cut surface 400.
Nun wird jeder Draht 12 im Bereich seines beweglichen Bogens 120 senkrecht zur Ebene 10 der Leiterbahn 1, ggf. unter Ver- biegung des Drahtes 12, vorzugsweise_ aber nur durch vertika- les Verschwenken bewegt, bis dieser Draht 12 mit der zugeordneten Kontaktfläche 2 in Kontakt ist. In der Figur 4 ist dieser Zustand bei dem der schraffierten Schnittfläche 400 näherliegenden Draht 12 beispielhaft gezeigt.Now each wire 12 is moved in the region of its movable arc 120 perpendicular to the plane 10 of the conductor track 1, possibly by bending the wire 12, but preferably only by pivoting it vertically until this wire 12 comes into contact with the associated contact surface 2 is. This state is shown by way of example in FIG. 4 in the case of the wire 12 lying closer to the hatched cutting surface 400.
Danach wird dieser Draht 12 mit dieser Kontaktfläche 2 verbunden, vorzugsweise durch Bonden mit einem Bondwerkzeug. Bei diesem Vorgang werden Kräfte nur auf den Draht 12, im Wesentlichen aber nicht auf die Leiterbahn 1 ausgeübt.Then this wire 12 is connected to this contact surface 2, preferably by bonding with a bonding tool. In this process, forces are only exerted on the wire 12, but essentially not on the conductor track 1.
Die Verbindung zwischen der Kontaktfläche 811 der weiteren Leiterbahn 81 und der Kontaktfläche 3 auf der einen Seite 51 des Körpers 5 mit dem Draht 82 kann je nach den geometrisch räumlichen Gegebenheiten vor oder nach dem relativen Anordnen der Leiterbahn 1 und des Körpers 5 zueinander und Verbinden der Leiterbahn 1 mit den Kontaktflächen 2 auf der einen Seite 51 des Körpers 5 vorgenommen werden.The connection between the contact surface 811 of the further conductor 81 and the contact surface 3 on one side 51 of the body 5 with the wire 82 can, depending on the geometrical spatial conditions before or after the relative arrangement of the conductor 1 and the body 5 to one another and connecting the Conductor 1 can be made with the contact surfaces 2 on one side 51 of the body 5.
Beim Beispiel nach den Figuren 3 und 4 befindet sich der Draht 82 teilweise unter der Leiternbahn 1. In diesem Fall erscheint es zweckmäßig die Verbindung zwischen der Kontaktfläche 811 der weiteren Leiterbahn 81 und der Kontaktfläche 3 vor dem relativen Anordnen der Leiterbahn 1 und des Körpers 5 zueinander vorzunehmen. Überbrückt dagegen der Draht 82 die Leiterbahn 1 erscheint es zweckmäßig die Verbindung zwischen der Kontaktfläche 811 der weiteren Leiterbahn 81 und der Kontaktfläche 3 nach dem relativen Anordnen der Leiterbahn 1 und des Körpers 5 zueinander vorzunehmen.In the example according to FIGS. 3 and 4, the wire 82 is located partially under the conductor track 1. In this case, it appears expedient for the connection between the contact surface 811 of the further conductor track 81 and the contact surface 3 before the relative arrangement of the conductor track 1 and the body 5 to make each other. By contrast, if the wire 82 bridges the conductor track 1, it appears expedient to make the connection between the contact surface 811 of the further conductor track 81 and the contact surface 3 after the conductor 1 and the body 5 have been arranged relative to one another.
Die Figur 5 zeigt zum Vergleich eine herkömmliche elektrische Verbindung von Leiterbahnen mit Kontaktflächen auf einer Seite eines Körpers auf der Basis der Figur 3 und in der glei- chen Draufsicht wie in Figur 3.For comparison, FIG. 5 shows a conventional electrical connection of conductor tracks with contact areas on one side of a body on the basis of FIG. 3 and in the same top view as in FIG. 3.
