JPH10321713A - Semiconductor wafer packaging container - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a packaging container which can be smoothly opened or closed and does not break or contaminate a semiconductor wafer which is housed therein. SOLUTION: A first divided container 11 has a flat portion perpendicular to the right-left direction that opens and closes the container 11 at the end of the peripheral wall 11a, and the flat portion has a hole 11f elongated in the up-down direction. A rectangular projection 11g extends in the right-left opening direction from the center of the flat portion, and a plurality of retaining holes 11h are made in line in the vertical direction near the tip of the projection 11g. A second divided container 12 of the bottom side has a projection 12e, extending from the center of the end of the peripheral wall in the right-left direction and removably inserted into the hole 11f of the first divided container 11. Further, the second divided container 12 has a plurality of retaining projections 12f, retained by the retaining holes 11h of the first divided container 11 at the portion, corresponding to the retaining hole 11h of the first divided container 11 on the peripheral wall thereof.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer packaging container for storing and safely transporting a semiconductor wafer without damaging or contaminating the same, and more particularly to a semiconductor wafer packaging container which can be opened and closed smoothly and accommodated. The present invention relates to a semiconductor wafer packaging container that does not damage or contaminate a semiconductor wafer during opening and closing.

[0002]

2. Description of the Related Art A packaging container for semiconductor wafers usually comprises a wafer carrier for accommodating a plurality of semiconductor wafers, a container body for accommodating and holding the wafer carriers, a lid, a wafer retainer and the like. As a general material of the wafer carrier and the container body, polypropylene is used, and the lid is made of polypropylene or polycarbonate. In addition, polyethylene or a thermoplastic elastomer is used for the wafer retainer.

[0003] The semiconductor wafer is manufactured by slicing a single crystal such as silicon thinly. The semiconductor wafer is highly brittle and has a great influence on physical properties due to contamination. Every effort must be made in the process to prevent damage and contamination. Therefore, the semiconductor wafer packaging container not only prevents the wafer from being damaged due to an external impact, but also contamination by particles generated by friction with the wafer retainer in the container, or the outside air due to a pressure difference or deformation between the inside and outside of the container. It is necessary to avoid contamination due to intrusion. To this end, it is necessary to secure the fixation of the wafer when storing the container and to avoid the contact friction with the wafer retainer, etc. It is strictly required to ensure impact resistance and airtightness.

In the past, the maximum diameter of a semiconductor wafer was at most 8 inches, and therefore, the accommodation of a wafer in a wafer carrier and the removal of a wafer from the carrier depended exclusively on humans. Various issues occur,
Considerations have been made on these issues. Specifically, it has been determined that a semiconductor wafer having a maximum diameter of 12 inches (300 mm) has been put to practical use. In order to increase the size of the semiconductor wafer, various fields dealing with semiconductor wafers, such as wafer manufacturers, transportation-related fields, and device manufacturers, have been decided. Standardization of each wafer handling specification and the like has been performed.

[0005] Standardization of the above-mentioned wafer packaging container is naturally studied, and international standardization of the basic part has already been carried out by SEMI (Semiconductor Equipment and Mater).
ialInternational) standard. The basic philosophy of the standardization is to appropriately cope with full automation in various processing steps accompanying the enlargement of semiconductor wafers. In other words, the processes in various processes such as cleaning, printing, cutting, etc., which had previously depended on manual labor, have been standardized, and the handling of semiconductor wafers in each process is completely entrusted to robots for complete automation. Therefore, even in the case of a wafer packaging container, it is necessary to adapt to the automation. Incidentally, a semiconductor wafer carried into a device maker is basically handled in a horizontal posture in various processing steps of the device.

Conventionally, packaging containers developed for semiconductor wafers are roughly classified into two types: a vertical type and a horizontal type. That is, the vertical type wafer packaging container has a storage structure suitable for vertically supporting and storing a semiconductor wafer stored in a wafer carrier, and mounting the container body on a mounting table or the like while maintaining its posture. The horizontal-type wafer packaging container supports a semiconductor wafer accommodated in a wafer carrier horizontally, and holds the container body on a mounting table or the like while maintaining its posture. This type has a structure. Here, the specifications of the wafer carrier are standardized according to the SEMI standard,
Its basic structure is common.

