WO2003006343A1 - Horizontal cassette - Google Patents
Horizontal cassette Download PDFInfo
- Publication number
- WO2003006343A1 WO2003006343A1 PCT/US2002/022241 US0222241W WO03006343A1 WO 2003006343 A1 WO2003006343 A1 WO 2003006343A1 US 0222241 W US0222241 W US 0222241W WO 03006343 A1 WO03006343 A1 WO 03006343A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- cassette
- enclosure portion
- closed
- retention
- door
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
Definitions
- FIG. 3 is perspective view of a cassette according to the invention.
- FIG. 13 illustrates a plan view diagram of a cassette with a zone of insertion and withdrawal indicated by the dashed lines.
- the positioning of the wafer engaging members associated with the first cassette embodiment are illustrated with the axis of rotation identified with the letter a.
- the axis of rotation is placed outside the zone of insertion and withdrawal with the engagement portion swingable between the retention position against the film frame and to the non-retention or retracted position adjacent the side wall of the enclosure portion.
- a handle may be formed on injection molded plastic in a generally U-shape with a pair of detents 120 which allows insertion into handle brackets 126 positioned on the side of the shell of the enclosure portion.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Warehouses Or Storage Devices (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2004-7000294A KR20040016977A (en) | 2001-07-12 | 2002-07-12 | Horizontal cassette |
EP02747007A EP1404594A4 (en) | 2001-07-12 | 2002-07-12 | Horizontal cassette |
JP2003512125A JP2005508274A (en) | 2001-07-12 | 2002-07-12 | Horizontal cassette |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US30506501P | 2001-07-12 | 2001-07-12 | |
US60/305,065 | 2001-07-12 | ||
US10/194,983 US6923325B2 (en) | 2001-07-12 | 2002-07-11 | Horizontal cassette |
US10/194,983 | 2002-07-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2003006343A1 true WO2003006343A1 (en) | 2003-01-23 |
Family
ID=26890588
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2002/022241 WO2003006343A1 (en) | 2001-07-12 | 2002-07-12 | Horizontal cassette |
Country Status (8)
Country | Link |
---|---|
US (1) | US6923325B2 (en) |
EP (1) | EP1404594A4 (en) |
JP (1) | JP2005508274A (en) |
KR (1) | KR20040016977A (en) |
CN (1) | CN1289364C (en) |
MY (1) | MY130842A (en) |
TW (1) | TW583742B (en) |
WO (1) | WO2003006343A1 (en) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7789241B2 (en) * | 2002-03-12 | 2010-09-07 | Seagate Technology Llc | Ergonomic substrate container |
TWI283621B (en) * | 2002-12-02 | 2007-07-11 | Miraial Co Ltd | Thin plate storage container |
JP4133407B2 (en) * | 2003-02-13 | 2008-08-13 | ミライアル株式会社 | Thin plate storage container |
US7347329B2 (en) * | 2003-10-24 | 2008-03-25 | Entegris, Inc. | Substrate carrier |
KR100573896B1 (en) * | 2004-08-16 | 2006-04-26 | 동부일렉트로닉스 주식회사 | Apparatus and method for preventing wafer separation in a carrier box |
CN1313332C (en) * | 2004-09-21 | 2007-05-02 | 财团法人工业技术研究院 | Hexalink location mechanism |
US9388936B2 (en) | 2005-03-01 | 2016-07-12 | Kenneth G. Stewart, III | Device for implement storage |
US8746647B2 (en) * | 2005-03-01 | 2014-06-10 | Kenneth G. Stewart, III | Device for implement storage |
