WO2003006705A2 - Poste tampon de fabrication de tranches en semiconducteur - Google Patents

Poste tampon de fabrication de tranches en semiconducteur Download PDF

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Publication number
WO2003006705A2
WO2003006705A2 PCT/US2002/022160 US0222160W WO03006705A2 WO 2003006705 A2 WO2003006705 A2 WO 2003006705A2 US 0222160 W US0222160 W US 0222160W WO 03006705 A2 WO03006705 A2 WO 03006705A2
Authority
WO
WIPO (PCT)
Prior art keywords
base
arms
specimen
buffer apparatus
supporting
Prior art date
Application number
PCT/US2002/022160
Other languages
English (en)
Other versions
WO2003006705A3 (fr
Inventor
Paul Bacchi
Paul S. Filipski
Original Assignee
Newport Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Newport Corporation filed Critical Newport Corporation
Publication of WO2003006705A2 publication Critical patent/WO2003006705A2/fr
Publication of WO2003006705A3 publication Critical patent/WO2003006705A3/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile

Definitions

  • This invention relates to semiconductor wafer handling and robotics systems and, in particular, to a buffer station for increasing the throughput of such systems.
  • Semiconductor wafer process environments typically include a processing unit, such as a chemical mechanical polisher, at least one wafer carrier station, an optional prealigner station, and a robotic arm for transferring wafers among the stations.
  • a processing unit such as a chemical mechanical polisher, at least one wafer carrier station, an optional prealigner station, and a robotic arm for transferring wafers among the stations.
  • the sequence for exchanging wafers on a processing station requires the robotic arm to pickup a processed wafer and return it to another location.
  • the robotic arm then retrieves an unprocessed wafer and loads it to the processing station.
  • the processing station is idled while the robotic arm is performing the aforementioned wafer exchange function.
  • a wafer buffer station includes at least one pair of supporting elements and a motion unit.
  • the supporting elements are capable of supporting at least two wafers and are located to support the wafers within the operational pathway of a measurement station.
  • the motion unit moves the supporting elements to either support wafers placed thereon within the pathway or to be separated to allow motion of the handling system during wafer handling.
  • the handling system is unduly complex and grips or releases the multiple wafers simultaneously.
  • the motion unit may drop a wafer.
  • the present invention provides an apparatus and a method for overcoming the limitations of the prior art.
  • the semiconductor buffer station disclosed herein is relatively simple, grips or releases wafers independently and, does not drop a wafer in the event of a power failure.
  • a specimen buffer station of this invention is suitable for use in a specimen processing system including a robotic arm.
  • the buffer station is beneficial for use in any processing environment where a specimen, such as a semiconductor wafer, is unloaded by the robotic arm (hereafter "robot") at a specimen processing location from which the specimen is later reloaded by the same robot or another robot.
  • the buffer station is advantageous because the processing station is less dependent on, or even independent of, specimen movements associated with the robot, resulting in increased specimen processing throughput.
  • the buffer station includes a base in which a wafer receptor is mounted. The wafer receptor supports and optionally elevates a wafer specimen. In one embodiment, multiple specimen supporting fingers protrude a first distance above the base.
  • the station fiirther includes multiple rotatable arms each having a specimen supporting surface that is located a second distance above the base.
  • the rotatable arms extend from posts that support, and impart rotating motion to, the rotatable arms.
  • the optional wafer receptor and posts preferably, but not necessarily, rotate about parallel axes.
  • the base is preferably mounted on a translation stage providing specimen- positioning capability.
  • the supporting fingers and rotatable arms coact with the wafer receptor or chuck motion in support of a wafer processing method of this invention.
  • the chuck is not mandatory, and its function can be readily replaced by another specimen holding device.
  • the supporting fingers, rotatable arms, and posts are replaced by multiple coaxially actuated upper and lower specimen supporting arms.
  • the posts are replaced by outer and inner posts that are coaxially and independently rotatable about a common longitudinal axis.
  • An upper arm protrudes from the outer post, and a lower arm protrudes from the inner post.
  • the upper and lower arms have specimen supporting surfaces that are positioned to support wafers at first and second distances above the base.
  • the upper and lower arms are independently rotatable to the above-described wafer supporting and releasing positions in support of a wafer processing method of this invention.
  • the supporting arms, rotatable arms, and posts are replaced by multiple non-coaxially actuated upper and lower specimen supporting arms.
