EP3379906B1 - Method for producing wire bond connections with a support structure, and the corresponding electronic device - Google Patents

Method for producing wire bond connections with a support structure, and the corresponding electronic device Download PDF

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Publication number
EP3379906B1
EP3379906B1 EP18155960.0A EP18155960A EP3379906B1 EP 3379906 B1 EP3379906 B1 EP 3379906B1 EP 18155960 A EP18155960 A EP 18155960A EP 3379906 B1 EP3379906 B1 EP 3379906B1
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EP
European Patent Office
Prior art keywords
component
bonding
bonding wire
connection point
support
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Application number
EP18155960.0A
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German (de)
French (fr)
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EP3379906A1 (en
Inventor
Erik EDLINGER
Bernd Dragosits
Roman Führinger
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ZKW Group GmbH
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ZKW Group GmbH
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
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    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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    • H05K3/22—Secondary treatment of printed circuits
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    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45139—Silver (Ag) as principal constituent
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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    • H01L2224/4899—Auxiliary members for wire connectors, e.g. flow-barriers, reinforcing structures, spacers, alignment aids
    • H01L2224/48996—Auxiliary members for wire connectors, e.g. flow-barriers, reinforcing structures, spacers, alignment aids being formed on an item to be connected not being a semiconductor or solid-state body
    • H01L2224/48998—Alignment aids
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
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    • H05K2201/0939—Curved pads, e.g. semi-circular or elliptical pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10363—Jumpers, i.e. non-printed cross-over connections

Definitions

  • the invention relates to a method for producing bond connections between electrical connection points on electronic components, in which a bonding wire is guided from a first connection point over the component surface to a second connection point with the aid of a bonding tool, one at the first and the second connection point Bond connection of the bonding wire is produced with a contact surface of the connection point, and before the bonding wire is guided from a first to a second connection point on the component, at least one support for the bonding wire is set up which holds the bonding wire at a predetermined distance from surface sections of the component.
  • the invention also relates to an electronic component with electrical connection points, in which at least one bonding wire is led from at least one first connection point over the component surface to at least one second connection point, with a bond connection of the wire at the at least first and at least second connection point a contact surface of the connection point is made, and at least one support for the at least one bonding wire is provided on the component and at least one bonding wire is held between a first connection point and a second connection point from the support at a predetermined distance from surface sections of the component.
  • Wire bonding is a connection technology method known to those skilled in the art, which is used on a large scale primarily for connecting electrical connections on printed circuit boards and chip assemblies.
  • a connecting wire is usually attached to a contact surface of a circuit board by means of ultrasound, with the connecting wire (bond wire), which usually consists of aluminum, copper, silver or gold, is pressed onto the contact surface with the help of a wire bonding head (also known as a bonding tool or wedge tool) .
  • a wire bonding head also known as a bonding tool or wedge tool
  • Common wire bonding heads have an essentially wedge-shaped tip with a contact surface and a feed for the bonding wire.
  • the bond wire which is guided over the contact surface, is pressed against the contact surface of the circuit board and, at the same time, in the bonding head Ultrasonic vibrations are generated, which connects the wire to the contact surface at the atomic level.
  • the bonding head can also be used to separate the fully bonded wire from a supply roll at the end of the bonding process.
  • the U.S. 3,934,783 such a bonding device with a bonding head.
  • bonding is the connection technology of first choice for many applications, there are often geometries in which a standard bonding process cannot be used, since either guiding the bonding wire is not possible and / or the bonding tool can only be used to a limited extent. If, for example, a connection is to be made between two printed circuit boards arranged at right angles to one another on a module, the entire module must be rotated by 90 ° during the bonding process in order to be able to bond successfully. If a bonding wire is stretched over a long distance, the minimum required insulation distance to a component or mechanical part may not be maintained. If you use a large number of bond wires with complex geometries in the layout, it is almost impossible to find a suitable design for the tensioned bond wire.
  • Such supports are in different versions of the documents US 2012145446 A1 , DE 102005036324A1 , DE 102004018434 A1 and US 5847445 A
  • the common feature of these supports is that they entail additional effort in production, since either the starting product, e.g. a printed circuit board, has to be specially shaped or later, generally before an assembly process, special work steps with appropriate aids are required.
  • the document U.S. 3,626,086 A shows a wiring system in which an electronic component with feet is soldered to soldering pads of a printed circuit board and is kept at a distance from it.
  • One object of the invention is to enable secure bonding even in the case of complexly arranged components in a method or a component of the type mentioned at the outset, with the provision of the supports being able to take place without great effort.
  • the at least one support with a metallic, solderable foot section is soldered onto a soldering pad of the component and surface-mounted using SMT technology.
  • the soldering pad is formed on a printed circuit board of the component.
  • the at least one support is produced from a sheet metal part by punching and / or bending.
  • the at least one support is produced from a wire section by bending.
  • the bonding wire is inserted into the receptacle via a resilient section which holds the bonding wire captive after it has been inserted. This prevents unintentional detachment of the bonding wire from the supports and consequential damage such as short circuits.
  • the problem posed is also achieved with an electronic component of the type specified above, wherein according to the invention the at least one support is provided with a metallic, solderable foot section is soldered to a solder pad of the component and is surface-mounted in SMT technology.
  • soldering pad is formed on a printed circuit board of the component.
  • the at least one support consists of a stamped and / or bent sheet metal part.
  • the at least one support consists of a bent wire section.
  • yet another favorable variant provides that the receptacle has a resilient section which enables the bonding wire to be inserted and which holds it captive after the bonding wire has been inserted. This prevents unintentional detachment of the bonding wire from the supports and consequential damage such as short circuits.
  • FIG Fig. 1 the problem in the production of bond connections using the example of a component 1, for example a heat sink module, with two printed circuit boards 2, 3 arranged on orthogonally aligned side surfaces of the component.