Die Figur 5 unterscheidet sich von der Figur 3 im wesentlichen dadurch, dass die erfindungsgemäße Leiterbahn 1 durch eine herkömmliche Leiterbahn ersetzt ist.FIG. 5 differs from FIG. 3 essentially in that the conductor track 1 according to the invention is replaced by a conventional conductor track.
Demgemäss weist die Verbindung nach Figur 5 die gleiche andere Leiterbahn 71 mit den Abschnitten 711 und 712 wie in Figur 3 auf. Diese Leiterbahn 71 ist in der gleichen zur Zeichenebene der Figur 5 parallelen Ebene 40 wie bei der Figur 3 an- geordnet.Accordingly, the connection according to FIG. 5 has the same other conductor track 71 with sections 711 and 712 as in FIG. 3. This conductor track 71 is arranged in the same plane 40 parallel to the drawing plane in FIG. 5 as in FIG. 3.
Auf dem Abschnitt 711 der anderen Leiterbahn 71 ist der Körper 5 so befestigt, dass seine eine Seite 51, auf der die Kontaktflächen 2 und die Kontaktfläche 3 befestigt sind, wie bei der Figur 3 nach oben gekehrt ist.The body 5 is fastened on the section 711 of the other conductor track 71 in such a way that its one side 51, on which the contact surfaces 2 and the contact surface 3 are fastened, is turned upwards as in FIG.
In der Ebene 40 ist wie bei der Figur 3 die weitere Leiterbahn 81, die mit seitlichem Abstand parallel zum Abschnitt 712 der anderen Leiterbahn 71 verläuft und mit Abstand vor dem Abschnitt 711 der anderen Leiterbahn 71 mit einer Kontaktfläche 811 endet.In plane 40, as in FIG. 3, is the further conductor track 81, which runs parallel to section 712 of the other conductor track 71 at a lateral distance and ends at a distance in front of section 711 of the other conductor track 71 with a contact area 811.
Die Kontaktfläche 811 ist auf herkömmliche Weise durch einen Draht 82 mit der Kontaktfläche 3 auf der einen Seite 51 des Körpers 5 verbunden, und der Draht 82 ist ein Bonddraht, der sowohl an die Kontaktfläche 811 als auch die Kontaktfläche 3 gebondet ist. Die Leiterbahn 1 und die andere Leiterbahn 4 einschließlich der Stuf 41 der Figur 3 sind bei der Verbindung nach Figur 5 durch eine einzige Leiterbahn 91 ersetzt, die ebenfalls in der Ebene 40 angeordnet ist und die wie die weitere Leiterbahn 81 ausgebildet und entsprechend der anderen Leiterbahn 4 der Figur 3 angeordnet ist.The contact surface 811 is connected in a conventional manner by a wire 82 to the contact surface 3 on one side 51 of the body 5, and the wire 82 is a bonding wire that is bonded to both the contact surface 811 and the contact surface 3. In the connection according to FIG. 5, the conductor track 1 and the other conductor track 4, including the step 41 in FIG. 3, are replaced by a single conductor track 91, which is likewise arranged in the plane 40 and which is designed like the further conductor track 81 and corresponds to the other conductor track 4 of Figure 3 is arranged.
Demgemäss verläuft die Leiterbahn 91 mit seitlichem Abstand parallel zum Abschnitt 712 der anderen Leiterbahn 71, ist die Leiterbahn 91 so angeordnet ist, dass die andere Leiterbahn 71 zwischen der Leiterbahn 91 und der weiteren Leiterbahn 81 angeordnet ist, und endet die Leiterbahn 91 mit Abstand vor dem Abschnitt 711 der anderen Leiterbahn 71 mit einer Kon- taktfläche 911.Accordingly, the conductor track 91 runs parallel to the section 712 of the other conductor track 71 with a lateral spacing, the conductor track 91 is arranged such that the other conductor track 71 is arranged between the conductor track 91 and the further conductor track 81, and the conductor track 91 ends at a distance the section 711 of the other conductor track 71 with a contact area 911.
