WO2002099878A1 - Power semiconductor module - Google Patents

Power semiconductor module Download PDF

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Publication number
WO2002099878A1
WO2002099878A1 PCT/US2001/017415 US0117415W WO02099878A1 WO 2002099878 A1 WO2002099878 A1 WO 2002099878A1 US 0117415 W US0117415 W US 0117415W WO 02099878 A1 WO02099878 A1 WO 02099878A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
substrate
die
semiconductor die
Prior art date
Application number
PCT/US2001/017415
Other languages
French (fr)
Inventor
Vijay Mangtani
Original Assignee
International Rectifier Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Rectifier Corporation filed Critical International Rectifier Corporation
Priority to PCT/US2001/017415 priority Critical patent/WO2002099878A1/en
Priority to DE10196942T priority patent/DE10196942B4/en
Priority to JP2003502885A priority patent/JP4051027B2/en
Publication of WO2002099878A1 publication Critical patent/WO2002099878A1/en

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Classifications

    • H—ELECTRICITY
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    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
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    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
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Definitions

  • This invention relates to semiconductor device power modules and more specifically relates to a novel structure for such devices which simplifies their manufacturing cost and reliability.
  • IMS insulation metal substrate
  • PCB printed circuit board
  • DRC Direct bonded copper
  • the bottom surface of the IMS can be pressed into contact with the top flat surface of a heatsink.
  • the PCB is generally supported in a plane above the plane of the IMS and is laterally removed from the IMS area.
  • the bottom of the PCB is spaced above the top surface of the support shell so that components can be mounted on the bottom surface of the PCB as well as on its top surface.
  • wire bonds to the control electrodes of the power die on the IMS for example, gate electrodes and temperature and current sense and Kelvin electrodes of MOSFETs and IGBTs, must extend from the lower plane of the top surfaces of the power die to the upper plane of the upper surface of the PCB, creating long wire bonds which are difficult to manage.
  • a substrate, usually IMS, containing the interconnected power semiconductor die, shunts, temperature and current sensors is first attached to an insulation base shell.
  • a PCB is next attached to the base shell and wire bonds are made between the silicon die and substrate to the PCB.
  • a cap is next placed over the IMS and encapsulant, for example, a silicone is introduced into the interior of the cap and atop the IMS through openings in the cap, and the silicone is cured. It would be advantageous to reduce the resulting high part count for the module.
  • encapsulant for example, a silicone is introduced into the interior of the cap and atop the IMS through openings in the cap, and the silicone is cured. It would be advantageous to reduce the resulting high part count for the module.
  • substrates are frequently employed to carry the various semiconductor die. These substrates usually have the construction shown in Figures 13 and 14 for substrate 320 and have a bottom copper layer 321, a central insulation ceramic 322, which may be Al 2 O 3 or A1N, and a top copper layer which has been patterned into various areas, such as the six insulated areas 323, 324, 325, 326, 327 and 328 shown. Any other pattern could be formed for the top copper layer.
  • Each of areas 323 to 328 have a respective power semiconductor device die 330 to 335 secured thereto, as by soldering or conductive epoxy, or the like.
  • the bottom electrodes of die 330 to 335 are insulated, but could be connected together as desired by conductive traces or by wire bonds.
  • Substrate 320 of Figures 13 and 14 may also be a direct bonded copper (DBC) substrate.
  • DBC direct bonded copper
  • Substrates 320 and 340 are conventionally attached to a common baseplate 341 by solder refiow techniques, or by a conductive epoxy.
  • the subassembly of substrates 320, 340 and base plate 341 is then secured within a plastic support shell 350 with the base plate 341 bottom exposed for connection to a flat heatsink 351.
  • a suitable printed current board and terminals are then provided.
  • the silicon die and substrate are wire bonded or otherwise connected to the PCB and terminal and the substrates are enclosed in a suitable potted volume.
  • a power module which is a self contained circuit, as for a motor control circuit, and which does not require expensive single or multiple insulation substrate(s) and which does not impede heat flow from the die to the heatsink.
  • the support insulation shell structure is modified to support the IMS in a higher plane above the bottom of the shell and closer to the plane of the PCB.
  • the main heat sink to receive the module is also modified to have a raised flat topped mesa to engage the raised bottom surface of the IMS.
  • the difference in height between the IMS (or other similar substrate) and the PCB is reduced and they are in closely adjacent parallel planes.
  • closely adjacent is meant less than about twice the thickness of the IMS.
  • This novel structure produces a number of advantages.
  • the reduction in the height differential of the tops of the die on the IMS and the top of the PCB improves wire bondability and the quality of the wire bonds, thus improving production yield.
  • the volume of the cavity that needs to be filled by encapulant above the IMS is reduced, reducing the volume of potting material used.
  • the substrate carrying the power die and current and temperature sensors, shunts and the like is attached directly to and supports the PCB and the conventional insulation base shell is eliminated.
  • the PCB has suitable openings to expose the top of the IMS substrate, leaving accessible wire bonding locations for bonding between the silicon substrate and the PCB.