US20080006559A1 (en) * | 2006-07-07 | 2008-01-10 | Entegris, Inc. | Substrate carrier and handle |
TWM309202U (en) * | 2006-08-15 | 2007-04-01 | Gudeng Prec Industral Co Ltd | Wafer pod and wafer holding device thereof |
JP4842879B2 (en) * | 2007-04-16 | 2011-12-21 | 信越ポリマー株式会社 | Substrate storage container and its handle |
KR100924506B1 (en) * | 2007-11-26 | 2009-11-02 | 내일시스템주식회사 | Cassette for Film Type Lead Frame |
JP5279372B2 (en) * | 2008-07-07 | 2013-09-04 | 信越ポリマー株式会社 | Storage case for processing jig |
US20100020440A1 (en) * | 2008-07-25 | 2010-01-28 | Seagate Technology Llc | Low profile substrate shipper |
DE102009024239A1 (en) * | 2009-05-29 | 2010-12-02 | Schmid Technology Systems Gmbh | Apparatus and method for stacking a plurality of flat substrates |
TWI363030B (en) * | 2009-07-10 | 2012-05-01 | Gudeng Prec Industral Co Ltd | Wafer container with top flange structure |
JP5328627B2 (en) * | 2009-12-17 | 2013-10-30 | 信越ポリマー株式会社 | Substrate storage container |
JP6189047B2 (en) * | 2013-02-18 | 2017-08-30 | 株式会社ディスコ | cassette |
US9127495B2 (en) * | 2013-03-13 | 2015-09-08 | Ncr Corporation | Secure enclosure |
JP6067129B2 (en) * | 2013-09-11 | 2017-01-25 | ミライアル株式会社 | Substrate storage container |
KR102223033B1 (en) * | 2014-04-29 | 2021-03-04 | 삼성전자주식회사 | wafer storage container |
KR101610168B1 (en) | 2014-07-16 | 2016-04-08 | 주식회사 도호세미텍 | Wafer cassette |
JP6375186B2 (en) * | 2014-09-05 | 2018-08-15 | 株式会社Screenホールディングス | Substrate storage container, load port device, and substrate processing apparatus |
TWI537192B (en) * | 2015-02-24 | 2016-06-11 | 友達光電股份有限公司 | Packing box |
TWM510539U (en) * | 2015-03-13 | 2015-10-11 | Entegris Inc | Modified spring cushion for film frame shipper |
US9972740B2 (en) | 2015-06-07 | 2018-05-15 | Tesla, Inc. | Chemical vapor deposition tool and process for fabrication of photovoltaic structures |
CN105751179B (en) * | 2016-03-25 | 2018-03-16 | 上海应用技术学院 | Portable film hanger rack collecting box |
US9748434B1 (en) | 2016-05-24 | 2017-08-29 | Tesla, Inc. | Systems, method and apparatus for curing conductive paste |
US9954136B2 (en) * | 2016-08-03 | 2018-04-24 | Tesla, Inc. | Cassette optimized for an inline annealing system |
US10115856B2 (en) | 2016-10-31 | 2018-10-30 | Tesla, Inc. | System and method for curing conductive paste using induction heating |
CN106409734A (en) * | 2016-11-04 | 2017-02-15 | 江苏纳沛斯半导体有限公司 | Wafer case |
TWI735115B (en) * | 2019-12-24 | 2021-08-01 | 力成科技股份有限公司 | A wafer storage cassette and a wafer carrier plate |
TWI793703B (en) * | 2021-06-04 | 2023-02-21 | 家登精密工業股份有限公司 | Closures and containers with closures |
KR20240068690A (en) * | 2021-09-22 | 2024-05-17 | 엔테그리스, 아이엔씨. | process carrier |
CN117524949B (en) * | 2024-01-04 | 2024-03-12 | 上海岚玥新材料科技有限公司 | Wafer boat box convenient for limiting wafers and working method thereof |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5960959A (en) * | 1998-01-13 | 1999-10-05 | Industrial Technology Research Institute | Wafer retaining mechanism |
US5988392A (en) * | 1997-09-01 | 1999-11-23 | Shin-Etsu Polymer Co., Ltd. | Shipping container |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4043451A (en) | 1976-03-18 | 1977-08-23 | Fluoroware, Inc. | Shipping container for silicone semiconductor wafers |