FIG. 7 is an exploded perspective view of a conventional vertical type semiconductor wafer packaging container. Reference numeral 1 denotes a container main body, 2 denotes a lid, and 3 denotes a container housed in the container main body 1 and the lid 2. A wafer retainer 4, a wafer retainer attached to the center of the back surface of the lid 2, a gasket 5 attached to the opening side periphery of the container main body, and hermetically sealing when the opening of the container main body 1 is closed by the lid 2; Reference numeral 6 denotes a clamp which is formed integrally with the lid 2 and engages with the container body 1 when the lid 2 is covered. The structure of this vertical-type packaging container is such that a plurality of semiconductor wafers are accommodated and supported in support grooves formed in parallel with the arc-shaped inner peripheral wall of the wafer carrier 3 and in this state, the inside of the container body 1 is The container is stored, covered with the lid 2, and the container body is closed by the clamp 6. At the center of the back surface of the lid 2, a wafer retainer 4 having a plurality of support grooves having the same form as the support grooves is attached.
When the clamp 6 is engaged and the container main body is closed to close the container body, when opposing peripheral edges of a plurality of semiconductor wafers accommodated and supported in the support grooves of the wafer carrier 3 are accommodated in the respective support grooves of the wafer retainer 4. Simultaneously, the semiconductor wafer in the container is firmly supported without rattling.

When opening this vertical type semiconductor wafer packaging container, the clamp 6 which holds the container body 1 and the lid 2 is removed and the lid 2 is removed. At this time, the vertical type semiconductor wafer packaging container usually lifts the lid 6 at the same time as the clamp 6 is removed due to the reaction force of the wafer retainer 4 interposed between the lid 2 and the semiconductor wafer, By lifting the lid 2, the container body can be opened. On the other hand, when closing the container main body, the lid 2 is strongly pressed down against the reaction force of the retainer 4 so that the clamp 6 is engaged with the container main body 1 and the lid 2.

As described above, the vertical type semiconductor wafer packaging container is advantageous in that the semiconductor wafer can be supported and transported in an upright state during transportation, but it is advantageous to take out the wafer carrier 3 from the inside of the container body 1. It is necessary to move the wafer carrier 3 directly above the container body 1 while maintaining the vertical posture. Further, the wafer carrier 3 taken out vertically upward from the container body 1 is changed in position from a vertical posture to a horizontal posture on the spot, and then the semiconductor wafers accommodated in the carrier 3 are horizontally moved one by one by a robot. Will be taken out.

On the other hand, FIG. 8 is a perspective view of a typical semiconductor wafer packaging container of a horizontal type which was previously proposed as Japanese Patent Application No. 9-36225 by the same applicant as the present application. In this packaging container, the container body 7 is composed of a first divided container 8 and a second divided container 9, and the entire top plate portion 8 a and the entire bottom plate portion 9 a when laid sideways are respectively the first divided container 8.
And the second divided containers 8 and 9 and the peripheral wall portions 8b and 9b.
Is vertically divided along the peripheral surface as first and second divided containers 8 and 9 as shown by reference numeral A in the same figure.

This horizontal type semiconductor wafer packaging container horizontally stores and supports semiconductor wafers, and further has a first
The second divided containers 8 and 9 are moved in the horizontal direction and are opened and closed. Therefore, when the wafer carrier is attached to and detached from the container body 7, for example, the container body 7 is placed in the horizontal position in which the semiconductor wafer is supported in a horizontal position, and the first divided container 8 on the top plate portion side is divided into the second divided portion on the bottom plate portion side. After the wafer carrier is horizontally moved in the direction away from the container 9, the wafer carrier can be moved vertically upward with the same posture only by slightly moving the wafer carrier in the horizontal direction. Therefore, even when such a packaging container is used for transporting a large-sized semiconductor wafer, it is not necessary to convert the packaging container to a horizontal posture for the subsequent processing steps. And the risk of contamination is reduced.

