WO2003017211A2 - Carte a puce a detecteur d'empreinte digitale - Google Patents

Carte a puce a detecteur d'empreinte digitale Download PDF

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Publication number
WO2003017211A2
WO2003017211A2 PCT/DE2002/002757 DE0202757W WO03017211A2 WO 2003017211 A2 WO2003017211 A2 WO 2003017211A2 DE 0202757 W DE0202757 W DE 0202757W WO 03017211 A2 WO03017211 A2 WO 03017211A2
Authority
WO
WIPO (PCT)
Prior art keywords
chip
card
card body
semiconductor chip
fingerprint sensor
Prior art date
Application number
PCT/DE2002/002757
Other languages
German (de)
English (en)
Other versions
WO2003017211A3 (fr
Inventor
Harald Gundlach
Boris Mayerhofer
Thomas SPÖTTL
Original Assignee
Infineon Technologies Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag filed Critical Infineon Technologies Ag
Publication of WO2003017211A2 publication Critical patent/WO2003017211A2/fr
Publication of WO2003017211A3 publication Critical patent/WO2003017211A3/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0716—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor
    • G06K19/0718—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor the sensor being of the biometric kind, e.g. fingerprint sensors
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing

Definitions

  • Chip card with integrated fingerprint sensor Chip card with integrated fingerprint sensor
  • the present invention relates to a chip card with an integrated fingerprint sensor, which is provided in particular for personal identification.
  • a semiconductor chip used in a chip card may only have dimensions that comply with the ISO standard for the chip cards (ISO / IEC 7810).
  • the chip card has to tolerate a certain degree of bending (according to ISO / IEC 10373-1) that the integrated chip survives intact.
  • silicon chips such as those used for fingerprint sensors, this sufficient resistance to bending cannot be guaranteed.
  • a fingerprint sensor in the form of a semiconductor device is e.g. B. integrated on a substrate made of silicon. If such semiconductor chips provided with a fingerprint sensor are bent, the substrate breaks. This will render the chips unusable.
  • the semiconductor chips are therefore installed in rigid housings, which, however, have such large dimensions that they cannot be installed in chip cards which comply with the ISO standard. Arrangements are described in WO 00/07420, WO 00/06023, WO 99/38112 and DE 199 21 231 which do not or only partially eliminate the difficulties stated.
  • the object of the present invention is to provide a chip card with an integrated fingerprint sensor which can be manufactured with sufficient break resistance within the dimensions of the ISO standard.
  • a semiconductor chip with a fingerprint sensor is at such a height, ie. H. Position, arranged within the card body according to ISO / IEC 7810, that the stress on the chip when the chip card is bent within the entire arrangement of card and chip is minimized in such a way that the sufficient break resistance at least for those according to the standard ISO / IEC 10373-1 required bending tests is achieved.
  • a recess is provided in the card body in ISO dimensions, in which the semiconductor chip, with or without its own housing, is attached. The depth of this cutout and thus the position of the semiconductor chip within the chip card is selected such that the semiconductor chip survives a bending of the card body that conforms to a test standard.
  • the position suitable for the semiconductor chip within the card body can be determined by calculation or experiment in a manner known per se. It should only be taken into account here that, according to the invention, the cutout is present on one side of the card body, so that, in the usual exemplary embodiments of the chip card, the surface of the semiconductor chip facing the outside is somewhat recessed relative to the top of the chip card.
  • the semiconductor chip is buried in the card body. In particular a portion of the card body, which is usually made of a plastic material, can also be surmounted over the edge regions of the semiconductor chip. Such an arrangement can be produced if the card body is produced as a laminate by arranging several layer parts one above the other and pressing them together.
  • the semiconductor chip with the fingerprint sensor is preferably installed in a floating manner, which means that the semiconductor chip is not rigidly connected to the card body with its underside facing the card body and with its edges.
  • the semiconductor chip is rather attached within the recess of the card body in such a way that it can be displaced in the plane of the chip or the card body relative to the card body when the card body is bent. It can therefore be advantageous if the semiconductor chip is fixed in the recess of the card body with only one edge or with two edges lying opposite one another.
  • an adhesive layer can preferably also be used, within which shearing of the material is possible.
  • the adhesive layer can thus allow a certain displacement between the surface of the card body in the recess and the surface (for example the rear side) of the semiconductor chip arranged thereon.
  • the semiconductor chip or the housing containing the chip is glued into the recess , it may be advantageous to choose the dimensions of the recess laterally somewhat larger than the dimensions of the semiconductor chip, so that when the card body is bent, lateral gaps between the semiconductor chip and the card body within the recess result in an otherwise occurring deformation of the semiconductor chip or the housing prevent.
  • the semiconductor chip therefore has sufficient play within the cutout, so that the bending occurring in the semiconductor chip is less than the bending of the hard body.
  • This effect can be further improved by making the sides of the semiconductor chip glued into the card body as smooth as possible, for which purpose an additional smoothing, in particular of the underside of the chip, can be carried out. A relative shift between the semiconductor chip and the card body can thus be additionally promoted.
  • FIG. 1 shows in cross section a semiconductor chip 1 with an integrated fingerprint sensor, not shown in detail, which is arranged in a card body 2 within a recess 3 therein.
  • the upper side of the semiconductor chip which in particular has a contact surface provided for a finger, is offset downwards by a depth d from the upper side of the card body into the card body.
  • the edges 4 of the semiconductor chip 1 and the underside 5 facing away from the outside can be designed and arranged in the manner described so that bending of the semiconductor chip is kept as low as possible when the card body 2 is bent out of the plane of the chip card.
  • the edges 4 of the semiconductor chip 1 can at least protrude from the edges of the card body 2 formed in the recess. are slightly protruded so that the chip is held securely in the card body and is not pressed out of the recess even when the card body 2 is bent in a shape that is convex in the direction of the recess.
  • the rear side 5 can be provided with a thin adhesive layer with which the semiconductor chip 1 is held at the bottom of the recess 3 of the card body 2. Spaces (not shown in the figure) can also be provided between the card body 2 and the edges 4 of the semiconductor chip 1, which enable the position of the semiconductor chip 1 to be compensated for by bending the card body 2 by a relative displacement of the chip relative to the card body.
  • the above-described floating arrangement of the chip in the card body can also be achieved with such an adhesive layer.
  • FIG. 2 shows an alternative exemplary embodiment, in which the semiconductor chip 1 is not inserted directly into the card body 2, but with a housing which essentially comprises a frame 6 and a casing 7, which does not necessarily completely surround the semiconductor chip.
  • the depth d by which the top side of the semiconductor chip is sunk relative to the top side of the card body can in principle be as small as desired; in particular, the surfaces of the semiconductor chip and the card body can also connect flush to one another within the same plane. If the semiconductor chip is chosen to be significantly thicker than shown in the figure, the top of the chip can also protrude above the card body. With regard to the given standard, this is not a preferred embodiment.
  • the semiconductor chip 1 can be inserted in the position shown in the figure and asymmetrical with respect to the central surface of the card body; instead, it is also possible to arrange the semiconductor chip symmetrically within the card body.
  • NEN semiconductor chips can also be used with a thickness that is substantially greater than the thickness of the card body than shown in the figure.
  • the arrangement according to the invention makes it possible to integrate very thin semiconductor substrates in the chip card in a break-proof manner.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Multimedia (AREA)
  • Automation & Control Theory (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