US4668484A (en) * | 1984-02-13 | 1987-05-26 | Elliott David J | Transport containers for semiconductor wafers |
US4588086A (en) | 1984-06-07 | 1986-05-13 | Coe Thomas U | Substrate and media carrier |
US4815912A (en) | 1984-12-24 | 1989-03-28 | Asyst Technologies, Inc. | Box door actuated retainer |
US4709834A (en) * | 1987-02-02 | 1987-12-01 | Empak Inc. | Storage box |
US5024329A (en) | 1988-04-22 | 1991-06-18 | Siemens Aktiengesellschaft | Lockable container for transporting and for storing semiconductor wafers |
US5482161A (en) | 1994-05-24 | 1996-01-09 | Fluoroware, Inc. | Mechanical interface wafer container |
US5452795A (en) | 1994-11-07 | 1995-09-26 | Gallagher; Gary M. | Actuated rotary retainer for silicone wafer box |
USRE38221E1 (en) | 1995-10-13 | 2003-08-19 | Entegris, Inc. | 300 mm microenvironment pod with door on side |
US5853214A (en) | 1995-11-27 | 1998-12-29 | Progressive System Technologies, Inc. | Aligner for a substrate carrier |
US5788082A (en) | 1996-07-12 | 1998-08-04 | Fluoroware, Inc. | Wafer carrier |
US5711427A (en) | 1996-07-12 | 1998-01-27 | Fluoroware, Inc. | Wafer carrier with door |
US5915562A (en) | 1996-07-12 | 1999-06-29 | Fluoroware, Inc. | Transport module with latching door |
US6010008A (en) | 1997-07-11 | 2000-01-04 | Fluoroware, Inc. | Transport module |
US6019241A (en) * | 1998-01-05 | 2000-02-01 | Burns; Kyle S. | Paint tray with storable carrying handle |
US6267245B1 (en) | 1998-07-10 | 2001-07-31 | Fluoroware, Inc. | Cushioned wafer container |
JP3556480B2 (en) * | 1998-08-17 | 2004-08-18 | 信越ポリマー株式会社 | Precision substrate storage container |
US6206196B1 (en) | 1999-01-06 | 2001-03-27 | Fluoroware, Inc. | Door guide for a wafer container |
US6540467B1 (en) * | 2001-06-18 | 2003-04-01 | Lsi Logic Corporation | Apparatus and method of semiconductor wafer protection |
-
2002
- 2002-07-11 US US10/194,983 patent/US6923325B2/en not_active Expired - Fee Related
- 2002-07-12 CN CNB028140397A patent/CN1289364C/en not_active Expired - Fee Related
- 2002-07-12 TW TW091115529A patent/TW583742B/en not_active IP Right Cessation
- 2002-07-12 WO PCT/US2002/022241 patent/WO2003006343A1/en active IP Right Grant
- 2002-07-12 EP EP02747007A patent/EP1404594A4/en not_active Withdrawn
- 2002-07-12 MY MYPI20022657A patent/MY130842A/en unknown
- 2002-07-12 JP JP2003512125A patent/JP2005508274A/en active Pending
- 2002-07-12 KR KR10-2004-7000294A patent/KR20040016977A/en not_active Application Discontinuation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5988392A (en) * | 1997-09-01 | 1999-11-23 | Shin-Etsu Polymer Co., Ltd. | Shipping container |
US5960959A (en) * | 1998-01-13 | 1999-10-05 | Industrial Technology Research Institute | Wafer retaining mechanism |
Non-Patent Citations (1)
Title |
---|
See also references of EP1404594A4 * |
Also Published As
Publication number | Publication date |
---|---|
US20030010673A1 (en) | 2003-01-16 |
EP1404594A1 (en) | 2004-04-07 |
MY130842A (en) | 2007-07-31 |
CN1289364C (en) | 2006-12-13 |
EP1404594A4 (en) | 2007-04-04 |
CN1527788A (en) | 2004-09-08 |
JP2005508274A (en) | 2005-03-31 |
TW583742B (en) | 2004-04-11 |
KR20040016977A (en) | 2004-02-25 |
US6923325B2 (en) | 2005-08-02 |
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