Die Kontaktfläche 911 ist durch einen Draht 921 mit einer der Kontaktflächen 2, die in der Figur 3 einem Draht 12 mit Bogen 120 zugeordnet ist, verbunden. Dieser Draht 921 ist ein Bond- draht, der sowohl an die Kontaktfläche 911 als auch an die Kontaktfläche 2 gebondet ist.The contact area 911 is connected by a wire 921 to one of the contact areas 2, which is assigned to a wire 12 with an arc 120 in FIG. 3. This wire 921 is a bonding wire that is bonded both to the contact surface 911 and to the contact surface 2.
Außerdem ist die Kontaktfläche 911 durch einen anderen Draht 922 mit einer anderen Kontaktflächen 2, die in der Figur 3 einem Draht 12 mit Bogen 120 zugeordnet ist, verbunden. Dieser andere Draht 921 ist ebenfalls ein Bonddraht, der sowohl an die Kontaktfläche 911 als auch an die Kontaktfläche 2 gebondet ist.In addition, the contact area 911 is connected by another wire 922 to another contact area 2, which in FIG. 3 is associated with a wire 12 with an arc 120. This other wire 921 is also a bonding wire that is bonded to both the contact surface 911 and the contact surface 2.
Die dritte Kontaktfläche 2, die in der Figur 3 einem Draht 12 mit Bogen 120 zugeordnet ist, fehlt bei der Verbindung nach Figur 5 aus Mangel an Platz für weitere Drähte zur Verbindung von Kontaktflächen.The third contact surface 2, which in FIG. 3 is assigned to a wire 12 with an arc 120, is missing in the connection according to FIG. 5 due to the lack of space for further wires for connecting contact surfaces.
Im Gegensatz dazu entstehen bei der Herstellung des in denIn contrast, the production of the in the
Figuren 3 und 4 dargestellten und oben beschriebenen Ausführungsbeispiels der erfindungsgemäßen Verbindung pro Bondvor- gang zwei Verbindungen, die zudem sehr kurz und niederohmig sind. Da in der Ebene 10 reichlich Platz zur Verfügung steht kann gleichzeitig die Anzahl der Bonds erhöht werden.FIGS. 3 and 4 illustrated and described above embodiment of the connection according to the invention per bond two connections, which are also very short and low-resistance. Since there is plenty of space on level 10, the number of bonds can be increased at the same time.
Der Zuleitungswiderstand kann auf diese Weise durchaus um eine Größenordnung gesenkt werden.In this way, the lead resistance can be reduced by an order of magnitude.
Bei diesem Verfahren entstehen pro Bondvorgang zwei Verbindungen, die zudem sehr kurz und niederohmig sind. Da in der zweiten Ebene die Anzahl der Bonds erhöht werden.With this method, two connections are created per bonding process, which are also very short and low-resistance. Because the number of bonds is increased in the second level.
Der Zuleitungswiderstand kann auf diese Weise dadurch vorteilhafterweise um eine Größenordnung gesenkt werden. In this way, the lead resistance can advantageously be reduced by an order of magnitude.