  • An upper arm protrudes from the one rotatable post, and a lower arm protrudes from a different rotatable post.
  • the upper and lower arms have specimen supporting surfaces that are positioned to support wafers at the first and second distances above the base.
  • the upper and lower arms are independently rotatable to the above-described wafer supporting and releasing positions in support of a wafer processing method of this invention.
  • Fig. 1 is an isometric view of a wafer buffer station of this invention showing wafer supporting fingers at a first elevation and three rotatable arms at a second elevation in alternate wafer supporting and releasing positions.
  • Figs. 2A and 2B are respective plan and side elevation views of the buffer station of Fig. 1 showing the rotatable arms in the wafer supporting position for supporting a wafer at the second elevation.
  • Figs. 3 A and 3B are respective plan and side elevation views of the buffer station of Fig. 1 showing the rotatable arms in the wafer releasing position and the fingers supporting a wafer at the first elevation.
  • Figs. 4A and 4B are respective plan and side elevation fragmentary views of the buffer station of this invention showing the rotatable arms in the wafer releasing position and an optional chuck supporting a first wafer at an inspection elevation.
  • Figs. 5 A and 5B are respective plan and side elevation fragmentary views of the buffer station of this invention showing the rotatable arms in the wafer releasing position and the first wafer lowered by the chuck and being supported by the wafer supporting fingers.
  • Figs. 6A and 6B are respective plan and side elevation fragmentary views of the buffer station of this invention showing the rotatable arms in the wafer supporting position and the first wafer supported by the wafer supporting fingers.
  • Figs. 7A and 7B are respective plan and side elevation fragmentary views of the buffer station of this invention showing the rotatable arms in the wafer supporting position and supporting a second wafer while the first wafer is still supported by the wafer supporting fingers.
  • Figs. 8 A and 8B are respective plan and side elevation fragmentary views of the buffer station of this invention showing the rotatable arms in the wafer supporting position and supporting the second wafer, the first wafer having been removed from the supporting fingers by a robot.
  • Figs. 9 A and 9B are respective plan and side elevation fragmentary views of the buffer station of this invention showing the rotatable arms in the wafer supporting position, and the optional chuck elevating the second wafer to the inspection elevation.
  • Figs. 10A and 10B are respective plan and side elevation fragmentary views of the buffer station of this invention showing the rotatable arms in the wafer releasing position and the optional chuck lowering the second wafer from the inspection elevation toward the supporting fingers.
  • Figs. 11 A to 1 lH are plan and sectional elevation views of an alternative rotatable arm embodiment of this invention shown in a series of views representing a multiple wafer inspection operation.
  • Figs. 12A and 12B are respective plan and side elevation views of an alternative buffer station of this invention showing upper and lower rotatable arms in the wafer supporting positions for supporting wafers at first and second elevations.
  • Figs. 13 A and 13B are respective side elevation and plan views of an alternative post and a linearly extensible arm that moves between wafer supporting and releasing positions.
  • Figs. 14A and 14B are respective side elevation and plan views of an alternative post and a hinged arm that moves between wafer supporting and releasing positions. Detailed Description of Preferred Embodiments
  • Figs. 1-3 show a specimen buffer station 10 of this invention for use in a specimen processing system including a robot (not shown).
  • Buffer station 10 is beneficial for use in any processing environment where a specimen 12, such as a semiconductor wafer is unloaded by the robot at a specimen processing location from which the specimen 12 is later reloaded by the same robot or another robot.
  • Buffer station 10 is advantageous because robot operation is less dependent, or even independent of, specimen movements associated with buffer station 10, resulting in increased specimen processing throughput.
  • Buffer station 10 includes a base 14 that provides a planar surface.
  • Base 14 further includes at least two, but preferably three specimen supporting fingers 18 that protrude a first distance 20 above base 14 and at least two, but preferably three rotatable arms 22.
  • Rotatable arms 22 extend from posts 27 that support, and impart rotating motion to rotatable arms 22.
  • Each arm 22 has a specimen supporting surface 24 that is located a second distance 26 above base 14.
  • the specimen supporting surface 24 may be configured as a step in arm 22 which provides an edge to limit movement of the specimen 12.
  • the specimen supporting surface 24 may be configured with alternative shapes provided that the surface 24 provides a generally planar support.
  • the buffer station 10 operates in conjunction with a handling system for elevating specimens 12 to an appropriate position for processing.