  • a cap is next mounted on top of the assembly and is secured by adhesive or by a screw structure. The cap is pressed toward the surface of the heat sink. All module electrical tests can be performed prior to heat sink mounting and encapsulation.
  • the heat sink can be undercut in these areas to provide the necessary space.
  • the substrate in the present invention is not glued to a shell and pressed into contact with the heat sink, but is adhesively attached directly to the heat sink for improved thermal characteristics.
  • screws passing throuth top cap can secure the substrate and PCB to heat sink.
  • multiple substrates are mounted in respective openings in a plastic shell, and the intermediate common conductive base is eliminated.
  • a PCB is disposed above the substrates and contains openings to provide access to the tops of each substrate for the necessary interconnect and wire bonding between the silicon die, the substrates and the PCB and terminals.
  • the PCB may include additional interconnects such as solderable or snap mount pins, terminals, connectors, etc. for connecting another PCB, or other components or wires to other equipment.
  • the PCB can be eliminated and the insulation shell can contain an insert molded lead frame with wire bond connections being made to the lead frame.
  • the leads may be soldered to a PCB external of the module for making the interconnects.
  • the internal PCB may be replaced by an external PCB and the substrate may contain terminal pins (connected to the substrate by reflowed solder), which pins are connected to the external PCB.
  • the separate substrates can be aligned longitudinally to reduce the number of mounting screws needed to mount the PCB to the insulation support shell.
  • the single heatsink of the prior art is divided into a plurality of separate heatsinks which are fixed to the main support insulation shell of the module and are spaced from one another and are insulated from one another by the insulation shell.
  • the die may be attached to their respective heatsinks by solder reflow or conductive epoxy techniques or the like.
  • one or more die, the bottom electrodes of which are at the same potential are fixed directly to the top bare conductive surface of the respective heatsinks.
  • no IMS is needed for the isolation of die at different potentials and the die are intimately thermally connected to their respective heatsink.
  • any mixture of power die such as diodes, Power MOSFETs, IGBTs, thyristors and the like can be used.
  • Figure 1 is a top view of a prior art module employing an IMS substrate for mounting power semiconductor die.
  • Figure 2 is a cross-section of Figure 1 taken across section 2-2 in Figure 1.
  • Figure 2 A is a cross section of Figure 1 taken across section line 2A-2A in Figure 1.
  • Figure 3 is an enlarged view of Figure 2, showing an insulation cap modified in accordance with one feature of the invention.
  • Figure 4 is a view similar to Figure 2 of a structure similar to that of the device of Figures 1 to 3 but modified in accordance with a feature of the invention..
  • FIG. 4A shows the manner in which the PCB is modified in accordance with the present invention.
  • Figure 4B is a cross sectional view of the assembly of the device similar to that of Figure 2 A, but in accordance with the invention, with the insulation shell removed.
  • Figure 5 is a top view of the shell structure of Figures 1 to 4 modified in accordance with the invention.
  • Figure 6 is a top view of one of the isolated heatsinks which is to be mounted in the main insulation shell.
  • Figure 7 is a side view of the heatsink of Figure 6.
  • Figure 8 is a top view of the insulation shell of Figure 5 with the separate heatsinks cemented in place.
  • Figure 9 is a cross-section of Figure 8 taken across section line 9-9 in Figure 8.
  • Figure 10 is a top view of a second embodiment of the invention in which three heatsinks each receive a P channel and an N channel MOSFET which have bottom electrodes at the same potential.
  • Figure 11 is a schematic cross-section of Figure 10 taken across section line 11-11 in Figure 10.
  • Figure 12 is a top view of a further embodiment of the invention.
  • Figure 13 is a top view of a conventional insulation ceramic.
  • Figure 14 is a cross-sectional view of Figure 1 taken across section line 14-14 in Figure 13.
  • Figure 15 shows in cross-section, the manner in which several substrates are mounted in an insulation shell.
  • Figure 16 is a top view of the PCB and substrate assembly made in accordance with the invention.
  • Figure 17 is a cross-sectional view of Figure 16 taken across section line 17-17 in Figure 16.
  • Figure 18 is a cross-sectional view of Figure 16 taken across section line 18-18 in Figure 16.
  • Figure 19 is a view like Figure 16 of another embodiment of the invention.
  • a molded shell support base 12 supports a PCB 13 and has a bottom opening 14 in which an LMS 15 ( Figure 2) is mounted.
  • the IMS is a flat sheet of material in which upper and lower conductive layers are insulated by a central insulation film.
  • the conductive layers can include a lower thick copper or aluminum heatsink and a thin upper copper layer which can be patterned to form conductive mounting pads to which power die, such as die 20 and 21 can be mounted and interconnected.
  • the die attach can be obtained by solder reflow or conductive epoxy or the like.
  • the bottom surface of the LMS 15 is pressed into contact with the flat upper surface of a single heatsink 30 ( Figure 2) as by insulated bolts 31, 32,
  • a high grade potting compound for example a suitable flexible silastic 60 fills the cavity above the LMS 15, contained by cap 70 as shown in Figure 3. Note that cap 70 may be first connected in place and the silastic or other potting material can be poured through openings in the cap and subsequently cured. A lower grade potting material can be used to fill the entire interior of shell 13.
  • a filter capacitor 80 can also be included with the module.
  • the structure shown in Figures 1 and 2 may have overall dimensions of 7.5 cm x 5 cm x 1 cm and can house a full motor control circuit, including an inverter, input circuits, protective circuits, and a microprocessor.