Claims

Patentansprüche claims
1. Elektrische Leiterbahn (1), die mit zumindest einer elektrischen Kontaktfläche (2) zu verbinden ist, wobei - die Leiterbahn (1) wenigsten eine senkrecht zu einer Ebene (10) der Leiterbahn (1) durchgehend sich erstreckende Aussparung (11) aufweist, und wobei1. Electrical conductor track (1), which is to be connected to at least one electrical contact surface (2), wherein - the conductor track (1) has at least one recess (11) extending perpendicular to a plane (10) of the conductor track (1) , and where
- die Aussparung (11) von zumindest einem elektrischen Draht (12) überbrückt ist, - dem die Kontaktfläche (2) zugeordnet ist,- The cutout (11) is bridged by at least one electrical wire (12) - to which the contact surface (2) is assigned,
- der auf einander gegenüberliegenden Seiten (111, 112) der Aussparung (11) mit der Leiterbahn (1) verbunden ist und- The on opposite sides (111, 112) of the recess (11) with the conductor track (1) is connected and
- der im Bereich der Aussparung (11) einen senkrecht zur Ebene (10) der Leiterbahn (1) beweglichen Bogen (120) auf- weist, wobei- In the area of the recess (11) has an arc (120) movable perpendicular to the plane (10) of the conductor track (1), wherein
- zur Herstellung der Verbindung zwischen der Leiterbahn (1) und der Kontaktfläche (2) die Kontaktfläche (2) auf einer Seite der Ebene (10) der Leiterbahn- (1) im Bereich der Aus- sparung (11) anzuordnen ist und der Draht (12) , dem die Kontaktfläche (2) zugeordnet ist, im Bereich seines beweglichen Bogens (120) senkrecht zur Ebene (10) der Leiterbahn (1) zu bewegen, mit der zugeordneten Kontaktfläche (2) in Kontakt zu bringen und mit dieser Kontaktfläche (2) zu verbinden ist.- To establish the connection between the conductor track (1) and the contact surface (2), the contact surface (2) is to be arranged on one side of the plane (10) of the conductor track (1) in the region of the recess (11) and the wire (12), to which the contact surface (2) is assigned, to move in the region of its movable arch (120) perpendicular to the plane (10) of the conductor track (1), to bring it into contact with the assigned contact surface (2) and with this contact surface (2) is to be connected.
2. Leiterbahn (1) nach Anspruch 1, wobei der Draht (12) ein Bonddraht ist, der im Bereich seines beweglichen Bogens (120) durch Bonden mit der zugeordneten Kontaktfläche (2) zu verbinden ist.2. The conductor track (1) according to claim 1, wherein the wire (12) is a bonding wire that is to be connected in the region of its movable arch (120) by bonding with the associated contact surface (2).
3. Leiterbahn (1) nach Anspruch 2, wobei der Bonddraht (12) an die Leiterbahn (1) gebondet ist.3. conductor track (1) according to claim 2, wherein the bonding wire (12) to the conductor track (1) is bonded.
4. Leiterbahn (1) nach einem der vorhergehenden Ansprüche, mit einer Aussparung (11) , die an eine Randseite (115) auf der Leiterbahn (1) grenzt und an dieser Randseite (115) offen ist, so dass sich die Leiterbahn (1) gabelzinkenartig entlang einander gegenüberliegenden Randseiten (116) der Aussparung4. conductor track (1) according to one of the preceding claims, with a recess (11) which borders on an edge side (115) on the conductor track (1) and is open on this edge side (115), so that the conductor track (1 ) along forks opposite edge sides (116) of the recess
(11) erstreckt.(11) extends.
5. Leiterbahn (1) nach einem der vorhergehenden Ansprüche, mit einer Aussparung (11) in Form einer Öffnung, die von der Leiterbahn (1) allseitig umschlossen ist.5. conductor track (1) according to one of the preceding claims, with a recess (11) in the form of an opening which is enclosed on all sides by the conductor track (1).
6. Leiterbahn (1) nach einem der vorhergehenden Ansprüche, die durch eine elektrisch leitende Stufe (41) mit einer elektrischen Leiterbahn (4) einer anderen Ebene (40) verbunden ist.6. interconnect (1) according to one of the preceding claims, which is connected by an electrically conductive step (41) to an electrical interconnect (4) of another level (40).
