WO2003005783A2 - Procedes et systemes permettant d'incorporer des composants electriques dans un dispositif contenant une structure sensible a la frequence - Google Patents
Procedes et systemes permettant d'incorporer des composants electriques dans un dispositif contenant une structure sensible a la frequence Download PDFInfo
- Publication number
- WO2003005783A2 WO2003005783A2 PCT/US2002/021266 US0221266W WO03005783A2 WO 2003005783 A2 WO2003005783 A2 WO 2003005783A2 US 0221266 W US0221266 W US 0221266W WO 03005783 A2 WO03005783 A2 WO 03005783A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrical components
- frequency responsive
- locations
- frequency
- components
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 119
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 claims abstract description 16
- 230000002068 genetic effect Effects 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims description 53
- 238000009713 electroplating Methods 0.000 claims description 14
- 238000001459 lithography Methods 0.000 claims description 14
- 238000007650 screen-printing Methods 0.000 claims description 14
- 238000004026 adhesive bonding Methods 0.000 claims description 10
- 238000005476 soldering Methods 0.000 claims description 10
- 238000005530 etching Methods 0.000 claims description 7
- 238000010884 ion-beam technique Methods 0.000 claims description 7
- 238000007790 scraping Methods 0.000 claims description 7
- 238000003486 chemical etching Methods 0.000 claims 6
- 238000009966 trimming Methods 0.000 claims 6
- 239000000654 additive Substances 0.000 description 7
- 230000000996 additive effect Effects 0.000 description 7
- 239000003990 capacitor Substances 0.000 description 7
- 238000013459 approach Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 230000009977 dual effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- 238000003491 array Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001131 transforming effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
- H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
- H01Q15/0013—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices said selective devices working as frequency-selective reflecting surfaces, e.g. FSS, dichroic plates, surfaces being partly transmissive and reflective
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
Definitions
- the present invention is directed to methods and systems for embedding electrical components in a device including a frequency responsive structure.
- the present invention is directed to methods and system for embedding electrical components into a device including a frequency responsive structure to optimize performance characteristics.
- frequency responsive structures such as antennas
- the frequency band is divided and allocated for specific tasks.
- Multiband antennas are typically made by using resonator loads to modify the resonance of the antenna.
- This approach can also provide broadband effects.
- Broadband and extreme broadband antennas are typically built using antenna arrays or specific antenna geometries approach.
- the embedded components enable broadband characteristics and reduce the space required by the antenna.
- Embedded components have also been used to provide enhancements in gain, match impedance, reduce reflections in SI 1 measurement and improve other electrical characteristics of the antenna.
- Techniques have been proposed for embedding passive components in devices that include antennas to improve the frequency response. However, these techniques typically use soldering to connect passive components such as inductors and capacitors to the antenna structure.
- the soldered passive electrical components are not contiguous with the antenna structure. At the joints between the solder and the components and between the solder and the structure, losses occur. Also, the soldering of the electrical components makes the structure not structurally sound and requires numerous steps in manufacturing. In addition, the size of the substrate supporting the structure must be large enough to accommodate the soldered electrical components. This adds to the size of the device.
- Another problem with embedding components into a device involves determining where to place the components. In the past, locations for embedding the components were chosen, and, depending upon the performance characteristics, the locations were varied as necessary. This "trial and error approach" is cumbersome and does not guarantee that the resulting structure has desired radiation characteristics but rather typically results in a design that is suboptimal.
- this and other objects are met by methods and systems for embedding electrical components within a device including a frequency responsive structure, such as an antenna or a frequency selective surface. Electrical components are selected and locations for placing the selected components within the device are selected for optimizing performance characteristics of the structure. These selections may be performed by modeling the device with various electrical components embedded at various locations using, e.g., a genetic algorithm. The selected components are embedded at the selected locations. The frequency responsive structure and the selected components embedded at the selected locations may be produced in the same manufacturing process. According to one embodiment, the selected electrical components are embedded at the selected locations as contiguous and integral parts of the device, e.g., within the frequency responsive structure.
- the selected components are embedded at the selected locations on a surface of a substrate opposite the surface on which the frequency responsive surface is supported.