  • the inverter and other power die are fastened to the IMS 15 and other components are on the PCB 13.
  • Figure 3 shows an enlarged portion of the structure of Figure 2, with a cap 70 in place to enclose silastic 60. It will be understood that the wirebond surface of IMS 15 and PCB 13 are at different heights.
  • wirebonds are long and relatively difficult to manage.
  • the structure of insulation shell 12 may be modified so that shoulder 40 is moved up much higher toward the plane of PCB 13.
  • the bottom of IMS 15 is then brought substantially above the plane of the bottom of shell 12. Therefore, a mesa 100 with a flat upper surface is formed on heatsink 30 and is arranged to press against the bottom surface of LMS 15, which is confined in shoulder 40 which surrounds opening 14.
  • FIG. 4A and 4B show a second feature of the present invention and parts similar to these of Figures 1 to 4 carry the same identifying numeral. It will first be noted that PCB 13 is modified in Figure 4A (the components thereon are not shown) to have an enlarged opening 400 therein. The IMS 15 is cemented, at its outer edge, to the underlying rim of opening 400. The die and substrate and PCB are then suitably wire bonded and the subassembly is electrically tested.
  • An insulation cap 410 is then mounted as shown, to enclose the upper surface of the IMS 15 and the wire bonds therein. Screws 411 and 412 which pass through the PCB 13 are threaded into heat sink 30 to fix the cap 410, PCB 13 and IMS 15 in place. The cap and the LMS may be secured to heat sink
  • the cap is then filled with a suitable potting compound through openings in the cap, not shown, and the compound is then cured.
  • Figures 4A and 4B eliminates the conventional insulation base shell 12 of Figures 1 to 4. Further, the thermal connection of LMS 15 and substrate 15 is improved and pretesting of the circuit is possible before capping.
  • the heat sink 30 can be undercut as shown by dotted lines 430, 440 in Figure 6 to provide the necessary room around peripheral portions of the heat sink 30.
  • the main support shell 12 is modified in accordance with a further feature of the invention, as shown in Figure 5 to have a plurality of openings 110, 111, 112, 113, 114 and 115 which are sized to receive respective heatsinks which are to be insulated from one another.
  • Figure 6 to 9 show one of the heatsinks 120 which is mounted in opening 113.
  • Heatsink 120 has a flat die-receiving upper surface 121, a finned body 122 and an outer flange 123.
  • the body of heatsink 120, and of identical heatsinks 121, 122, 123, 124 and 125 are fitted into openings 113, 114, 115, 110, 111 and 112, respectively. They are secured to shell 12 in any desired way, as by cementing to the underside of flanges such as flange 123 of heatsink 120. Obviously the heatsinks are insulated from one another by the insulation material of shell 12.
  • individual power semiconductor die 134 such as die 130, 131, 132, 133, 134 and 135 ( Figures 8 and 9) are connected to the top surfaces such as surface 121 of each of heatsinks 120 to 125, respectively.
  • the die are power die having bottom electrodes which may be thermally and electrically coupled directly to their respective heatsink.
  • the top electrodes of die 130 to 135 are then electrically connected to form any desired circuit by wire bonds which interconnect the die and are connected to external leads.
  • terminal 150 which is connected to each of heatsinks 123, 124 and 125 (and thus to the bottom electrodes of die 133, 134 and 135); terminals 151, 152 and 153 which are wire bonded to the top contacts of die 133, 134 and 135 respectively, and to heatsinks 120, 121 and 122, respectively; terminals 154, 155 and 156 which are connected to the top metal electrodes of die 130, 131 and 132, respectively; and control terminals 160, 161, 162, 163, 164 and 165 which are connected to the gate, or control electrodes of the 133 to 135 and 130 to 132, respectively.
  • terminals 150 through 165 can be elements of a common lead frame. It is to be noted that the control printed circuit board such as board
  • the present invention as shown in Figures 5 to 9, also eliminates the need for an expensive LMS substrate to appropriately insulate various ones of the die 130 to 135 by employing separate heatsinks; and improved thermal performance is also obtained.
  • FIG. 10 and 11 show an embodiment employing three heatsinks 180, 181 and 182.
  • Each of the heatsinks carry a P channel MOSFET 183, 184 and 185, respectively and an N channel MOSFET 186, 187 and 188, respectively.
  • Each of heatsinks 180 to 182 have a flat top surface for receiving the two spaced die, a flange (flange 190 in Figure 11) which can be cemented into an opening in insulation shell 12 and fins 191 or any other desired structure.
  • the structure and circuit can be completed in any desired manner.
  • one long heatsink 200 can carry spaced, interconnected (at their bottom electrodes) MOSFETs 201, 202 and 203 while separate heatsinks such as heatsinks 120, 121 and 122 of Figures 8 and 9 can carry fully electrically isolated power MOSFETs 130, 131 and 132, respectively.
  • FIG. 16 there is shown a further embodiment of another aspect of the invention.
  • two separate substrates 360 and 361 which are similar to substrates 320 and 340 respectively, are separately pressed against the heatsink by mounting screws in the insulation support housing 382 (similar to housing 350 in Figure 15).
  • the substrates 360 and 361 are contained within separate openings 363 and 364 respectively ( Figures 17 and 18), and their top surfaces are exposed through openings 370 and 371 in the PCB 372.
  • PCB 372 is mounted within the housing 382 and is secured thereto by screws 390, 391, 392 and 393 which thread into bosses extending integrally from housing 382.
  • Bosses 395 and 396 are shown in Figure 17 for screws 391 and 393 respectively.
  • Figure 19 shows an arrangement of the substrates 360 and 361 longitudinally in line in a longer, narrower insulation shell than that of Figures