Une microplaquette semi-conductrice (1) à détecteur d'empreinte digitale est placée dans le corps d'une carte (2) dans une position telle que lorsque la carte à puce est pliée, la charge de la puce à l'intérieur de l'ensemble carte et puce est minimisée de manière à obtenir une sécurité suffisante contre la rupture, au moins pour ce qui est des essais de pliage requis conformément aux normes ISO. A cet effet, il est prévu dans le corps de la carte un évidement (3) dans lequel la microplaquette semi-conductrice est appliquée, de préférence sans son propre boîtier, à une profondeur .sélectionnée de façon appropriée (d)
PCT/DE2002/002757 2001-08-10 2002-07-26 Carte a puce a detecteur d'empreinte digitale WO2003017211A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10139382A DE10139382A1 (de) 2001-08-10 2001-08-10 Chipkarte mit integriertem Fingerabdrucksensor
DE10139382.2 2001-08-10

Publications (2)

Publication Number Publication Date
WO2003017211A2 true WO2003017211A2 (fr) 2003-02-27
WO2003017211A3 WO2003017211A3 (fr) 2003-07-10

Family

ID=7695063

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2002/002757 WO2003017211A2 (fr) 2001-08-10 2002-07-26 Carte a puce a detecteur d'empreinte digitale

Country Status (2)

Country Link
DE (1) DE10139382A1 (fr)
WO (1) WO2003017211A2 (fr)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009140968A1 (fr) * 2008-05-22 2009-11-26 Cardlab Aps Lecteur d'empreintes digitales et son procédé de fonctionnement
US7697729B2 (en) 2004-01-29 2010-04-13 Authentec, Inc. System for and method of finger initiated actions
US7831070B1 (en) 2005-02-18 2010-11-09 Authentec, Inc. Dynamic finger detection mechanism for a fingerprint sensor
US8231056B2 (en) 2005-04-08 2012-07-31 Authentec, Inc. System for and method of protecting an integrated circuit from over currents
DE102013011812A1 (de) * 2013-07-16 2015-01-22 Peter-Joachim Neymann Elektronische Chipkarte
EP3035230A1 (fr) 2014-12-19 2016-06-22 Cardlab ApS Procédé et ensemble permettant de générer un champ magnétique
US9471825B2 (en) 2012-04-24 2016-10-18 Zwipe As Method of manufacturing an electronic card
US9659208B2 (en) 2010-01-15 2017-05-23 Idex Asa Biometric image sensing
EP3087558A4 (fr) * 2013-12-26 2017-06-21 Intel Corporation Procédé et appareil pour un dispositif de communication électronique souple
US9798917B2 (en) 2012-04-10 2017-10-24 Idex Asa Biometric sensing
FR3061333A1 (fr) * 2016-12-26 2018-06-29 Oberthur Technologies Carte plastique mince integrant un capteur d'empreinte digitale et procede de realisation
US10095968B2 (en) 2014-12-19 2018-10-09 Cardlabs Aps Method and an assembly for generating a magnetic field and a method of manufacturing an assembly
US10558901B2 (en) 2015-04-17 2020-02-11 Cardlab Aps Device for outputting a magnetic field and a method of outputting a magnetic field