  • the handling system may be embodied in various ways known in the art. In the embodiment shown in Figs. 1-3, the handling system includes a chuck 16 that nests within an aperture in the base 14. The aperture is concentrically disposed between the fingers 18 and the posts 27.
  • the chuck 16 vertically extends between the fingers 18 and posts 27 and supports, elevates, and rotates a specimen 12. As shown in Figs. 1-3, the chuck 16 and posts 27 rotate about parallel axes.
  • the handling system may include an arm that lowers from above the specimen 12 to retain the specimen 12. The arm may be connected to a vacuum grip that secures the specimen 12 upon contact.
  • a handling system may be configured in various implementations that would operate with the present invention.
  • Base 14 may be mounted on or otherwise connected to x- and y-axis translation stages 28 and 30 for providing specimen positioning capability.
  • Fig. 1 shows rotatable arms 22 in a specimen supporting position and, in dashed lines, in a specimen releasing position.
  • Rotatable arms 22 rotate concurrently by any of various well-known means, such as driving posts 27 with an actuator, belt, solenoid(s), gear(s), or pulleys.
  • Figs. 2A and 2B show rotatable arms 22 in the specimen supporting position for supporting specimen 12 at the second distance 26 above base 14.
  • Specimen 12 is shown by way of example only in phantom lines to represent a transparent specimen.
  • Specimen 12 may be a semiconductor wafer having a finite thickness.
  • Fig. 2B shows chuck 16 elevated to a distance between first and second distances 20 and 26.
  • Figs. 3 A and 3B show rotatable arms 22 in the specimen releasing position in which specimen supporting fingers 18 can support specimen 12 at first distance 20 above base 14.
  • Fig. 3B shows chuck 16 (or a robot) elevated to a distance less than first distance 20.
  • Chuck 16 can be elevated over distances ranging from substantially less than the first distance 20 to substantially greater than the second distance 26.
  • Chuck 16 is movable by any of various well-known means. Other handling systems would likewise elevate the specimen 12 to the same heights.
  • buffer station 10 A method of processing semiconductor wafers by employing buffer station 10 is described below with reference to Figs. 4-10.
  • Figs. 4A and 4B show a first wafer processing operation in which rotatable arms 22 are in the wafer releasing position and chuck 16 supports a first wafer 40 at a processing distance 42 above base 14.
  • Figs. 5A and 5B show a first wafer storage operation in which rotatable arms 22 remain in the wafer releasing position and first wafer 40 is lowered by chuck 16 for storage on wafer supporting fingers 18.
  • Figs. 6A and 6B show an intermediate operation in which rotatable arms 22 rotate to the wafer supporting position while first wafer 40 remains stored on wafer supporting fingers 18.
  • Figs. 7A and 7B show a second wafer storing operation in which rotatable arms 22 remain in the wafer supporting position and receive a second wafer 44 from a robot (not shown) while first wafer 40 remains stored on wafer supporting fingers 18.
  • the robot serves to deliver unprocessed specimens to the buffer station 10 and retrieve processed specimens 12.
  • Figs. 8A and 8B show a first wafer retrieving operation in which rotatable arms 22 continue supporting second wafer 44 while first wafer 40 (no longer shown) was retrieved from supporting fingers 18 by the robot.
  • Figs. 9A and 9B show a second wafer processing operation in which rotatable arms 22 remain in the wafer supporting position and chuck 16 elevates second wafer 44 to processing distance 42 above base 14.
  • the buffer station has returned to substantially the state shown in Figs. 4A and 4B.
  • Figs. 10A and 10B show a second wafer storing operation in which rotatable arms 22 rotate to the wafer releasing position and chuck 16 lowers second wafer 44 toward supporting fingers 18.
  • the buffer station has returned to substantially the state shown in Figs. 5A and 5B.
  • FIGS. 11 A to 11H show a series of views representing how the alternative embodiment carries out the method of inspecting semiconductor wafers that was described with reference to Figs. 4-10.
  • Fig. 1 IE best shows the structure of this embodiment.
  • Posts 27 and fingers 18 (Figs. 1-10) are replaced by outer post 50 and inner post 52 that are coaxially and independently rotatable about a common longitudinal axis 54.
  • An upper arm 56 protrudes from outer post 50, and a lower arm 58 protrudes from inner post 52 and through an opening in outer post 50.
  • Upper arm 56 and lower arm 58 have respective specimen supporting surfaces 60 and 62 that are positioned to support wafers at the respective second and first distances 26 and 20 above base 14.
  • Upper and lower arms 56 and 58 are independently rotatable to the above-described wafer supporting and releasing positions.
  • FIG. 11 A shows the first wafer processing operation in which upper and lower arms 56 and 58 are both in the wafer releasing position and chuck 16 supports first wafer 40 at processing distance 42 above base 14.
  • Fig. 1 IB shows a rotation operation in which inner post 52 rotates lower arm 58 to the wafer supporting position while upper arm 56 remains in the wafer releasing position.