- the frequency response of the structure may be tuned by adding and/or subtracting material from the device.
- tuning may be achieved by adjusting the electrical components.
- FIGS. 1 and 2 illustrate an exemplary device including components embedded within an antenna
- FIG. 3 illustrates an actual prototype including an embedded inductor and capacitor written in line with an antenna to provide a dual band antenna
- FIG. 4 illustrates an exemplary method for embedding electrical components.
- methods and systems are provided for producing devices including frequency responsive structures with enhanced performance characteristics that are small in comparison to conventional devices.
- antennas For simplicity of illustration, the description below is directed largely to an antenna. However, it will be appreciated that the invention is not limited to antennas but is applicable to any device including a frequency responsive structure.
- Typical models of antennas comprise a variation of electrical components, such as capacitors and inductors, arranged in series and in parallel. According to exemplary embodiments, these components may be embedded into the device in a contiguous and integral manner, e.g., into the metallic conductors of the antenna, in strategically placed locations, forcing different electrical characteristics. These new electrical characteristics can be modeled and predicted before fabricating the device, thus creating new desired electrical effects.
- electrical components may be embedded within a device including a frequency responsive surface, such an antenna, as integral and contiguous parts of the device.
- a frequency responsive surface such an antenna
- Any contiguous and integral embedding process may be used to embed the components either within the frequency responsive surface or within the substrate supporting the surface. These processes may include but are not limited to direct writing, screen printing, stamping, lithography, and electroplating. Once the configuration for embedding the components is determined, these processes may be performed by conventional devices.
- the electrical components may include any combination of linear passive components, such as capacitors, inductors, resistors, transistors (bipolar or field effect), nonlinear passive components, such as varicaps, varactors, and varactor diodes, and active components, such as negative impedance, fractional impedance, and higher-order impedance loads. These components enhance performance characteristics such as the antenna gain, frequency response, bandwidth, and loading characteristics and may be used to provide multiband tunability.
- linear passive components such as capacitors, inductors, resistors, transistors (bipolar or field effect)
- nonlinear passive components such as varicaps, varactors, and varactor diodes
- active components such as negative impedance, fractional impedance, and higher-order impedance loads.
- the electrical components may also include a balun structure and a matching network.
- a balun network is a transforming circuit that allows a balanced transmission line to efficiently drive an unbalanced antenna structure.
- the balun configuration as well as the matching network topology and associated component values may be optimized simultaneously with the antenna geometry and loads.
- the loaded antenna structure may be modeled before fabrication to determine the components and placement of components within the device that produce optimal performance characteristics. Modeling may be performed using, e.g., a genetic algorithm as described in the afore- mentioned copending U.S. Patent Application No. 10/072,739. The genetic algorithm may be applied to determine the pattern of the antenna and the electrical components that produce optimal performance characteristics.
- the performance of the frequency responsive surface may be fine-tuned by adapting the material of the device.
- the tuning may be performed by adding and/or subtracting material from the device.
- Material may be added to or subtracted from, e.g., the electrical components and/or the frequency responsive structure.
- the additive process may include using a contiguous and integral additive process, such as direct writing, screen printing, stamping, lithography, or electroplating.
- the additive process may also include other processes such as wire bonding, conductive gluing, soldering or any other additive process to add conductor material, resistor material, dielectric material, or ferrite material sufficient to alter the capacitance, resistance, inductance, or any combination of the aforementioned properties for optimal tuning of the antenna structure.
- the subtractive process may include using a cutting laser or other subtractive techniques such as scraping or chemical or ion beam etching, to remove conductor material, resistor material, dielectric material, or ferrite material, or any combination of the aforementioned materials sufficient to alter the capacitance, resistance or inductance for optimal tuning of the antenna structure.
- the additive and subtractive processes may be performed before forming the antenna, as part of the fabrication of the antenna, or after forming the antenna. Also, these processes may be modeled in advance
- FIGS. 1 and 2 illustrate an exemplary device including an antenna and embedded components.
- passive components 210 and 220 are embedded in line with the metallic shape 200 that forms the antenna.