  • the bonded lines that is to say the bonding wires 4 are produced between electrical connection points on electronic components, here the circuit boards, with the aid of a known but not shown bonding tool.
  • a bonding wire 4 is guided from a first connection point 5o over the surface of the component 1 to a second connection point 5u, a bond of the wire 4 to a contact surface of the respective connection point being established at the first and second connection points 5o, 5u.
  • component or “electronic component” used in the context of the described invention should not only include the base body of a component, but also components arranged thereon, such as circuit boards, electronic components or even just a circuit board as such. Furthermore, within the scope of the invention, the component does not necessarily have to contain “electronic” components; only electrical connection points are essential, from which electrical connections generally run to other points on the component.
  • Fig. 2 illustrated example.
  • Fig. 2 Similar to Fig. 1 , again schematically shows a component 1 in which circuit boards 2, 3 are arranged on two orthogonally aligned side surfaces.
  • connection points 5o, 5u bonding wires 4 are led from a first connection point 5o over the surface of the component 1 to a second connection point 5u, with a bond between the wire 4 and a contact surface of the respective connection point 5o, 5u being made at the first and second connection points 5o, 5u will.
  • bar-shaped supports 6 protrude from the upper edge of the one printed circuit board 3 at the front in the drawing, over the ends of which the bonding wires can be guided, these supports 6 including the bonding wires at a predetermined distance from surface sections of the component the circuit boards 2, 3 belonging to this hold.
  • a rounded recess 7 is formed in each of the ends of the supports 6, which recess prevents the bonding wires 4 from slipping off.
  • the supports 6 are integral with the circuit boards and therefore consist of the same material, for example FR4, as these. Supports could also be provided here on both circuit boards and they must also not be in one piece with the circuit boards, but can be connected to them by an adhesive connection.
  • the training according to Fig. 2 essentially belongs to the state of the art.
  • FIG. 3a shows another embodiment of a component 8, namely a printed circuit board, which is equipped with several modules, two of which are designated by 9o and 9u , and two LED elements 10 , wherein in Fig. 3a a connection by bonding without supports and in Fig. 3a a bond with supports is shown.
  • a bond is to be established by a bond wire between two modules 9o, 9u, which are located in the drawing on the top left and bottom right. If you go into it Fig.
  • a bonding wire 11 is guided in a straight line by means of a bonding tool from a connection point 8a of the module 9o to a corresponding connection point 8b of the module 9u, in which case it crosses the radiation area of the two LED elements 10 and at least affects the radiation.
  • the bonding wire crosses other modules and can lie against them in an undesirable manner.
  • supports 12 are erected on the component 8 in the manner explained in more detail below, and the bonding wire 11 is guided by the bonding tool in a programmed manner in such a way that it is supported by a total of six supports 12 from the module 9o located at the top left of the component 8 in the drawing is guided to the module 9u at the bottom right in such a way that it lies at a suitable predetermined distance from all modules or the surface of the component 8 and also does not impair the radiation of the LED elements 10.
  • the supports 12 are not formed in one piece with a printed circuit board of the component 8, but they are soldered with a foot section onto a soldering pad 13 of the component 8 designed as a printed circuit board. It must be borne in mind here that the supports 12 for the guided bonding wire should generally have an insulating function with regard to other components and conductor tracks. If the supports 12 are made entirely of metal, the soldering pads 13 must generally be insulated from other conductor tracks. On the other hand, the supports 12 can also consist of insulating material and, for example, be glued onto the component 8, or they can partially consist of insulating material and according to the invention have a metallic foot section with which they are soldered onto soldering pads. The supports 12 can, however, also be metallic or consist of conductive material.
  • Figure 4a shows a support 12, which consists of wire or sheet metal strips, with a foot section 14, which here has three fingers 15 arranged at an angle to one another, with which it can be soldered onto a soldering pad or some other metallic surface.
  • a stem 16 protrudes upward from the foot section 14, at the upper end of which a receptacle 17 for a bonding wire, not shown here, is connected.
  • the receptacle 17 has a preferably resilient section 18, which enables the introduction of a bonding wire, but then springs back and holds the bonding wire captive.
  • Figure 4b shows, but two resilient sections 18 are provided here.
  • Figure 4c also shows a variant similar to the two embodiments described above, in which a stem 16 extends upward from a foot section 14 with three fingers 15, which in its upper end region carries an annular receptacle 17 for a bonding wire.
  • the ring of this receptacle for example made of wire or a wire strip, is not closed, but can open resiliently when a bonding wire is placed and then at least partially close again, so that in this case too the bonding wire remains captured and held.
  • FIGS. 4e and 4f Two other variants of supports 12 are in the Figures 4e and 4f shown.
  • the starting point is, for example, a rectangular piece of sheet metal which after punching or cutting a support wing 18 is bent up.
  • the remaining part of the sheet metal piece serves as a foot section 19 which can be soldered onto a circuit board, for example.
  • a rounded recess 20 is formed, for example by punching, which represents a support for a bonding wire and prevents it from slipping sideways, at least as long as greater forces do not act on it or the bonding wire is correspondingly tensioned.
  • a certain centering of the bonding wire while it is being laid by a bonding tool With the variant after Fig. 4f a lateral incision 21 is formed in the support wing 18, for example by punching.
  • a bonding wire can advantageously be held in such an incision 21 when the support is intended to form a deflection point for the bonding wire, namely a point at which the bonding wire is deflected laterally, as is the case at several points in FIG Figure 3b for the bonding wire 11 is shown.
  • supports according to the invention can advantageously be soldered onto a circuit board together with other components, in particular by means of SMT soldering technology, during the assembly of a circuit board.
  • SMT Surface Mounted Technology
  • the bonding process can be easily integrated in the production of a component according to the invention in two steps. These steps are the SMD process for equipping and soldering surface-mountable components and the subsequent assembly, in which, for example, a circuit board is connected to a heat sink on special machines. In this assembly, the laying of the bonding wires can be integrated sequentially.
  • the metal pads that are intended for connecting SMD components are first printed with solder, then SMD components are fitted onto them and soldered by melting them together. Bond pads, on which a bond wire is to be placed in a subsequent bonding process, are not printed and should not oxidize further on the surface at the elevated temperature of the soldering process.
  • soldering is carried out on the one hand in a nitrogen atmosphere with a residual oxygen content of approx. 500 ppm, and on the other hand Ni / Au pads with a Ni thickness of approx. 7 ⁇ m and an Au thickness of less than 100 nm can be used for bonding.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
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  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