  • Fig. 11C shows the first wafer storage operation in which first wafer 40 is lowered by chuck 16 for storage on lower arm 58.
  • Fig. 1 ID shows another rotation operation in which outer post 50 rotates upper arm 56 to the wafer supporting position while lower arm 58 continues supporting first wafer 40.
  • Fig. 1 IE shows the second wafer storing operation in which upper and lower arms 56 and 58 remain in the wafer supporting position and upper arm 56 receives second wafer 44 from the robot (not shown) while first wafer 40 remains stored on lower arm 58.
  • Fig. 1 IF shows the first wafer retrieving operation in which upper arm 56 continues supporting second wafer 44 while first wafer 40 (no longer shown) was retrieved from lower arm 58 by the robot.
  • Fig. 11G shows the second wafer processing operation in which upper and lower arms 56 and 58 remain in the wafer supporting position and chuck 16 elevates second wafer 44 to processing distance 42 above base 14.
  • Fig. 11H shows yet another rotation operation in which upper and lower arms 56 and 58 both rotate to the wafer releasing position, which returns the buffer station to substantially the processing operation state shown in Fig. 11 A.
  • Figs. 12A and 12B show an alternative embodiment of the present invention in which fingers 18 (Figs. 1-10) are replaced by lower posts 70.
  • Lower posts 70 may be disposed non-coaxially relative to posts 27.
  • Each lower post 70 may be disposed equidistantly between posts 27, adjacent posts 27, or at other suitable locations.
  • Lower posts 70 are each connected to a corresponding lower arm 72.
  • Arms 22 and 72 have specimen supporting surfaces that are positioned to support wafers at the respective second and first distances 26 and 20 above base 14.
  • Lower arms 72 rotate independently from arms 22 to the above-described wafer supporting and releasing positions in support of a wafer processing method described in reference to Figs. 11A-11H.
  • Figs. 13 A and 13B show an alternative embodiment for a post 76 and an extensible arm 78.
  • Arm 78 is linearly actuated to horizontally extend and retract to specimen supporting and releasing positions, with the supporting position shown in phantom. Accordingly, arm 78 does not rotate but extends and retracts through mechanisms well known in the art.
  • arm 78 is configured for telescoping extension and retraction as shown.
  • arm 78 includes a supporting surface 24 for supporting a specimen. Skilled persons will appreciate that arm 78 may be substituted for arms 22, 56, 58, and 72 in previously disclosed embodiments.
  • Figs. 14A and 14B show an alternative embodiment for a post 80 and a hinged arm 82.
  • Arm 82 vertically rotates to specimen supporting and releasing positions, with the supporting position shown in phantom.
  • Arm 82 may include a hinge 84 to enable vertical rotation.
  • Post 80 may include some or all of the mechanisms commonly known in the art for movement of arm 82.
  • arm 82 includes a supporting surface 24. Arm 82 maybe substituted for arms 22, 56, 58, and 72 in previously disclosed embodiments. Skilled persons will appreciate that arms 78 and 82 of Figs. 13A, 13B, 14A, and 14B maybe operated in support of wafer processing methods disclosed above.
  • Fingers 18 and rotatable arms 22 may vary in their configurations and still be included within the scope of the present invention.
  • Buffer station 10 of the present invention can operate with a robot that simultaneously carries two or more wafers, and can be readily modified to include a pre-alignment unit. It will be obvious to those having skill in the art that many changes may be made to the details of the above-described embodiments of this invention without departing from the underlying principles thereof. Accordingly, it will be appreciated that this invention is also applicable to specimen handling applications other than those found in semiconductor processing. The scope of the invention should, therefore, be determined only by the following claims.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Un poste tampon comporte une base et des colonnes multiples qui s'étendent depuis une base. Un bras mobile est accouplé à chaque colonne et se déplace entre des positions de soutien et de dégagement de spécimens. La station tampon peut également comprendre des doigts de support s'étendant depuis la base pour soutenir un spécimen. Dans un autre mode de réalisation, la station de base peut comprendre des bras inférieurs mobiles qui s'accouplent chacun à une colonne correspondante. Les bras inférieurs mobiles se déplacent entre des positions de soutien et de dégagement de spécimens. Les bras mobiles inférieurs peuvent également s'accoupler à leurs propres colonnes individuelles. Le mouvement des bras inférieurs est indépendant de celui des bras supérieurs. La station tampon soutient des spécimens à des hauteurs différentes, si bien que la productivité de traitement des spécimens est accrue.
PCT/US2002/022160 2001-07-13 2002-07-12 Poste tampon de fabrication de tranches en semiconducteur WO2003006705A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US30542001P 2001-07-13 2001-07-13
US60/305,420 2001-07-13

