WO2003001572A3 - Vorrichtung zum bonden mit elektromagnetischer kraftdosierung - Google Patents

Vorrichtung zum bonden mit elektromagnetischer kraftdosierung Download PDF

Info

Publication number
WO2003001572A3
WO2003001572A3 PCT/AT2002/000183 AT0200183W WO03001572A3 WO 2003001572 A3 WO2003001572 A3 WO 2003001572A3 AT 0200183 W AT0200183 W AT 0200183W WO 03001572 A3 WO03001572 A3 WO 03001572A3
Authority
WO
WIPO (PCT)
Prior art keywords
positioning device
holding element
carrier
electronic circuits
lifting part
Prior art date
Application number
PCT/AT2002/000183
Other languages
English (en)
French (fr)
Other versions
WO2003001572A2 (de
Inventor
Andreas Mayr
Original Assignee
Datacon Semiconductor Equip
Andreas Mayr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Datacon Semiconductor Equip, Andreas Mayr filed Critical Datacon Semiconductor Equip
Publication of WO2003001572A2 publication Critical patent/WO2003001572A2/de
Publication of WO2003001572A3 publication Critical patent/WO2003001572A3/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Jigs For Machine Tools (AREA)

Abstract

Die Erfindung betrifft eine Einrichtung zum Positionieren und/oder zum Verbinden der Kontaktbahnen von elektronischen Schaltungen, beispielsweise Chips (9), auf einem Träger, wie beispielweise einer Leiterplatte, Keramiksubstrat od. dgl. Die elektronischen Schaltungen werden von einer Positioniereinrichtung (1) erfasst und auf dem Träger positioniert. Die Positioniereinrichtung (1) umfasst mindestens eine Halterung (2) und einen in der Halterung (2) gelagerten Hubteil (3). Der Hubteil (3) ist über magnetische Kräfte an die Halterung (2) angekoppelt. Mindestens ein regelbarer Elektromagnet (4) und ein relativ zu diesem Elektromagneten (4) angeorneter, beweglicher Ankerteil (6) ist vorgesehen.
PCT/AT2002/000183 2001-06-26 2002-06-25 Vorrichtung zum bonden mit elektromagnetischer kraftdosierung WO2003001572A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ATA983/01 2001-06-26
AT9832001A AT411855B (de) 2001-06-26 2001-06-26 Einrichtung zum positionieren

Publications (2)

Publication Number Publication Date
WO2003001572A2 WO2003001572A2 (de) 2003-01-03
WO2003001572A3 true WO2003001572A3 (de) 2003-09-12

Family

ID=3683811

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/AT2002/000183 WO2003001572A2 (de) 2001-06-26 2002-06-25 Vorrichtung zum bonden mit elektromagnetischer kraftdosierung

Country Status (2)

Country Link
AT (1) AT411855B (de)
WO (1) WO2003001572A2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006514444A (ja) * 2003-09-05 2006-04-27 シーメンス　アクチエンゲゼルシヤフト 基板に電気的な構成素子を装着するためのグリッパユニット
DE10345538A1 (de) * 2003-09-30 2005-05-12 Siemens Ag Bestückkopf mit einer Greifereinheit zum Bestücken von Substraten mit elektrischen Bauelementen
FR2905883B1 (fr) * 2006-09-14 2008-12-05 Valeo Electronique Sys Liaison Procede de soudage d'un organe sur un support par apport de matiere et dispositif d'agencement de deux elements l'un sur l'autre
CN111987055B (zh) * 2020-07-16 2022-06-07 大同新成新材料股份有限公司 一种半导体制冷石墨烯芯片

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3697837A (en) * 1970-10-05 1972-10-10 Gen Electric Electromagnetic force system for integrated circuit fabrication
JPH10135250A (ja) * 1996-10-31 1998-05-22 Sanyo Electric Co Ltd ボンディングユニット

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5898937A (ja) * 1981-12-09 1983-06-13 Fujitsu Ltd ワイヤボンデイング装置
JP2590252B2 (ja) * 1989-02-22 1997-03-12 株式会社東芝 ダイボンデイング装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3697837A (en) * 1970-10-05 1972-10-10 Gen Electric Electromagnetic force system for integrated circuit fabrication
JPH10135250A (ja) * 1996-10-31 1998-05-22 Sanyo Electric Co Ltd ボンディングユニット

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 10 31 August 1998 (1998-08-31) *

Also Published As

Publication number Publication date
AT411855B (de) 2004-06-25
WO2003001572A2 (de) 2003-01-03
ATA9832001A (de) 2003-11-15

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