7. Elektrische Verbindung (6) zwischen einer elektrischen Leiterbahn (1) und einer oder mehreren elektrischen Kontakt- flächen (2) , die auf einer Seite (51) eines Körpers (5) angeordnet sind, wobei7. Electrical connection (6) between an electrical conductor track (1) and one or more electrical contact surfaces (2) which are arranged on one side (51) of a body (5), wherein
- die Leiterbahn (1) wenigsten eine senkrecht zu einer Ebene (10) der Leiterbahn (1) durchgehend sich erstreckende Aussparung (11) aufweist, wobei - die Aussparung (11) von zumindest einem elektrischen Draht- The conductor track (1) has at least one recess (11) extending perpendicular to a plane (10) of the conductor track (1), wherein - the recess (11) of at least one electrical wire
(12) überbrückt ist,(12) is bridged,
- dem eine Kontaktfläche (2) auf der einen Seite (51) des Körpers (5) zugeordnet ist,- which is assigned a contact surface (2) on one side (51) of the body (5),
- der auf einander gegenüberliegenden Seiten (111, 112) der Aussparung (11) mit der Leiterbahn (1) verbunden ist und- The on opposite sides (111, 112) of the recess (11) with the conductor track (1) is connected and
- der im Bereich der Aussparung (11) einen senkrecht zur Ebene (10) der Leiterbahn (1) beweglichen Bogen (12) aufweist, wobei- Which has in the region of the recess (11) a perpendicular to the plane (10) of the conductor track (1) movable arc (12), wherein
- der Körper (5) auf einer Seite der Ebene (10) der Leiter- bahn (1) so angeordnet ist, dass die eine Seite (51) des Körpers (5) , auf der jede mit der Leiterbahn (1) zu verbindende Kontaktfläche (2) angeordnet ist, dieser Ebene (10) zugekehrt ist und jede dieser Kontaktflächen (2) im Bereich der Aussparung (11) der Leiterbahn (1) liegt, und wobei - jede Kontaktfläche (2) auf der einen Seite (51) des Körpers (5) mit dem dieser Kontaktfläche (2) zugeordneten Draht (12) der Leiterbahn (1) im Bereich des Bogens (120) dieses Drahtes (12) verbunden ist.- The body (5) on one side of the plane (10) of the conductor track (1) is arranged so that the one side (51) of the body (5) on which each contact surface to be connected to the conductor track (1) (2) is arranged, this level (10) faces and each of these contact surfaces (2) lies in the region of the recess (11) of the conductor track (1), and wherein - each contact surface (2) on one side (51) of the Body (5) with the wire (12) assigned to this contact surface (2) the conductor track (1) is connected in the region of the arc (120) of this wire (12).
8. Verbindung (6) nach Anspruch 7, wobei eine mit der Leiter- bahn (1) verbundene Kontaktfläche (2) eine Kontaktfläche ei¬ nes Körpers (5) in Form eines Halbleiterbauelements ist.8. The compound (6) according to claim 7, wherein a conductor with the web (1) contact surface (2) connected to a contact surface ei ¬ nes body (5) is a semiconductor device in form.
9. Verbindung (6) nach Anspruch 8, wobei das Halbleiterbauelement ein Leistungshalbleiterbauelement ist.9. The connection (6) according to claim 8, wherein the semiconductor component is a power semiconductor component.
10. Verbindung (6) nach einem der Ansprüche 7 bis 9, wobei eine mit der Leiterbahn (1) verbundene Kontaktfläche (2) eine Kontaktfläche (2) eines Körpers (5) in Form einer anderen elektrischen Leiterbahn ist.10. Connection (6) according to one of claims 7 to 9, wherein a contact surface (2) connected to the conductor track (1) is a contact surface (2) of a body (5) in the form of another electrical conductor track.
11. Verbindung (β) nach einem der Ansprüche 7 bis 10, wobei ein Draht (5), dem eine Kontaktfläche (2) zugeordnet ist, ein Bonddraht ist, der durch Bonden mit der zugeordneten Kontaktfläche (2) verbunden ist.11. Connection (β) according to one of claims 7 to 10, wherein a wire (5), which is assigned a contact area (2), is a bonding wire which is connected by bonding to the associated contact area (2).
12. Verbindung (6) nach Anspruch 11, wobei der Bonddraht (5) an die Leiterbahn (1) gebondet ist.12. The connection (6) according to claim 11, wherein the bonding wire (5) is bonded to the conductor track (1).
13. Verbindung (6) nach einem der Ansprüche 7 bis 12, wobei die Leiterbahn (1) eine Aussparung (11) aufweist, die an einen Rand (110) auf einer Seite der Leiterbahn (1) grenzt und an diesem Rand (110) offen ist, so dass sich die Leiterbahn (1) gabelzinkenartig auf beiden Seiten der Aussparung (11) erstreckt .13. Connection (6) according to one of claims 7 to 12, wherein the conductor track (1) has a recess (11) which borders on an edge (110) on one side of the conductor track (1) and on this edge (110) is open, so that the conductor track (1) extends like a fork on both sides of the recess (11).
