WO2003012166A3 - Procede destine a la production d'un materiau de base plat en metal, materiau de base ainsi produit et son utilisation - Google Patents

Procede destine a la production d'un materiau de base plat en metal, materiau de base ainsi produit et son utilisation Download PDF

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Publication number
WO2003012166A3
WO2003012166A3 PCT/DE2002/002687 DE0202687W WO03012166A3 WO 2003012166 A3 WO2003012166 A3 WO 2003012166A3 DE 0202687 W DE0202687 W DE 0202687W WO 03012166 A3 WO03012166 A3 WO 03012166A3
Authority
WO
WIPO (PCT)
Prior art keywords
base material
producing
flat base
superconducting layer
metal flat
Prior art date
Application number
PCT/DE2002/002687
Other languages
German (de)
English (en)
Other versions
WO2003012166A2 (fr
Inventor
Ursus Krueger
Vogelaere Marc De
Original Assignee
Siemens Ag
Ursus Krueger
Vogelaere Marc De
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag, Ursus Krueger, Vogelaere Marc De filed Critical Siemens Ag
Publication of WO2003012166A2 publication Critical patent/WO2003012166A2/fr
Publication of WO2003012166A3 publication Critical patent/WO2003012166A3/fr

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00Electroforming
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00Electroforming
    • C25D1/20Separation of the formed objects from the electrodes with no destruction of said electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00Superconducting devices
    • H10N60/01Manufacture or treatment
    • H10N60/0268Manufacture or treatment of devices comprising copper oxide
    • H10N60/0296Processes for depositing or forming copper oxide superconductor layers
    • H10N60/0576Processes for depositing or forming copper oxide superconductor layers characterised by the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Superconductor Devices And Manufacturing Methods Thereof (AREA)

Abstract

La présente invention concerne un procédé destiné à la production d'un matériau de base plat en métal pour permettre l'application d'une couche supraconductrice. L'invention a pour objet de rendre ce procédé plus économique. A cet effet, une couche métallique (3) est appliquée par galvanisation sur un substrat monocristallin (1), et la couche métallique (3) est séparée du substrat (1) pour donner la matériau de base. L'invention concerne également un matériau de base produit grâce audit procédé ainsi que son utilisation.
PCT/DE2002/002687 2001-07-25 2002-07-17 Procede destine a la production d'un materiau de base plat en metal, materiau de base ainsi produit et son utilisation WO2003012166A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10136891A DE10136891B4 (de) 2001-07-25 2001-07-25 Verfahren zum Erzeugen eines flächenhaften Basismaterials aus Metall
DE10136891.7 2001-07-25

Publications (2)

Publication Number Publication Date
WO2003012166A2 WO2003012166A2 (fr) 2003-02-13
WO2003012166A3 true WO2003012166A3 (fr) 2003-10-16

Family

ID=7693460

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2002/002687 WO2003012166A2 (fr) 2001-07-25 2002-07-17 Procede destine a la production d'un materiau de base plat en metal, materiau de base ainsi produit et son utilisation

Country Status (2)

Country Link
DE (1) DE10136891B4 (fr)
WO (1) WO2003012166A2 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10136890B4 (de) * 2001-07-25 2006-04-20 Siemens Ag Verfahren und Vorrichtung zum Erzeugen eines kristallstrukturell texturierten Bandes aus Metall sowie Band
DE10346368B4 (de) * 2003-09-29 2006-05-18 Siemens Ag Verfahren und Herstellungsanlage zum Herstellen eines schichtartigen Bauteils
JP5559791B2 (ja) 2008-08-11 2014-07-23 コーニンクレッカ フィリップス エヌ ヴェ 身体領域ネットワーク用の媒体アクセス制御(mac)プロトコル

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5741377A (en) * 1995-04-10 1998-04-21 Martin Marietta Energy Systems, Inc. Structures having enhanced biaxial texture and method of fabricating same
KR20010063692A (ko) * 1999-12-24 2001-07-09 황해웅 전기도금법에 의한 2축 집합조직을 갖는 니켈 도금층 및이의 제조방법과 제조장치

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69403104T2 (de) * 1993-02-15 1997-10-30 Sumitomo Electric Industries Verfahren zum Erzeugen einer strukturierten oxydsupraleitenden Dünnschicht
GB2336849B (en) * 1998-04-27 2003-02-26 Telcon Ltd Substrate materials

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5741377A (en) * 1995-04-10 1998-04-21 Martin Marietta Energy Systems, Inc. Structures having enhanced biaxial texture and method of fabricating same
US5968877A (en) * 1995-04-10 1999-10-19 Lockheed Martin Energy Research Corp High Tc YBCO superconductor deposited on biaxially textured Ni substrate
KR20010063692A (ko) * 1999-12-24 2001-07-09 황해웅 전기도금법에 의한 2축 집합조직을 갖는 니켈 도금층 및이의 제조방법과 제조장치
US6346181B1 (en) * 1999-12-24 2002-02-12 Korea Institute Of Machinery And Materials Electroplating process for preparing a Ni layer of biaxial texture

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Section Ch Week 200317, Derwent World Patents Index; Class M11, AN 2002-031979, XP002249052 *

Also Published As

Publication number Publication date
WO2003012166A2 (fr) 2003-02-13
DE10136891B4 (de) 2004-07-22
DE10136891A1 (de) 2003-02-20

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