[0012]

However, as described above, semiconductor wafers are required to have extremely high airtightness in order to avoid contamination due to invasion of outside air. In the vertical type packaging container, the container body 1 and the lid 2 are configured so that their openings are closely fitted to each other via a gasket. Therefore, in the above-described conventional semiconductor wafer packaging container, when the lid 2 is lifted to open the container main body, even the container main body 1 and the wafer carrier 3 are lifted together with the lid 2. In addition, the container body cannot be opened smoothly. Further, the lifted main body 1 may fall and give an impact to the semiconductor wafer contained therein. Further, even if the container body 1 is not lifted together with the lid 2, the lid 2 cannot be lifted straight up, but is lifted in an inclined manner, and is attached to the back surface of the lid 2. Wafer retainer 4
Disadvantageously comes into contact with the semiconductor wafer and the semiconductor wafer is damaged.

Further, in the vertical type semiconductor wafer packaging container, the reaction force of the wafer retainer 4 is increased so that the lid 2 is completely detached from the container body 1 when the clamp 6 is removed. Can be prevented from being lifted together. However, when the reaction force is increased, the lid 2 must be strongly pressed against the container main body 1 when closing the container main body 1, and the lid 2 is disengaged from the container main body 1. When the clamp 6 is opened for removal, the engaging force of the clamp 6 becomes too large due to the reaction force, and an excessive load is applied to the hand of the worker. Further, even if the lid 2 is lifted by the reaction force, the lifting direction of the lid 2 is not defined, so that the lid 2 is lifted obliquely and the wafer retainer attached to the inner surface of the lid 2 is lifted. 4 may damage the semiconductor wafer.

On the other hand, in order to open the first divided container 8 and the second divided container 9 even in a horizontal type packaging container,
The first divided container 8 on the top plate side is pulled so as to be horizontally separated from the second divided container 9 on the bottom plate side. At this time, the openings of the first and second divided containers 8 and 9 are closely fitted to each other via a gasket, and the pulling direction is a horizontal direction orthogonal to the direction of gravity, so that the frictional resistance between the table and the table is reduced. If it is low, there is a concern that the remaining second divided container 9 of the bottom plate is dragged and moved by the first divided container 8 on the top plate side.

The present invention has been made to solve such a problem, and a specific object of the present invention is to allow a semiconductor wafer packaging container to be smoothly opened and closed without dragging one of the semiconductor wafer packaging containers. An object of the present invention is to provide a semiconductor wafer packaging container which does not damage or contaminate the semiconductor wafer.

[0016]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a semiconductor device having a plurality of substantially circular semiconductor wafers having two closing members which are engaged and closed by an engaging means which is a main structure of the present invention. A synthetic resin semiconductor wafer packaging container that accommodates and supports in parallel, wherein one of the closing members is integrally formed with a protruding portion extending in the opening and closing direction of the closing member, and the other closing member has The present invention is attained by a semiconductor wafer packaging container, wherein an insertion / removal opening through which the protrusion is inserted / removed is formed.

Preferably, the insertion hole is formed in a plane orthogonal to the opening / closing direction, and further, the one closing member is connected to a plane including the insertion opening of the other closing member. It is preferable that a step portion composed of a substantially flat surface parallel to the flat surface is formed at a dimension position equal to or greater than the extension dimension of the protruding portion provided in the projection.

Further, the engaging means corresponds to an engaging projection protruding from the one closing member having the protruding portion in a direction orthogonal to the protruding portion, and corresponding to the engaging protrusion of the other closing member. It is preferable that the engaging means comprises a protruding piece having an engaging hole which protrudes from the portion to be engaged. Alternatively, the engaging means may be a clamp separate from the closing member.

Preferably, the two closing members are a lid and a container main body, and the semiconductor wafer is accommodated in a vertical state. In this semiconductor wafer packaging container, for example, the semiconductor wafers are housed in a state where they are supported in parallel in a vertical direction by a wafer carrier, and a wafer retainer is attached to an inner surface of the lid. A wafer carrier supporting the semiconductor wafer is accommodated in the container body, and an opening of the container body is closed with the lid. At this time, the projecting portion of the container main body is inserted into the insertion opening of the lid, and the lid is pressed toward the container main body. At this time, the lid is guided while being restricted in its direction toward the container body by the insertion / removal opening and the protruding portion, and is not attached to the inner surface of the lid because the lid does not incline. The damaged wafer retainer does not damage the semiconductor wafer.