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Abstract

A power semiconductor device module which is a self contained circuit, as for a motor control circuit, and which does not require expensive single or multiple insulation substrates and which does not impede heat flow the die to the heatsink (120).

Description

POWER SEMICONDUCTOR MODULE
FIELD OF THE INVENTION
This invention relates to semiconductor device power modules and more specifically relates to a novel structure for such devices which simplifies their manufacturing cost and reliability.
BACKGROUND OF THE INVENTION
Semiconductor modules are well known, in which a plurality of power semiconductor die are fixed to a ceramic based substrate support such as an insulation metal substrate (IMS) or the like to interconnect the devices and are carried in a main support shell which also supports a printed circuit board (PCB) which carries control circuits for controlling the power die. Direct bonded copper (DBC) substrate can be used in place of IMS. Power terminals extend from the IMS for connection to a load, such as a motor and the PCB carries a terminal connector for connection to an external source of control signals. Such devices are usually arranged so that the IMS is secured within a small opening in the shell
(so that the area of the expensive IMS can be minimized) and the bottom surface of the IMS can be pressed into contact with the top flat surface of a heatsink.
The PCB is generally supported in a plane above the plane of the IMS and is laterally removed from the IMS area. The bottom of the PCB is spaced above the top surface of the support shell so that components can be mounted on the bottom surface of the PCB as well as on its top surface.
As a result of this structure, wire bonds to the control electrodes of the power die on the IMS, for example, gate electrodes and temperature and current sense and Kelvin electrodes of MOSFETs and IGBTs, must extend from the lower plane of the top surfaces of the power die to the upper plane of the upper surface of the PCB, creating long wire bonds which are difficult to manage. Further, in the prior art structure, a substrate, usually IMS, containing the interconnected power semiconductor die, shunts, temperature and current sensors is first attached to an insulation base shell. A PCB is next attached to the base shell and wire bonds are made between the silicon die and substrate to the PCB. A cap is next placed over the IMS and encapsulant, for example, a silicone is introduced into the interior of the cap and atop the IMS through openings in the cap, and the silicone is cured. It would be advantageous to reduce the resulting high part count for the module.
In general ceramic based substrates are frequently employed to carry the various semiconductor die. These substrates usually have the construction shown in Figures 13 and 14 for substrate 320 and have a bottom copper layer 321, a central insulation ceramic 322, which may be Al2O3 or A1N, and a top copper layer which has been patterned into various areas, such as the six insulated areas 323, 324, 325, 326, 327 and 328 shown. Any other pattern could be formed for the top copper layer. Each of areas 323 to 328 have a respective power semiconductor device die 330 to 335 secured thereto, as by soldering or conductive epoxy, or the like. The bottom electrodes of die 330 to 335 are insulated, but could be connected together as desired by conductive traces or by wire bonds. Substrate 320 of Figures 13 and 14 may also be a direct bonded copper (DBC) substrate.
In order to insure the mechanical integrity of such substrates, and to prevent the ceramic from cracking, their length is usually limited to less than about 2 inches. Thus, when a power module requires a larger substrate, two or more shorter separate substrates must be used. Thus, as shown in Figure 15, two identical substrates 320 and 340 are attached to a common base plate 341 which is of copper or of AlSiC for higher performance applications.
Substrates 320 and 340 are conventionally attached to a common baseplate 341 by solder refiow techniques, or by a conductive epoxy. The subassembly of substrates 320, 340 and base plate 341 is then secured within a plastic support shell 350 with the base plate 341 bottom exposed for connection to a flat heatsink 351. A suitable printed current board and terminals are then provided. The silicon die and substrate are wire bonded or otherwise connected to the PCB and terminal and the substrates are enclosed in a suitable potted volume.
The above described structure has a number of drawbacks. These include:
1. Tooling and material cost for base plate 341.
2. The additional processing required for the use of base plate
341.
3. The added thermal resistance between the silicon die and the heatsink 351 due to the added interfaces at the top and bottom of plate 341. 4. Degradation of power and temperature cycling capability due to the added interfaces.
It would be desirable to employ multiple substrates in a power module without the disadvantages brought about by the added common base plate. hi the known prior art structure and as described above, the entire module is attached to a single unitary heatsink as by screws or the like. The individual devices are electrically isolated from one another against conduction through the common heatsink by the use of the expensive IMS or DBC. The use of the IMS or DBC or the like substrate increases the thermal resistance between the die and heatsink.
It would be desirable to provide a power module which is a self contained circuit, as for a motor control circuit, and which does not require expensive single or multiple insulation substrate(s) and which does not impede heat flow from the die to the heatsink.
BRIEF DESCRIPTION OF THE INVENTION
