WO2003005783A2 - Procedes et systemes permettant d'incorporer des composants electriques dans un dispositif contenant une structure sensible a la frequence - Google Patents

Procedes et systemes permettant d'incorporer des composants electriques dans un dispositif contenant une structure sensible a la frequence Download PDF

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Publication number
WO2003005783A2
WO2003005783A2 PCT/US2002/021266 US0221266W WO03005783A2 WO 2003005783 A2 WO2003005783 A2 WO 2003005783A2 US 0221266 W US0221266 W US 0221266W WO 03005783 A2 WO03005783 A2 WO 03005783A2
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WO
WIPO (PCT)
Prior art keywords
electrical components
frequency responsive
locations
frequency
components
Prior art date
Application number
PCT/US2002/021266
Other languages
English (en)
Other versions
WO2003005783A9 (fr
WO2003005783A3 (fr
Inventor
Kenneth H. Church
Michael John Wilhelm
Robert M. Taylor
Douglas H. Werner
Pinguan Werner
Original Assignee
Sciperio, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/072,739 external-priority patent/US7365701B2/en
Application filed by Sciperio, Inc. filed Critical Sciperio, Inc.
Priority to AU2002354784A priority Critical patent/AU2002354784A1/en
Publication of WO2003005783A2 publication Critical patent/WO2003005783A2/fr
Publication of WO2003005783A3 publication Critical patent/WO2003005783A3/fr
Publication of WO2003005783A9 publication Critical patent/WO2003005783A9/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
    • H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
    • H01Q15/0013—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices said selective devices working as frequency-selective reflecting surfaces, e.g. FSS, dichroic plates, surfaces being partly transmissive and reflective
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support