Further, the lid is pressed against the container body against the reaction force of the wafer retainer.
The projection of the lid is pressed against the peripheral wall of the container body while pressing the step of the lid with the palm of the hand, and the engagement projection of the container body is engaged with the engagement hole of the projection. Then, the opening of the container body is closed with the lid. Since the stepped portion is formed at a position larger than the extension of the projecting portion of the container main body, the projecting portion does not hit the hand when the stepped portion is pressed down with the palm, which hinders the closing operation. Never. In addition, from the viewpoint of the closing operation, the width of the step is desirably about 2 cm or more so that the palm can be put thereon, and the distance from the tip of the protruding piece to the step is the same. It is desirable that the length be such that the palm rests on the part and the fingertips touch the tip of the protruding piece.

In the semiconductor wafer-like container in the closed state, the container main body and the lid are engaged with the projecting portion and the insertion / removal opening in the vertical opening / closing direction, and are engaged with the engaging projection in the opening / closing direction. Since the container is closed by two-way engagement with the engagement hole, rattling between the container body and the lid is spun.

On the other hand, when removing the lid from the container body, first, the engaging means is released. At this time, the lid is slightly lifted by the reaction force of the wafer retainer, but the rising direction is restricted by the projecting portion of the container main body and the insertion / removal opening of the lid, so that the lid is lifted up. There is no danger of the semiconductor wafer being lifted up obliquely and coming into contact with and damaging the semiconductor wafer housed therein. Further, when removing the lid, it is sufficient to lift the lid while pressing down the top of the projecting portion of the container body inserted through the insertion opening of the lid with the operator's finger, This can prevent the container main body from being lifted by being lifted by the lid, and can easily separate the tightly fitted lid from the container main body.

Further, the two closing members divide the top plate portion and the bottom plate portion when the semiconductor wafer is placed laterally into first and second divided top plate portions and first and second divided bottom plate portions, respectively. Then, the first divided top plate portion and the second divided bottom plate portion that face each other on the diagonal line have a large area that is more than 1/2 of the entire area than the adjacent second divided top plate portion and first divided bottom plate portion. The first divided top plate and the first divided bottom plate, and the second divided top plate and the second divided bottom plate, which are vertically opposed to each other, are connected to each other by first and second divided peripheral wall portions divided into right and left. The first divided container and the second divided container can be configured as follows.

In this horizontal type semiconductor wafer packaging container, for example, the semiconductor wafers are horizontally arranged and supported by a wafer carrier. In order to accommodate the wafer carrier in the packaging container, first, the wafer carrier is fixedly engaged with a carrier holding portion formed on the inner wall of the second divided container, and then the first divided container and the second divided container are fixed. The container and the container are engaged and closed by the engaging member. At this time, a second opening is formed in the insertion / removal opening formed in the first divided container.
Since the projecting portion of the divided container is inserted, the first divided container and the second divided container are horizontally guided toward each other and are close to each other, and they are not inclined, and these divided containers contact the semiconductor wafer. Never.

On the other hand, when the horizontal type semiconductor wafer packaging container is to be opened, the first divided container is pulled in the horizontal direction and removed from the second divided container after removing the engaging member. As described above, since the horizontal type packaging container is pulled not in the vertical direction where gravity acts but in the horizontal direction, the remaining second divided container is dragged by the other first divided container more than the vertical type packaging container. Cheap. However, in the present invention, when removing the first divided container, the first divided container can be pulled apart in the horizontal direction while pressing the top of the protrusion of the second divided container with a finger.
The divided container does not move by being dragged by the first divided container, and the first divided container can be removed smoothly. In addition, according to the present invention, since the moving direction of the first divided container is also restricted in the horizontal direction by the protrusion and the insertion / removal opening,
Also, since the second divided container does not contact the semiconductor wafer while being inclined with respect to each other, and the operator does not accidentally touch the semiconductor wafer, damage and contamination of the semiconductor wafer can be prevented.

Further, in the horizontal type semiconductor packaging container, if the first divided container is removed as described above, the wafer carrier can be moved vertically upward while maintaining the same posture, and can be moved horizontally for the subsequent processing steps. There is no need to convert to posture again. Therefore, the risk of contamination and damage of the semiconductor wafer due to the posture change can be avoided, and the posture change process can be eliminated, thereby improving the working efficiency.