In accordance with a first feature of the present invention, the support insulation shell structure is modified to support the IMS in a higher plane above the bottom of the shell and closer to the plane of the PCB. The main heat sink to receive the module is also modified to have a raised flat topped mesa to engage the raised bottom surface of the IMS. Thus, the difference in height between the IMS (or other similar substrate) and the PCB is reduced and they are in closely adjacent parallel planes. By "closely adjacent" is meant less than about twice the thickness of the IMS.
This novel structure produces a number of advantages. First, the reduction in the height differential of the tops of the die on the IMS and the top of the PCB improves wire bondability and the quality of the wire bonds, thus improving production yield.
Second, the length of wire bonds is reduced, and mechanical stress on the wirebonds during device operation is reduced.
Third, the volume of the cavity that needs to be filled by encapulant above the IMS is reduced, reducing the volume of potting material used.
In accordance with a second feature of the present invention, the substrate carrying the power die and current and temperature sensors, shunts and the like is attached directly to and supports the PCB and the conventional insulation base shell is eliminated. The PCB has suitable openings to expose the top of the IMS substrate, leaving accessible wire bonding locations for bonding between the silicon substrate and the PCB. A cap is next mounted on top of the assembly and is secured by adhesive or by a screw structure. The cap is pressed toward the surface of the heat sink. All module electrical tests can be performed prior to heat sink mounting and encapsulation.
If the control circuit is elaborate and control components are desirable on the bottom surface of the heat sink, the heat sink can be undercut in these areas to provide the necessary space.
It will be noted that the substrate in the present invention is not glued to a shell and pressed into contact with the heat sink, but is adhesively attached directly to the heat sink for improved thermal characteristics. Alternately, screws passing throuth top cap can secure the substrate and PCB to heat sink.
In accordance with a further aspect of the present invention, multiple substrates are mounted in respective openings in a plastic shell, and the intermediate common conductive base is eliminated. A PCB is disposed above the substrates and contains openings to provide access to the tops of each substrate for the necessary interconnect and wire bonding between the silicon die, the substrates and the PCB and terminals.
If desired, the PCB may include additional interconnects such as solderable or snap mount pins, terminals, connectors, etc. for connecting another PCB, or other components or wires to other equipment.
In another implementation, the PCB can be eliminated and the insulation shell can contain an insert molded lead frame with wire bond connections being made to the lead frame. The leads may be soldered to a PCB external of the module for making the interconnects. In still another implementation of the invention, the internal PCB may be replaced by an external PCB and the substrate may contain terminal pins (connected to the substrate by reflowed solder), which pins are connected to the external PCB.
In a yet further implementation of the invention, the separate substrates can be aligned longitudinally to reduce the number of mounting screws needed to mount the PCB to the insulation support shell.
In accordance with a still further aspect of the invention the single heatsink of the prior art is divided into a plurality of separate heatsinks which are fixed to the main support insulation shell of the module and are spaced from one another and are insulated from one another by the insulation shell. The die may be attached to their respective heatsinks by solder reflow or conductive epoxy techniques or the like. Thus, one or more die, the bottom electrodes of which are at the same potential, are fixed directly to the top bare conductive surface of the respective heatsinks. Thus, no IMS is needed for the isolation of die at different potentials and the die are intimately thermally connected to their respective heatsink. Note that any mixture of power die such as diodes, Power MOSFETs, IGBTs, thyristors and the like can be used.
BRIEF DESCRIPTION OF THE DRAWINGS
Figure 1 is a top view of a prior art module employing an IMS substrate for mounting power semiconductor die. Figure 2 is a cross-section of Figure 1 taken across section 2-2 in Figure 1.
Figure 2 A is a cross section of Figure 1 taken across section line 2A-2A in Figure 1. Figure 3 is an enlarged view of Figure 2, showing an insulation cap modified in accordance with one feature of the invention.
Figure 4 is a view similar to Figure 2 of a structure similar to that of the device of Figures 1 to 3 but modified in accordance with a feature of the invention..
Figure 4A shows the manner in which the PCB is modified in accordance with the present invention.
Figure 4B is a cross sectional view of the assembly of the device similar to that of Figure 2 A, but in accordance with the invention, with the insulation shell removed. Figure 5 is a top view of the shell structure of Figures 1 to 4 modified in accordance with the invention.
Figure 6 is a top view of one of the isolated heatsinks which is to be mounted in the main insulation shell.
Figure 7 is a side view of the heatsink of Figure 6. Figure 8 is a top view of the insulation shell of Figure 5 with the separate heatsinks cemented in place.
Figure 9 is a cross-section of Figure 8 taken across section line 9-9 in Figure 8.