Definitions

  • the present invention is directed to methods and systems for embedding electrical components in a device including a frequency responsive structure.
  • the present invention is directed to methods and system for embedding electrical components into a device including a frequency responsive structure to optimize performance characteristics.
  • frequency responsive structures such as antennas
  • the frequency band is divided and allocated for specific tasks.
  • Multiband antennas are typically made by using resonator loads to modify the resonance of the antenna.
  • This approach can also provide broadband effects.
  • Broadband and extreme broadband antennas are typically built using antenna arrays or specific antenna geometries approach.
  • the embedded components enable broadband characteristics and reduce the space required by the antenna.
  • Embedded components have also been used to provide enhancements in gain, match impedance, reduce reflections in SI 1 measurement and improve other electrical characteristics of the antenna.
  • Techniques have been proposed for embedding passive components in devices that include antennas to improve the frequency response. However, these techniques typically use soldering to connect passive components such as inductors and capacitors to the antenna structure.
  • the soldered passive electrical components are not contiguous with the antenna structure. At the joints between the solder and the components and between the solder and the structure, losses occur. Also, the soldering of the electrical components makes the structure not structurally sound and requires numerous steps in manufacturing. In addition, the size of the substrate supporting the structure must be large enough to accommodate the soldered electrical components. This adds to the size of the device.
  • Another problem with embedding components into a device involves determining where to place the components. In the past, locations for embedding the components were chosen, and, depending upon the performance characteristics, the locations were varied as necessary. This "trial and error approach" is cumbersome and does not guarantee that the resulting structure has desired radiation characteristics but rather typically results in a design that is suboptimal.
  • this and other objects are met by methods and systems for embedding electrical components within a device including a frequency responsive structure, such as an antenna or a frequency selective surface. Electrical components are selected and locations for placing the selected components within the device are selected for optimizing performance characteristics of the structure. These selections may be performed by modeling the device with various electrical components embedded at various locations using, e.g., a genetic algorithm. The selected components are embedded at the selected locations. The frequency responsive structure and the selected components embedded at the selected locations may be produced in the same manufacturing process. According to one embodiment, the selected electrical components are embedded at the selected locations as contiguous and integral parts of the device, e.g., within the frequency responsive structure.
  • the selected components are embedded at the selected locations on a surface of a substrate opposite the surface on which the frequency responsive surface is supported.
  • the frequency response of the structure may be tuned by adding and/or subtracting material from the device.
  • tuning may be achieved by adjusting the electrical components.
  • FIGS. 1 and 2 illustrate an exemplary device including components embedded within an antenna
  • FIG. 3 illustrates an actual prototype including an embedded inductor and capacitor written in line with an antenna to provide a dual band antenna
  • FIG. 4 illustrates an exemplary method for embedding electrical components.
  • methods and systems are provided for producing devices including frequency responsive structures with enhanced performance characteristics that are small in comparison to conventional devices.
  • antennas For simplicity of illustration, the description below is directed largely to an antenna. However, it will be appreciated that the invention is not limited to antennas but is applicable to any device including a frequency responsive structure.
  • Typical models of antennas comprise a variation of electrical components, such as capacitors and inductors, arranged in series and in parallel. According to exemplary embodiments, these components may be embedded into the device in a contiguous and integral manner, e.g., into the metallic conductors of the antenna, in strategically placed locations, forcing different electrical characteristics. These new electrical characteristics can be modeled and predicted before fabricating the device, thus creating new desired electrical effects.
  • electrical components may be embedded within a device including a frequency responsive surface, such an antenna, as integral and contiguous parts of the device.
  • a frequency responsive surface such an antenna
  • Any contiguous and integral embedding process may be used to embed the components either within the frequency responsive surface or within the substrate supporting the surface. These processes may include but are not limited to direct writing, screen printing, stamping, lithography, and electroplating. Once the configuration for embedding the components is determined, these processes may be performed by conventional devices.
  • the electrical components may include any combination of linear passive components, such as capacitors, inductors, resistors, transistors (bipolar or field effect), nonlinear passive components, such as varicaps, varactors, and varactor diodes, and active components, such as negative impedance, fractional impedance, and higher-order impedance loads. These components enhance performance characteristics such as the antenna gain, frequency response, bandwidth, and loading characteristics and may be used to provide multiband tunability.
  • linear passive components such as capacitors, inductors, resistors, transistors (bipolar or field effect)
  • nonlinear passive components such as varicaps, varactors, and varactor diodes
  • active components such as negative impedance, fractional impedance, and higher-order impedance loads.
  • the electrical components may also include a balun structure and a matching network.
  • a balun network is a transforming circuit that allows a balanced transmission line to efficiently drive an unbalanced antenna structure.
  • the balun configuration as well as the matching network topology and associated component values may be optimized simultaneously with the antenna geometry and loads.
  • the loaded antenna structure may be modeled before fabrication to determine the components and placement of components within the device that produce optimal performance characteristics. Modeling may be performed using, e.g., a genetic algorithm as described in the afore- mentioned copending U.S. Patent Application No. 10/072,739. The genetic algorithm may be applied to determine the pattern of the antenna and the electrical components that produce optimal performance characteristics.
  • the performance of the frequency responsive surface may be fine-tuned by adapting the material of the device.
  • the tuning may be performed by adding and/or subtracting material from the device.
  • Material may be added to or subtracted from, e.g., the electrical components and/or the frequency responsive structure.
  • the additive process may include using a contiguous and integral additive process, such as direct writing, screen printing, stamping, lithography, or electroplating.
  • the additive process may also include other processes such as wire bonding, conductive gluing, soldering or any other additive process to add conductor material, resistor material, dielectric material, or ferrite material sufficient to alter the capacitance, resistance, inductance, or any combination of the aforementioned properties for optimal tuning of the antenna structure.
  • the subtractive process may include using a cutting laser or other subtractive techniques such as scraping or chemical or ion beam etching, to remove conductor material, resistor material, dielectric material, or ferrite material, or any combination of the aforementioned materials sufficient to alter the capacitance, resistance or inductance for optimal tuning of the antenna structure.
  • the additive and subtractive processes may be performed before forming the antenna, as part of the fabrication of the antenna, or after forming the antenna. Also, these processes may be modeled in advance
  • FIGS. 1 and 2 illustrate an exemplary device including an antenna and embedded components.
  • passive components 210 and 220 are embedded in line with the metallic shape 200 that forms the antenna.
  • the antenna 200 and components 210 and 220 may be fabricated in one manufacturing process.
  • a close up of the embedded components, the inductor and capacitor, is shown in FIG 2B.
  • the inductor is the metallic loop 210, while the capacitor is the layered and rectangular shape 220.
  • the electrical components are embedded in line with the antenna pattern, it will be appreciated that the invention is not limited to this type of configuration.
  • the electrical components may also be applied to the substrate that supports the antenna or to the antenna itself, using any contiguous and integrated embedding technique, such as those described above.
  • FIG. 3 illustrates a prototype of the antenna 200 with embedded components 210 and 220 that was actually fabricated and tested.
  • the antenna was designed to be a dual band antenna, and an inductor and a capacitor were embedded for this purpose. As shown on the oscilloscope 300 in FIG. 3, the antenna produced a dual band frequency response. As can be seen from this figure, the electrical characteristics were altered by embedding the passive components as predicted.
  • Electrical components may also be strategically selected and placed within a device including an antenna array.
  • the electrical components may be selected and placed within a device including a frequency selective surface (FSS).
  • FSS frequency selective surface
  • Components may be embedded directly within the FSS and/or on the substrate supporting the FSS in a contiguous and integral manner.
  • the components may be embedded within the device on the surface of the substrate opposite the surface supporting the FSS, either in a contiguous and integral manner or using some other embedding technique, such as wire bonding, conductive gluing or soldering. All of these configurations minimize the size of the device including the FSS and allow enhancement and control of the electrical characteristics.
  • FIG. 4 illustrates an exemplary method for embedding electrical components within a device including a frequency responsive surface according to exemplary embodiments.
  • the method begins at step 400 at which a frequency responsive structure is fabricated. This step may include selecting a configuration for the frequency responsive structure using, e.g., a genetic algorithm as described in the copending U.S. Patent Application No. 10/072,739.
  • electrical components are selected for embedding in the device.
  • locations for placing the electrical components within the device are selected. Steps 410 and 420 may be performed using, e.g., a genetic algorithm.
  • the selected components are embedded at the selected locations.
  • the electrical components may be embedded in a contiguous and integral manner within, e.g., the antenna or the substrate supporting the antenna.
  • the electrical components may be embedded in a contiguous and integral manner within, e.g., the FSS or the substrate supporting the FSS.
  • the components may be embedded on the surface of the substrate opposite the surface supporting the FSS using any embedding technique.
  • the frequency responsive structure is fined tuned, e.g., by an additive and/or subtractive process or by adjusting the electrical components. Although shown as separate steps, one or more of the steps in FIG. 4 may be performed at the same time.
  • the configuration for the frequency responsive structure may be selected at the same time as the electrical components and the locations for embedding the electrical components.
  • the structure including the frequency responsive structure and the embedded components may be fabricated at one time, in the same manufacturing process.
  • the additive and/or subtractive processes may be performed before, during, or after fabrication of the frequency selective surface.
  • frequency responsive structures such as antennas and FSS's that are smaller and have improved electrical characteristics in comparison with conventional devices.
  • Electrical components may be embedded as continuous and integral parts of the device, e.g., within the frequency responsive structure or on the substrate supporting the frequency responsive structure. Alternately, these components may be embedded on a surface of a substrate opposite the surface supporting the frequency responsive structure using any embedding technique. The embedded components force specified and designed electrical effects, thus enhancing and controlling the electrical performance of the frequency responsive structure.