[0027] It is preferable that at least the second divided bottom plate portion is constituted by an entire bottom plate portion, and the top plate portion may be distributed to both the first and second divided containers. Since the second divided bottom plate portion is composed of the entire bottom plate portion and the first divided container has no bottom plate portion, no frictional resistance is generated between the first divided container and the mounting surface. The removal of the first divided container becomes easier.

[0028]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be specifically described below with reference to the drawings. FIG. 1 is an external perspective view of a semiconductor wafer packaging container according to a first embodiment of the present invention, and FIGS. 2 and 3 show two closing members of the packaging container.
It is each perspective view at the time of dividing. Note that the packaging container of the present embodiment is of a horizontal type, and the wafer carrier, the wafer retainer and the gasket are the same as the above-described conventional horizontal type semiconductor wafer packaging container. The description will focus on the closing member which is a feature of the present invention.

1 to 3, the semiconductor wafer packaging container 10 has a substantially disk shape. A part of the peripheral wall of the packaging container 10 that is opposed to the rectangular wall swells, and the peripheral wall is vertically cut at the swelling part.
a and 12a. The left peripheral wall portion 11a is connected to the top plate portion 11b, and the right peripheral wall portion 12a is connected to the bottom plate portion 12b, respectively, to form a first divided container 11 and a second divided container 12 forming two closing members that open and close in the left-right direction. doing.
Further, the first and second divided containers 11 and 12 respectively have wafer retainers 11c and 12c on inner surfaces of the peripheral wall portions 11a and 12a.
Are formed.

The second divided container 12 on the bottom plate side has a concave groove 12d formed in the periphery of the opening that abuts with the first divided container 11, and an annular gasket (not shown) is fitted in the concave groove 12d. I have. On the other hand, the first divided container 11 on the top plate side
A rib 11d is formed on the outer portion of the periphery of the opening at a position substantially the same size as the depth of the concave groove 12d from the edge of the opening, and the opening periphery of the first divided container 11 is connected to the second divided container. 12, the rib 11d of the first divided container 11 comes into contact with the peripheral edge of the opening of the second divided container 12.

Further, the first and second divided containers 1 are attached to the edge of the bulging peripheral wall portion 11a of the first divided container 11 on the top plate side.
A flat portion 11e perpendicular to the left and right opening and closing directions of the first and the left 12 is formed, and a vertically long insertion / removal hole 11f is formed in the flat portion 11e. Further, a rectangular protruding piece 11g extends in the left-right opening and closing direction from the center of the edge of the peripheral wall portion 11a, and a plurality of engaging holes 11h are provided near the tip of the protruding piece 11g.
Are formed side by side in the vertical direction.

The second divided container 12 on the bottom plate side extends from the center of the edge of the expanded peripheral wall portion 12a in the left and right opening and closing directions of the container 12,
A protruding portion 12e that can be inserted and removed from the insertion hole 11f of the first divided container 11 extends. Further, in the peripheral wall portion 12a of the second divided container, a portion corresponding to the engagement hole 11h formed in the protruding piece 11g of the first divided container 11 is provided.
A plurality of engaging projections 12f that can be attached to 1h are protruded.

The first divided container 11 and the second divided container 1
2 and a semiconductor wafer packaging container 1 containing a semiconductor wafer.
To close 0, first, a wafer carrier supporting semiconductor wafers in parallel is accommodated in the second divided container 12 on the bottom plate side,
Thereafter, the first divided container 11 on the top plate side is directed toward the second divided container 12, and the protrusion 12 e of the second divided container 12 is inserted through the insertion / removal hole 11 f of the first divided container 11. To slide. After the opening peripheral edge of the second divided container 12 is fitted into the concave groove 12d of the second divided container 12, the protruding piece 11g of the first divided container 11 is attached to the peripheral wall portion 12 of the second divided container 12.
a, and the first and second divided containers 11 and 12 are closed by engaging the engagement projections 12f of the second divided container 12 with the engagement holes 11h of the projection piece 11g.

In the present invention, when the first divided container 11 is slid toward the second divided container, the projecting portion 12e of the second divided container 12 is inserted into the insertion / removal hole 11f of the first divided container 11.
Let through. Therefore, the sliding direction of the first divided container 11 with respect to the second divided container 12 is restricted in the vertical direction by the insertion / removal hole 11f and the protruding portion 12e.
The divided container 11 does not tilt and contact the semiconductor wafer inside.