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8421890B2 (en) 2010-01-15 2013-04-16 Picofield Technologies, Inc. Electronic imager using an impedance sensor grid array and method of making
GB201600890D0 (en) * 2016-01-18 2016-03-02 Zwipe As Reinforced fingerprint sensor card
JP7000196B2 (ja) * 2018-02-16 2022-01-19 株式会社東芝 Ｉｃカード

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999038112A1 (fr) * 1998-01-27 1999-07-29 Infineon Technologies Ag Module de cartes a puce pour detecteurs biometriques
DE19921231A1 (de) * 1999-05-07 2000-11-09 Giesecke & Devrient Gmbh Fingerabdrucksensor für Chipkarte

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19631569A1 (de) * 1996-07-29 1998-02-05 Kuban Waldemar Fingerabdruckscanner für die Chipkarte

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999038112A1 (fr) * 1998-01-27 1999-07-29 Infineon Technologies Ag Module de cartes a puce pour detecteurs biometriques
DE19921231A1 (de) * 1999-05-07 2000-11-09 Giesecke & Devrient Gmbh Fingerabdrucksensor für Chipkarte

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7697729B2 (en) 2004-01-29 2010-04-13 Authentec, Inc. System for and method of finger initiated actions
US7831070B1 (en) 2005-02-18 2010-11-09 Authentec, Inc. Dynamic finger detection mechanism for a fingerprint sensor
US8231056B2 (en) 2005-04-08 2012-07-31 Authentec, Inc. System for and method of protecting an integrated circuit from over currents
WO2009140968A1 (fr) * 2008-05-22 2009-11-26 Cardlab Aps Lecteur d'empreintes digitales et son procédé de fonctionnement
US8933781B2 (en) 2008-05-22 2015-01-13 Cardlab Aps Fingerprint reader and a method of operating it
US11080504B2 (en) 2010-01-15 2021-08-03 Idex Biometrics Asa Biometric image sensing
US10592719B2 (en) 2010-01-15 2020-03-17 Idex Biometrics Asa Biometric image sensing
US10115001B2 (en) 2010-01-15 2018-10-30 Idex Asa Biometric image sensing
US9659208B2 (en) 2010-01-15 2017-05-23 Idex Asa Biometric image sensing
US9798917B2 (en) 2012-04-10 2017-10-24 Idex Asa Biometric sensing
US10088939B2 (en) 2012-04-10 2018-10-02 Idex Asa Biometric sensing
US10101851B2 (en) 2012-04-10 2018-10-16 Idex Asa Display with integrated touch screen and fingerprint sensor
US10114497B2 (en) 2012-04-10 2018-10-30 Idex Asa Biometric sensing
US9471825B2 (en) 2012-04-24 2016-10-18 Zwipe As Method of manufacturing an electronic card
DE102013011812A1 (de) * 2013-07-16 2015-01-22 Peter-Joachim Neymann Elektronische Chipkarte
EP3087558A4 (fr) * 2013-12-26 2017-06-21 Intel Corporation Procédé et appareil pour un dispositif de communication électronique souple
US10095968B2 (en) 2014-12-19 2018-10-09 Cardlabs Aps Method and an assembly for generating a magnetic field and a method of manufacturing an assembly
EP3035230A1 (fr) 2014-12-19 2016-06-22 Cardlab ApS Procédé et ensemble permettant de générer un champ magnétique
US10614351B2 (en) 2014-12-19 2020-04-07 Cardlab Aps Method and an assembly for generating a magnetic field and a method of manufacturing an assembly
US10558901B2 (en) 2015-04-17 2020-02-11 Cardlab Aps Device for outputting a magnetic field and a method of outputting a magnetic field
FR3061333A1 (fr) * 2016-12-26 2018-06-29 Oberthur Technologies Carte plastique mince integrant un capteur d'empreinte digitale et procede de realisation

Also Published As

Publication number Publication date
DE10139382A1 (de) 2003-02-27
WO2003017211A3 (fr) 2003-07-10

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