WO2003021008A1 - Tin electroplating solution and method for plating - Google Patents

Tin electroplating solution and method for plating Download PDF

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Publication number
WO2003021008A1
WO2003021008A1 PCT/JP2001/007559 JP0107559W WO03021008A1 WO 2003021008 A1 WO2003021008 A1 WO 2003021008A1 JP 0107559 W JP0107559 W JP 0107559W WO 03021008 A1 WO03021008 A1 WO 03021008A1
Authority
WO
WIPO (PCT)
Prior art keywords
tin
electroplating solution
plating
tin electroplating
ion
Prior art date
Application number
PCT/JP2001/007559
Other languages
French (fr)
Japanese (ja)
Inventor
Kazuyuki Suda
Makoto Kondo
Original Assignee
Learonal Japan Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2000053727A priority Critical patent/JP4728462B2/en
Application filed by Learonal Japan Inc. filed Critical Learonal Japan Inc.
Priority to CNB018236685A priority patent/CN1260399C/en
Priority to PCT/JP2001/007559 priority patent/WO2003021008A1/en
Publication of WO2003021008A1 publication Critical patent/WO2003021008A1/en
Priority to US10/788,811 priority patent/US20040251143A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Abstract

A tin electroplating solution, characterized in that it has a pH of 1.5 to 6.0 and comprises the following components: (1) 5 to 60 g/L of a tin(II) ion, (2) a complexing agent, (3) a surfactant and (4) 0.01 to 0.5 g/L of a bismuth(III) ion; and a method for the tin plating of electronic parts or the like which comprises using the tin electroplating solution. The tin electroplating solution exhibits a soldering wettability being comparable with or superior to a conventional tin-lead alloy (solder) without the use of hazardous lead or an organic brightening agent.
PCT/JP2001/007559 2000-02-29 2001-08-31 Tin electroplating solution and method for plating WO2003021008A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2000053727A JP4728462B2 (en) 2000-02-29 2000-02-29 Tin electroplating solution and plating method
CNB018236685A CN1260399C (en) 2001-08-31 2001-08-31 Electrolytic tin-plating solution and method for electroplating
PCT/JP2001/007559 WO2003021008A1 (en) 2000-02-29 2001-08-31 Tin electroplating solution and method for plating
US10/788,811 US20040251143A1 (en) 2001-08-31 2004-02-27 Electrolytic tin-plating solution and method for plating

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000053727A JP4728462B2 (en) 2000-02-29 2000-02-29 Tin electroplating solution and plating method
PCT/JP2001/007559 WO2003021008A1 (en) 2000-02-29 2001-08-31 Tin electroplating solution and method for plating

Publications (1)

Publication Number Publication Date
WO2003021008A1 true WO2003021008A1 (en) 2003-03-13

Family

ID=26345132

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2001/007559 WO2003021008A1 (en) 2000-02-29 2001-08-31 Tin electroplating solution and method for plating

Country Status (2)

Country Link
JP (1) JP4728462B2 (en)
WO (1) WO2003021008A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8083922B2 (en) 2007-08-01 2011-12-27 Taiyo Yuden Co., Ltd. Tin electrolytic plating solution for electronic parts, method for tin electrolytic plating of electronic parts, and tin electroplated electronic parts

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3910028B2 (en) * 2001-09-13 2007-04-25 株式会社村田製作所 Electrode formation method for chip-type ceramic electronic components

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3360446A (en) * 1964-05-08 1967-12-26 M & T Chemicals Inc Electrodepositing a tin-bismuth alloy and additives therefor
US3663384A (en) * 1969-12-19 1972-05-16 Ibm Bath for electroplating tin-bismuth alloy
US4252618A (en) * 1980-02-11 1981-02-24 Pitt Metals & Chemicals, Inc. Method of electroplating tin and alkaline electroplating bath therefor
US4331518A (en) * 1981-01-09 1982-05-25 Vulcan Materials Company Bismuth composition, method of electroplating a tin-bismuth alloy and electroplating bath therefor
US4717460A (en) * 1983-12-22 1988-01-05 Learonal, Inc. Tin lead electroplating solutions
JPS6314887A (en) * 1986-07-04 1988-01-22 Daiwa Kasei Kenkyusho:Kk Bismuth and bismuth alloy plating bath from organic sulfonate
WO1990009048A1 (en) * 1989-01-24 1990-08-09 Saab Automobile Aktiebolag Spark plug for internal combustion engine
JPH07138782A (en) * 1993-11-18 1995-05-30 Deitsupusoole Kk Sn-bi alloy plating bath and plating method using the plating bath
JPH0813185A (en) * 1994-06-28 1996-01-16 Ebara Yuujiraito Kk Plating bath of low melting point tin alloy

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3360446A (en) * 1964-05-08 1967-12-26 M & T Chemicals Inc Electrodepositing a tin-bismuth alloy and additives therefor
US3663384A (en) * 1969-12-19 1972-05-16 Ibm Bath for electroplating tin-bismuth alloy
US4252618A (en) * 1980-02-11 1981-02-24 Pitt Metals & Chemicals, Inc. Method of electroplating tin and alkaline electroplating bath therefor
US4331518A (en) * 1981-01-09 1982-05-25 Vulcan Materials Company Bismuth composition, method of electroplating a tin-bismuth alloy and electroplating bath therefor
US4717460A (en) * 1983-12-22 1988-01-05 Learonal, Inc. Tin lead electroplating solutions
JPS6314887A (en) * 1986-07-04 1988-01-22 Daiwa Kasei Kenkyusho:Kk Bismuth and bismuth alloy plating bath from organic sulfonate
WO1990009048A1 (en) * 1989-01-24 1990-08-09 Saab Automobile Aktiebolag Spark plug for internal combustion engine
JPH07138782A (en) * 1993-11-18 1995-05-30 Deitsupusoole Kk Sn-bi alloy plating bath and plating method using the plating bath
JPH0813185A (en) * 1994-06-28 1996-01-16 Ebara Yuujiraito Kk Plating bath of low melting point tin alloy

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8083922B2 (en) 2007-08-01 2011-12-27 Taiyo Yuden Co., Ltd. Tin electrolytic plating solution for electronic parts, method for tin electrolytic plating of electronic parts, and tin electroplated electronic parts

Also Published As

Publication number Publication date
JP4728462B2 (en) 2011-07-20
JP2001240993A (en) 2001-09-04

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