Further, in the closed semiconductor wafer packaging container 10, the first divided container 11 and the second divided container 12
And the engaging projection 12f in the direction perpendicular to the opening and closing direction.
The first divided container 11 and the second divided container 12 are closed by two-way engagement with the engagement hole 11h.
Rattling is prevented.

In order to open the semiconductor wafer packaging container 10, first, the projection 11g of the first divided container 11 is opened outward, and the engaging projection 12f of the second divided container 12 is
g from the engagement hole 11h. Thereafter, while holding the top of the protruding portion 12e of the second divided container 12 with a palm or a finger, the first divided container 11 is moved in the horizontal direction by putting a hand on the tip of the protruding piece 11g of the first divided container 11. , And separated from the second divided container 12. As described above, when the semiconductor wafer packaging container 10 is opened, the protruding portion 12e extending in the left and right opening and closing directions can be used as described above. Further, the first divided container 11 on the top plate side has no bottom plate portion. , The same container 1
Since there is no frictional resistance between the mounting surface of
When the first divided container 11 is pulled, the first divided container 1
1, the second divided container 12 is not dragged and moved, and the first divided container 11 can be removed smoothly. Further, since the moving direction of the first divided container 11 is restricted in the vertical direction by the projecting portion 12e of the second divided container 12 and the insertion / removal hole 11f of the first divided container 11, the first and second displacements are restricted. The divided containers 11 and 12 are inclined with respect to each other, and the wafer retainer 1 formed inside the
Since the semiconductor wafers 1c and 12c do not come into contact with the semiconductor wafer in an abnormal posture and are not rubbed, and the operator does not accidentally touch the semiconductor wafer, damage and contamination of the semiconductor wafer can be prevented.

Furthermore, the semiconductor packaging container 10 of the horizontal type
If the first divided container 11 is removed as described above, the wafer carrier can be moved upward with the same posture,
There is no need to convert to a horizontal position for the subsequent processing steps. Therefore, the risk of contamination and damage of the semiconductor wafer due to the posture change can be avoided, and the posture change process can be eliminated, thereby improving the working efficiency.

FIG. 4 is a perspective view of a vertical type semiconductor packaging container 20 according to a second embodiment of the present invention, FIG. 5 is a sectional view of a closing member of the packaging container 20, and FIG. 6 is a side view of the packaging container. FIG. The closing member of the semiconductor packaging container 20 is composed of a lower container 21 and an upper lid 22, and the lower container 21 accommodates a wafer carrier 23 that supports the semiconductor wafers W in the vertical direction. A concave groove 21a is formed in the upper edge of the opening of the lower container 21, and a gasket (not shown) is fitted in the concave groove 21a. On the other hand, an upper lid 22 that closes the lower container 21 from above is a horizontal portion that abuts against the upper edge of the lower container 21 so that the opening edge covers a concave groove 21a formed at the upper edge of the opening of the lower container 21. 22a are formed. Further, a wafer retainer 24 made of a separate member is fixed to the inner surfaces of the lower container 21 and the upper lid 22.

The left and right walls 21b, 21 of the lower container 21
A protruding portion 21c protrudes upward from the center of the upper edge b in the opening and closing direction of the main packaging container 20. Further, the left and right wall portions 21
From below the protruding portion 21c of the b and 21b, an engaging protrusion 21d is provided to protrude in a horizontal direction orthogonal to the opening and closing direction.

On the other hand, an insertion hole 22b through which the projection 21c can be inserted and removed is formed at a position corresponding to the projection 21c on the horizontal portion 22a of the upper lid 22. Further, from the center of the edge of the horizontal portion 22a, the projecting piece 22
c is extended, and an engagement hole 22d is formed in the protruding piece 22c at a position corresponding to the engagement projection 21d of the lower container 21. Further, the upper lid 22 is formed with a step portion 22e formed of a substantially flat surface parallel to the horizontal portion 22a above the protruding height of the protruding portion 21c of the lower container 21 so as to be continuous with the horizontal portion 22a. I have. Since the step 22e is a part on which the operator places his / her palm when closing the upper lid 22, the width of the step 22e must be at least 2 cm.
In addition, when the container is opened and closed, the worker places his / her finger on the tip of the protruding piece 22c with the palm resting on the step 22e. Therefore, the extended dimension of the protruding piece 22c may be about 5 to 8 cm. desirable. However, this extension is only an example,
It can be changed as appropriate.