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Abstract

L'invention concerne des procédés et des systèmes permettant d'incorporer des composants électriques dans un dispositif contenant une structure sensible à la fréquence, tel qu'une antenne ou qu'une surface à sélection de fréquence. Des composants électriques sont choisis et les emplacements de ces composants dans le dispositifs sont choisis de manière à optimiser les caractéristiques de rendement de la structure. Le choix peut s'effectuer par modélisation du dispositif présentant divers composants électriques incorporés à divers emplacements, à l'aide, par exemple, d'un algorithme génétique. Les composants choisis sont ensuite incorporés aux emplacements choisis. La structure sensible à la fréquence et les composants choisis incorporés peuvent être fabriqués au cours du même processus de fabrication. Les composants électriques choisis peuvent être incorporés à des emplacements choisis sur des portions adjacentes ou sur des portions faisant partie intégrante du dispositif et ils peuvent être incorporés dans la structure sensible à la fréquence. Les composants choisis peuvent également être incorporés à des emplacements choisis sur une surface d'un substrat situé en face de la surface sur laquelle repose la surface sensible à la fréquence. La réponse en fréquence de la structure peut être syntonisée par adaptation des composants électriques.
PCT/US2002/021266 2001-07-03 2002-07-03 Procedes et systemes permettant d'incorporer des composants electriques dans un dispositif contenant une structure sensible a la frequence WO2003005783A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2002354784A AU2002354784A1 (en) 2001-07-03 2002-07-03 Methods and systems for embedding electrical components in a device including a frequency responsive structure