Figure 10 is a top view of a second embodiment of the invention in which three heatsinks each receive a P channel and an N channel MOSFET which have bottom electrodes at the same potential.
Figure 11 is a schematic cross-section of Figure 10 taken across section line 11-11 in Figure 10.
Figure 12 is a top view of a further embodiment of the invention. Figure 13 is a top view of a conventional insulation ceramic. Figure 14 is a cross-sectional view of Figure 1 taken across section line 14-14 in Figure 13.
Figure 15 shows in cross-section, the manner in which several substrates are mounted in an insulation shell. Figure 16 is a top view of the PCB and substrate assembly made in accordance with the invention.
Figure 17 is a cross-sectional view of Figure 16 taken across section line 17-17 in Figure 16.
Figure 18 is a cross-sectional view of Figure 16 taken across section line 18-18 in Figure 16.
Figure 19 is a view like Figure 16 of another embodiment of the invention.
DETAILED DESCRIPTION OF THE INVENTION Referring first to Figures 1 and 2 there is shown a typical prior art module. Thus, a molded shell support base 12 supports a PCB 13 and has a bottom opening 14 in which an LMS 15 (Figure 2) is mounted. The IMS is a flat sheet of material in which upper and lower conductive layers are insulated by a central insulation film. The conductive layers can include a lower thick copper or aluminum heatsink and a thin upper copper layer which can be patterned to form conductive mounting pads to which power die, such as die 20 and 21 can be mounted and interconnected. The die attach can be obtained by solder reflow or conductive epoxy or the like.
The bottom surface of the LMS 15 is pressed into contact with the flat upper surface of a single heatsink 30 (Figure 2) as by insulated bolts 31, 32,
33 in shell 12 (Figures 1 and 2A). Note that the LMS 15 is fitted into a shouldered groove 40 in opening 14 (Figure 2). Further, printed circuit board 13 sits atop a shelf 41 in shell 12 so that space is provided for components on the bottom of shelf 41. Wire bonds are then made from die 20 and 21 to terminals on the printed circuit board 13 which will conduct control signals from control terminal 50 which controls the operation of the power die 20 and 21. Wire bonds are also made to power output terminals 55-56.
A high grade potting compound, for example a suitable flexible silastic 60 fills the cavity above the LMS 15, contained by cap 70 as shown in Figure 3. Note that cap 70 may be first connected in place and the silastic or other potting material can be poured through openings in the cap and subsequently cured. A lower grade potting material can be used to fill the entire interior of shell 13.
A filter capacitor 80 can also be included with the module. The structure shown in Figures 1 and 2 may have overall dimensions of 7.5 cm x 5 cm x 1 cm and can house a full motor control circuit, including an inverter, input circuits, protective circuits, and a microprocessor. The inverter and other power die are fastened to the IMS 15 and other components are on the PCB 13. Figure 3 shows an enlarged portion of the structure of Figure 2, with a cap 70 in place to enclose silastic 60. It will be understood that the wirebond surface of IMS 15 and PCB 13 are at different heights. As a consequence of this, a large volume of encapsulant is necessary to cover the LMS 15 surface and the wires 90 and 91 (Figure 3), which are to be wirebonded from IMS 15 to PCB 13 or the terminal pad of terminals 55 and 56 (Figures 1 and 2).
Further, the wirebonds are long and relatively difficult to manage.
It is possible, in Figure 2, to substantially lower the plane of PCB 13. However, this makes it impossible to place components on the underside of PCB 13, thus requiring a larger area for the PCB 13 if a large number of components is needed. Further, the PCB 13 is also brought closer to the heatsink
30, making the PCB 13 run hotter.
In accordance with a first feature of the invention, and as shown in Figure 4, the structure of insulation shell 12 may be modified so that shoulder 40 is moved up much higher toward the plane of PCB 13. The bottom of IMS 15 is then brought substantially above the plane of the bottom of shell 12. Therefore, a mesa 100 with a flat upper surface is formed on heatsink 30 and is arranged to press against the bottom surface of LMS 15, which is confined in shoulder 40 which surrounds opening 14.
The resulting structure brings the upper surface of the die 20 and 21 closer to the plane of PCB 13 which surrounds LMS 15, as shown in Figure 4. Consequently, the volume above LMS 15, which must be filled with high grade and, thus, expensive silastic 60 is considerably reduced; the length of wire bonds 90 and 91 is shortened, reducing mechanical stress on the wire bonds during operation; and the wire bondability and quality is improved, improving production yield. Figures 4A and 4B show a second feature of the present invention and parts similar to these of Figures 1 to 4 carry the same identifying numeral. It will first be noted that PCB 13 is modified in Figure 4A (the components thereon are not shown) to have an enlarged opening 400 therein. The IMS 15 is cemented, at its outer edge, to the underlying rim of opening 400. The die and substrate and PCB are then suitably wire bonded and the subassembly is electrically tested.
An insulation cap 410 is then mounted as shown, to enclose the upper surface of the IMS 15 and the wire bonds therein. Screws 411 and 412 which pass through the PCB 13 are threaded into heat sink 30 to fix the cap 410, PCB 13 and IMS 15 in place. The cap and the LMS may be secured to heat sink
30 by a suitable adhesive. The cap is then filled with a suitable potting compound through openings in the cap, not shown, and the compound is then cured.