Die Erfindung bezieht sich auf ein Verfahren zum Herstellen von Bondverbindungen zwischen elektrischen Anschlussstellen auf elektronischen Bauteilen, bei welchem mit Hilfe eines Bondwerkzeuges ein Bonddraht von einer ersten Anschlussstelle über die Bauteiloberfläche zu einer zweiten Anschlussstelle geführt wird, wobei an der ersten und an der zweiten Anschlussstelle eine Bondverbindung des Bonddrahtes mit einer Kontaktfläche der Anschlussstelle hergestellt wird, und vor dem Führen des Bonddrahtes von einer ersten zu einer zweiten Anschlussstelle auf dem Bauteil zumindest eine Abstützung für den Bonddraht errichtet wird, welche den Bonddraht in einem vorgegebenen Abstand von Oberflächenabschnitten des Bauteils hält.The invention relates to a method for producing bond connections between electrical connection points on electronic components, in which a bonding wire is guided from a first connection point over the component surface to a second connection point with the aid of a bonding tool, one at the first and the second connection point Bond connection of the bonding wire is produced with a contact surface of the connection point, and before the bonding wire is guided from a first to a second connection point on the component, at least one support for the bonding wire is set up which holds the bonding wire at a predetermined distance from surface sections of the component.

Ebenso bezieht sich die Erfindung auf ein elektronisches Bauteil mit elektrischen Anschlussstellen, bei welchem ein zumindest Bonddraht von zumindest einer ersten Anschlussstelle über die Bauteiloberfläche zu zumindest einer zweiten Anschlussstelle geführt ist, wobei an der zumindest ersten und an der zumindest zweiten Anschlussstelle eine Bondverbindung des Drahtes mit einer Kontaktfläche der Anschlussstelle hergestellt ist, und auf dem Bauteil zumindest eine Abstützung für den zumindest einen Bonddraht vorgesehen ist und zumindest ein Bonddraht zwischen einer ersten Anschlussstelle und einer zweiten Anschlussstelle von der Abstützung in einem vorgegeben Abstand von Oberflächenabschnitten des Bauteils gehalten ist.The invention also relates to an electronic component with electrical connection points, in which at least one bonding wire is led from at least one first connection point over the component surface to at least one second connection point, with a bond connection of the wire at the at least first and at least second connection point a contact surface of the connection point is made, and at least one support for the at least one bonding wire is provided on the component and at least one bonding wire is held between a first connection point and a second connection point from the support at a predetermined distance from surface sections of the component.

Das Drahtbonden ist ein dem Fachmann bekanntes Verfahren der Verbindungstechnik, das in großem Maßstab vor allem für das Verbinden elektrischer Anschlüsse auf Leiterplatten und Chipaufbauten verwendet wird. Meist wird mittels Ultraschalles ein Verbindungsdraht auf einer Kontaktfläche einer Leiterplatte angebracht, wobei der Verbindungsdraht (Bonddraht), der üblicherweise aus Aluminium, Kupfer, Silber oder Gold besteht, mit Hilfe eines Drahtbondingkopfes (auch als Bondingwerkzeug oder Wedge Tool bezeichnet) auf der Kontaktfläche angepresst wird. Gängige Drahtbondingköpfe weisen eine im Wesentlichen keilförmige Spitze mit einer Anpressfläche sowie eine Zuführung für den Bonddraht auf. Zum Herstellen der Bondverbindung wird der über die Anpressfläche geführte Bonddraht gegen die Kontaktfläche der Leiterplatte gepresst und gleichzeitig werden im Bondingkopf Ultraschallschwingungen erzeugt, wodurch der Draht mit der Kontaktfläche auf atomarer Ebene verbunden wird. Mit dem Bondingkopf kann am Ende des Bondingvorganges auch ein Trennen des fertig gebondeten Drahtes von einer Vorratsrolle erfolgen. Beispielsweise offenbart die US 3,934,783 eine derartige Bondingvorrichtung mit einem Bondingkopf.Wire bonding is a connection technology method known to those skilled in the art, which is used on a large scale primarily for connecting electrical connections on printed circuit boards and chip assemblies. A connecting wire is usually attached to a contact surface of a circuit board by means of ultrasound, with the connecting wire (bond wire), which usually consists of aluminum, copper, silver or gold, is pressed onto the contact surface with the help of a wire bonding head (also known as a bonding tool or wedge tool) . Common wire bonding heads have an essentially wedge-shaped tip with a contact surface and a feed for the bonding wire. To establish the bond connection, the bond wire, which is guided over the contact surface, is pressed against the contact surface of the circuit board and, at the same time, in the bonding head Ultrasonic vibrations are generated, which connects the wire to the contact surface at the atomic level. The bonding head can also be used to separate the fully bonded wire from a supply roll at the end of the bonding process. For example, the U.S. 3,934,783 such a bonding device with a bonding head.

Wenngleich Bonden für viele Anwendungsfälle die Verbindungstechnik der ersten Wahl ist, liegen jedoch oft Geometrien vor, bei welchen ein Standard-Bondprozess nicht eingesetzt werden kann, da entweder das Führen des Bonddrahtes nicht möglich ist und/oder das Bondingwerkzeug nur eingeschränkt verwendet werden kann. Soll beispielsweise eine Verbindung zwischen zwei rechtwinklig zueinander angeordneten, auf einem Modul gelegenen Leiterplatten hergestellt werden, muss das gesamte Modul während des Bondvorgangs um 90° gedreht werden, um erfolgreich bonden zu können. Wird ein Bonddraht über eine weite Strecke gespannt, kann möglicherweise der minimal notwendige Isolationsabstand zu einem Bauteil oder mechanischen Teil nicht eingehalten werden. Verwendet man eine Vielzahl von Bonddrähten mit komplexen Geometrien im Layout, so ist es nahezu unmöglich, eine passende Auslegung für den gespannten Bonddraht zu finden.Although bonding is the connection technology of first choice for many applications, there are often geometries in which a standard bonding process cannot be used, since either guiding the bonding wire is not possible and / or the bonding tool can only be used to a limited extent. If, for example, a connection is to be made between two printed circuit boards arranged at right angles to one another on a module, the entire module must be rotated by 90 ° during the bonding process in order to be able to bond successfully. If a bonding wire is stretched over a long distance, the minimum required insulation distance to a component or mechanical part may not be maintained. If you use a large number of bond wires with complex geometries in the layout, it is almost impossible to find a suitable design for the tensioned bond wire.

Derartige Abstützungen sind in unterschiedlichen Ausführungen den Dokumenten US 2012145446 A1 , DE 102005036324A1 , DE 102004018434 A1 und US 5847445 A entnehmbar, wobei diesen Abstützungen gemeinsam ist, dass sie einen zusätzliche Aufwand bei der Herstellung nach sich ziehen, da entweder das Ausgangsprodukt, z.B. eine Leiterplatte, speziell geformt werden muss oder später, im Allgemeinen vor einem Bestückungsprozess, besondere Arbeitsschritte mit entsprechenden Hilfsmittel erforderlich sind.Such supports are in different versions of the documents US 2012145446 A1 , DE 102005036324A1 , DE 102004018434 A1 and US 5847445 A The common feature of these supports is that they entail additional effort in production, since either the starting product, e.g. a printed circuit board, has to be specially shaped or later, generally before an assembly process, special work steps with appropriate aids are required.

Das Dokument US 3 626 086 A zeigt ein Verdrahtungssystem, bei welchem ein elektronischer Bauteil mit Füßchen auf Lötpads einer Leiterplatte aufgelötet und von dieser in Abstand gehalten wird.The document U.S. 3,626,086 A shows a wiring system in which an electronic component with feet is soldered to soldering pads of a printed circuit board and is kept at a distance from it.

Die US 4 294 008 A beschreibt Abschnitte aus geschlitzten Rohr- oder Schlauchstückchen, welche auf eine Leiterplatte aufgeklebt sind und zur Führung von in ihnen enthaltenen Leitungen dienen.the U.S. 4,294,008 A describes sections of slotted pipe or hose pieces that are glued to a circuit board and are used to guide lines contained in them.