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US30237501P 2001-07-03 2001-07-03
US60/302,375 2001-07-03
US34918502P 2002-01-15 2002-01-15
US60/349,185 2002-01-15
US10/072,739 US7365701B2 (en) 2001-02-08 2002-02-08 System and method for generating a genetically engineered configuration for at least one antenna and/or frequency selective surface
US10/072,739 2002-02-08

Publications (3)

Publication Number Publication Date
WO2003005783A2 true WO2003005783A2 (fr) 2003-01-16
WO2003005783A3 WO2003005783A3 (fr) 2003-04-10
WO2003005783A9 WO2003005783A9 (fr) 2003-05-15

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AU (1) AU2002354784A1 (fr)
WO (1) WO2003005783A2 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014039975A2 (fr) 2012-09-10 2014-03-13 Neotope Biosciences Limited Anticorps anti-mcam et méthodes d'utilisation associées
CN106229662A (zh) * 2016-09-11 2016-12-14 河南师范大学 射频高效吸收天线
CN110169623A (zh) * 2019-05-16 2019-08-27 黎明职业大学 制鞋用涂胶机、基于遗传算法制鞋用涂胶机清洁维护方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3780373A (en) * 1972-11-21 1973-12-18 Avco Corp Near field spiral antenna
US4706050A (en) * 1984-09-22 1987-11-10 Smiths Industries Public Limited Company Microstrip devices
US5598032A (en) * 1994-02-14 1997-01-28 Gemplus Card International Hybrid chip card capable of both contact and contact-free operation and having antenna contacts situated in a cavity for an electronic module
US5959594A (en) * 1997-03-04 1999-09-28 Trw Inc. Dual polarization frequency selective medium for diplexing two close bands at an incident angle
US6067056A (en) * 1997-09-09 2000-05-23 Micron Technology, Inc. Methods of forming conductive lines, methods of forming antennas, methods of forming wireless communication devices, conductive lines, antennas, and wireless communications devices
US6081242A (en) * 1998-06-16 2000-06-27 Galtronics U.S.A., Inc. Antenna matching circuit

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3780373A (en) * 1972-11-21 1973-12-18 Avco Corp Near field spiral antenna
US4706050A (en) * 1984-09-22 1987-11-10 Smiths Industries Public Limited Company Microstrip devices
US5598032A (en) * 1994-02-14 1997-01-28 Gemplus Card International Hybrid chip card capable of both contact and contact-free operation and having antenna contacts situated in a cavity for an electronic module
US5959594A (en) * 1997-03-04 1999-09-28 Trw Inc. Dual polarization frequency selective medium for diplexing two close bands at an incident angle
US6067056A (en) * 1997-09-09 2000-05-23 Micron Technology, Inc. Methods of forming conductive lines, methods of forming antennas, methods of forming wireless communication devices, conductive lines, antennas, and wireless communications devices
US6081242A (en) * 1998-06-16 2000-06-27 Galtronics U.S.A., Inc. Antenna matching circuit

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014039975A2 (fr) 2012-09-10 2014-03-13 Neotope Biosciences Limited Anticorps anti-mcam et méthodes d'utilisation associées
CN106229662A (zh) * 2016-09-11 2016-12-14 河南师范大学 射频高效吸收天线
CN110169623A (zh) * 2019-05-16 2019-08-27 黎明职业大学 制鞋用涂胶机、基于遗传算法制鞋用涂胶机清洁维护方法

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Publication number Publication date
AU2002354784A1 (en) 2003-01-21
WO2003005783A9 (fr) 2003-05-15
WO2003005783A3 (fr) 2003-04-10

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