14. Verbindung (6) nach einem der Ansprüche 7 bis 13, wobei die Leiterbahn (1) eine Aussparung (11) in Form einer Öffnung, die von der Leiterbahn (1) allseitig umschlossen ist, aufweist .14. Connection (6) according to one of claims 7 to 13, wherein the conductor track (1) has a recess (11) in the form of an opening which is enclosed on all sides by the conductor track (1).
15. Verbindung (6) nach einem der Ansprüche 7 bis 14, wobei die Leiterbahn (1) durch eine elektrisch leitende Stufe (41) mit einer elektrischen Leiterbahn (4) einer anderen Ebene (40) verbunden ist.15. Connection (6) according to one of claims 7 to 14, wherein the conductor track (1) by an electrically conductive step (41) is connected to an electrical conductor track (4) of another level (40).
16. Verfahren zur Herstellung einer Verbindung nach einem der Ansprüche 7 bis 14 mittels einer Leiterbahn nach einem der Ansprüche 1 bis 6, mit den Schritten:16. A method for producing a connection according to one of claims 7 to 14 by means of a conductor track according to one of claims 1 to 6, comprising the steps:
- Anordnen des Körpers (5) und der Leiterbahn (1) so, dass der Körper (5) auf einer Seite der Ebene (10) der Leiterbahn (1) angeordnet ist und die eine Seite (51) des Körpers (5), auf der jede mit der Leiterbahn (1) zu verbindende Kontaktfläche (2) angeordnet ist, dieser Ebene (10) zugekehrt ist und diese Kontaktfläche (2) im Bereich der Aussparung (11) der Leiterbahn (1) liegt,- Arranging the body (5) and the conductor track (1) so that the body (5) is arranged on one side of the plane (10) of the conductor track (1) and one side (51) of the body (5) each contact surface (2) to be connected to the conductor track (1) is arranged, faces this plane (10) and this contact surface (2) lies in the region of the recess (11) of the conductor track (1),
- Bewegen jedes Drahtes (12), dem eine mit . der Leiterbahn (1) zu verbindende Kontaktfläche (2) zugeordnet ist, im Bereich seines beweglichen Bogens (120) senkrecht zur Ebene (10) der Leiterbahn (1) , bis dieser Draht (12) mit der zugeordneten Kontaktfläche (2) in Kontakt ist, und- Move each wire (12), the one with. is assigned to the conductor track (1) to be connected contact surface (2), in the region of its movable arc (120) perpendicular to the plane (10) of the conductor track (1) until this wire (12) is in contact with the associated contact surface (2) , and
- Verbinden dieses Drahtes (12) mit dieser Kontaktfläche (2) .- Connect this wire (12) to this contact surface (2).
17. Verfahren nach Anspruch 16, wobei der Draht (12) ein Bonddraht ist und durch Bonden mit der zugeordneten Kontaktfläche () verbunden wird. 17. The method according to claim 16, wherein the wire (12) is a bonding wire and is connected by bonding to the associated contact area ().
PCT/DE2002/003502 2001-09-26 2002-09-18 Connection between a printed conductor and an electric contact surface and production method WO2003028164A1 (en)

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DE10147478 2001-09-26
DE10147478.4 2001-09-26

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1493912A (en) * 1966-06-24 1967-09-01 Buchungsmaschinenwerk Veb Matrix contactor for accounting and similar machines
US5791911A (en) * 1996-10-25 1998-08-11 International Business Machines Corporation Coaxial interconnect devices and methods of making the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1493912A (en) * 1966-06-24 1967-09-01 Buchungsmaschinenwerk Veb Matrix contactor for accounting and similar machines
US5791911A (en) * 1996-10-25 1998-08-11 International Business Machines Corporation Coaxial interconnect devices and methods of making the same

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