Aus dem Dokument DE 20 2016 106235 U1 geht ein besonders ausgebildetes Kontaktstück hervor, dass auf einer Leiterplatte angelötet ist und zum Anklemmen und Halten von Leiterdrähten dient. Ein ähnliches Kontaktstück geht auch aus der EP 2 418 738 A2 als bekannt hervor.From the document DE 20 2016 106235 U1 shows a specially designed contact piece that is soldered onto a circuit board and is used to clamp and hold conductor wires. A similar contact piece also goes out of the EP 2 418 738 A2 as known.

Eine Aufgabe der Erfindung liegt darin, bei einem Verfahren bzw. einem Bauteil der eingangs genannten Art ein sicheres Bonden auch bei komplex angeordneten Bauteilen zu ermöglichen, wobei das Bereitstellen der Abstützungen ohne hohen Aufwand erfolgen kann.One object of the invention is to enable secure bonding even in the case of complexly arranged components in a method or a component of the type mentioned at the outset, with the provision of the supports being able to take place without great effort.

Diese Aufgabe wird mit einem Verfahren der eingangs genannten Art gelöst, bei welchem erfindungsgemäß die zumindest eine Abstützung mit einem metallischen, lötbaren Fußabschnitt auf ein Lötpad des Bauteils aufgelötet und in SMT-Technologie oberflächenmontiert wird.This object is achieved with a method of the type mentioned at the outset, in which, according to the invention, the at least one support with a metallic, solderable foot section is soldered onto a soldering pad of the component and surface-mounted using SMT technology.

Dank der Erfindung können Abstützungen, die eine praktisch beliebige Leitungsführung von Bonddrähten ermöglich und die Bondstellen entlasten, einfach und billig hergestellt werden.Thanks to the invention, supports that allow practically any routing of bonding wires and relieve the bonding points can be produced simply and cheaply.

Bei einer zweckmäßigen Ausbildung ist vorgesehen, dass das Lötpad auf einer Leiterplatte des Bauteils ausgebildet ist.In an expedient embodiment, it is provided that the soldering pad is formed on a printed circuit board of the component.

Es kann auch empfehlenswert sein, dass die zumindest eine Abstützung aus einem Blechteil durch Stanzen und/oder Biegen hergestellt wird.It can also be recommended that the at least one support is produced from a sheet metal part by punching and / or bending.

Bei einer anderen günstigen Variante ist vorgesehen, dass die zumindest eine Abstützung aus einem Drahtabschnitt durch Biegen hergestellt wird.In another favorable variant, it is provided that the at least one support is produced from a wire section by bending.

Auch kann mit Vorteil vorgesehen sein, dass der Bonddraht in die Aufnahme über einen federnden Abschnitt eingeführt wird, der nach dem Einführen des Bonddrahtes diesen gefangen hält. Dadurch lässt sich ein unbeabsichtigtes Ablösen des Bonddrahtes von den Abstützungen verhindern und daraus resultierende Folgeschäden, wie z.B. Kurzschlüsse.It can also be advantageously provided that the bonding wire is inserted into the receptacle via a resilient section which holds the bonding wire captive after it has been inserted. This prevents unintentional detachment of the bonding wire from the supports and consequential damage such as short circuits.

Die gestellte Aufgabe wird auch mit einem elektronischen Bauteil der oben angegebenen Art gelöst, wobei erfindungsgemäß die zumindest eine Abstützung mit einem metallischen, lötbaren Fußabschnitt auf ein Lötpad des Bauteils aufgelötet ist und in SMT-Technologie oberflächenmontiert ist.The problem posed is also achieved with an electronic component of the type specified above, wherein according to the invention the at least one support is provided with a metallic, solderable foot section is soldered to a solder pad of the component and is surface-mounted in SMT technology.

Eine vorteilhafte Variante sieht vor, dass das Lötpad auf einer Leiterplatte des Bauteils ausgebildet ist.An advantageous variant provides that the soldering pad is formed on a printed circuit board of the component.

Bei einer anderen preisgünstigen Weiterbildung kann vorgesehen sein, dass die zumindest eine Abstützung aus einem gestanzten und/oder gebogenen Blechteil besteht.In another inexpensive development, it can be provided that the at least one support consists of a stamped and / or bent sheet metal part.

Andererseits kann es vorteilhaft sein, wenn die zumindest eine Abstützung aus einem gebogenen Drahtabschnitt besteht.On the other hand, it can be advantageous if the at least one support consists of a bent wire section.

Schließlich sieht eine noch andere günstige Variante vor, dass die Aufnahme einen federnden Abschnitt aufweist, der das Einführen des Bonddrahtes ermöglicht und nach Einführen des Bonddrahtes diesen gefangen hält. Dadurch lässt sich ein unbeabsichtigtes Ablösen des Bonddrahtes von den Abstützungen verhindern und daraus resultierende Folgeschäden, wie z.B. Kurzschlüsse.Finally, yet another favorable variant provides that the receptacle has a resilient section which enables the bonding wire to be inserted and which holds it captive after the bonding wire has been inserted. This prevents unintentional detachment of the bonding wire from the supports and consequential damage such as short circuits.

Die Erfindung ist im Folgenden an Hand von Ausführungsbeispielen näher erläutert, die in der Zeichnung veranschaulicht sind. In dieser zeigen

  • Fig. 1 ein Kühlkörpermodul nach dem Stand der Technik mit zwei Leiterplatten, welche elektrisch miteinander zu verbinden sind,
  • Fig. 2 schematisch ein Kühlkörpermodul mit zwei orthogonal zueinander gelegenen Leiterplatten,
  • Fig. 3a und 3b Draufsichten auf eine Leiterplatte, die mit verschiedenen Bauteilen und zwei LED-Elementen bestückt ist, wobei in Fig. 3a eine herkömmliche Verbindung durch Bonden und in Fig. 3a eine Bondverbindung unter Verwendung von Abstützungen dargestellt ist, und die
  • Fig. 4a bis 4f Beispiele von für Biege- und Stanzteile in SMT-Technologie, die als Stützelemente im Rahmen der Erfindung verwendbar sind.
The invention is explained in more detail below on the basis of exemplary embodiments which are illustrated in the drawing. In this show
  • Fig. 1 a heat sink module according to the state of the art with two printed circuit boards, which are to be electrically connected to each other,
  • Fig. 2 schematically a heat sink module with two orthogonal printed circuit boards,
  • Figures 3a and 3b Top views of a circuit board that is equipped with various components and two LED elements, with in Fig. 3a a conventional connection by bonding and in Fig. 3a a bond is shown using supports, and the
  • Figures 4a to 4f Examples of bent and stamped parts in SMT technology that can be used as support elements within the scope of the invention.