To close the lower container 21 with the upper lid 22, the projecting portion 21 c of the lower container 21 is connected to the upper lid 22.
The step 22e of the upper lid 22 is pushed down with the palm of the hand while the protrusion 22c is opened outward with a finger. Then, after the horizontal portion 22a of the upper lid 22 contacts the upper edge of the opening of the lower container 21, the protrusion 22c is pressed toward the left and right wall portions 21b of the lower container 21 to engage the protrusion 22c. The engagement projection 2 of the lower container 21 is inserted into the hole 22d.
1d is engaged, and the lower container 21 and the upper lid 22 are closed.

In the present invention, when the upper lid 22 is put on the lower container 21, the projecting portion 21 c of the lower container 21 is
Through the insertion hole 22b. Therefore, the direction in which the upper lid 22 is pushed down is restricted from shifting in the horizontal direction by the insertion / removal holes 22b and the protruding portions 21c, and the upper retainer 22 is inclined and the wafer retainer 24 mounted inside the same lid 22 is internally Does not contact the semiconductor wafer W in an abnormal posture.

Further, in the semiconductor wafer packaging container 20 in the closed state, the lower container 21 and the upper lid 22 are engaged with each other in the vertical opening and closing directions by the projection 21c and the insertion / removal hole 22b, and the engagement projection 21d. The lower container 21 and the upper lid 22 are restrained from rattling because they are closed by two-way engagement with the engagement hole 22d in the horizontal direction.

When the upper lid 22 is pushed down, the step 22e formed above the projecting height of the projecting portion 21c can be used as described above, and the step 22e can be pushed down by the palm. The closing operation is easily performed, and the projecting portion 21c does not interfere.

In order to open the semiconductor wafer packaging container 20, first, the projection 22c of the upper lid 22 is opened outward, and the engagement projection 21d of the lower container 21 is engaged with the engagement hole 2 of the projection 22c.
Remove from 2d. Then, the protrusion 21 of the lower container 21
c while holding down the top of the c with a finger.
(c) Lift the lid 22 upward by putting a hand on the tip and pull it away from the lower container 21. As described above, when the semiconductor wafer packaging container 20 is opened, the projection 21c extending in the vertical opening and closing direction is used as described above, so that when the upper lid 22 is lifted, the lower container 21 is
The upper cover 22 can be removed smoothly without being lifted together. Further, the direction of lifting the upper lid 22 is such that the protrusion 21 c of the lower container 21 is
2, the upper cover 22 is inclined so that the wafer retainer 24 attached to the inner surface of the upper cover 22 may come into contact with the internal semiconductor wafer W in an abnormal posture, or 24 prevents the semiconductor wafer W from being rubbed and the operator from accidentally touching the semiconductor wafer W, thereby preventing damage and contamination of the semiconductor wafer W.

In the vertical type semiconductor wafer packaging container 20, since the wafer retainer 24 is attached to the inner surface of the upper lid 22, the engaging projection 21 d of the lower container 21 is removed from the engaging hole 22 d of the upper lid 22. At this time, the upper lid 22 floats up due to the reaction force of the wafer retainer 24. Also at this time, the direction in which the upper lid 22 rises is
The upper cover 22 is obliquely lifted obliquely, and is prevented from shifting in the horizontal direction by the upper and lower holes.
4 eliminates the risk of damaging the semiconductor wafer W.

It should be noted that a pair of protrusions 30 can be used as the protrusions of the present invention, for example, as shown in FIG.
In that case, insertion / removal slits 31a, 31 for inserting / removing the protruding portion 30 from the left and right ends of the protruding piece 31 of the other party.
a is formed. Further, in both the first and second embodiments described above, the engaging means for engaging the two closing members is formed integrally with the closing member. And the like can also be used as engaging means.

[Brief description of the drawings]

FIG. 1 is an external perspective view of a semiconductor wafer packaging container of a horizontal type according to a first embodiment of the present invention.

FIG. 2 is a perspective view of one of two divided closing members of the packaging container.

FIG. 3 is a perspective view of the other closing member.

FIG. 4 is a perspective view of a vertical type semiconductor wafer packaging container according to a second embodiment of the present invention.