- the antenna 200 and components 210 and 220 may be fabricated in one manufacturing process.
- a close up of the embedded components, the inductor and capacitor, is shown in FIG 2B.
- the inductor is the metallic loop 210, while the capacitor is the layered and rectangular shape 220.
- the electrical components are embedded in line with the antenna pattern, it will be appreciated that the invention is not limited to this type of configuration.
- the electrical components may also be applied to the substrate that supports the antenna or to the antenna itself, using any contiguous and integrated embedding technique, such as those described above.
- FIG. 3 illustrates a prototype of the antenna 200 with embedded components 210 and 220 that was actually fabricated and tested.
- the antenna was designed to be a dual band antenna, and an inductor and a capacitor were embedded for this purpose. As shown on the oscilloscope 300 in FIG. 3, the antenna produced a dual band frequency response. As can be seen from this figure, the electrical characteristics were altered by embedding the passive components as predicted.
- Electrical components may also be strategically selected and placed within a device including an antenna array.
- the electrical components may be selected and placed within a device including a frequency selective surface (FSS).
- FSS frequency selective surface
- Components may be embedded directly within the FSS and/or on the substrate supporting the FSS in a contiguous and integral manner.
- the components may be embedded within the device on the surface of the substrate opposite the surface supporting the FSS, either in a contiguous and integral manner or using some other embedding technique, such as wire bonding, conductive gluing or soldering. All of these configurations minimize the size of the device including the FSS and allow enhancement and control of the electrical characteristics.
- FIG. 4 illustrates an exemplary method for embedding electrical components within a device including a frequency responsive surface according to exemplary embodiments.
- the method begins at step 400 at which a frequency responsive structure is fabricated. This step may include selecting a configuration for the frequency responsive structure using, e.g., a genetic algorithm as described in the copending U.S. Patent Application No. 10/072,739.
- electrical components are selected for embedding in the device.
- locations for placing the electrical components within the device are selected. Steps 410 and 420 may be performed using, e.g., a genetic algorithm.
- the selected components are embedded at the selected locations.
- the electrical components may be embedded in a contiguous and integral manner within, e.g., the antenna or the substrate supporting the antenna.
- the electrical components may be embedded in a contiguous and integral manner within, e.g., the FSS or the substrate supporting the FSS.
- the components may be embedded on the surface of the substrate opposite the surface supporting the FSS using any embedding technique.
- the frequency responsive structure is fined tuned, e.g., by an additive and/or subtractive process or by adjusting the electrical components. Although shown as separate steps, one or more of the steps in FIG. 4 may be performed at the same time.
- the configuration for the frequency responsive structure may be selected at the same time as the electrical components and the locations for embedding the electrical components.
- the structure including the frequency responsive structure and the embedded components may be fabricated at one time, in the same manufacturing process.
- the additive and/or subtractive processes may be performed before, during, or after fabrication of the frequency selective surface.
- frequency responsive structures such as antennas and FSS's that are smaller and have improved electrical characteristics in comparison with conventional devices.
- Electrical components may be embedded as continuous and integral parts of the device, e.g., within the frequency responsive structure or on the substrate supporting the frequency responsive structure. Alternately, these components may be embedded on a surface of a substrate opposite the surface supporting the frequency responsive structure using any embedding technique. The embedded components force specified and designed electrical effects, thus enhancing and controlling the electrical performance of the frequency responsive structure.