Nun wird unter Bezugnahme auf Fig. 1 die Problematik bei der Herstellung von Bondverbindungen an dem Beispiel eines Bauteils 1, z.B. eines Kühlkörpermoduls, mit zwei auf orthogonal zueinander ausgerichteten Seitenflächen des Bauteils angeordneten Leiterplatten 2, 3 erläutert. Die gebondeten Leitungen, d.h. die Bonddrähte 4, werden zwischen elektrischen Anschlussstellen auf elektronischen Bauteilen, hier den Leiterplatten, mit Hilfe eines bekannten, jedoch nicht dargestellten Bondwerkzeuges hergestellt. Dabei wird ein Bonddraht 4 von einer ersten Anschlussstelle 5o über die Oberfläche des Bauteils 1 zu einer zweiten Anschlussstelle 5u geführt, wobei an der ersten und an der zweiten Anschlussstelle 5o, 5u eine Bondverbindung des Drahtes 4 mit einer Kontaktfläche der jeweiligen Anschlussstelle hergestellt wird.Referring now to FIG Fig. 1 the problem in the production of bond connections using the example of a component 1, for example a heat sink module, with two printed circuit boards 2, 3 arranged on orthogonally aligned side surfaces of the component. The bonded lines, that is to say the bonding wires 4, are produced between electrical connection points on electronic components, here the circuit boards, with the aid of a known but not shown bonding tool. A bonding wire 4 is guided from a first connection point 5o over the surface of the component 1 to a second connection point 5u, a bond of the wire 4 to a contact surface of the respective connection point being established at the first and second connection points 5o, 5u.

In diesen und ähnlichen Fällen ist ein Führen der Bonddrähte durch das Bondwerkzeug nicht oder nur schwer möglich. Man müsste das gesamte Bauteil 1 während des Bondvorganges um 90° drehen, um den Bondvorgang zu ermöglichen. Wird jedoch der Bonddraht über eine vergleichsweise lange Strecke gespannt, kann der vor allem in Hinblick auf die Isolation minimal notwendige Abstand zu elektronischen oder mechanischen Komponenten nicht eingehalten werden. Bei Verwendung einer Vielzahl von Bonddrähten und komplexen Geometrien im Layout ist es dann nahezu unmöglich, eine geeignete Auslegung für das Spannen der Bonddrähte zu finden.In these and similar cases, it is difficult or impossible to guide the bonding wires through the bonding tool. The entire component 1 would have to be rotated by 90 ° during the bonding process in order to enable the bonding process. However, if the bonding wire is stretched over a comparatively long distance, the minimum distance to electronic or mechanical components, especially with regard to the insulation, cannot be maintained. When using a large number of bond wires and complex geometries in the layout, it is then almost impossible to find a suitable design for tensioning the bond wires.

Der verwendete Begriff "Bauteil" bzw. "elektronisches Bauteil" soll im Rahmen der beschriebenen Erfindung nicht nur den Grundkörper eines Bauteils beinhalten, sondern auch auf diesem angeordnete Komponenten, wie beispielsweise Leiterplatten, elektronische Komponenten oder auch nur eine Leiterplatte als solche. Weiters muss das Bauteil im Rahmen der Erfindung nicht notwendigerweise "elektronische" Komponenten enthalten, wesentlich sind lediglich elektrische Anschlussstellen, von welchen im Allgemeinen elektrische Verbindungen zu anderen Stellen des Bauteils verlaufen.The term “component” or “electronic component” used in the context of the described invention should not only include the base body of a component, but also components arranged thereon, such as circuit boards, electronic components or even just a circuit board as such. Furthermore, within the scope of the invention, the component does not necessarily have to contain “electronic” components; only electrical connection points are essential, from which electrical connections generally run to other points on the component.

Um in solchen Fällen einen Bondvorgang zu erleichtern bzw. überhaupt zu ermöglichen, kann man vorsehen, dass vor dem Führen des Bonddrahtes von einer ersten zu einer zweiten Anschlussstelle auf dem Bauteil zumindest eine Abstützung für den Bonddraht errichtet wird, welche den Bonddraht in einem vorgegeben Abstand von Oberflächenabschnitten des Bauteils hält. Dies wird nun an einem ersten, in Fig. 2 dargestellten Beispiel erläutert. Hier ist, vergleichbar mit Fig. 1, wieder schematisch ein Bauteil 1 gezeigt, bei welchem auf zwei orthogonal zueinander ausgerichteten Seitenflächen Leiterplatten 2, 3 angeordnet sind. Auch hier werden Bonddrähte 4 von einer ersten Anschlussstelle 5o über die Oberfläche des Bauteils 1 zu einer zweiten Anschlussstelle 5u geführt, wobei an der ersten und an der zweiten Anschlussstelle 5o, 5u eine Bondverbindung des Drahtes 4 mit einer Kontaktfläche der jeweiligen Anschlussstelle 5o, 5u hergestellt wird.In order to facilitate or even enable a bonding process in such cases, provision can be made for at least one support for the bonding wire to be set up for the bonding wire at a predetermined distance before the bonding wire is guided from a first to a second connection point on the component of surface sections of the component. This will now be done on a first, in Fig. 2 illustrated example. Here is, comparable to Fig. 1 , again schematically shows a component 1 in which circuit boards 2, 3 are arranged on two orthogonally aligned side surfaces. Here, too, bonding wires 4 are led from a first connection point 5o over the surface of the component 1 to a second connection point 5u, with a bond between the wire 4 and a contact surface of the respective connection point 5o, 5u being made at the first and second connection points 5o, 5u will.

Man erkennt nun, dass von dem in der Zeichnung oberen Rand der einen, in der Zeichnung vorderen Leiterplatte 3 stegförmige Abstützungen 6 abstehen, über deren Enden die Bonddrähte geführt werden können, wobei diese Abstützungen 6 die Bonddrähte in einem vorgegebenen Abstand von Oberflächenabschnitten des Bauteils einschließlich der zu diesem gehörigen Leiterplatten 2, 3 hält. It can now be seen that bar-shaped supports 6 protrude from the upper edge of the one printed circuit board 3 at the front in the drawing, over the ends of which the bonding wires can be guided, these supports 6 including the bonding wires at a predetermined distance from surface sections of the component the circuit boards 2, 3 belonging to this hold.

Wie in dem Detail A ersichtlich, ist bei dem gezeigten Beispiel in den Enden der Abstützungen 6 je eine abgerundete Vertiefung 7 ausgeformt, welche ein Abrutschen der Bonddrähte 4 verhindert. Die Abstützungen 6 sind bei dem Ausführungsbeispiel einstückig mit den Leiterplatten und bestehen daher aus demselben Material, z.B. FR4, wie diese. Abstützungen könnten hier auch an beiden Leiterplatten vorgesehen sein und sie müssen auch nicht einstückig mit den Leiterplatten sein, sondern können mit diesen durch eine Klebeverbindung verbunden sein.As can be seen in detail A , in the example shown, a rounded recess 7 is formed in each of the ends of the supports 6, which recess prevents the bonding wires 4 from slipping off. In the exemplary embodiment, the supports 6 are integral with the circuit boards and therefore consist of the same material, for example FR4, as these. Supports could also be provided here on both circuit boards and they must also not be in one piece with the circuit boards, but can be connected to them by an adhesive connection.