Publications (2)

Publication Number Publication Date
WO2003006705A2 true WO2003006705A2 (fr) 2003-01-23
WO2003006705A3 WO2003006705A3 (fr) 2003-03-27

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PCT/US2002/022160 WO2003006705A2 (fr) 2001-07-13 2002-07-12 Poste tampon de fabrication de tranches en semiconducteur

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008065645A1 (fr) * 2006-11-27 2008-06-05 Camtek Ltd. Système de support et procédé pour supporter un objet
EP2513962A2 (fr) * 2009-12-18 2012-10-24 Lam Research AG Tige renforcée conçue pour être utilisée dans un mandrin à tige et mandrin à tige utilisant une telle tige renforcée

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5571325A (en) * 1992-12-21 1996-11-05 Dainippon Screen Mfg. Co., Ltd. Subtrate processing apparatus and device for and method of exchanging substrate in substrate processing apparatus
US5989346A (en) * 1995-12-12 1999-11-23 Tokyo Electron Limited Semiconductor processing apparatus
US6309163B1 (en) * 1997-10-30 2001-10-30 Applied Materials, Inc. Wafer positioning device with storage capability
US6331095B1 (en) * 1998-04-04 2001-12-18 Tokyo Electron Limited Transportation system and processing apparatus employing the transportation system
US6390767B1 (en) * 1999-03-10 2002-05-21 Nova Measuring Instruments Ltd. Positioning assembly

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5571325A (en) * 1992-12-21 1996-11-05 Dainippon Screen Mfg. Co., Ltd. Subtrate processing apparatus and device for and method of exchanging substrate in substrate processing apparatus
US5989346A (en) * 1995-12-12 1999-11-23 Tokyo Electron Limited Semiconductor processing apparatus
US6309163B1 (en) * 1997-10-30 2001-10-30 Applied Materials, Inc. Wafer positioning device with storage capability
US6331095B1 (en) * 1998-04-04 2001-12-18 Tokyo Electron Limited Transportation system and processing apparatus employing the transportation system
US6390767B1 (en) * 1999-03-10 2002-05-21 Nova Measuring Instruments Ltd. Positioning assembly

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008065645A1 (fr) * 2006-11-27 2008-06-05 Camtek Ltd. Système de support et procédé pour supporter un objet
EP2513962A2 (fr) * 2009-12-18 2012-10-24 Lam Research AG Tige renforcée conçue pour être utilisée dans un mandrin à tige et mandrin à tige utilisant une telle tige renforcée
EP2513962A4 (fr) * 2009-12-18 2013-11-27 Lam Res Ag Tige renforcée conçue pour être utilisée dans un mandrin à tige et mandrin à tige utilisant une telle tige renforcée
US8608146B2 (en) 2009-12-18 2013-12-17 Lam Research Ag Reinforced pin for being used in a pin chuck, and a pin chuck using such reinforced pin

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