The novel structure of Figures 4A and 4B eliminates the conventional insulation base shell 12 of Figures 1 to 4. Further, the thermal connection of LMS 15 and substrate 15 is improved and pretesting of the circuit is possible before capping.
Note that if components are desired on the underside of PCB 13 that the heat sink 30 can be undercut as shown by dotted lines 430, 440 in Figure 6 to provide the necessary room around peripheral portions of the heat sink 30.
Referring next to Figures 5 to 9, where components similar to those of Figures 1 to 4 have the same reference numerals, the main support shell 12 is modified in accordance with a further feature of the invention, as shown in Figure 5 to have a plurality of openings 110, 111, 112, 113, 114 and 115 which are sized to receive respective heatsinks which are to be insulated from one another. Figure 6 to 9 show one of the heatsinks 120 which is mounted in opening 113. Heatsink 120 has a flat die-receiving upper surface 121, a finned body 122 and an outer flange 123. The body of heatsink 120, and of identical heatsinks 121, 122, 123, 124 and 125 (Figures 8 and 9) are fitted into openings 113, 114, 115, 110, 111 and 112, respectively. They are secured to shell 12 in any desired way, as by cementing to the underside of flanges such as flange 123 of heatsink 120. Obviously the heatsinks are insulated from one another by the insulation material of shell 12.
Before or after the installation of heatsinks 120 to 125, individual power semiconductor die 134 such as die 130, 131, 132, 133, 134 and 135 (Figures 8 and 9) are connected to the top surfaces such as surface 121 of each of heatsinks 120 to 125, respectively. The die are power die having bottom electrodes which may be thermally and electrically coupled directly to their respective heatsink. The top electrodes of die 130 to 135 are then electrically connected to form any desired circuit by wire bonds which interconnect the die and are connected to external leads. These external leads or terminals are shown as terminal 150 which is connected to each of heatsinks 123, 124 and 125 (and thus to the bottom electrodes of die 133, 134 and 135); terminals 151, 152 and 153 which are wire bonded to the top contacts of die 133, 134 and 135 respectively, and to heatsinks 120, 121 and 122, respectively; terminals 154, 155 and 156 which are connected to the top metal electrodes of die 130, 131 and 132, respectively; and control terminals 160, 161, 162, 163, 164 and 165 which are connected to the gate, or control electrodes of the 133 to 135 and 130 to 132, respectively. Note that terminals 150 through 165 can be elements of a common lead frame. It is to be noted that the control printed circuit board such as board
13 of Figures 1 to 4 may be fixed within the shell 12 in Figures 5 to 9, above the level of die 130 to 135 to provide or process the control signals applied to control terminals 160 to 165.
The present invention, as shown in Figures 5 to 9, also eliminates the need for an expensive LMS substrate to appropriately insulate various ones of the die 130 to 135 by employing separate heatsinks; and improved thermal performance is also obtained.
While the structure in the embodiment of Figures 5 to 9 shows a separate heatsink for a respective die, it will be understood that more than one die can be mounted on singulated heatsinks. For example, Figures 10 and 11 show an embodiment employing three heatsinks 180, 181 and 182. Each of the heatsinks carry a P channel MOSFET 183, 184 and 185, respectively and an N channel MOSFET 186, 187 and 188, respectively. Each of heatsinks 180 to 182 have a flat top surface for receiving the two spaced die, a flange (flange 190 in Figure 11) which can be cemented into an opening in insulation shell 12 and fins 191 or any other desired structure. The structure and circuit can be completed in any desired manner.
It is also possible to mix different sized heatsinks, as shown in Figure 12. Thus, as shown in Figure 12, one long heatsink 200 can carry spaced, interconnected (at their bottom electrodes) MOSFETs 201, 202 and 203 while separate heatsinks such as heatsinks 120, 121 and 122 of Figures 8 and 9 can carry fully electrically isolated power MOSFETs 130, 131 and 132, respectively.
Referring next to Figures 16, 17 and 18 there is shown a further embodiment of another aspect of the invention. Thus, two separate substrates 360 and 361, which are similar to substrates 320 and 340 respectively, are separately pressed against the heatsink by mounting screws in the insulation support housing 382 (similar to housing 350 in Figure 15). The substrates 360 and 361 are contained within separate openings 363 and 364 respectively (Figures 17 and 18), and their top surfaces are exposed through openings 370 and 371 in the PCB 372. PCB 372 is mounted within the housing 382 and is secured thereto by screws 390, 391, 392 and 393 which thread into bosses extending integrally from housing 382. Bosses 395 and 396 are shown in Figure 17 for screws 391 and 393 respectively. After the assembly of Figures 16, 17 and 18, the substrate, silicon die, PCB and terminals (not shown) may be wire bonded or otherwise interconnected.
Figure 19 shows an arrangement of the substrates 360 and 361 longitudinally in line in a longer, narrower insulation shell than that of Figures
16, 17 and 18. This arrangement permits the use of fewer screws 400, 401 and 402 for fastening PCB 372 to the shell 382.
The foregoing description of the preferred embodiments of the present invention have been provided for the purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise forms disclosed. Many modifications and variations are possible in light of the above teaching. It is intended that the scope of the invention not be limited to this detailed description, but rather by the claims appended hereto.