Die Ausbildung gemäß Fig. 2 gehört im Wesentlichen dem Stand der Technik an.The training according to Fig. 2 essentially belongs to the state of the art.

Anhand der Fig. 3a und 3b ist eine andere Ausführungsform eines Bauteils 8, nämlich einer Leiterplatte dargestellt, die mit mehreren Modulen, von welchen zwei Module mit 9o und 9u bezeichnet sind, und zwei LED-Elementen 10 bestückt ist, wobei in Fig. 3a eine Verbindung durch Bonden ohne Abstützungen und in Fig. 3a eine Bondverbindung mit Abstützungen dargestellt ist. Im Einzelnen erkennt man, dass eine Bondverbindung durch einen Bonddraht zwischen zwei Modulen 9o, 9u hergestellt werden soll, die sich in der Zeichnung links oben und rechts unten befinden. Geht man dabei nach Fig. 3a vor, so wird ein Bonddraht 11 mittels eines Bondwerkzeuges geradlinig von einer Anschlussstelle 8a des Moduls 9o zu einer entsprechenden Anschlussstelle 8b des Moduls 9u geführt, wobei er in diesem Fall den Abstrahlbereich der beiden LED-Elemente 10 kreuzt und die Abstrahlung zumindest beeinträchtigt. Überdies kreuzt der Bonddraht weitere Module und kann an diesen in unerwünschter Weise anliegen.Based on Figures 3a and 3b shows another embodiment of a component 8, namely a printed circuit board, which is equipped with several modules, two of which are designated by 9o and 9u , and two LED elements 10 , wherein in Fig. 3a a connection by bonding without supports and in Fig. 3a a bond with supports is shown. In detail, it can be seen that a bond is to be established by a bond wire between two modules 9o, 9u, which are located in the drawing on the top left and bottom right. If you go into it Fig. 3a before, a bonding wire 11 is guided in a straight line by means of a bonding tool from a connection point 8a of the module 9o to a corresponding connection point 8b of the module 9u, in which case it crosses the radiation area of the two LED elements 10 and at least affects the radiation. In addition, the bonding wire crosses other modules and can lie against them in an undesirable manner.

Gemäß Fig. 3b werden auf dem Bauteil 8 in weiter unten näher erläuterter Weise Abstützungen 12 errichtet, und der Bonddraht 11 wird von dem Bondwerkzeug in programmierter Weise so geführt, dass er von dem in der Zeichnung links oben auf dem Bauteil 8 gelegenen Modul 9o über insgesamt sechs Abstützungen 12 so zu dem Modul 9u rechts unten geführt wird, dass er in einem geeigneten vorgegebenen Abstand von sämtlichen Modulen bzw. der Oberfläche des Bauteils 8 liegt und auch die Abstrahlung der LED-Elemente 10 nicht beeinträchtigt.According to Figure 3b supports 12 are erected on the component 8 in the manner explained in more detail below, and the bonding wire 11 is guided by the bonding tool in a programmed manner in such a way that it is supported by a total of six supports 12 from the module 9o located at the top left of the component 8 in the drawing is guided to the module 9u at the bottom right in such a way that it lies at a suitable predetermined distance from all modules or the surface of the component 8 and also does not impair the radiation of the LED elements 10.

Im Falle der Fig. 3b sind die Abstützungen 12 nicht einstückig mit einer Leiterplatte des Bauteils 8 ausgebildet, sondern sie sind mit einem Fußabschnitt auf ein Lötpad 13 des als Leiterplatte ausgebildeten Bauteils 8 aufgelötet. Dabei muss bedacht werden, dass die Abstützungen 12 für den geführten Bonddraht im Allgemeinen eine Isolierfunktion hinsichtlich anderer Bauteile und Leiterzüge zeigen sollen. Falls die Abstützungen 12 ganz aus Metall bestehen, müssen die Lötpads 13 im Allgemeinen gegen andere Leiterzüge isoliert sein. Andererseits können die Abstützungen 12 auch aus Isoliermaterial bestehen und z.B. auf das Bauteil 8 aufgeklebt sein oder sie können teilweise aus Isoliermaterial bestehen und erfindungsgemäß einen metallischen Fußabschnitt besitzen, mit dem sie auf Lötpads aufgelötet sind. Die Abstützungen 12 können jedoch auch metallisch sein bzw. aus leitendem Material bestehen.In case of Figure 3b If the supports 12 are not formed in one piece with a printed circuit board of the component 8, but they are soldered with a foot section onto a soldering pad 13 of the component 8 designed as a printed circuit board. It must be borne in mind here that the supports 12 for the guided bonding wire should generally have an insulating function with regard to other components and conductor tracks. If the supports 12 are made entirely of metal, the soldering pads 13 must generally be insulated from other conductor tracks. On the other hand, the supports 12 can also consist of insulating material and, for example, be glued onto the component 8, or they can partially consist of insulating material and according to the invention have a metallic foot section with which they are soldered onto soldering pads. The supports 12 can, however, also be metallic or consist of conductive material.

In der Draufsicht der Fig. 3b sind die Abstützungen mit kleinen Ringen schematisch dargestellt, einige mögliche konkrete Ausführungen sind nun in den folgenden Fig. 4a bis 4f gezeigt, wobei zur Vereinfachung für alle Ausführungen der Stützen das Bezugszeichen 12 und für deren Fußabschnitt das Bezugszeichen 14 verwendet wird. Auch werden in den Fig. 4a bis 4f für gleiche oder vergleichbare Teile gleiche Bezugszeichen verwendet.In the top view of the Figure 3b the supports with small rings are shown schematically, some possible concrete designs are now in the following Figures 4a to 4f shown, the reference numeral 12 being used for all versions of the supports and the reference numeral 14 being used for their foot section. Also in the Figures 4a to 4f the same reference numerals are used for the same or comparable parts.

Fig. 4a zeigt eine Abstützung 12, die aus Draht oder Blechstreifen besteht, wobei von einem Fußabschnitt 14, der hier drei unter einem Winkel gegeneinander angeordnete Finger 15 besitzt, mit welchen er auf ein Lötpad oder sonst eine metallische Fläche aufgelötet werden kann. Von dem Fußabschnitt 14 steht ein Stängel 16 nach oben ab, an dessen oberen Ende eine Aufnahme 17 für einen hier nicht gezeigten Bonddraht anschließt. An ihrem oberen Ende besitzt die Aufnahme 17 einen vorzugsweise federnden Abschnitt 18, der das Einführen eines Bonddrahtes ermöglicht, dann aber zurückfedert und den Bonddraht gefangen hält. Eine ähnliche Ausführung ist in Fig. 4b dargestellt, doch sind hier zwei federnde Abschnitte 18 vorgesehen. Figure 4a shows a support 12, which consists of wire or sheet metal strips, with a foot section 14, which here has three fingers 15 arranged at an angle to one another, with which it can be soldered onto a soldering pad or some other metallic surface. A stem 16 protrudes upward from the foot section 14, at the upper end of which a receptacle 17 for a bonding wire, not shown here, is connected. At its upper end, the receptacle 17 has a preferably resilient section 18, which enables the introduction of a bonding wire, but then springs back and holds the bonding wire captive. A similar implementation is in Figure 4b shown, but two resilient sections 18 are provided here.