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- Manufacturing Cores, Coils, And Magnets (AREA)
- Details Of Aerials (AREA)
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2002354784A AU2002354784A1 (en) | 2001-07-03 | 2002-07-03 | Methods and systems for embedding electrical components in a device including a frequency responsive structure |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US30237501P | 2001-07-03 | 2001-07-03 | |
US60/302,375 | 2001-07-03 | ||
US34918502P | 2002-01-15 | 2002-01-15 | |
US60/349,185 | 2002-01-15 | ||
US10/072,739 US7365701B2 (en) | 2001-02-08 | 2002-02-08 | System and method for generating a genetically engineered configuration for at least one antenna and/or frequency selective surface |
US10/072,739 | 2002-02-08 |
Publications (3)
Publication Number | Publication Date |
---|---|
WO2003005783A2 true WO2003005783A2 (fr) | 2003-01-16 |
WO2003005783A3 WO2003005783A3 (fr) | 2003-04-10 |
WO2003005783A9 WO2003005783A9 (fr) | 2003-05-15 |
Family
ID=27372149
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2002/021266 WO2003005783A2 (fr) | 2001-07-03 | 2002-07-03 | Procedes et systemes permettant d'incorporer des composants electriques dans un dispositif contenant une structure sensible a la frequence |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU2002354784A1 (fr) |
WO (1) | WO2003005783A2 (fr) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014039975A2 (fr) | 2012-09-10 | 2014-03-13 | Neotope Biosciences Limited | Anticorps anti-mcam et méthodes d'utilisation associées |
CN106229662A (zh) * | 2016-09-11 | 2016-12-14 | 河南师范大学 | 射频高效吸收天线 |
CN110169623A (zh) * | 2019-05-16 | 2019-08-27 | 黎明职业大学 | 制鞋用涂胶机、基于遗传算法制鞋用涂胶机清洁维护方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3780373A (en) * | 1972-11-21 | 1973-12-18 | Avco Corp | Near field spiral antenna |
US4706050A (en) * | 1984-09-22 | 1987-11-10 | Smiths Industries Public Limited Company | Microstrip devices |
US5598032A (en) * | 1994-02-14 | 1997-01-28 | Gemplus Card International | Hybrid chip card capable of both contact and contact-free operation and having antenna contacts situated in a cavity for an electronic module |
US5959594A (en) * | 1997-03-04 | 1999-09-28 | Trw Inc. | Dual polarization frequency selective medium for diplexing two close bands at an incident angle |
US6067056A (en) * | 1997-09-09 | 2000-05-23 | Micron Technology, Inc. | Methods of forming conductive lines, methods of forming antennas, methods of forming wireless communication devices, conductive lines, antennas, and wireless communications devices |
US6081242A (en) * | 1998-06-16 | 2000-06-27 | Galtronics U.S.A., Inc. | Antenna matching circuit |
-
2002
- 2002-07-03 WO PCT/US2002/021266 patent/WO2003005783A2/fr not_active Application Discontinuation
- 2002-07-03 AU AU2002354784A patent/AU2002354784A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3780373A (en) * | 1972-11-21 | 1973-12-18 | Avco Corp | Near field spiral antenna |
US4706050A (en) * | 1984-09-22 | 1987-11-10 | Smiths Industries Public Limited Company | Microstrip devices |
US5598032A (en) * | 1994-02-14 | 1997-01-28 | Gemplus Card International | Hybrid chip card capable of both contact and contact-free operation and having antenna contacts situated in a cavity for an electronic module |
US5959594A (en) * | 1997-03-04 | 1999-09-28 | Trw Inc. | Dual polarization frequency selective medium for diplexing two close bands at an incident angle |
US6067056A (en) * | 1997-09-09 | 2000-05-23 | Micron Technology, Inc. | Methods of forming conductive lines, methods of forming antennas, methods of forming wireless communication devices, conductive lines, antennas, and wireless communications devices |
US6081242A (en) * | 1998-06-16 | 2000-06-27 | Galtronics U.S.A., Inc. | Antenna matching circuit |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014039975A2 (fr) | 2012-09-10 | 2014-03-13 | Neotope Biosciences Limited | Anticorps anti-mcam et méthodes d'utilisation associées |
CN106229662A (zh) * | 2016-09-11 | 2016-12-14 | 河南师范大学 | 射频高效吸收天线 |
CN110169623A (zh) * | 2019-05-16 | 2019-08-27 | 黎明职业大学 | 制鞋用涂胶机、基于遗传算法制鞋用涂胶机清洁维护方法 |
Also Published As
Publication number | Publication date |
---|---|
AU2002354784A1 (en) | 2003-01-21 |
WO2003005783A9 (fr) | 2003-05-15 |
WO2003005783A3 (fr) | 2003-04-10 |
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