FIG. 5 is a sectional view of a closing member of the semiconductor wafer packaging container.

FIG. 6 is a side view of the packaging container.

FIG. 7 is an enlarged perspective view of a modified example of the protrusion and the insertion / removal opening of the present invention.

FIG. 8 is an exploded perspective view showing an example of a conventional horizontal type wafer packaging container.

FIG. 9 is a perspective view showing an example of a conventional horizontal type wafer packaging container.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Container main body 2 Lid 3 Wafer carrier 3a Wafer insertion / removal opening 3b Wafer accommodation bottom 4 Wafer retainer 5 Gasket 6 Clamp 7 Container main body 8 First divided container 8a Top plate 8b Perimeter wall 9 Second divided container 9a Bottom plate 9b Peripheral wall Part 10 Semiconductor wafer packaging container 11 First divided container 11a Left peripheral wall part 11b Top plate part 11c Wafer retainer 11d Rib 11e Flat part 11f Insertion and removal hole 11g Projection piece 11h Engagement hole 12 Second divided container 12a Right peripheral wall part 12b Bottom plate part 12c Wafer retainer 12d Concave groove 12e Projection 12f Engagement projection 20 Semiconductor packaging container 21 Lower container 21a Concave groove 21b Left and right wall 21c Projection 21d Engagement protrusion 22 Upper lid 22a Horizontal part 22b Insertion / removal hole 22c Projection piece 22d Engagement Hole 22e Step 23 Wafer carrier 24 Wafer retainer 0 protrusions 31 projecting piece 31a inserted and removed slits W semiconductor wafer

 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Satoshi Fukuhara 1200 Manda, Hiratsuka-shi, Kanagawa Prefecture Inside of Komatsu Seisakusho Research Center (72) Inventor Toshiharu Abegawa 1200 Manda, Hiratsuka-shi, Kanagawa Komatsu Seisakusho Research Headquarters Inside

Claims (8)

[Claims] 1. A synthetic resin semiconductor wafer packaging container having two closing members which are engaged with each other and closed by an engaging means, and which accommodates and supports a plurality of substantially circular semiconductor wafers in parallel. A projecting portion extending in the opening and closing direction of the closing member is integrally formed on one of the closing members, and an insertion / removal opening through which the projecting portion is inserted / removed is formed on the other closing member. A semiconductor wafer packaging container, comprising: 2. The semiconductor wafer packaging container according to claim 1, wherein said insertion / removal opening is formed in a plane orthogonal to the opening / closing direction. 3. A continuation of the plane including the insertion / removal opening of the other closing member and a dimensional position parallel to the plane at a dimension position equal to or greater than the extension dimension of the protruding portion provided on the one closing member. 3. The semiconductor wafer packaging container according to claim 2, wherein a stepped portion having a substantially flat surface is formed. 4. The engaging means corresponds to an engaging projection protruding from the one closing member having the protruding portion in a direction orthogonal to the one protruding portion and the engaging protrusion of the other closing member. 2. A protruding piece having an engaging hole projecting from a portion to be engaged.
4. The semiconductor wafer packaging container according to any one of items 1 to 3. 5. The semiconductor wafer packaging container according to claim 1, wherein said engaging means is a clamp separate from said closing member. 6. The semiconductor wafer packaging container according to claim 1, wherein the two closing members are a lid and a container main body, and the semiconductor wafer is accommodated in a vertical state. 7. The two closing members respectively move a top plate portion and a bottom plate portion of the semiconductor wafer when the semiconductor wafer is placed laterally, to a first position.
And a second divided top plate portion, which is divided into a second divided top plate portion and first and second divided bottom plate portions, and the first divided top plate portion and the second divided bottom plate portion which are diagonally opposed to each other are adjacent to each other. And a first divided top plate, a first divided bottom plate, a second divided top plate, and a second divided bottom plate which have a larger area than the first divided bottom plate and more than half of the whole, and which are vertically opposed to each other. And a first divided container and a second divided container which are connected by first and second divided peripheral wall portions divided into right and left.
The semiconductor wafer packaging container according to any one of the above. 8. The semiconductor wafer packaging container according to claim 7, wherein at least the second divided bottom plate portion is constituted by an entire bottom plate portion.