Fig. 4c zeigt gleichfalls eine mit den beiden zuvor beschriebenen Ausführungen ähnliche Variante, bei welcher von einem Fußabschnitt 14 mit drei Fingern 15 ein Stängel 16 nach oben verläuft, der in seinem oberen Endbereich eine ringförmige Aufnahme 17 für einen Bonddraht trägt. Der z.B. aus Draht oder aus einem Drahtstreifen bestehende Ring dieser Aufnahme ist jedoch nicht geschlossen, sondern kann sich bei Auflegen eines Bonddrahtes federnd öffnen und darnach zumindest teilweise wieder schließen, sodass auch in diesem Fall der Bonddraht gefangen und gehalten bleibt. Figure 4c also shows a variant similar to the two embodiments described above, in which a stem 16 extends upward from a foot section 14 with three fingers 15, which in its upper end region carries an annular receptacle 17 for a bonding wire. The ring of this receptacle, for example made of wire or a wire strip, is not closed, but can open resiliently when a bonding wire is placed and then at least partially close again, so that in this case too the bonding wire remains captured and held.

Bei der Variante nach Fig. 4d ist - so wie bei den vorgehenden Ausführungsformen - ein Fußabschnitt 14 mit einem nach oben ragenden Stängel 16 vorhanden, der oben eine in Seitenansicht becherförmige Aufnahme 17 für einen hier eingezeichneten Bonddraht 11 trägt.With the variant after Figure 4d As in the previous embodiments, there is a foot section 14 with an upwardly projecting stem 16, which at the top carries a receptacle 17, which is cup-shaped in a side view, for a bonding wire 11 shown here.

Zwei weitere Varianten von Abstützungen 12 sind in den Fig. 4e und 4f dargestellt. In beiden Fällen ist Ausgangspunkt ein beispielsweise rechteckförmiges Blechstück, aus welchem nach Ausstanzen oder Einschneiden ein Stützflügel 18 hochgebogen wird. Der verbleibende Teil des Blechstückes dient als Fußabschnitt 19, der beispielsweise auf eine Leiterplatte aufgelötet werden kann. Um einen Bonddraht in einem gewissen Ausmaß zu fixieren, ist an dem oberen Ende des Stützflügels 18 gemäß Fig. 4e eine abgerundete Vertiefung 20, beispielsweise durch Stanzen, ausgebildet, welche eine Auflage für einen Bonddraht darstellt und dessen seitliches Verrutschen verhindert, jedenfalls solange nicht größere Kräfte an diesem angreifen bzw. der Bonddraht entsprechend gespannt ist. Auch gewährleistet diese Vertiefung 20, ebenso wie die Vertiefung 7 der Fig. 2, Detail A, ein gewisses Zentrieren des Bonddrahtes während seines Verlegens durch ein Bondwerkzeug. Bei der Variante nach Fig.4f ist in dem Stützflügel 18 ein seitlicher Einschnitt 21 ausgebildet, beispielsweise durch Stanzen. In einem solchen Einschnitt 21 kann ein Bonddraht mit Vorteil dann gehalten werden, wenn die Stütze einen Umlenkpunkt für den Bonddraht bilden soll, nämlich einen Punkt, an dem der Bonddraht seitlich umgelenkt wird, wie dies an mehreren Stellen der Fig. 3b für den Bonddraht 11 gezeigt ist.Two other variants of supports 12 are in the Figures 4e and 4f shown. In both cases, the starting point is, for example, a rectangular piece of sheet metal which after punching or cutting a support wing 18 is bent up. The remaining part of the sheet metal piece serves as a foot section 19 which can be soldered onto a circuit board, for example. In order to fix a bonding wire to a certain extent, at the upper end of the support wing 18 according to FIG Figure 4e a rounded recess 20 is formed, for example by punching, which represents a support for a bonding wire and prevents it from slipping sideways, at least as long as greater forces do not act on it or the bonding wire is correspondingly tensioned. Also ensures this recess 20, as well as the recess 7 of the Fig. 2 , Detail A, a certain centering of the bonding wire while it is being laid by a bonding tool. With the variant after Fig. 4f a lateral incision 21 is formed in the support wing 18, for example by punching. A bonding wire can advantageously be held in such an incision 21 when the support is intended to form a deflection point for the bonding wire, namely a point at which the bonding wire is deflected laterally, as is the case at several points in FIG Figure 3b for the bonding wire 11 is shown.

Falls zumindest der jeweilige Fußabschnitt 14 bzw. 19 aus lötbarem Metall besteht, können Abstützungen gemäß der Erfindung in vorteilhafter Weise während der Bestückung einer Leiterplatte zusammen mit anderen Komponenten auf diese insbesondere durch eine SMT-Löttechnologie aufgelötet werden. Unter "Surface Mounted Technology" mit der gebräuchlichen Abkürzung SMT versteht man die Technologie von "oberflächenmontierten" Bauelementen.If at least the respective foot section 14 or 19 is made of solderable metal, supports according to the invention can advantageously be soldered onto a circuit board together with other components, in particular by means of SMT soldering technology, during the assembly of a circuit board. "Surface Mounted Technology" with the common abbreviation SMT is understood to mean the technology of "surface-mounted" components.