Claims

WHAT IS CLAIMED IS:
1. A power semiconductor device module comprising, in combination, a plurality of power semiconductor die each having bottom surface and a top surface; an insulation support shell; a plurality of thermally conductive semiconductor die support means for receiving the bottom surfaces of respective ones of said power semiconductor die; and a printed circuit board containing a control circuit thereon for controlling the operation of said plurality of power die; said printed circuit board disposed in a plane and parallel to the plane of said die support means; said printed circuit board having a plurality of spaced openings therein; said insulation support shell having a plurality of coplanar openings therein which are each centered on a respective one of the openings in said printed circuit board; said plurality of thermally conductive support means being disposed and fixed within respective ones of said opemngs in said insulation shell and being electrically insulated from one another by said insulation shell; and wire bond means extending through said openings and connecting said control circuits to respective ones of said power semiconductor die.
2. The power module of claim 1 , wherein said plurality of thermally conductive support means are each an electrically conductive heatsink; and wherein at least one of said plurality of semiconductive die is affixed to the upper surface of respective ones of said heatsinks.
3. The power module of claim 1 , wherein each said plurality of thermally conductive support means comprises an electrical insulation substrate having a conductive upper surface region; at least one of said plurality of semiconductor die being affixed to said conductive upper surface of each of said substrates; each of said substrates being adapted to receive an electrically conductive heatsink in thermal communication with their bottom surfaces.
4. The power module of claims 1, 2 or 3, wherein each of said thermally conductive support means has a square upper surface.
5. The power module of claims 1 , 2 or 3, wherein each of said thermally conductive support means has an elongated rectangular surface.
6. The power module of claims 1, 2 or 3, wherein each of said support means receives at least two spaced semiconductor die on the top surface thereof; said at least two die on each of said support means being electrically connected at their bottom surfaces.
7. The power module of claim 5, wherein each of said support means receives at least two spaced semiconductor die on the top surface thereof; said at least two die on each of said support surfaces being electrically com ected at their bottom surfaces.
8. A power semiconductor device module comprising a thin flat thermally conductive substrate having a bottom surface engageable by a heat sink surface and a top surface receiving at least one power semiconductor die in surface-to-surface contact; the top surface of said at least one semiconductor die having control electrode means; an enlarged planar printed circuit board having electrical components thereon for the control of said at least one power semiconductor die; said printed circuit board having an opening therein of a shape which at least approximates the shape of said thermally conductive substrate; said printed circuit board being disposed in a plane parallel to the plane of said substrate and being displaced above said substrate; said plane of said printed circuit board being closely adjacent to the plane of said substrate whereby the upper surfaces of said substrate and said printed circuit board are spaced by less than about twice the thickness of said substrate; and at least one wire bond connection extending from at least one of said components on said printed circuit board, through said opening in said printed circuit board and to said control electrode means on said semiconductor die.
9. The module of claim 8, which further includes an insulation cap disposed atop and enclosing the area of said opening and defining a dielectric fluid filled volume atop said semiconductor die.
10. The module of claims 8 or 9, which further includes an insulation shell for supporting said substrate; said insulation shell having an opening there- through for exposing said bottom surface of said substrate around a peripheral edge thereof and for receiving a projecting mesa of a heat sink which engages said bottom surface of said substrate; the upper surface of said insulation shell receiving and supporting the bottom surface of said printed circuit board.
11. The module of claims 8 or 9, wherein at least portions of „ the peripheral top surface of said substrate are fixed to corresponding peripheral portions of the bottom of said printed circuit board adjacent said opening in said printed circuit board.
12. The module of claim 11 , wherein said peripheral surfaces of said substrate and printed circuit board are fixed together by an adhesive.
13. The module of claim 10, wherein said printed circuit board has a plurality of spaced openings therein and wherein said insulation shell has a plurality of coplanar openings therein which are each centered on a respective one of the openings in said printed circuit board; said plurality of thermally conductive support means being disposed and fixed within respective ones of said openings in said insulation shell and being electrically insulated from one another by said insulation shell; and wire bond means extending through said openings and connecting said control circuits to respective ones of said power semiconductor die.
PCT/US2001/017415 2001-05-30 2001-05-30 Power semiconductor module WO2002099878A1 (en)

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PCT/US2001/017415 WO2002099878A1 (en) 2001-05-30 2001-05-30 Power semiconductor module
DE10196942T DE10196942B4 (en) 2001-05-30 2001-05-30 Semiconductor power module
JP2003502885A JP4051027B2 (en) 2001-05-30 2001-05-30 Power semiconductor device module

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WO2014052616A3 (en) * 2012-09-27 2015-07-23 The Trustees Of The University Of Pennsylvania Insulated nanoelectrode-nanopore devices and related methods
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CN104835794A (en) * 2015-03-23 2015-08-12 广东美的制冷设备有限公司 Intelligent power module and method for manufacturing same
US11652021B2 (en) 2019-05-07 2023-05-16 Zf Friedrichshafen Ag Power module having packaged power semiconductors for the controllable supply of electric power to a load

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JP2004529505A (en) 2004-09-24
JP4051027B2 (en) 2008-02-20
DE10196942T5 (en) 2004-04-22
DE10196942B4 (en) 2009-09-03

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