Der Bondprozess ist, wie das folgende Beispiel zeigen soll, bei der Herstellung eines erfindungsgemäßen Bauteils in zwei Schritten einfach integrierbar. Diese Schritte sind der SMD-Prozess zum Bestücken und Löten von oberflächenmontierbaren Bauteilen und das darauf folgende Assemblieren, bei dem auf Sondermaschinen z.B. eine Leiterplatte mit einem Kühlkörper verbunden wird. Bei diesem Assemblieren kann das Legen der Bonddrähte sequentiell integriert werden. Auf der SMD-Linie werden zunächst diejenigen Metallpads, die zum Verbinden von SMD-Komponenten vorgesehen sind, mit Lot bedruckt, danach werden SMD-Bauelemente darauf bestückt und durch gemeinsames Aufschmelzen verlötet. Bondpads, auf die in einem nachfolgenden Bondprozess ein Bonddraht aufgesetzt werden soll, werden nicht bedruckt und sollten bei der erhöhten Temperatur des Lötvorgangs an der Oberfläche nicht weiter oxidieren. Dazu wird einerseits unter StickstoffAtmosphäre mit einem Rest-Sauerstoffgehalt von ca. 500 ppm gelötet, andererseits können zum Bonden Ni/Au-Pads mit einer Ni-Dicke von ca. 7 µm und einer Au-Dicke von unter 100 nm verwendet werden. Liste der Bezugszeichen 1 Bauteil 11 Bonddraht 2 Leiterplatte 12 Abstützung 3 Leiterplatte 13 Lötpad 4 Bonddraht 14 Fußabschnitt 50 erste Anschlussstelle 15 Finger 5u zweite Anschlussstelle 16 Stängel 6 Abstützung 17 Aufnahme 7 Vertiefung 18 Stützflügel 8 Bauteil 19 Fußabschnitt 90 Modul 20 Vertiefung 9u Modul 21 Einschnitt 10 LED-Element As the following example is intended to show, the bonding process can be easily integrated in the production of a component according to the invention in two steps. These steps are the SMD process for equipping and soldering surface-mountable components and the subsequent assembly, in which, for example, a circuit board is connected to a heat sink on special machines. In this assembly, the laying of the bonding wires can be integrated sequentially. On the SMD line, the metal pads that are intended for connecting SMD components are first printed with solder, then SMD components are fitted onto them and soldered by melting them together. Bond pads, on which a bond wire is to be placed in a subsequent bonding process, are not printed and should not oxidize further on the surface at the elevated temperature of the soldering process. For this purpose, soldering is carried out on the one hand in a nitrogen atmosphere with a residual oxygen content of approx. 500 ppm, and on the other hand Ni / Au pads with a Ni thickness of approx. 7 µm and an Au thickness of less than 100 nm can be used for bonding. <b> List of reference signs </b> 1 Component 11 Bond wire 2 Circuit board 12th Support 3 Circuit board 13th Solder pad 4th Bond wire 14th Foot section 50 first junction 15th finger 5u second junction 16 Stalk 6th Support 17th recording 7th deepening 18th Support wing 8th Component 19th Foot section 90 module 20th deepening 9u module 21 incision 10 LED element

Claims (10)

  1. Method for producing bonding connections between electrical connection points on electronic components (8), in which a bonding wire (11) is guided from a first connection point over the component surface to a second connection point with the aid of a bonding tool, wherein a bonding connection of the bonding wire to a contact surface of the connection point being produced at the first (8a) and at the second (8b) connection point, and before the bonding wire (11) is guided from a first to a second connection point, at least one support (12) for the bonding wire is erected on the component (8), which support (12) holds the bonding wire at a predetermined distance from surface portions of the component,
    characterized in that
    the at least one support (12) is soldered with a metallic, solderable foot section (14,19) onto a solder pad (13) of the component (8) and is surface-mounted using SMT technology.
  2. Method according to claim 1, characterized in that the solder pad (13) is formed on a printed circuit board of the component (8).
  3. Method according to claim 1 or 2, characterized in that the at least one support (12) is produced from a sheet metal part by punching and/or bending.
  4. Method according to claim 1 or 2, characterized in that the at least one support (12) is produced from a wire section by bending.
  5. Method according to any one of claims 1 to 4, characterized in that the bonding wire (11) is inserted into the receptacle (17) via a resilient section (18) which, after insertion of the bonding wire, holds it captive.
  6. Electronic component (8) with electrical connection points, in which at least one bonding wire (11) is guided from at least one first connection point via the component surface to at least one second connection point, wherein a bonding connection of the wire to a contact surface of the connection point being produced at the at least first and at the at least second connection point, and at least one support (12) for the at least one bonding wire (11) is provided on the component (8), and at least one bonding wire is held between a first connection point and a second connection point by the support at a predetermined distance from surface portions of the component,
    characterised in that
    the at least one support (12) is soldered with a metallic, solderable foot portion (14,19) onto a solder pad (13) of the component (8) and is surface-mounted in SMT technology.
  7. Electronic component according to claim 6, characterized in that the solder pad (13) is formed on a printed circuit board of the component (8).
  8. Electronic component according to claim 6 or 7, characterized in that the at least one support (12) consists of a stamped and/or bent sheet metal part.
  9. Electronic component according to claim 6 or 7, characterized in that the at least one support (12) consists of a bent wire section.
  10. Electronic component according to any one of claims 6 to 9, characterized in that the receptacle (17) has a resilient portion (18) which allows the insertion of the bonding wire (11) and, after insertion of the bonding wire, holds its captive.
EP18155960.0A 2017-03-20 2018-02-09 Method for producing wire bond connections with a support structure, and the corresponding electronic device Active EP3379906B1 (en)

Applications Claiming Priority (1)

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ATA50220/2017A AT519780B1 (en) 2017-03-20 2017-03-20 Process for making bond connections

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Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3626086A (en) * 1970-04-28 1971-12-07 Computer Ind Inc Wire-routing system
US4294008A (en) * 1979-06-27 1981-10-13 Western Electric Company, Inc. Methods of manufacturing and securing tubular wire-retaining anchors to circuit boards
US5847445A (en) * 1996-11-04 1998-12-08 Micron Technology, Inc. Die assemblies using suspended bond wires, carrier substrates and dice having wire suspension structures, and methods of fabricating same
US6531784B1 (en) * 2000-06-02 2003-03-11 Amkor Technology, Inc. Semiconductor package with spacer strips
JP2004312008A (en) * 2003-04-08 2004-11-04 Samsung Electronics Co Ltd Semiconductor multi-chip package and manufacturing method therefor
US8022522B1 (en) * 2005-04-01 2011-09-20 Marvell International Ltd. Semiconductor package
DE102005036324A1 (en) * 2005-07-29 2006-09-28 Infineon Technologies Ag Semiconductor device for use as digital memory device, has semiconductor chip comprising bond wire guiding unit in edge area of top side of chip, where guiding unit has structures for guiding bond wire
JP2007214314A (en) * 2006-02-09 2007-08-23 Shinkawa Ltd Semiconductor device
US20080131998A1 (en) * 2006-12-01 2008-06-05 Hem Takiar Method of fabricating a film-on-wire bond semiconductor device
JP2010199548A (en) * 2009-01-30 2010-09-09 Elpida Memory Inc Semiconductor device and method of manufacturing the same
EP2418738B1 (en) * 2010-08-05 2016-07-13 Tyco Electronics Nederland B.V. Terminal for connecting wires to printed circuit boards
CN102412167B (en) * 2010-09-25 2016-02-03 飞思卡尔半导体公司 What engage for line fixes
CN102487025B (en) * 2010-12-08 2016-07-06 飞思卡尔半导体公司 For the long supporter in conjunction with wire
TWI575206B (en) * 2014-03-14 2017-03-21 友達光電股份有限公司 Solar module
JP2015185570A (en) * 2014-03-20 2015-10-22 三菱電機株式会社 power semiconductor device
DE202016106235U1 (en) * 2015-12-02 2017-03-03 Wago Verwaltungsgesellschaft Mbh Conductor connection contact and circuit board arrangement

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CN108630796B (en) 2021-10-01
AT519780B1 (en) 2020-02-15
CN108630796A (en) 2018-10-09
AT519780A1 (en) 2018-10-15

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